CN220206137U - Chip tester and chip cooling device thereof - Google Patents
Chip tester and chip cooling device thereof Download PDFInfo
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- CN220206137U CN220206137U CN202320236636.0U CN202320236636U CN220206137U CN 220206137 U CN220206137 U CN 220206137U CN 202320236636 U CN202320236636 U CN 202320236636U CN 220206137 U CN220206137 U CN 220206137U
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- 238000001816 cooling Methods 0.000 title claims abstract description 66
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 230000004308 accommodation Effects 0.000 claims description 4
- 238000012360 testing method Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 abstract description 4
- 238000011056 performance test Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of chip testing, in particular to a chip tester and a chip cooling device thereof, wherein the chip cooling device comprises a mounting block and an air cooling mechanism, and a chip accommodating groove is arranged on the mounting block so as to receive a chip through the chip accommodating groove; the air cooling mechanism is used for generating air at the chip accommodating groove so as to cool the chip. According to the technical scheme, when the air cooling mechanism is started, air can be generated at the chip accommodating groove, and the chip exchanges heat with surrounding air after being placed in the chip accommodating groove, so that the cooling effect is achieved; in addition, the height of the correlation type photoelectric sensor is adjustable, so that the correlation type photoelectric sensor can be conveniently adjusted on site, and the chip accommodating groove is located in the detection range of the sensor.
Description
Technical Field
The utility model relates to the technical field of chip testing, in particular to a chip testing machine and a chip cooling device thereof.
Background
With the continuous development and maturation of chip technology, the application of chips relates to various fields of various industries, the use environment of the chips becomes more complex, and higher requirements are placed on various performances of the chips. The stable electric parameter performance of the high-temperature resistant chip under the high-temperature environment is a basic requirement of concern in the electronic industries such as automobile electronics, 5G communication and the like. The high temperature resistant chips are developed and produced in a large batch in a packaging factory, and then the high temperature test function is required for test sorting equipment, and the high temperature chips are subjected to performance test, sorting and packaging recovery before shipment through a high temperature test sorting machine.
The conventional turret type test sorting machine at present can only test the electrical property of the chip at normal temperature, the chip heating function is not provided on the conventional equipment, the chip is discharged from the material to the material and the intermediate process link is carried out at normal temperature, and the performance state of the high-temperature chip at high temperature can not be accurately and reliably tested. The chip is subjected to high-temperature test, which is firstly heated to reach the required test temperature, then subjected to high-temperature performance test, and then cooled to perform normal-temperature performance test, and how to cool the chip in the cooling procedure is a technical problem which needs to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present utility model provides a chip tester and a chip cooling device thereof, which mainly solves the technical problems: how to cool down the chip.
In order to achieve the above purpose, the present utility model mainly provides the following technical solutions:
in one aspect, an embodiment of the present utility model provides a chip cooling device, including a mounting block and an air cooling mechanism, where the mounting block is provided with a chip accommodating groove to receive a chip through the chip accommodating groove;
the air cooling mechanism is used for generating air at the chip accommodating groove so as to cool the chip.
Optionally, the bottom surface of chip accommodation groove has the updraft ventilator that runs through, forced air cooling mechanism is used for producing the negative pressure in updraft ventilator department to the updraft ventilator in the chip accommodation groove.
Optionally, a through air port is arranged on the side surface of the groove body of the chip accommodating groove.
Optionally, the mounting block is provided with a first boss, a second boss, a third boss and a fourth boss, the first boss, the second boss, the third boss and the fourth boss are sequentially arranged, and the chip accommodating groove is formed by surrounding the first boss, the second boss, the third boss and the fourth boss;
and a space is arranged between two adjacent bosses so as to form the air passing opening at the space.
Optionally, a raised supporting table is arranged on the bottom surface of the chip accommodating groove, and the air suction hole is arranged on the supporting table;
and a through groove is formed between the supporting table and each boss.
Optionally, the chip cooling device further comprises a supporting seat, the mounting block is arranged on the supporting seat, an air duct communicated with the air suction hole is arranged in the supporting seat, and the air cooling mechanism is used for generating negative pressure at the air suction hole through the air duct.
