CN220210861U - Self-adaptive electronic equipment heat dissipation and heat preservation device - Google Patents

Abstract

The self-adaptive electronic equipment heat dissipation and insulation device comprises a case shell, wherein electronic equipment is arranged in the case shell, a gap is reserved between the shell of the electronic equipment and the inner side wall of the case shell, and a memory alloy plate is arranged on the outer side wall, close to the case shell, of the electronic equipment shell; the memory alloy heat dissipation teeth are arranged on the outer side wall of the case body, and the fixed ends of the memory alloy heat dissipation teeth are arranged on the outer side wall of the case body, and the movable ends face to the external space. When the temperature is low, the memory alloy plate breaks heat conduction between the electronic equipment and the case shell, the memory alloy heat dissipation teeth shrink, the heat dissipation area is reduced, the heating time of the heating equipment is shortened, the heating equipment is prevented from being started frequently, and the number of the heating equipment is reduced; when the temperature is higher, the memory alloy plate deforms to be propped against the case shell, so that heat conduction is realized, the memory alloy radiating teeth are unfolded, the radiating area is increased, heat dissipation is accelerated, and the temperature is automatically reduced.

Description

Self-adaptive electronic equipment heat dissipation and heat preservation device

Technical Field

The utility model belongs to the technical field of equipment heat dissipation, and particularly relates to a self-adaptive electronic equipment heat dissipation and insulation device.

Background

The Chinese operators are wide, and the electronic equipment has heat dissipation and heat preservation requirements in the use process of different places. If the electronic equipment is used in northeast and high-altitude areas, the external environment temperature is lower, the heat dissipation is carried out when the electronic equipment works normally, the nearby environment temperature is still lower, and in order to enable the electronic equipment to have proper working temperature, the heating equipment is required to work, the temperature is increased, and the proper working temperature is provided for the electronic equipment. When the electronic device is used in the southeast coast, the external environment temperature is higher, and the electronic device has no heat preservation requirement when normally radiating.

The structure of a chassis for installing electronic equipment which is commonly used at present is shown in fig. 1, and an exploded view is shown in fig. 2. In order to achieve the purposes of heat dissipation and heat preservation, besides the electronic equipment meeting the technical requirements of the case, heating equipment is required to be installed in the case structure, and heat dissipation teeth are arranged on the case shell. When the environment temperature is lower, the electronic equipment can not meet the proper working temperature only by means of self heat dissipation, and the electronic equipment needs to be heated by the heating equipment, so that the proper temperature is provided for the normal working of the electronic equipment. As the heating device shown in fig. 2, when the cabinet is in a high-temperature environment, the heating equipment does not work, and the equipment radiates heat by virtue of the surface area of the equipment; when the case is in a low-temperature environment, the heating equipment works, the temperature in the case is increased, and a proper working temperature is provided for the internal electronic equipment.

After the heating equipment works for a period of time, the temperature in the case reaches a proper value, and as the case has certain heat preservation capability and the electronic equipment dissipates heat during working, the heating equipment is not required to continuously work, the working temperature in the case can be maintained by means of the heat preservation capability of the case and the heat dissipation of the electronic equipment, and after the working temperature in the case is reduced to be lower than the proper working temperature, the heating equipment is restarted so as to maintain the working temperature of the case. The existing case has poor heat preservation capability, when the heating equipment heats the temperature in the case to a proper temperature and is turned off, the heat dissipation of the case is faster, the temperature reduction speed is faster, and the case needs to be restarted, so that the heating equipment is frequently started; in addition, under lower ambient temperature, the heat dissipation of the machine case is faster, and in order to maintain the machine case temperature, the heating equipment needs to be started for a longer time, and even a plurality of heating equipment needs to work simultaneously to maintain the machine case temperature, so that energy waste is caused.

Disclosure of Invention

The utility model provides a self-adaptive heat dissipation and heat preservation device for electronic equipment, which aims to reduce the starting time of heating equipment, avoid frequent starting of the heating equipment and reduce the number of the heating equipment.

