CN216752595U - Heat radiation structure for high-speed nanosecond level switch - Google Patents
Heat radiation structure for high-speed nanosecond level switch Download PDFInfo
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- CN216752595U CN216752595U CN202220096350.2U CN202220096350U CN216752595U CN 216752595 U CN216752595 U CN 216752595U CN 202220096350 U CN202220096350 U CN 202220096350U CN 216752595 U CN216752595 U CN 216752595U
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Abstract
The utility model discloses a heat dissipation structure for a high-speed nanosecond switch, which comprises the high-speed nanosecond switch, wherein a protection box is fixedly connected to the left side of the high-speed nanosecond switch, a fan is fixedly connected to the right side of the inner wall of the protection box, a water tank is fixedly connected to the bottom of the left side of the high-speed nanosecond switch, the right side of the water tank penetrates through the inside of the high-speed nanosecond switch, a heat conduction pipe is arranged inside the water tank, and the output end of the fan penetrates through the inside of the water tank and is communicated with the top of the heat conduction pipe. The high-speed nanosecond switch is matched with the high-speed nanosecond switch, the protective box, the fan, the water tank, the heat conduction pipe, the flow distribution box, the spray head, the semiconductor refrigeration piece, the heat dissipation block and the fan, so that the problems that the existing high-speed nanosecond switch does not have a heat dissipation structure, natural cooling is carried out through air, the heat dissipation effect is poor, and the use by a user is inconvenient are solved.
Description
Technical Field
The utility model relates to the technical field of high-speed nanosecond switches, in particular to a heat dissipation structure for a high-speed nanosecond switch.
Background
High-speed nanosecond level switch can be used in industry, but the existing high-speed nanosecond level switch does not have a heat dissipation structure, and is naturally cooled through air, so that the heat dissipation effect is poor, and the high-speed nanosecond level switch is not convenient for a user to use.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems in the background art, the present invention is directed to a heat dissipation structure for a high-speed nanosecond switch, which has the advantage of heat dissipation, and solves the problems that the existing high-speed nanosecond switch does not have a heat dissipation structure, and is naturally cooled by air, so that the heat dissipation effect is poor, and the use is inconvenient for a user.
In order to achieve the purpose, the utility model provides the following technical scheme: a heat dissipation structure for a high-speed nanosecond switch comprises the high-speed nanosecond switch, a protection box is fixedly connected to the left side of the high-speed nanosecond switch, a fan is fixedly connected to the right side of the inner wall of the protection box, a water tank is fixedly connected to the left bottom of the high-speed nanosecond switch, the right side of the water tank penetrates through the inside of the high-speed nanosecond switch, a heat conduction pipe is arranged inside the water tank, the output end of the fan penetrates through the inside of the water tank and is communicated with the top of the heat conduction pipe, a shunting box is fixedly connected to the left side of the bottom of the inner wall of the high-speed nanosecond switch, a nozzle is communicated with the right side of the shunting box, the right side of the heat conduction pipe penetrates through the right side of the water tank and is communicated with the left side of the shunting box, a semiconductor refrigeration piece is fixedly connected to the left side of the water tank, and a heat dissipation block is fixedly connected to the left side of the semiconductor refrigeration piece, and the left side of the heat dissipation block is fixedly connected with a fan.
Preferably, the top of the protective box is fixedly connected with a protective cover, and the protective cover is matched with the input end of the fan for use.
Preferably, a protective net is fixedly connected to the left side of the fan, and the protective net is made of metal.
Preferably, the right side of the high-speed nanosecond switch is provided with a plurality of heat dissipation ports.
Preferably, the number of the spray heads is several, and the several spray heads are uniformly distributed in a straight line.
In the present invention, the heat transfer pipe is preferably made of copper, and the diameter of the heat transfer pipe is preferably five millimeters.
Compared with the prior art, the utility model has the following beneficial effects:
1. the high-speed nanosecond switch is matched with the high-speed nanosecond switch, the protective box, the fan, the water tank, the heat conduction pipe, the flow distribution box, the spray head, the semiconductor refrigeration piece, the heat dissipation block and the fan, so that the problems that the existing high-speed nanosecond switch does not have a heat dissipation structure, natural cooling is carried out through air, the heat dissipation effect is poor, and the use by a user is inconvenient are solved.
