CN220229621U - Working thermal physical plate placing table with rapid cooling function - Google Patents
Working thermal physical plate placing table with rapid cooling function Download PDFInfo
- Publication number
- CN220229621U CN220229621U CN202321982902.0U CN202321982902U CN220229621U CN 220229621 U CN220229621 U CN 220229621U CN 202321982902 U CN202321982902 U CN 202321982902U CN 220229621 U CN220229621 U CN 220229621U
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- Prior art keywords
- cooling
- placing table
- fixedly connected
- intercommunication
- plate
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- 238000001816 cooling Methods 0.000 title claims abstract description 61
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 38
- 238000005507 spraying Methods 0.000 claims abstract description 12
- 238000003860 storage Methods 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000007921 spray Substances 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000011324 bead Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 5
- 230000017525 heat dissipation Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 5
- 238000005457 optimization Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a working thermal physical plate placing table with a rapid cooling function, which comprises a placing table body, wherein a placing plate is fixedly connected to the top of the placing table body, a cooling groove is formed in the placing table body, a calandria is communicated with the bottom of the cooling groove, a water storage groove is communicated with the bottom of the calandria, a short pipe is communicated with the left side of the water storage groove, a water pump is communicated with the left end of the short pipe, a radiating pipe is communicated with the output end of the water pump, a connecting pipe is communicated with the top of the radiating pipe, a water spraying pipe penetrates through the inside of the cooling groove, and a water spraying head is communicated with the surface of the water spraying pipe. The rapid cooling assembly is used for rapidly cooling the plate, the plate with higher temperature can be rapidly cooled, the plate can be reduced to the proper temperature without longer time, longer time is not wasted, and the processing efficiency of the plate is reduced.
Description
Technical Field
The utility model relates to the technical field of work placing tables, in particular to a work thermophysical plate placing table with a rapid cooling function.
Background
The workbench has many advantages, including welding resistance, corrosion resistance, high temperature resistance, good polishing performance and simple structure, so that the workbench is very convenient to use and maintain in the later period.
When depositing the panel after the heat treatment can use to place the platform and deposit the panel, place the platform at present and do not possess quick cooling module, be difficult to carrying out quick cooling to the panel that the temperature is higher, the panel just can reduce to suitable temperature when needing longer, needs extravagant longer time, has reduced the machining efficiency of panel.
Therefore, the placing table needs to be designed and modified, and the phenomenon that the placing table is difficult to cool is effectively prevented.
Disclosure of Invention
In order to solve the problems in the prior art, the utility model aims to provide a working thermal physical board placing table with a rapid cooling function, which has the advantage of rapid cooling and solves the problem of difficult cooling.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a platform is placed to work heat physics panel with quick cooling function, includes places the stage body, place the top fixedly connected with of stage body and place the board, the cooling tank has been seted up to the inside of placing the stage body, the bottom intercommunication in cooling tank has the calandria, the bottom intercommunication of calandria has the aqua storage tank, the left side intercommunication of aqua storage tank has the nozzle stub, the left end intercommunication of nozzle stub has the water pump, the output intercommunication of water pump has the cooling tube, the top intercommunication of cooling tube has the connecting pipe, the top of connecting pipe runs through the inside intercommunication to cooling tank has the spray pipe, the surface intercommunication of spray pipe has the sprinkler bead.
As the preferable mode of the utility model, the left side of the placing table body is provided with a heat dissipation groove, the surface of the heat dissipation pipe is fixedly connected with a heat conduction block, the left side of the heat conduction block is fixedly connected with a semiconductor refrigerating sheet, and the left side of the semiconductor refrigerating sheet is fixedly connected with a heat dissipation fin.
In the present utility model, preferably, the heat dissipation grooves are fixedly connected with heat dissipation fans, and the number of the heat dissipation fans is a plurality of.
As the preferable mode of the utility model, the support frame is fixedly connected in the cooling groove, and the surface of the water spray pipe is fixedly connected at the top of the support frame.
As preferable in the utility model, the bottom of the placement table body is fixedly connected with supporting legs, and the number of the supporting legs is four.