The aim of the utility model is realized by adopting the following technical scheme. The utility model provides a self-adaptive electronic equipment heat dissipation and insulation device, which comprises a case shell, wherein electronic equipment is arranged in the case shell, a gap is reserved between the case of the electronic equipment and the inner side wall of the case shell, and a memory alloy plate is arranged on the outer side wall of the case shell, which is close to the case shell, of the electronic equipment; the memory alloy heat dissipation teeth are arranged on the outer side wall of the case body, and the fixed ends of the memory alloy heat dissipation teeth are arranged on the outer side wall of the case body, and the movable ends face to the external space.

Further, the electronic equipment is detachably arranged on the inner side wall of the case body, and a heat insulation pad is arranged between the electronic equipment and the inner side wall of the case body.

Further, the electronic equipment is provided with screw holes, and the screws sequentially penetrate through the screw holes, the heat insulation pad and the case shell to fix the electronic equipment and the heat insulation pad on the case shell.

Further, heating equipment is arranged in the case shell.

Further, the electronic equipment shell is fixed with the memory alloy plate through welding, or the electronic equipment shell is fixedly connected with the memory alloy plate through screws, and silicone grease is smeared between the electronic equipment shell and the memory alloy plate.

Furthermore, the memory alloy heat dissipation teeth are arranged on the outer side wall of the case shell in parallel and uniformly, and gaps are reserved between the adjacent memory alloy heat dissipation teeth.

Further, the memory alloy radiating teeth and the case shell are fixed in a brazing mode.

Further, the case shell comprises a top cover plate, a bottom plate, an upper cover plate, a lower cover plate, a left cover plate and a right cover plate.

Further, the inner side wall of the bottom plate is provided with a plurality of electronic devices in a distributed mode and heating devices.

Further, the memory alloy heat dissipation teeth are arranged on the outer side walls of the upper cover plate, the left cover plate, the right cover plate and the lower cover plate.

Compared with the prior art, the utility model has the following advantages: the utility model provides a self-adaptive electronic equipment heat dissipation and insulation device by changing the heat dissipation area of the surface of a case and the heat conduction path of electronic equipment and a case shell by utilizing the shape memory effect of a shape memory alloy; when the temperature is lower, the memory alloy plate deforms and contracts, heat conduction between the electronic equipment and the case shell is disconnected, the memory alloy heat dissipation teeth contract, the heat dissipation area is reduced, the case temperature is increased to the proper working temperature of the electronic equipment through heating of the heating equipment, heat dissipation is less at the moment, the heating time of the heating equipment is reduced, frequent starting of the heating equipment is avoided, the number of the heating equipment is reduced, even the heating equipment is not needed, and the reliability and maintainability of the equipment are improved; when the temperature is higher, the memory alloy plate deforms to be propped against the case shell, so that heat conduction is realized, the memory alloy radiating teeth are unfolded, the radiating area is increased, heat dissipation is accelerated, and the temperature is automatically reduced.

The foregoing description is only an overview of the present utility model, and is intended to be implemented in accordance with the teachings of the present utility model, as well as the preferred embodiments thereof, together with the following detailed description of the utility model, given by way of illustration only, together with the accompanying drawings.

Drawings

FIG. 1 is a schematic diagram of a prior art enclosure;

FIG. 2 is an exploded view of FIG. 1;

FIG. 3 is a schematic diagram of the heat transfer mode of FIG. 1;

FIG. 4 is a schematic diagram of an embodiment of the present utility model in which an electronic device is separated from a chassis base in a thermal insulation state;

fig. 5 is a schematic diagram of an electronic device contacting a chassis base plate in a heat dissipation state according to an embodiment of the present utility model;

FIG. 6a is a schematic diagram of a memory alloy heat dissipation tooth in a contracted state according to an embodiment of the utility model;

FIG. 6b is a schematic view of the memory alloy heat dissipation teeth of FIG. 5 in an expanded state;

FIG. 7 is a perspective view of a memory alloy heat dissipating tooth on a cover plate structure in a contracted state according to an embodiment of the present utility model;

FIG. 8a is a top view of FIG. 7;

FIG. 8b is an enlarged schematic view of FIG. 8a at A;

FIG. 9 is a perspective view of a memory alloy heat dissipating tooth on a cover plate structure in an expanded state according to an embodiment of the present utility model;

FIG. 10a is a top view of FIG. 9;

FIG. 10B is an enlarged schematic view of FIG. 10a at B;

fig. 11 is a schematic diagram of a heat dissipation flow of an electronic device according to an embodiment of the present utility model;

fig. 12 is a schematic diagram of a thermal insulation flow of an electronic device according to an embodiment of the utility model.