2. According to the utility model, the protection cover is arranged, so that the input end of the fan can be protected, the air can be filtered, and the use by a user is convenient.
3. According to the utility model, the fan can be protected through the arrangement of the protective net, and the safety of the fan is effectively improved.
4. According to the utility model, through the arrangement of the heat dissipation port, air in the high-speed nanosecond switch can be discharged, and the air flow rate in the high-speed nanosecond switch is effectively improved.
5. According to the utility model, the number of the spray heads is set to be a plurality of spray heads, so that air can be uniformly sprayed inside the high-speed nanosecond switch, and the use by a user is facilitated.
6. According to the utility model, the surface of the heat conduction pipe can be uniformly cooled by setting the material of the heat conduction pipe to be copper, so that the heat conduction pipe is convenient for a user to use.
Drawings
FIG. 1 is a front view of the structure of the present invention;
FIG. 2 is an enlarged view of the structure of FIG. 1 at A in accordance with the present invention;
fig. 3 is a perspective view of the water tank of the structure of the utility model.
In the figure: 1. a high-speed nanosecond level switch; 2. a protective box; 3. a fan; 4. a water tank; 5. a heat conducting pipe; 6. a shunt box; 7. a spray head; 8. a semiconductor refrigeration sheet; 9. a heat dissipating block; 10. a fan; 11. a protective cover; 12. a protective net; 13. and a heat dissipation port.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 3, the heat dissipation structure for a high-speed nanosecond switch provided by the utility model comprises a high-speed nanosecond switch 1, wherein a protection box 2 is fixedly connected to the left side of the high-speed nanosecond switch 1, a fan 3 is fixedly connected to the right side of the inner wall of the protection box 2, a water tank 4 is fixedly connected to the bottom of the left side of the high-speed nanosecond switch 1, the right side of the water tank 4 penetrates through the high-speed nanosecond switch 1, a heat conduction pipe 5 is arranged inside the water tank 4, the output end of the fan 3 penetrates through the inside of the water tank 4 and is communicated with the top of the heat conduction pipe 5, a shunting box 6 is fixedly connected to the left side of the bottom of the inner wall of the high-speed nanosecond switch 1, a spray nozzle 7 is communicated to the right side of the shunting box 6, the right side of the heat conduction pipe 5 penetrates through the right side of the water tank 4 and is communicated with the left side of the shunting box 6, a semiconductor refrigeration sheet 8 is fixedly connected to the left side of the water tank 4, the left side of the semiconductor refrigeration piece 8 is fixedly connected with a heat dissipation block 9, and the left side of the heat dissipation block 9 is fixedly connected with a fan 10.
Referring to fig. 1, a protective cover 11 is fixedly connected to the top of the protective box 2, and the protective cover 11 is used in cooperation with the input end of the fan 3.
As a technical optimization scheme of the utility model, the input end of the fan 3 can be protected by arranging the protective cover 11, air can be filtered, and the fan is convenient for a user to use.
Referring to fig. 2, a protective net 12 is fixedly connected to the left side of the fan 10, and the protective net 12 is made of metal.
As a technical optimization scheme of the present invention, the fan 10 can be protected by the protective net 12, and the safety of the fan 10 is effectively improved.
Referring to fig. 1, a heat dissipation port 13 is formed on the right side of the high-speed nanosecond switch 1, and the number of the heat dissipation ports 13 is several.
As a technical optimization scheme of the utility model, through the arrangement of the heat dissipation port 13, air in the high-speed nanosecond switch 1 can be discharged, and the air flow rate in the high-speed nanosecond switch 1 is effectively improved.
Referring to fig. 2, the number of the nozzles 7 is several, and the several nozzles 7 are uniformly distributed in a straight line.
As a technical optimization scheme of the utility model, the number of the spray heads 7 is set to be a plurality, so that air can be uniformly sprayed inside the high-speed nanosecond switch 1, and the use by a user is facilitated.
Referring to fig. 2, the heat pipe 5 is made of copper, and the diameter of the heat pipe 5 is five millimeters.
As a technical optimization scheme of the present invention, the material of the heat conduction pipe 5 is copper, so that the surface of the heat conduction pipe 5 can be uniformly cooled, and the present invention is convenient for a user to use.