Optionally, the chip cooling device further comprises a sensor, and the sensor is used for detecting whether a chip is in the chip accommodating groove.
Optionally, the sensor is a correlation type photoelectric sensor, and the height of the correlation type photoelectric sensor is adjustable.
Optionally, when the chip cooling device comprises a supporting seat, the chip cooling device further comprises two mounting plates, each mounting plate is provided with a strip-shaped hole, one side of the supporting seat is provided with a first threaded hole, the other side of the supporting seat is provided with a second threaded hole, one screw is used for penetrating the strip-shaped hole of one mounting plate and being screwed in the first threaded hole, and the other screw is used for penetrating the strip-shaped hole of the other mounting plate and being screwed in the second threaded hole;
one of the opposite-type photoelectric sensors is arranged on one mounting plate, and the other is arranged on the other mounting plate.
On the other hand, the embodiment of the utility model also provides a chip testing machine, which can comprise any one of the chip cooling devices.
By means of the technical scheme, the chip tester and the chip cooling device have the following beneficial effects:
1. in the technical scheme provided by the utility model, when the air cooling mechanism is started, air can be generated at the chip accommodating groove, and the chip exchanges heat with surrounding air after being placed in the chip accommodating groove, so that the cooling effect is achieved;
2. the correlation photoelectric sensor is adjustable in height so as to be convenient to adjust on site, and the chip accommodating groove is located in the detection range of the sensor.
The foregoing description is only an overview of the present utility model, and is intended to provide a better understanding of the present utility model, as it is embodied in the following description, with reference to the preferred embodiments of the present utility model and the accompanying drawings.
Drawings
FIG. 1 is a schematic diagram of a portion of a chip cooling device according to an embodiment of the present utility model;
FIG. 2 is an enlarged schematic view at A in FIG. 1;
fig. 3 is a cross-sectional view reflecting the assembly of both the mounting block and the support base.
Reference numerals: 1. a mounting block; 2. a support base; 3. a mounting plate; 4. a sensor; 5. a screw; 21. an air duct; 31. a bar-shaped hole; 101. a chip accommodating groove; 102. an air suction hole; 103. an air port; 104. a support table; 105. a groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
As shown in fig. 1, a chip cooling device according to an embodiment of the present utility model includes a mounting block 1 and an air cooling mechanism, where a chip accommodating groove 101 is provided on the mounting block 1 to receive a chip through the chip accommodating groove 101. The robot arm may place the chip into the chip accommodating groove 101 or take the chip out of the chip accommodating groove 101.
The air cooling mechanism is used for generating air at the chip accommodating groove 101 so as to cool the chip. The air cooling mechanism can blow air to the chip accommodating groove 101 so as to exhaust air to the chip accommodating groove 101. Whichever way the air cooling mechanism can generate air at the chip accommodating groove 101 to accelerate the air flow at the chip accommodating groove 101, thereby realizing the effect of rapidly cooling the chip.
As shown in fig. 2, the bottom surface of the chip accommodating groove 101 may have an air suction hole 102 penetrating therethrough. The air cooling mechanism is used for generating negative pressure at the air suction hole 102 so as to suck air in the chip accommodating groove 101. The chip is placed in the chip accommodating groove 101, and a gap is formed between the chip and the opening of the air exhaust hole 102, and air can flow into the air exhaust hole 102 through the gap. The number of the air suction holes 102 may be plural to accelerate the air suction effect.
As shown in fig. 2, the side surface of the body of the chip accommodating groove 101 may be provided with a through-air vent 103, and preferably, the four groove corners of the chip accommodating groove 101 are provided with the through-air vent 103. Wherein, through the air gap 103, the air flow of the chip accommodating groove 101 can be further accelerated, and the cooling effect of the chip is further improved.
As shown in fig. 2, the mounting block 1 may be provided with a first boss, a second boss, a third boss, and a fourth boss. The first boss, the second boss, the third boss and the fourth boss are sequentially arranged, and the chip accommodating groove 101 is formed by surrounding the first boss, the second boss, the third boss and the fourth boss. Wherein, a space is arranged between two adjacent bosses to form the air passing hole 103 at the space. In this example, the first boss, the second boss, the third boss, and the fourth boss may be integrally formed on the mounting block 1.