[ reference numerals ]

1-case shell, 101-top cover plate, 102-bottom plate, 103-memory alloy radiating teeth, 104-upper cover plate, 105-lower cover plate, 106-left cover plate, 107-right cover plate, 2-electronic equipment, 201-contact surface, 202-screw hole, 3-heating equipment, 4-heat insulation pad and 5-memory alloy plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

An embodiment of a heat dissipation and insulation device for an adaptive electronic device according to the present utility model is shown in fig. 4 to 12. The device exploits the shape memory effect of shape memory alloys. The shape memory effect refers to plastic deformation of a shape memory alloy in a low-temperature environment, and when the shape memory alloy is heated to a specific temperature, restoring stress is generated to force the shape memory alloy to restore to an original shape. Based on the special property of the memory alloy, the control of the shape can be realized by changing the temperature of the memory alloy. The specific phase change principle of the shape memory alloy is the prior art, and is not repeated here, and the heat dissipation teeth and the memory alloy plate of the memory alloy are manufactured by utilizing the shape memory effect, so that the purposes of simultaneously satisfying the heat dissipation and heat preservation of electronic equipment can be achieved.

In the prior art, as shown in fig. 1 to 3, an electronic device 2 is disposed in a chassis housing 1, and the chassis housing 1 includes a top cover 101, a bottom plate 102, an upper cover 104, a lower cover 105, a left cover 106, and a right cover 107, which together enclose a closed case. The upper cover plate 104, the lower cover plate 105, the left cover plate 106 and the right cover plate 107 are respectively provided with heat dissipation teeth, so that the heat dissipation requirement of the chassis is met. The inner side wall of the bottom plate 102 is provided with a plurality of electronic devices 2 in a distributed manner, and the heating device 3 is arranged according to the requirement, so that the electronic devices 2 work at a proper temperature. The electronic device 2 is provided with screw holes 202, and the contact surface 201 is fixed to the base plate 102 by screws after being attached to the inner side wall of the base plate 102. The electronic equipment shell and the case shell are made of heat conducting materials. When the electronic device 2 works, when the ambient temperature is low, the heating device 3 needs to be started to enable the electronic device 2 to work at a proper temperature, and when the working temperature in the case reaches the standard, the heating device can be closed, and the proper temperature is maintained by utilizing the heat dissipation of the electronic device and the heat preservation capability of the case.

As can be seen from the heat dissipation path of the chassis shown in fig. 2, when the electronic device inside the chassis works, heat is generated, transferred to the chassis housing, and naturally cooled and dissipated by the chassis housing. During the heat dissipation process, there are three forms of heat conduction, convection and radiation simultaneously. The prior art has better heat dissipation effect, and the contact surface between the electronic equipment and the inner side wall of the case body is larger, so that the heat generated by the electronic equipment can be conducted to the case body and dissipated through the heat dissipation teeth on the case body. However, when the cabinet is in a low-temperature environment, the heating device needs to be turned on, and the temperature in the cabinet is difficult to maintain due to faster heat dissipation, the heating device 3 needs to be turned on frequently, and sometimes the heating device needs to be increased or the heating time needs to be increased in order to counteract the too fast heat dissipation. The novel chassis of the prior art is improved, the principle is the same as that of the chassis of the prior art when the electronic equipment dissipates heat, the heat preservation aspect of the chassis is improved, the heat preservation aspect of the chassis is specifically improved in two aspects, the first aspect is the improvement of the existing heat conduction path, and the second aspect is the improvement of the chassis structure.

The conventional heat conduction manner between the electronic device inside the case and the case housing is shown in fig. 3, the electronic device 2 is in contact with the base plate 102 in a large area, most of the materials of the case of the electronic device 2 and the base plate 102 are aluminum alloys, and the heat conductivity coefficient of the aluminum alloys is 150-206W/(m·k). When the temperature of the casing of the electronic device is almost the same as the temperature of the base plate, and thus the temperature of the environment measured outside the base plate is low, the temperatures of the base plate 102 and the electronic device 2 are also low, and it is possible to operate the electronic components in the electronic device at a low temperature lower than the predetermined temperature. But the existing heat conduction mode has the disadvantages of faster heat dissipation and poor heat preservation effect, and needs to improve the existing heat conduction path.