The working principle and the using process of the utility model are as follows: during the use, the user need dispel the heat to high-speed nanosecond level switch 1's inside, the user starts fan 3, later fan 3 transmits the inside of heat pipe 5 with the air, later start semiconductor refrigeration piece 8, semiconductor refrigeration piece 8 is with the inside water cooling of water tank 4, semiconductor refrigeration piece 8's left side is conducted heat through radiating block 9, later dispel the heat through fan 10, later heat pipe 5 is cooled down through water, and cool down to the inside air of heat pipe 5, later the inside of cold air transmission reposition of redundant personnel box 6, and discharge the cold air through shower nozzle 7, later dispel the heat to high-speed nanosecond level switch 1's inside, thereby reach radiating effect.
In summary, the following steps: this high-speed nanosecond level heat radiation structure for switch, through setting up high-speed nanosecond level switch 1, protective housing 2, fan 3, water tank 4, heat pipe 5, reposition of redundant personnel box 6, shower nozzle 7, semiconductor refrigeration piece 8, radiating block 9 and fan 10's cooperation and using, solved current high-speed nanosecond level switch and do not possess radiating structure, all carry out natural cooling through the air, radiating effect is than poor, the problem that the not convenient to use user used.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a heat radiation structure for high-speed nanosecond level switch, includes high-speed nanosecond level switch (1), its characterized in that: the high-speed nanosecond switch is characterized in that a protection box (2) is fixedly connected to the left side of the high-speed nanosecond switch (1), a fan (3) is fixedly connected to the right side of the inner wall of the protection box (2), a water tank (4) is fixedly connected to the left bottom of the high-speed nanosecond switch (1), the right side of the water tank (4) penetrates through the inside of the high-speed nanosecond switch (1), a heat conduction pipe (5) is arranged inside the water tank (4), the output end of the fan (3) penetrates through the inside of the water tank (4) and is communicated with the top of the heat conduction pipe (5), a shunting box (6) is fixedly connected to the left side of the bottom of the inner wall of the high-speed nanosecond switch (1), a spray head (7) is communicated with the right side of the shunting box (6), the right side of the heat conduction pipe (5) penetrates through the right side of the water tank (4) and is communicated with the left side of the shunting box (6), and a semiconductor refrigerating sheet (8) is fixedly connected to the left side of the water tank (4), the left side fixedly connected with radiating block (9) of semiconductor refrigeration piece (8), the left side fixedly connected with fan (10) of radiating block (9).
2. A heat dissipation structure for high-speed nanosecond switches according to claim 1, wherein: the top fixedly connected with protection casing (11) of guard box (2), protection casing (11) are used with the input cooperation of fan (3).
3. A heat dissipation structure for high-speed nanosecond switches according to claim 1, wherein: the left side of the fan (10) is fixedly connected with a protective net (12), and the protective net (12) is made of metal.
4. A heat dissipation structure for high-speed nanosecond switches according to claim 1, wherein: heat dissipation opening (13) have been seted up on high-speed nanosecond level switch (1) right side, the quantity of heat dissipation opening (13) is a plurality of.
5. A heat dissipation structure for high-speed nanosecond switches according to claim 1, wherein: the number of the spray heads (7) is a plurality, and the spray heads (7) are uniformly distributed in a straight line.
6. A heat dissipation structure for high-speed nanosecond switches according to claim 1, wherein: the heat conduction pipe (5) is made of copper, and the diameter of the heat conduction pipe (5) is five millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220096350.2U CN216752595U (en) | 2022-01-14 | 2022-01-14 | Heat radiation structure for high-speed nanosecond level switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220096350.2U CN216752595U (en) | 2022-01-14 | 2022-01-14 | Heat radiation structure for high-speed nanosecond level switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216752595U true CN216752595U (en) | 2022-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220096350.2U Active CN216752595U (en) | 2022-01-14 | 2022-01-14 | Heat radiation structure for high-speed nanosecond level switch |
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| Country | Link |
|---|---|
| CN (1) | CN216752595U (en) |
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2022
- 2022-01-14 CN CN202220096350.2U patent/CN216752595U/en active Active
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