Preferably, the surface of the placing plate is provided with a corrosion-resistant layer, and the number of the water spraying heads is a plurality.
Compared with the prior art, the utility model has the following beneficial effects:
1. the rapid cooling assembly is used for rapidly cooling the plate, the plate with higher temperature can be rapidly cooled, the plate can be reduced to the proper temperature without longer time, longer time is not wasted, and the processing efficiency of the plate is reduced.
2. According to the utility model, the radiating grooves, the heat conducting blocks, the semiconductor refrigerating sheets and the radiating fins are arranged, so that the radiating pipes can be cooled, and the radiating effect of the radiating pipes is improved.
3. According to the utility model, the cooling effect of the semiconductor refrigerating sheet is improved by arranging the cooling fan to cool the semiconductor refrigerating sheet.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of a front cross-section of a placement platform according to the present utility model;
fig. 3 is an enlarged schematic view of fig. 3 a in accordance with the present utility model.
In the figure: 1. placing a table body; 2. placing a plate; 3. a cooling tank; 4. a calandria; 5. a water storage tank; 6. a short pipe; 7. a water pump; 8. a heat radiating pipe; 9. a connecting pipe; 10. a water spray pipe; 11. a water spray head; 12. a heat sink; 13. a heat conduction block; 14. a semiconductor refrigeration sheet; 15. a heat radiation fin; 16. a heat radiation fan; 17. a support frame; 18. and (5) supporting legs.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 3, the working thermal physical board placement table with the rapid cooling function provided by the utility model comprises a placement table body 1, a placement plate 2 is fixedly connected to the top of the placement table body 1, a cooling tank 3 is arranged in the placement table body 1, a calandria 4 is communicated with the bottom of the cooling tank 3, a water storage tank 5 is communicated with the bottom of the calandria 4, a short pipe 6 is communicated with the left side of the water storage tank 5, a water pump 7 is communicated with the left end of the short pipe 6, a radiating pipe 8 is communicated with the output end of the water pump 7, a connecting pipe 9 is communicated with the top of the radiating pipe 8, a water spraying pipe 10 is communicated with the inside of the cooling tank 3 by penetrating through the top of the connecting pipe 9, and a water spraying head 11 is communicated with the surface of the water spraying pipe 10.
Referring to fig. 3, a heat dissipation groove 12 is formed in the left side of the placement table body 1, a heat conduction block 13 is fixedly connected to the surface of the heat dissipation tube 8, a semiconductor refrigerating plate 14 is fixedly connected to the left side of the heat conduction block 13, and heat dissipation fins 15 are fixedly connected to the left side of the semiconductor refrigerating plate 14.
As a technical optimization scheme of the utility model, the radiating tube 8 can be cooled by arranging the radiating groove 12, the heat conducting block 13, the semiconductor refrigerating sheet 14 and the radiating fins 15, so that the radiating effect of the radiating tube 8 is improved.
Referring to fig. 2, the heat dissipation fans 16 are fixedly connected to the inside of the heat dissipation groove 12, and the number of the heat dissipation fans 16 is several.
As a technical optimization scheme of the utility model, the cooling effect of the semiconductor refrigerating sheet 14 is improved by arranging the cooling fan 16 to cool the semiconductor refrigerating sheet 14.
Referring to fig. 2, the cooling tank 3 is fixedly connected with a support frame 17, and the surface of the water spray pipe 10 is fixedly connected to the top of the support frame 17.
As a technical optimization scheme of the utility model, the water spray pipe 10 can be supported by arranging the supporting frame 17, so that the stability of the water spray pipe 10 is improved.
Referring to fig. 1, the bottom of the placement table body 1 is fixedly connected with support legs 18, and the number of the support legs 18 is four.
As a technical optimization scheme of the utility model, the placement table body 1 can be supported by arranging the supporting legs 18, so that the stability of the placement table body 1 is improved.
Referring to fig. 2, the surface of the placement plate 2 is provided with a corrosion-resistant layer, and the number of sprinkler heads 11 is several.