The improved heat conduction between the electronics and the backplane within the enclosure is illustrated in fig. 4, with the addition of shape memory alloy 5 and thermal insulation pad 4 between the electronics and the backplane. The memory alloy plate 5 is arranged on the shell of the electronic equipment, which is close to the bottom plate, and the memory alloy plate 5 is in a contracted state and is not contacted with the bottom plate 102 under the condition of low temperature, so that heat conduction is avoided, and the heat preservation effect is realized. The heat insulation pad 4 is arranged between the mounting seat where the screw hole 202 of the electronic device 2 is positioned and the bottom plate 102, and after the screws sequentially pass through the mounting seat, the heat insulation pad 4 and the bottom plate 102, the electronic device 2 and the heat insulation pad 4 are fixed on the bottom plate. The main functions of the heat insulation pad are as follows: firstly, the heat insulation pad 4 has low heat conductivity coefficient, reduces heat exchange between the electronic equipment 2 and the bottom plate 102, and plays a role in heat insulation; secondly, the heat insulation pad has a certain thickness, so that a certain gap exists between the electronic equipment 2 and the bottom 102, the bottom plate 102 is prevented from being directly contacted with the electronic equipment 2 in a low-temperature environment, and a space is provided for the work of the memory alloy plate 5.

The memory alloy plate 5 can be fixed on the shell of the electronic equipment close to the bottom plate in a welding mode, and the shape of the memory alloy plate is kept unchanged in a low-temperature state, so that the electronic equipment cannot be contacted with the bottom plate of the case due to the effect of the heat insulation pad 4, and heat conduction is avoided; when the temperature in the electronic equipment exceeds the temperature threshold value required by the operation of the internal devices, heat is required to be transferred outwards to dissipate heat, and meanwhile, the temperature of the shell of the electronic equipment is increased, so that the temperature of the memory alloy plate is increased, the memory alloy plate is elastically deformed and is in contact with the bottom plate for heat transfer, and as shown in fig. 5, the heat conduction is realized, and the heat dissipation is accelerated.

Through the improved structural design, the heat conduction mode between the chassis base plate and the electronic equipment is changed according to the temperature change condition, and the conversion of heat transfer between the electronic equipment and the chassis base plate in different states is realized. When the case is in a low-temperature environment, the electronic equipment dissipates heat faster and has lower temperature, and the memory alloy plate is in a contracted state and is not contacted with the bottom plate, so that the heat dissipation is prevented from being too fast; at this time, the heating device 3 is required to heat, the working temperature of the electronic device is improved, because the electronic device is not in direct contact with the chassis bottom plate, in the heating process, the heat dissipation is less, the electronic device can be quickly heated to the working temperature, at this time, the heating device 3 can be closed, the heat dissipation of the electronic device can be relied on, the temperature in the chassis is lowered more slowly, the time interval between the next heating and the current heating of the heating device is prolonged, frequent starting is avoided, meanwhile, the heat dissipation is less, the number of the heating devices can be reduced, and the energy consumption is reduced. When the temperature of the electronic equipment is too high, the memory alloy plate can be deformed to be in contact with the bottom plate, so that heat dissipation is accelerated.

Taking the case shown in fig. 1 to 2 as an example for describing the improvement of the case structure, the upper cover plate 104, the left cover plate 106, the right cover plate 107 and the lower cover plate 105 of the case are all arranged with heat dissipation teeth, and the heat dissipation teeth face the external space, so that the contact area with air is enlarged, and the heat dissipation is accelerated. According to theory of heat transfer, the heat dissipation capacity of the cover plate structure is as follows in sequence: the cover plate structure is provided with radiating teeth and the radiating teeth face the external space, the cover plate structure is provided with no radiating teeth, and the cover plate structure is provided with radiating teeth and the radiating teeth face the internal space. The heat-insulating effect is realized by reducing the heat-insulating capability, and the chassis structure is improved by combining the thermodynamic basic theory and the characteristics of the shape memory alloy.