As shown in fig. 2, a raised support base 104 may be disposed on the bottom surface of the chip accommodating groove 101, and the aforementioned air suction hole 102 is disposed on the support base 104. The chip receiving groove 101 provides support for the chip through the support table 104. A through groove 105 is formed between the support base 104 and each boss. The grooves 105 can pass through the wind, so that the air flow at the chip accommodating groove 101 can be further improved, and the cooling of the chip is accelerated.
As shown in fig. 3, the aforementioned chip cooling device may further include a support base 2, and the aforementioned mounting block 1 is disposed on the support base 2 and fixed on the support base 2, for example, by a screw 5 or the like. The support seat 2 is internally provided with an air duct 21 communicated with the air suction hole 102, and the air cooling mechanism is used for generating negative pressure at the air suction hole 102 through the air duct 21. In a specific application example, the underside of the mounting block 1 may be provided with an interface slot, the aforementioned suction opening 102 extending through the bottom surface of the interface slot. Wherein the opening of the interface slot is opposite to the opening of one side of the air duct 21. The air cooling mechanism may be an exhaust fan, and the air suction port of the air cooling mechanism may be connected to the opening on the other side of the air duct 21.
In the above example, the volume of the mounting block 1 is relatively small, the volume of the support base 2 is large, and the air cooling mechanism may be mounted on the support base 2 to communicate with the air suction hole 102 on the mounting block 1 through the air duct 21 on the support base 2, so that negative pressure is generated at the air suction hole 102.
As shown in fig. 1, the foregoing chip cooling device may further include a sensor, where the sensor is configured to detect whether a chip is in the chip accommodating groove 101, and if no chip is in the chip accommodating groove, an alarm signal may be sent. In one specific example of application, the sensor may be a correlation-type photosensor 4. The correlation photoelectric sensor is adjustable in height so as to be convenient to adjust on site, and the chip accommodating groove 101 is located in the detection range of the sensor.
As shown in fig. 1, when the chip cooling device comprises a supporting seat 2, the chip cooling device further comprises two mounting plates 3, and each mounting plate 3 is provided with a strip-shaped hole 31. The support seat 2 has a first threaded hole on one side and a second threaded hole on the other side. One screw 5 is used to pass through the bar-shaped hole 31 of one mounting plate 3 and is screwed in the first threaded hole, and the other screw 5 is used to pass through the bar-shaped hole 31 of the other mounting plate 3 and is screwed in the second threaded hole. Wherein one of the correlation type photoelectric sensors 4 is provided on one mounting plate 3 and the other is provided on the other mounting plate 3.
In the above example, the photoelectric sensors may be fixed to the respective mounting plates 3 by screws 5 or the like. When the screw 5 at the strip-shaped hole 31 is unscrewed, the height of the mounting plate 3 can be adjusted, the mounting plate 3 drives the sensor 4 on the mounting plate to lift together, and after the position of the sensor 4 is adjusted, the screw 5 at the strip-shaped hole 31 is screwed down again.
What needs to be explained here is: the upper end of the chip accommodating groove 101 may be provided with a clearance hole penetrating through both sides, and the detection light of the correlation photoelectric sensor 4 may pass through the clearance hole to detect whether a chip is in the chip accommodating groove 101.
An embodiment of the present utility model further provides a chip testing machine, which may include any one of the chip cooling devices described above. In this example, the chip tester can perform cooling treatment on the chip due to the chip cooling device, and then perform performance test on the chip at normal temperature.
The working principle and preferred embodiments of the present utility model are described below.
The utility model relates to a chip tester and a chip cooling device thereof, wherein the chip cooling device comprises a supporting seat 2, a mounting block 1 and an air cooling mechanism, the mounting block 1 is arranged on the supporting seat 2, an air duct 21 is arranged on the supporting seat 2, one end of an air suction inlet air duct 21 of the air cooling mechanism is connected with one end opening, a chip accommodating groove 101 is arranged on the mounting block 1, and a penetrating exhaust hole 102 is arranged on the bottom surface of the chip accommodating groove 101. The underside of the mounting block 1 is provided with an interface slot, and the air suction hole 102 penetrates through the bottom surface of the interface slot. The opening of the interface slot is opposite to the opening of the other end of the air duct 21. When the air cooling mechanism is started, negative pressure can be generated at the air suction hole 102 through the air duct 21 so as to generate air at the chip accommodating groove 101. The chip is placed in the chip accommodating groove 101 and then exchanges heat with surrounding air, so that the cooling effect is achieved.