As a technical optimization scheme of the utility model, the corrosion-resistant layer is arranged, so that the placing plate 2 can be prevented from being corroded, and the service life of the placing plate 2 is prolonged.
The working principle and the using flow of the utility model are as follows: when the cooling device is used, when a plate needs to be cooled, the water pump 7 is started, the water pump 7 conveys water in the water storage tank 5 to the inside of the water spraying pipe 10 through the cooling pipe 8 and the connecting pipe 9, the water spraying pipe 10 cools the placing plate 2 and the plate through the water spraying head 11, cooled water flows back to the water storage tank 5 through the calandria 4, meanwhile, the semiconductor refrigerating sheet 14 cools the cooling pipe 8 through the heat conducting block 13, and the cooling fan 16 cools the semiconductor refrigerating sheet 14 through the heat conducting fin 15, so that the effect of rapid cooling can be achieved.
To sum up: this work hot physics panel with quick cooling function places platform through utilizing quick cooling module to carry out quick cooling to panel, can carry out quick cooling to the panel that the temperature is higher, does not need longer can reduce panel to suitable temperature, does not need extravagant longer time, has reduced the machining efficiency of panel, has solved the problem that is difficult to the cooling.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The working thermal physical plate placing table with the rapid cooling function comprises a placing table body (1), wherein a placing plate (2) is fixedly connected to the top of the placing table body (1);
the method is characterized in that: the cooling tank (3) has been seted up to the inside of placing table body (1), the bottom intercommunication of cooling tank (3) has calandria (4), the bottom intercommunication of calandria (4) has aqua storage tank (5), the left side intercommunication of aqua storage tank (5) has nozzle stub (6), the left end intercommunication of nozzle stub (6) has water pump (7), the output intercommunication of water pump (7) has cooling tube (8), the top intercommunication of cooling tube (8) has connecting pipe (9), the top of connecting pipe (9) runs through to the inside intercommunication of cooling tank (3) has spray pipe (10), the surface intercommunication of spray pipe (10) has sprinkler bead (11).
2. A work thermophysical sheet material placing table with a rapid cooling function as claimed in claim 1, wherein: the cooling device is characterized in that a cooling groove (12) is formed in the left side of the placing table body (1), a heat conducting block (13) is fixedly connected to the surface of the cooling tube (8), a semiconductor cooling sheet (14) is fixedly connected to the left side of the heat conducting block (13), and cooling fins (15) are fixedly connected to the left side of the semiconductor cooling sheet (14).
3. A work thermophysical sheet material placing table with a rapid cooling function as claimed in claim 2, wherein: and the inside of the radiating groove (12) is fixedly connected with radiating fans (16), and the number of the radiating fans (16) is a plurality of.
4. A work thermophysical sheet material placing table with a rapid cooling function as claimed in claim 1, wherein: the cooling tank (3) is fixedly connected with a supporting frame (17), and the surface of the water spraying pipe (10) is fixedly connected to the top of the supporting frame (17).
5. A work thermophysical sheet material placing table with a rapid cooling function as claimed in claim 1, wherein: the bottom of the placing table body (1) is fixedly connected with supporting legs (18), and the number of the supporting legs (18) is four.
6. A work thermophysical sheet material placing table with a rapid cooling function as claimed in claim 1, wherein: the surface of the placing plate (2) is provided with a corrosion-resistant layer, and the number of the water spraying heads (11) is a plurality of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321982902.0U CN220229621U (en) | 2023-07-26 | 2023-07-26 | Working thermal physical plate placing table with rapid cooling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321982902.0U CN220229621U (en) | 2023-07-26 | 2023-07-26 | Working thermal physical plate placing table with rapid cooling function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220229621U true CN220229621U (en) | 2023-12-22 |
Family
ID=89187926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321982902.0U Active CN220229621U (en) | 2023-07-26 | 2023-07-26 | Working thermal physical plate placing table with rapid cooling function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220229621U (en) |
-
2023
- 2023-07-26 CN CN202321982902.0U patent/CN220229621U/en active Active
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