As shown in fig. 6a, the shape memory alloy is in a contracted state under the condition of low temperature, the cross section of the shape memory alloy is contracted and folded, and the exposed heat dissipation area is smaller; when the temperature rises and then becomes the expansion state, as shown in fig. 6b, the cross section of the shape memory alloy expands into a straight shape, the exposed area increases, and the heat dissipation area increases. According to different expansion amounts of the change of different temperatures, the expansion amount is larger as the temperature is higher, so that heat dissipation is accelerated, and conversely, when the temperature is too low, the shape memory alloy contracts to slow down heat dissipation.

By combining thermodynamic theory, the cover plate structure shown in fig. 7-8 b is designed. The heat dissipation teeth on the outer side wall of the cover plate structure are replaced by the memory alloy heat dissipation teeth 103. When the case is in a lower temperature state, the memory alloy heat dissipation teeth 103 are contracted and folded, the heat dissipation area is small, and heat preservation can be realized by slowing down heat dissipation. When the case is at a higher temperature, the memory alloy heat dissipation teeth 103 are gradually unfolded, and when a certain temperature is reached, the heat dissipation area of the memory alloy heat dissipation teeth 103 is completely unfolded, so that the maximum heat dissipation capacity can be realized, and the temperature in the case is reduced.

The fixed end of the memory alloy heat dissipation tooth 103 is arranged on the outer side wall of the cover plate structure, and the movable end faces the external space. In this embodiment, the memory alloy heat dissipation teeth 103 are arranged in parallel on the outer sidewall of the cover plate structure, and a gap is left between adjacent memory alloy heat dissipation teeth 103. In this embodiment, the memory alloy heat dissipation teeth 103 are uniformly distributed on the outer sidewall of the cover plate structure, so as to avoid uneven heat dissipation. In this embodiment, the memory alloy heat dissipation teeth 103 are integrally and vertically disposed on the outer side wall of the cover plate structure in the contracted or expanded state, so as to avoid interference between the memory alloy heat dissipation teeth 103 when they are extended.

The memory alloy heat dissipation teeth and the base material of the cover plate structure are welded together in a brazing manner to form the cover plate structure, and can be connected in other manners. The substrate may be an aluminum alloy or other thermally conductive material.

The memory alloy heat dissipation teeth on the cover plate structure shown in fig. 7-8 b shrink in a low temperature state, and the heat dissipation teeth have small area, so that the heat dissipation capability is weakened, and the heat preservation effect is achieved. When the temperature rises, the memory alloy radiating teeth are unfolded, the radiating area is enlarged, and the radiating capacity is improved, as shown in fig. 9-10 b.

By improving the heat transfer paths of the electronic equipment and the case shell and the heat dissipation teeth of the cover plate structure, the self-adaptive adjustment of heat dissipation and heat preservation of the electronic equipment is realized. The electronic equipment is a heat source of the device, the temperature of the device close to an electronic device is higher, the environment outside the machine case is lower, and in order to enable the shape memory alloys at two positions to be matched with each other, the heat preservation and heat dissipation effects are achieved, the shape memory alloys at two positions are made of different materials, so that the temperature threshold value when the shape memory alloy on the shell of the electronic equipment deforms and expands is higher than the temperature threshold value when the shape memory alloy on the cover plate structure expands. The temperature that the memory alloy plate on the electronic equipment shell deforms and props against the bottom plate is set to be T1, the temperature that the memory alloy plate deforms and breaks away from the contact bottom plate is set to be T2, the temperature that the memory alloy heat dissipation teeth on the cover plate structure start to be unfolded from a contracted state is set to be T3, the memory alloy heat dissipation teeth continue to be unfolded to a fully unfolded state along with the temperature rise, the temperature that the memory alloy heat dissipation teeth start to be contracted from the fully unfolded state is set to be T4, and the temperature continues to be reduced along with the temperature, the memory alloy heat dissipation teeth continue to be contracted to a fully contracted state, wherein T1> T2> T3> T4.

