CN214982985U - Water cooling device for injection mold - Google Patents
Water cooling device for injection mold Download PDFInfo
- Publication number
- CN214982985U CN214982985U CN202121232715.1U CN202121232715U CN214982985U CN 214982985 U CN214982985 U CN 214982985U CN 202121232715 U CN202121232715 U CN 202121232715U CN 214982985 U CN214982985 U CN 214982985U
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- CN
- China
- Prior art keywords
- injection mold
- water tank
- cooling
- communicated
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 66
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 238000002347 injection Methods 0.000 title claims abstract description 39
- 239000007924 injection Substances 0.000 title claims abstract description 39
- 239000000110 cooling liquid Substances 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 238000009826 distribution Methods 0.000 claims abstract description 10
- 238000005057 refrigeration Methods 0.000 claims abstract description 10
- 239000007921 spray Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 8
- 238000005457 optimization Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000779 smoke Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Abstract
The utility model discloses a water cooling plant that injection mold used, including the bottom plate, the left side fixed mounting at bottom plate top has the injection mold body, and the guiding gutter has been seted up to the inside of injection mold body, the right side fixedly connected with water tank at bottom plate top, and the left side fixed mounting of water tank inner wall bottom has the immersible pump, and the output intercommunication of immersible pump has the flow distribution box, and the left side intercommunication of flow distribution box has the output tube, and the left side of output tube runs through to the left side of water tank and through the bottom intercommunication of joint with the guiding gutter. The utility model discloses a set up bottom plate, injection mold body, guiding gutter, water tank, immersible pump, flow distribution box, output tube, flow distribution box, cooling tube, collecting box, semiconductor refrigeration piece, fin, radiator fan and cooling liquid's cooperation and use, solved current injection mold in use and need cool off the cooling, all at present be the forced air cooling to its cooling, the cooling effect is poor, the cooling time is longer, the problem that the person of not being convenient for used.
Description
Technical Field
The utility model relates to an injection mold technical field specifically is a water cooling plant that injection mold used.
Background
Injection mold is the instrument that uses in the production of an injection molding, but present injection mold in use need cool off, all is forced air cooling to its cooling at present, and the cooling effect is poor, and the cooling time is longer, and the person of not being convenient for uses, has reduced injection mold's practicality.
SUMMERY OF THE UTILITY MODEL
For solving the problem that provides in the above-mentioned background art, the utility model aims to provide a water cooling plant that injection mold used has possessed water-cooled advantage, has solved current injection mold in use and need carry out cooling, all is forced air cooling to its cooling at present, and the cooling effect is poor, and the cooling time is longer, the problem that the person of not being convenient for used.
In order to achieve the above object, the utility model provides a following technical scheme: a water cooling device for an injection mold comprises a bottom plate, wherein an injection mold body is fixedly arranged on the left side of the top of the bottom plate, a diversion trench is formed in the injection mold body, a water tank is fixedly connected to the right side of the top of the bottom plate, a submersible pump is fixedly arranged on the left side of the bottom of the inner wall of the water tank, the output end of the submersible pump is communicated with a diversion box, an output pipe is communicated with the left side of the diversion box, the left side of the output pipe penetrates through the left side of the water tank and is communicated with the bottom end of the diversion trench through a joint, a diversion box is fixedly connected to the left side of the top of the water tank, the left side of the diversion box is communicated with the top end of the diversion trench through a joint, a radiating pipe is communicated with the right side of the diversion box, a collecting box positioned on the right side of the top of the water tank is communicated with the top of the water tank through a connecting pipe, the right side fixedly connected with semiconductor refrigeration piece of water tank, the right side fixed mounting of semiconductor refrigeration piece has the fin, the right side fixedly connected with radiator fan of fin, the inside of water tank is provided with cooling liquid.
As the utility model discloses it is preferred, the top of reposition of redundant personnel case is provided with the supporting network, the top fixedly connected with fan of supporting network.
As the utility model discloses preferred, the top intercommunication of reposition of redundant personnel box has the cooling tube, the top of cooling tube runs through to the top of supporting network and communicates there is the shower nozzle.
As the utility model discloses it is preferred, the top intercommunication of water tank has the outlet, the quantity in outlet is a plurality of.
As the utility model discloses preferred, the quantity of fan is four, and four fan evenly distributed.
As the utility model discloses it is preferred, the quantity of cooling tube is a plurality of, and a plurality of cooling tube is copper metal and makes.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up the bottom plate, the injection mold body, the guiding gutter, the water tank, the immersible pump, the flow distribution box, the output tube, the flow distribution box, the cooling tube, the collecting box, the semiconductor refrigeration piece, the fin, radiator fan and cooling liquid's cooperation is used, it needs to cool off the cooling to have solved current injection mold in use, all be forced air cooling to its cooling at present, the cooling effect is poor, the cooling time is longer, the problem that the person of not being convenient for uses, this water cooling plant that injection mold used, water-cooled advantage has been possessed, injection mold's practicality has been improved.
