CN220720000U

CN220720000U - Mold cooling mechanism

Info

Publication number: CN220720000U
Application number: CN202322452037.5U
Authority: CN
Inventors: 陈海振
Original assignee: Liaoning Jianzhu Vocational College
Current assignee: Liaoning Jianzhu Vocational College
Priority date: 2023-09-11
Filing date: 2023-09-11
Publication date: 2024-04-05
Anticipated expiration: 2033-09-11

Abstract

The utility model discloses a mold cooling mechanism which comprises a workbench, a flow divider, a water pump, a connecting pipe, an upper module and a lower module, wherein the flow divider is fixedly connected to the top of the inner wall of the workbench, the lower module is fixedly connected to the top of the flow divider, and the water pump is fixedly connected to the bottom of the inner wall of the workbench. According to the cooling mechanism, the water pump is arranged, the cooling liquid is conveyed to the connecting pipe through the water pump when the cooling mechanism is used, then the cooling liquid is conveyed to the flow divider through the connecting pipe, the cooling liquid is conveyed to the bottom of the lower module through the flow divider to cool the lower module, the problems that the cooling liquid can be cooled down due to the fact that the cooling liquid can be cooled down rapidly after heat absorption of the lower module in the existing cooling mechanism, the cooling liquid can be continuously heated up when the cooling mechanism is used, the cooling effect is gradually deteriorated, and the cooling cannot be stably carried out when the cooling mechanism is used are solved.

Description

Mold cooling mechanism

Technical Field

The utility model relates to the technical field of dies, in particular to a die cooling mechanism.

Background

In the process of mold forming, the cooling time of the mold occupies more than two thirds of the whole mold forming period, the effective cooling loop can reduce the cooling time, improve the production efficiency, and even cooling can reduce the residual stress generated by uneven heat transfer, thereby controlling the warping of a finished product, maintaining the accuracy and stability of the size of the product, and further improving the quality of the product.

The prior Chinese patent with the patent number of CN202023004822.7 discloses a cooling mechanism for a die, and belongs to the field of die processing equipment. The cooling device comprises a water inlet, a cooling pipe groove, a water outlet and a cooling pipe, wherein the water inlet is formed in the center of the liquid dispenser, a plurality of liquid dispensing channels communicated with the water inlet are formed in the liquid dispenser, the cooling pipe groove is formed in one end of each liquid dispensing channel, the water outlet is formed in the diagonal corner of the liquid dispenser, the water outlet pipe is arranged in the water outlet, the cooling pipe is arranged in the cooling groove, and penetrates through the top of the liquid dispenser and extends into a downward module, and the cooling pipe is communicated in the downward module. According to the utility model, the cooling pipes are uniformly distributed below the forming cavity of the lower module through the liquid distributor, so that the die can be uniformly cooled, and one end of the water outlet pipe extends into the water storage tank through the water outlet pipe connected to one side of the cooling pipe in the horizontal direction, so that the cooling medium can be returned into the water storage tank again for recycling.

The existing cooling mechanism water can dissipate heat of the lower module, but cooling liquid which cannot absorb heat is quickly cooled, so that the temperature of the cooling liquid can be continuously increased when the cooling mechanism water is used, the cooling effect is gradually deteriorated, and the cooling cannot be stably performed when the cooling mechanism water is used.

Disclosure of Invention

In order to solve the problems in the prior art, the utility model aims to provide a mold cooling mechanism, which has the advantage of cooling a cooling liquid, and solves the problems that the cooling liquid can be cooled down continuously when in use, the cooling liquid temperature is gradually deteriorated, and the cooling liquid can not be cooled down stably when in use because the cooling liquid can not absorb heat for cooling down rapidly although the cooling liquid can be cooled down to the lower module in the prior cooling mechanism.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a mould cooling mechanism, includes workstation, shunt, water pump, connecting pipe, goes up module and lower module, shunt fixed connection is at the top of workstation inner wall, lower module fixed connection is at the top of shunt, water pump fixed connection is in the bottom of workstation inner wall, the top at the water pump is fixed to the connecting pipe intercommunication, the top of connecting pipe is linked together with the inner wall of shunt, the left bottom fixedly connected with coolant circulation mechanism of workstation inner wall.