The heat dissipation flow of the device when the electronic equipment is started is shown in fig. 11, when the case is in a low-temperature environment, the electronic equipment is started, in order to quickly raise the temperature in the case to the proper working temperature of the electronic equipment, according to the characteristics of the shape memory alloy, the memory alloy heat dissipation teeth are in a contracted state, and the memory alloy plate is not contacted with the case shell, so that heat dissipation is reduced, and at the moment, the heating equipment is opened according to the requirement to heat, so that the temperature in the case is quickly raised to the proper working temperature until the temperature reaches the proper working temperature. In the self-adaptive heat dissipation process after the electronic equipment works, whether the working temperature of a device in the electronic equipment is proper or not needs to be judged, the temperature of a shell of the electronic equipment can generally reflect the working temperature of the device, if the temperature of the shell of the electronic equipment is lower than or meets the working temperature of the device in the electronic equipment, namely, the temperature of the shell of the electronic equipment is lower than T1 corresponding to a memory alloy plate at the moment, the shell of the electronic equipment does not need to be contacted with a bottom plate to accelerate heat dissipation, the memory alloy plate on the shell of the electronic equipment is kept in an original state at the temperature, and meanwhile, the heat preservation effect can be achieved at the lower temperature; if the temperature of the electronic equipment shell exceeds the proper working temperature T1 of the electronic equipment, the memory alloy plate is deformed by heat and is attached to the bottom plate of the case, so that the heat conduction between the electronic equipment shell and the bottom plate is realized, and the heat dissipation is accelerated; after heat dissipation is accelerated through heat conduction, the temperature of the electronic equipment can be reduced and maintained at the normal working temperature, but the temperature is still higher than T2, the memory alloy plate is not deformed, and the memory alloy plate is still adhered to the bottom plate; along with the operation of the electronic equipment, whether the operating temperature of the electronic equipment is proper needs to be continuously judged, the heat of the electronic equipment shell is transferred to the bottom plate through the memory alloy plate, the heat conduction can be realized between the cover plate structure and the bottom plate, the temperature is relatively close to the temperature of the bottom plate, if the temperature of the cover plate structure is lower than the T3 corresponding to the memory alloy heat dissipation teeth, the heat conducted to the cover plate structure is insufficient, at the moment, the temperature of the electronic equipment shell is lower than or meets the normal operating temperature of the electronic equipment, the memory alloy heat dissipation teeth on the cover plate structure maintain a contracted state at the temperature, the heat dissipation is not required to be accelerated, and meanwhile, the heat preservation effect can be realized in a low-temperature environment; when the temperature of the cover plate structure exceeds the temperature T3 of the memory alloy radiating teeth for starting to be unfolded, the temperature of the electronic equipment shell is too high, so that the temperature of the cover plate structure is increased, the memory alloy radiating teeth on the cover plate structure are unfolded, the radiating area is increased, heat dissipation is quickened, the electronic equipment works at a proper temperature, and if the temperature of the cover plate structure is higher than the T4 corresponding to the memory alloy radiating teeth, the memory alloy radiating teeth continue to be unfolded, and the high radiating capacity is maintained.

The heat preservation flow of the device when the electronic equipment is closed is shown in fig. 12, the case is at a lower temperature, the temperature of the electronic equipment is higher when the electronic equipment is just closed, the memory alloy plate is contacted with the bottom plate, and the memory alloy heat dissipation teeth are in an unfolding state and continue to keep heat dissipation; in the self-adaptive heat preservation process after the electronic equipment of the device is closed, the whole temperature of the case begins to gradually decrease, and the case body of the case generally cools down faster and the internal electronic equipment cools down slower; in the temperature reduction process, if the temperature of the cover plate structure is higher than the T4 of the corresponding shrinkage temperature of the memory alloy heat dissipation teeth on the cover plate structure, the memory alloy heat dissipation teeth keep in an unfolding state and continue to dissipate heat; along with the temperature reduction, if the temperature of the cover plate structure is lower than the shrinkage temperature T4 of the memory alloy heat dissipation teeth, the case needs to be subjected to heat preservation by reducing heat dissipation, and the memory alloy heat dissipation teeth begin to shrink, so that the heat dissipation area is reduced; if the temperature in the case is continuously reduced, the memory alloy radiating teeth on the cover plate structure are continuously kept in a contracted state, and heat preservation is continuously carried out; when the temperature of the electronic equipment shell is reduced to a temperature T2 at which the memory alloy plate deforms to be separated from the contact bottom plate, the memory alloy plate deforms to shrink, heat conduction between the electronic equipment and the case shell is disconnected, and the heat preservation effect is enhanced. When the electronic equipment is in a lower-temperature environment, even if the electronic equipment is started, the temperature in the case still drops, heat preservation is needed, the heat preservation process is the same as the heat preservation process, and details are not repeated here, and if the temperature in the case drops to the normal working temperature of the electronic equipment, the heating equipment is started for heating.