What needs to be explained here is: under the condition of no conflict, the technical features related to the examples can be combined with each other according to actual situations by a person skilled in the art so as to achieve corresponding technical effects, and specific details of the combination situations are not described in detail herein.
The above description is only a preferred embodiment of the present utility model, and the protection scope of the present utility model is not limited to the above examples, and all technical solutions belonging to the concept of the present utility model belong to the protection scope of the present utility model. It should be noted that modifications and adaptations to the present utility model may occur to one skilled in the art without departing from the principles of the present utility model and are intended to be within the scope of the present utility model.
Claims (9)
1. The chip cooling device is characterized by comprising a mounting block (1) and an air cooling mechanism, wherein a chip accommodating groove (101) is formed in the mounting block (1) so as to receive a chip through the chip accommodating groove (101);
the air cooling mechanism is used for generating air at the chip accommodating groove (101) so as to cool the chip;
the bottom surface of chip accommodation groove (101) has updraft ventilator (102) that runs through, forced air cooling mechanism is used for producing negative pressure in updraft ventilator (102) department to updraft to chip accommodation groove (101) in.
2. The chip cooling device according to claim 1, wherein,
the side surface of the groove body of the chip accommodating groove (101) is provided with a penetrating air port (103).
3. The chip cooling device according to claim 2, wherein,
the mounting block (1) is provided with a first boss, a second boss, a third boss and a fourth boss, the first boss, the second boss, the third boss and the fourth boss are sequentially arranged, and the chip accommodating groove (101) is formed by surrounding the first boss, the second boss, the third boss and the fourth boss;
wherein, a space is arranged between two adjacent bosses to form the air passing opening (103) at the space.
4. The chip cooling device according to claim 3, wherein,
a raised supporting table (104) is arranged on the bottom surface of the chip accommodating groove (101), and the air suction hole (102) is arranged on the supporting table (104);
and a through groove (105) is formed between the supporting table (104) and each boss.
5. The chip cooling device according to claim 1, further comprising a supporting seat (2), wherein the mounting block (1) is arranged on the supporting seat (2), an air duct (21) communicated with the air suction hole (102) is arranged in the supporting seat (2), and the air cooling mechanism is used for generating negative pressure at the air suction hole (102) through the air duct (21).
6. The chip cooling device according to any one of claims 1 to 5, further comprising a sensor for detecting whether a chip is present in the chip receiving recess (101).
7. The chip cooling device according to claim 6, wherein the sensor is a correlation type photoelectric sensor (4), and the correlation type photoelectric sensor (4) is adjustable in height.
8. The chip cooling device according to claim 7, wherein,
when the chip cooling device comprises a supporting seat (2), the chip cooling device further comprises two mounting plates (3), each mounting plate (3) is provided with a strip-shaped hole (31), one side of the supporting seat (2) is provided with a first threaded hole, the other side of the supporting seat is provided with a second threaded hole, one screw (5) is used for penetrating the strip-shaped hole (31) of one mounting plate (3) and is screwed in the first threaded hole, and the other screw (5) is used for penetrating the strip-shaped hole (31) of the other mounting plate (3) and is screwed in the second threaded hole;
wherein one of the opposite-type photoelectric sensors (4) is arranged on one mounting plate (3), and the other is arranged on the other mounting plate (3).
9. A chip tester comprising the chip cooling device according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320236636.0U CN220206137U (en) | 2023-02-16 | 2023-02-16 | Chip tester and chip cooling device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320236636.0U CN220206137U (en) | 2023-02-16 | 2023-02-16 | Chip tester and chip cooling device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220206137U true CN220206137U (en) | 2023-12-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320236636.0U Active CN220206137U (en) | 2023-02-16 | 2023-02-16 | Chip tester and chip cooling device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220206137U (en) |
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2023
- 2023-02-16 CN CN202320236636.0U patent/CN220206137U/en active Active
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