2. The utility model discloses a setting of supporting network can support the fan, the effectual stability that improves the fan, and convenient to use person uses.
3. The utility model discloses a setting of cooling tube can be through the shower nozzle to the surface spray water smoke of cooling tube, can cool down the cooling tube, the effectual practicality that improves the shower nozzle.
4. The utility model discloses a setting in outlet can flow back the inside of water tank, the loss of effectual reduction cooling liquid, convenient to use person uses with shower nozzle spun water smoke.
5. The utility model discloses a setting of fan can cool down the cooling tube, the effectual practicality that improves the cooling tube, and convenient to use person uses.
6. The utility model discloses a set up the quantity of cooling tube into a plurality of, can cool down by the efficient, the effectual radiating effect that has improved, convenient to use person uses.
Drawings
FIG. 1 is a front view of the structure of the present invention;
FIG. 2 is a front sectional view of the water tank of the present invention;
fig. 3 is a perspective view of the structure flow distribution box of the present invention.
In the figure: 1. a base plate; 2. an injection mold body; 3. a diversion trench; 4. a water tank; 5. a submersible pump; 6. a shunt box; 7. an output pipe; 8. a shunt box; 9. a radiating pipe; 10. a collection box; 11. a semiconductor refrigeration sheet; 12. a heat sink; 13. a heat radiation fan; 14. cooling liquid; 15. a support net; 16. a fan; 17. a cooling pipe; 18. a spray head; 19. and a water outlet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in FIGS. 1 to 3, the water cooling device for injection mold provided by the utility model comprises a bottom plate 1, an injection mold body 2 is fixedly arranged on the left side of the top of the bottom plate 1, a diversion trench 3 is arranged in the injection mold body 2, a water tank 4 is fixedly connected on the right side of the top of the bottom plate 1, a submersible pump 5 is fixedly arranged on the left side of the bottom of the inner wall of the water tank 4, the output end of the submersible pump 5 is communicated with a diversion box 6, the left side of the diversion box 6 is communicated with an output pipe 7, the left side of the output pipe 7 penetrates to the left side of the water tank 4 and is communicated with the bottom end of the diversion trench 3 through a joint, a diversion box 8 is fixedly connected on the left side of the top of the water tank 4, the left side of the diversion box 8 is communicated with the top end of the diversion trench 3 through a joint, the right side of the diversion box 8 is communicated with a heat radiation pipe 9, the right side of the heat radiation pipe 9 is communicated with a collection box 10 positioned on the right side of the top of the water tank 4, the top of collecting box 10 passes through the connecting pipe and communicates with the top of water tank 4, and the right side fixedly connected with semiconductor refrigeration piece 11 of water tank 4, the right side fixed mounting of semiconductor refrigeration piece 11 has fin 12, and the right side fixedly connected with radiator fan 13 of fin 12, the inside of water tank 4 is provided with cooling liquid 14.
Referring to fig. 1, a support net 15 is disposed on the top of the flow dividing box 8, and a fan 16 is fixedly connected to the top of the support net 15.
As the utility model discloses a technical optimization scheme, through the setting of supporting network 15, can support fan 16, the effectual stability that has improved fan 16, convenient to use person uses.
Referring to fig. 1, the top of the diversion box 6 is communicated with a cooling pipe 17, and the top of the cooling pipe 17 penetrates through the top of the supporting net 15 and is communicated with a spray head 18.
As the utility model discloses a technical optimization scheme, through cooling tube 17's setting, can be through 18 surface spray water smoke to cooling tube 9 of shower nozzle, can cool down cooling tube 17, the effectual practicality that improves shower nozzle 18.
Referring to fig. 2, the top of the water tank 4 is communicated with a plurality of water outlets 19, and the number of the water outlets 19 is several.
As a technical optimization scheme of the utility model, through outlet 19's setting, can flow back 18 spun water smoke of shower nozzle to the inside of water tank 4, effectual reduction cooling liquid 14's loss, convenient to use person uses.
Referring to fig. 1, the number of the fans 16 is four, and the four fans 16 are evenly distributed.
As the utility model discloses a technical optimization scheme, through fan 16's setting, can cool down cooling tube 9, the effectual practicality that improves cooling tube 9, the user of being convenient for uses.
Referring to fig. 1, the number of the heat pipes 9 is several, and the heat pipes 9 are made of copper metal.