In summary, the utility model utilizes the shape memory effect of the shape memory alloy to provide a self-adaptive heat-dissipating and heat-preserving device for the electronic equipment by changing the heat-dissipating area of the surface of the case and the heat conduction path between the electronic equipment and the case shell; when the temperature is lower, the memory alloy plate deforms and contracts, heat conduction between the electronic equipment and the case shell is disconnected, the memory alloy heat dissipation teeth contract, the heat dissipation area is reduced, the case temperature is increased to the proper working temperature of the electronic equipment through heating of the heating equipment, heat dissipation is less at the moment, the heating time of the heating equipment is reduced, frequent starting of the heating equipment is avoided, the number of the heating equipment is reduced, even the heating equipment is not needed, and the reliability and maintainability of the equipment are improved; when the temperature is higher, the memory alloy plate deforms to be propped against the case shell, so that heat conduction is realized, the memory alloy radiating teeth are unfolded, the radiating area is increased, heat dissipation is accelerated, and the temperature is automatically reduced.

In other embodiments of the present utility model, the electronic device may be fixed on the inner sidewall of the base plate by a bracket made of a material with poor thermal conductivity, so as to avoid heat conduction.

In other embodiments of the present utility model, the electronic device housing and the memory alloy plate may be fixed by screw connection, and silicone grease is coated on the contact surface of the electronic device housing and the memory alloy plate to improve heat conduction capability.

In other embodiments of the present utility model, the memory alloy plate or the memory alloy heat dissipation teeth may be used alone to adaptively adjust the chassis according to the specific situation.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.

Claims (10)

1. The utility model provides a self-adaptation electronic equipment heat dissipation heat preservation device, includes machine case casing, its characterized in that: the electronic equipment is arranged in the case shell, a gap is reserved between the case of the electronic equipment and the inner side wall of the case shell, and a memory alloy plate is arranged on the outer side wall of the case shell, which is close to the case shell, of the electronic equipment; the memory alloy heat dissipation teeth are arranged on the outer side wall of the case body, and the fixed ends of the memory alloy heat dissipation teeth are arranged on the outer side wall of the case body, and the movable ends face to the external space.

2. The adaptive electronic device heat dissipation and preservation apparatus of claim 1, wherein: the electronic equipment is detachably arranged on the inner side wall of the case body, and a heat insulation pad is arranged between the electronic equipment and the inner side wall of the case body.

3. The adaptive electronic device heat dissipation and preservation apparatus of claim 2, wherein: the electronic equipment is provided with screw holes, and the screws sequentially penetrate through the screw holes, the heat insulation pad and the case shell to fix the electronic equipment and the heat insulation pad on the case shell.

4. The adaptive electronic device heat dissipation and preservation apparatus of claim 1, wherein: and heating equipment is arranged in the case shell.

5. The adaptive electronic device heat dissipation and preservation apparatus of claim 1, wherein: the electronic equipment shell is fixedly connected with the memory alloy plate through welding, or the electronic equipment shell is fixedly connected with the memory alloy plate through screws, and silicone grease is smeared between the electronic equipment shell and the memory alloy plate.

6. The adaptive electronic device heat dissipation and preservation apparatus of claim 1, wherein: the memory alloy radiating teeth are uniformly arranged on the outer side wall of the case shell in parallel, and gaps are reserved between the adjacent memory alloy radiating teeth.

7. The adaptive electronic device heat dissipation and preservation apparatus of claim 1, wherein: the memory alloy radiating teeth and the case shell are fixed in a brazing mode.

8. The adaptive electronic device heat dissipation and preservation apparatus of claim 1, wherein: the case shell comprises a top cover plate, a bottom plate, an upper cover plate, a lower cover plate, a left cover plate and a right cover plate.

9. The adaptive electronic device heat dissipation and preservation apparatus of claim 8, wherein: the inside wall of bottom plate distributes and sets up a plurality of electronic equipment and sets up firing equipment.

10. The adaptive electronic device heat dissipation and preservation apparatus of claim 8, wherein: and the memory alloy radiating teeth are arranged on the outer side walls of the upper cover plate, the left cover plate, the right cover plate and the lower cover plate.