As the preferable mode of the utility model, the cooling liquid circulation mechanism comprises a box body, wherein the box body is fixedly connected to the bottom of the inner wall of the workbench, the top of the right side of the box body is fixedly communicated with a drain pipe, the other end of the drain pipe is communicated with the left side of the inner wall of the lower module, and the bottom of the right side of the box body is fixedly communicated with a small water pump.

As the preferable mode of the utility model, the inner wall of the box body is fixedly connected with a cooling block, the right side of the cooling block is fixedly connected with a heat conducting plate, and the heat conducting plate is made of copper.

Preferably, the right side of the heat conducting plate is fixedly connected with a semiconductor, and the right side of the semiconductor is fixedly connected with a cooling fan.

As the preferable mode of the utility model, the top of the small water pump is fixedly communicated with a pipeline, the other end of the pipeline is fixedly communicated with a water storage tank, and the bottom of the right side of the water storage tank is communicated with the bottom of the connecting pipe.

As the preferable mode of the utility model, the surface of the cooling block and the surface of the heat conducting plate are respectively provided with a plurality of through holes which are distributed equidistantly.

As the preferable mode of the utility model, the top of the right side of the semiconductor is fixedly connected with a plurality of radiating fins which are distributed in an annular equidistant manner.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the cooling mechanism, the water pump is arranged, the cooling liquid is conveyed to the connecting pipe through the water pump when the cooling mechanism is used, then the cooling liquid is conveyed to the flow divider through the connecting pipe, the cooling liquid is conveyed to the bottom of the lower module through the flow divider to cool the lower module, the problems that the cooling liquid can be cooled down due to the fact that the cooling liquid can be cooled down rapidly after heat absorption of the lower module in the existing cooling mechanism, the cooling liquid can be continuously heated up when the cooling mechanism is used, the cooling effect is gradually deteriorated, and the cooling cannot be stably carried out when the cooling mechanism is used are solved.

2. According to the utility model, the cooling liquid circulation mechanism is arranged, so that the cooling liquid after absorbing heat can be conveyed into the box body through the water drain pipe when the cooling liquid is used, and can fall onto the cooling block in the falling process, and the cooling block absorbs the heat of the cooling liquid, so that the effect of rapidly cooling the cooling liquid is achieved.

3. According to the utility model, the cooling block and the heat conducting plate are arranged, the semiconductor is used for refrigerating, and then the heat conducting plate is used for transmitting temperature to the cooling block, so that the refrigerating area is increased, and the cooling speed of the cooling liquid is higher.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic view of a three-dimensional cross-sectional structure of the present utility model;

fig. 3 is an enlarged schematic view of fig. 2 a according to the present utility model.

In the figure: 1. a work table; 2. a shunt; 3. a water pump; 4. a connecting pipe; 5. an upper module; 6. a lower module; 7. a cooling liquid circulation mechanism; 71. a case; 72. a drain pipe; 73. a small water pump; 8. a cooling block; 9. a heat conductive plate; 10. a semiconductor; 11. a heat radiation fan; 12. a pipe; 13. a water storage tank; 14. a through hole; 15. a heat sink.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 3, the mold cooling mechanism provided by the utility model comprises a workbench 1, a flow divider 2, a water pump 3, a connecting pipe 4, an upper module 5 and a lower module 6, wherein the flow divider 2 is fixedly connected to the top of the inner wall of the workbench 1, the lower module 6 is fixedly connected to the top of the flow divider 2, the water pump 3 is fixedly connected to the bottom of the inner wall of the workbench 1, the connecting pipe 4 is fixedly connected to the top of the water pump 3, the top of the connecting pipe 4 is communicated with the inner wall of the flow divider 2, and the bottom of the left side of the inner wall of the workbench 1 is fixedly connected with a cooling liquid circulating mechanism 7.

Referring to fig. 2, the cooling liquid circulation mechanism 7 includes a box 71, the box 71 is fixedly connected to the bottom of the inner wall of the workbench 1, a drain pipe 72 is fixedly connected to the top of the right side of the box 71, the other end of the drain pipe 72 is communicated with the left side of the inner wall of the lower module 6, and a small water pump 73 is fixedly connected to the bottom of the right side of the box 71.

As a technical optimization scheme of the utility model, through arranging the cooling liquid circulation mechanism 7, the cooling liquid after absorbing heat can be conveyed into the box 71 through the drain pipe 72 when in use, and can fall onto the cooling block 8 in the falling process of the cooling liquid, and the cooling block 8 absorbs the heat of the cooling liquid, so that the effect of quickly cooling the cooling liquid is achieved.

Referring to fig. 2, a cooling block 8 is fixedly connected to an inner wall of the case 71, a heat conducting plate 9 is fixedly connected to a right side of the cooling block 8, and the heat conducting plate 9 is made of copper.

As a technical optimization scheme of the utility model, the cooling block 8 and the heat conducting plate 9 are arranged, the semiconductor 10 is used for refrigerating, and then the heat conducting plate 9 is used for transmitting temperature to the cooling block 8, so that the refrigerating area is increased, and the cooling liquid is cooled more rapidly.

Referring to fig. 2, a semiconductor 10 is fixedly connected to the right side of the heat conductive plate 9, and a heat radiation fan 11 is fixedly connected to the right side of the semiconductor 10.

As a technical optimization scheme of the utility model, the semiconductor 10 and the cooling fan 11 are arranged, so that the semiconductor 10 is refrigerated during use, then the heat is quickly transferred to the cooling block 8 through the heat conducting plate 9, a large amount of heat exists on the right side in the refrigerating process of the semiconductor 10, and the semiconductor 10 is cooled through the cooling fan 11, so that the semiconductor cooling device is more stable during use.

Referring to fig. 2, the top of the small water pump 73 is fixedly connected with a pipeline 12, the other end of the pipeline 12 is fixedly connected with a water storage tank 13, and the bottom of the right side of the water storage tank 13 is communicated with the bottom of the connecting pipe 4.

As a technical optimization scheme of the utility model, through arranging the pipeline 12 and the water storage tank 13, the cooling liquid cooled at the bottom of the tank body 71 is pumped out through the small water pump 73, is conveyed to the water storage tank 13 through the pipeline 12, and then is stored and insulated through the water storage tank 13, so that the influence of external temperature on the temperature of the cooling liquid is avoided.

Referring to fig. 2, through holes 14 are formed on the surface of the cooling block 8 and the surface of the heat conducting plate 9, the through holes 14 are provided with a plurality of through holes 14, and the through holes 14 are equidistantly distributed.

As a technical optimization scheme of the utility model, through the arrangement of the through holes 14, the cooling time of the cooling liquid can be prolonged when the cooling liquid passes through the through holes 14, and meanwhile, the cooling liquid can be split by the plurality of through holes 14, so that the cooling efficiency and speed are improved.

Referring to fig. 2, a heat sink 15 is fixedly connected to the top of the right side of the semiconductor 10, the heat sink 15 is provided with a plurality of heat sinks 15, and the plurality of heat sinks 15 are distributed in an annular equidistant manner.

As a technical optimization scheme of the utility model, the heat of the semiconductor 10 can be quickly absorbed through the heat radiating fins 15 by arranging the heat radiating fins 15, and then the heat is transferred to the surrounding air, so that a better heat radiating effect can be achieved by matching with the heat radiating fan 11.

The working principle and the using flow of the utility model are as follows: the utility model provides a cooling liquid is carried to connecting pipe 4 through water pump 3 when using, then carry the cooling liquid to the shunt 2 through connecting pipe 4, carry the cooling liquid to the bottom of module 6 down through shunt 2 and cool down module 6, in carrying the cooling liquid after the heat absorption to box 71 through drain pipe 72 when using, can fall on cooling block 8 in the in-process that the cooling liquid falls, absorb the heat of cooling liquid through cooling block 8, reach the effect to cooling liquid rapid cooling, refrigerate through semiconductor 10, then pass through heat-conducting plate 9 and pass through the temperature to cooling block 8, increase refrigerated area, make the cooling liquid at the speed of cooling faster, pass through semiconductor 10 refrigeration when using, then pass through heat-conducting plate 9 and pass through fast to cooling block 8, there is a large amount of heat on the right side at the in the refrigerated in-process of semiconductor 10, through radiator fan 11 carries out the heat dissipation, can make more stable when using, can take out the cooling liquid after cooling down the bottom of box 71 through small-size water pump 73, carry through pipeline 12 to 13, then pass through storage tank 13 and store the cooling liquid and carry out the effect of cooling liquid and the cooling liquid and can avoid the cooling liquid to influence the cooling liquid to the cooling liquid through the thermal insulation through-hole 14 when cooling fan 14, can cool down the cooling liquid through the thermal insulation effect to the thermal insulation through the thermal insulation plate 14, can reach the thermal insulation effect, and the cooling tank is more than the cooling liquid, and cooling effect is cooled down through the thermal insulation through the cooling plate 14, and can be cooled down time is more than the thermal insulation, and the thermal insulation effect is cooled down through the cooling plate 14.

To sum up: this mould cooling mechanism, through setting up water pump 3, carry coolant liquid to connecting pipe 4 through water pump 3 when using, then carry coolant liquid to shunt 2 through connecting pipe 4 in, carry coolant liquid to the bottom of module 6 down through shunt 2 and cool down module 6, solved current cooling mechanism water although can dispel the heat to module down, but the coolant liquid after unable heat absorption carries out quick cooling, lead to the temperature of coolant liquid can continuously rise when using, lead to the effect of cooling to worsen gradually, unable stable radiating problem when using.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a mould cooling mechanism, includes workstation, shunt, water pump, connecting pipe, goes up module and lower module, its characterized in that: the utility model discloses a cooling device, including work bench inner wall, lower module, connecting pipe, water pump, connecting pipe, shunt, coolant circulation mechanism, connecting pipe, lower module fixed connection is at the top of work bench inner wall, lower module fixed connection is at the top of shunt, water pump fixed connection is at the bottom of work bench inner wall, the top of connecting pipe is linked together with the inner wall of shunt, the left bottom fixedly connected with coolant circulation mechanism of work bench inner wall.

2. A mold cooling mechanism as recited in claim 1, wherein: the cooling liquid circulation mechanism comprises a box body, the bottom at the workstation inner wall is fixedly connected to the box body, the top on box body right side is fixed to be linked together and is had the drain pipe, the other end of drain pipe is linked together with the left side of lower module inner wall, the fixed intercommunication in box body right side bottom has small-size water pump.

3. A mold cooling mechanism as recited in claim 2, wherein: the inner wall fixedly connected with cooling block of box, the right side fixedly connected with heat conduction board of cooling block, the material of heat conduction board is copper.

4. A mold cooling mechanism according to claim 3, wherein: the right side of the heat conducting plate is fixedly connected with a semiconductor, and the right side of the semiconductor is fixedly connected with a cooling fan.

5. A mold cooling mechanism according to claim 3, wherein: the top of the small water pump is fixedly communicated with a pipeline, the other end of the pipeline is fixedly communicated with a water storage tank, and the bottom of the right side of the water storage tank is communicated with the bottom of the connecting pipe.

6. A mold cooling mechanism according to claim 3, wherein: through holes are formed in the surface of the cooling block and the surface of the heat conducting plate, a plurality of through holes are formed in the through holes, and the through holes are distributed at equal intervals.

7. A mold cooling mechanism as recited in claim 4, wherein: the top fixedly connected with fin on semiconductor right side, the fin is provided with a plurality of, and a plurality of fin is annular equidistance and distributes.