As the utility model discloses a technical optimization scheme sets up to a plurality of through the quantity with cooling tube 9, can cool down by the efficient, the effectual radiating effect that has improved, convenient to use person uses.
The utility model discloses a theory of operation and use flow: when the cooling device is used, when a user needs to cool the injection mold body 2, the user firstly starts the cooling fan 13, the submersible pump 5 and the semiconductor refrigerating sheet 11, the semiconductor refrigerating sheet 11 cools the surface of the water tank 4, then heat cools the cooling liquid 14 in the water tank 4 through heat transfer, the output end of the submersible pump 5 transmits the cooling liquid 14 to the inside of the shunting box 6, then the cooling liquid is conveyed to the inside of the diversion groove 3 through the output pipe 7 to cool the injection mold body 2, then the cooling liquid 14 circulates to the inside of the diversion box 8 in the diversion groove 3, the cooling liquid 14 is shunted through the radiating pipe 9, the surface of the radiating pipe 9 is sprayed with water mist through the cooling pipe 17 and the spray head 18 to cool, the user starts the fan 16 to cool the surface of the radiating pipe 9, and the cooling liquid 14 flows back to the inside of the water tank 4 through the collecting box 10, the cooling liquid 14 in the water tank 4 is kept at a low temperature, thereby achieving the water cooling effect.
To sum up: this water cooling plant that injection mold used, through setting up bottom plate 1, the injection mold body 2, guiding gutter 3, water tank 4, immersible pump 5, flow distribution box 6, output tube 7, flow distribution box 8, cooling tube 9, collecting box 10, semiconductor refrigeration piece 11, fin 12, radiator fan 13 and cooling liquid 14's cooperation is used, it need cool down to have solved current injection mold in use, all at present the forced air cooling is to its cooling, the cooling effect is poor, the cooling time is longer, the problem that the user of not being convenient for used.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a water cooling plant that injection mold used, includes bottom plate (1), its characterized in that: the injection mold comprises a bottom plate (1), an injection mold body (2) is fixedly mounted on the left side of the top of the bottom plate (1), a diversion trench (3) is formed in the injection mold body (2), a water tank (4) is fixedly connected to the right side of the top of the bottom plate (1), a submersible pump (5) is fixedly mounted on the left side of the bottom of the inner wall of the water tank (4), an output end of the submersible pump (5) is communicated with a diversion box (6), an output pipe (7) is communicated with the left side of the diversion box (6), the left side of the output pipe (7) penetrates through the left side of the water tank (4) and is communicated with the bottom end of the diversion trench (3) through a joint, a diversion box (10) is fixedly connected to the left side of the top of the water tank (4), the left side of the diversion box (8) is communicated with the top end of the diversion trench (3) through a joint, a heat dissipation pipe (9) is communicated with the right side of the diversion box (8), and a collection box (10) is communicated with the right side of the top of the heat dissipation pipe (9), the top of collecting box (10) is passed through the top intercommunication of connecting pipe with water tank (4), the right side fixedly connected with semiconductor refrigeration piece (11) of water tank (4), the right side fixed mounting of semiconductor refrigeration piece (11) has fin (12), the right side fixedly connected with radiator fan (13) of fin (12), the inside of water tank (4) is provided with cooling liquid (14).
2. The water cooling device for an injection mold according to claim 1, characterized in that: the top of reposition of redundant personnel case (8) is provided with supporting network (15), the top fixedly connected with fan (16) of supporting network (15).
3. The water cooling device for an injection mold according to claim 2, characterized in that: the top of the flow distribution box (6) is communicated with a cooling pipe (17), and the top of the cooling pipe (17) penetrates through the top of the supporting net (15) and is communicated with a spray head (18).
4. The water cooling device for an injection mold according to claim 1, characterized in that: the top of the water tank (4) is communicated with a plurality of water outlets (19).
5. The water cooling device for an injection mold according to claim 1, characterized in that: the number of the fans (16) is four, and the four fans (16) are uniformly distributed.
6. The water cooling device for an injection mold according to claim 1, characterized in that: the number of the radiating pipes (9) is a plurality, and the radiating pipes (9) are all made of copper metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121232715.1U CN214982985U (en) | 2021-06-03 | 2021-06-03 | Water cooling device for injection mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121232715.1U CN214982985U (en) | 2021-06-03 | 2021-06-03 | Water cooling device for injection mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214982985U true CN214982985U (en) | 2021-12-03 |
Family
ID=79086067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121232715.1U Expired - Fee Related CN214982985U (en) | 2021-06-03 | 2021-06-03 | Water cooling device for injection mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214982985U (en) |
-
2021
- 2021-06-03 CN CN202121232715.1U patent/CN214982985U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211203 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |