CN220172087U - Silicon wafer cleaning machine convenient for taking materials - Google Patents
Silicon wafer cleaning machine convenient for taking materials Download PDFInfo
- Publication number
- CN220172087U CN220172087U CN202320738101.3U CN202320738101U CN220172087U CN 220172087 U CN220172087 U CN 220172087U CN 202320738101 U CN202320738101 U CN 202320738101U CN 220172087 U CN220172087 U CN 220172087U
- Authority
- CN
- China
- Prior art keywords
- cleaning
- driving
- box
- rotating shaft
- rotate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 101
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 47
- 239000010703 silicon Substances 0.000 title claims abstract description 47
- 239000000463 material Substances 0.000 title claims abstract description 10
- 235000012431 wafers Nutrition 0.000 claims abstract description 38
- 239000012459 cleaning agent Substances 0.000 claims abstract description 9
- 238000005406 washing Methods 0.000 claims 1
- 230000002457 bidirectional effect Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to the technical field of cleaning machines, in particular to a silicon wafer cleaning machine convenient for taking materials, which comprises a workbench, wherein a first driving box is arranged on the workbench, and is characterized by further comprising: the cleaning box is arranged on the workbench, a containing groove for containing the cleaning box is formed in the workbench and used for storing cleaning agents for cleaning the silicon wafers, and a first rotating part for driving the cleaning box to rotate is arranged in the workbench. According to the utility model, the first motor and the second motor are arranged, the first motor drives the first rotating shaft to rotate, the second motor drives the second rotating shaft to rotate, the second rotating shaft drives the cleaning box to rotate, and the cleaning agent in the cleaning box is used for bidirectional cleaning of the silicon wafers in the cleaning basket through bidirectional rotation of the first motor and the second motor, so that the cleaning effect of the silicon wafers is improved, and meanwhile, the quality of the silicon wafers is guaranteed.
Description
Technical Field
The utility model relates to the technical field of cleaning machines, in particular to a silicon wafer cleaning machine convenient for taking materials.
Background
The silicon slice is a slice cut from monocrystalline silicon, the diameter of the slice is 6 inches, 8 inches, 12 inches and other specifications, the slice is mainly used for producing integrated circuits, the slice is an important material for manufacturing integrated circuits, various semiconductor devices can be manufactured by means of photoetching, ion implantation and the like, the chip manufactured by the silicon slice has remarkable operation capability, the development of semiconductors, the development of automation, computers and other technical developments are continuously promoted, and the manufacturing cost of the high-technology product of the silicon slice (integrated circuits) is reduced to quite low level, so that the silicon slice is widely applied to aerospace, industry, agriculture and national defense.
In the prior art, the following defects also exist: after the silicon wafer is cut by a wire cutting machine, the surface of the silicon wafer is seriously polluted, the silicon wafer is generally cleaned by a chemical cleaning method, the silicon wafer to be cleaned is placed in a cleaning basket, the cleaning basket is placed in a cleaning tank, and the silicon wafer in the cleaning basket is cleaned by a solution in the cleaning tank, so that the cleaning effect is poor, and the quality of the silicon wafer is reduced. In view of this, we propose a silicon wafer cleaning machine that facilitates material taking.
Disclosure of Invention
In order to make up for the defects, the utility model provides the silicon wafer cleaning machine convenient for taking materials.
The technical scheme of the utility model is as follows:
the utility model provides a conveniently get silicon chip cleaning machine of material, includes the workstation, be equipped with first drive case on the workstation, still include:
the cleaning box is arranged on the workbench, an accommodating groove for accommodating the cleaning box is formed in the workbench and used for storing cleaning agents for cleaning the silicon wafers, and a first rotating part for driving the cleaning box to rotate is arranged in the workbench;
the cleaning basket is arranged in the cleaning box and used for placing silicon wafers to be cleaned, and a first driving box is internally provided with a first driving part used for driving the cleaning basket to move along the horizontal direction.
Further, the first rotating part comprises a second rotating shaft arranged in the workbench, a power source used for driving the second rotating shaft to rotate is arranged in the workbench, the inner wall of the accommodating groove is provided with a supporting plate, the second rotating shaft penetrates through the supporting plate, and a limiting part is arranged between the second rotating shaft and the supporting plate.
Further, the limiting part comprises a limiting ring fixed on the second rotating shaft, and an annular groove matched with the limiting ring is arranged on the supporting plate.
Further, the first driving part comprises a first electric push rod arranged in a first driving box, a first connecting rod is arranged on a piston rod in the first electric push rod, a supporting frame is arranged on the first connecting rod, a second driving box is arranged on the supporting frame, and a second driving part used for driving the cleaning basket to move along the vertical direction is arranged in the second driving box.
Further, the second driving part comprises a second electric push rod arranged in a second driving box, a connecting plate is arranged on a piston rod in the second electric push rod, second connecting rods are arranged on two sides of the connecting plate, a case is arranged on the second connecting rods, and a second rotating part used for driving the cleaning basket to rotate is arranged in the case.
Further, the second rotating part comprises a first rotating shaft arranged in the case, and a second power source for driving the first rotating shaft to rotate is arranged in the case.
Further, one end of the first rotating shaft is provided with a rotating disc, and the bottom of the rotating disc is provided with a mounting plate.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the first motor and the second motor are arranged, the first motor drives the first rotating shaft to rotate, the first rotating shaft drives the rotating disc to rotate, the rotating disc drives the mounting plate to rotate, the mounting plate drives the hook to rotate, and the hook drives the cleaning basket to rotate, so that silicon wafers in the cleaning basket are cleaned; the second motor drives the second rotating shaft to rotate, the second rotating shaft drives the cleaning box to rotate, and the cleaning agent in the cleaning box can carry out bidirectional cleaning on the silicon wafer in the cleaning basket through bidirectional rotation of the first motor and the second motor, so that the cleaning effect of the silicon wafer is improved, and meanwhile, the quality of the silicon wafer is also guaranteed.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the internal structure of the first driving box of the present utility model;
FIG. 3 is a schematic view of the internal structure of a second driving box according to the present utility model;
FIG. 4 is a schematic diagram of the internal structure of the chassis according to the present utility model;
FIG. 5 is a schematic view of the bottom structure of the cleaning tank of the present utility model.
In the figure:
1. a work table; 101. a receiving groove;
2. a first drive box; 21. a first electric push rod; 22. a first connecting rod; 23. a support frame;
3. a second drive box; 31. a second electric push rod; 32. a connecting plate; 33. a second connecting rod;
4. a cleaning box;
5. a cleaning basket; 51. a fixed block;
6. a chassis; 61. a first motor; 62. a first rotating shaft; 63. a turntable;
7. a mounting plate; 71. a hook;
8. a second motor; 81. a second rotating shaft;
9. and a support plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Referring to fig. 1-5, the present utility model is described in detail by the following embodiments:
the utility model provides a conveniently get silicon chip cleaning machine of material, includes workstation 1, and fixed mounting has first drive case 2 on the workstation 1, still includes:
the cleaning box 4 is arranged on the workbench 1, the workbench 1 is provided with a containing groove 101 for containing the cleaning box 4 and used for storing cleaning agents for cleaning silicon wafers, and the workbench 1 is internally provided with a first rotating part for driving the cleaning box 4 to rotate;
the cleaning basket 5 is arranged in the cleaning box 4 and used for placing silicon wafers to be cleaned, and a first driving part used for driving the cleaning basket 5 to move along the horizontal direction is arranged in the first driving box 2.
In this embodiment, the first rotating portion includes a second rotating shaft 81 disposed in the workbench 1, a first power source for driving the second rotating shaft 81 to rotate is fixedly mounted in the workbench 1, the first power source is a second motor 8, a power output shaft of the second motor 8 is coaxially fixed with the second rotating shaft 81, a supporting plate 9 is fixedly mounted on an inner wall of the accommodating groove 101, the second rotating shaft 81 penetrates through the supporting plate 9, the second rotating shaft 81 is fixedly connected with the cleaning box 4, and a limiting portion is disposed between the second rotating shaft 81 and the supporting plate 9. The second motor 8 drives the second rotating shaft 81 to rotate, and the second rotating shaft 81 drives the cleaning box 4 to rotate, so that the silicon wafers placed in the cleaning box 4 are cleaned.
In this embodiment, the limiting part includes a limiting ring fixed on the second rotating shaft 81, and the supporting plate 9 is provided with an annular groove matching with the limiting ring. By providing a stop collar, the purge bin 4 is prevented from being offset during rotation.
In this embodiment, the first driving part includes a first electric push rod 21 disposed in the first driving box 2, the first electric push rod 21 is movably connected with the first driving box 2, a first connecting rod 22 is fixedly mounted on a piston rod in the first electric push rod 21, a supporting frame 23 is fixedly mounted on the first connecting rod 22, a second driving box 3 is fixedly mounted on the supporting frame 23, and a second driving part for driving the cleaning basket 5 to move along the vertical direction is disposed in the second driving box 3. The piston rod in the first electric push rod 21 drives the first connecting rod 22 to move along the horizontal direction, the first connecting rod 22 drives the supporting frame 23 to move, and the supporting frame 23 drives the second driving box 3 to move, so that the position of the cleaning basket 5 is adjusted.
In this embodiment, the second driving part comprises a second electric push rod 31 disposed in the second driving box 3, the second electric push rod 31 is movably connected with the second driving box 3, a connecting plate 32 is fixedly mounted on a piston rod in the second electric push rod 31, two sides of the connecting plate 32 are fixedly provided with second connecting rods 33, the second connecting rods 33 are fixedly provided with a machine box 6, and a second rotating part for driving the cleaning basket 5 to rotate is arranged in the machine box 6. The connecting plate 32 is driven to move along the vertical direction by the piston rod in the second electric push rod 31, the connecting plate 32 drives the second connecting rod 33 to move, and the second connecting rod 33 drives the case 6 to move, so that the cleaning basket 5 is placed in or taken out of the cleaning box 4.
In this embodiment, the second rotating part includes a first rotating shaft 62 disposed in the chassis 6, a second power source for driving the first rotating shaft 62 to rotate is fixedly mounted in the chassis 6, the second power source is a first motor 61, a power output shaft of the first motor 61 is coaxially fixed with the first rotating shaft 62, a turntable 63 is fixedly mounted at one end of the first rotating shaft 62, and a mounting plate 7 is fixedly mounted at the bottom of the turntable 63. The first motor 61 drives the first rotating shaft 62 to rotate, the first rotating shaft 62 drives the rotating disc 63 to rotate, and the rotating disc 63 drives the mounting plate 7 to rotate, so that the cleaning basket 5 rotates in the cleaning box 4.
In this embodiment, a plurality of fixing blocks 51 are fixedly installed on the cleaning basket 5, hooks 71 matched with the fixing blocks 51 are fixedly installed on the mounting plate 7, a switch is fixedly installed on the workbench 1, a closed loop is formed between the switch and the first electric push rod 21, the second electric push rod 31, the first motor 61 and the second motor 8, and the first electric push rod 21, the second electric push rod 31, the first motor 61 and the second motor 8 are controlled to be started and closed through a switch control loop.
Working principle: firstly, a silicon wafer to be cleaned is placed in a cleaning basket 5, a switch of a second electric push rod 31 is turned on, a piston rod in the second electric push rod 31 drives a connecting plate 32 to move along the vertical direction, the connecting plate 32 drives a second connecting rod 33 to move, the second connecting rod 33 drives a case 6 to move, the case 6 drives a first rotating shaft 62 to move, the first rotating shaft 62 drives a rotating disc 63 to move, the rotating disc 63 drives a mounting plate 7 to move, the mounting plate 7 drives a hook 71 to move, when the hook 71 moves to the lower part of a fixed block 51, the switch of the second electric push rod 31 is turned off, the switch of a first electric push rod 21 is turned on, a piston rod in the first electric push rod 21 drives a first connecting rod 22 to move along the horizontal direction, the first connecting rod 22 drives a supporting frame 23 to move, the supporting frame 23 drives a second driving case 3 to move, and therefore the hook 71 is moved to the lower part of the fixed block 51, the switch of the first electric push rod 21 is closed, the switch of the second electric push rod 31 is opened, the fixed block 51 is hooked through the hook 71, thereby realizing the fixation of the cleaning basket 5, after the hook 71 hooks the fixed block 51, the switch of the second electric push rod 31 is closed, the switch of the first electric push rod 21 is opened, the cleaning basket 5 is moved to the upper part of the cleaning box 4, then the switch of the first electric push rod 21 is closed, the switch of the second electric push rod 31 is opened, the cleaning basket 5 is placed in the cleaning box 4, then the switch of the second electric push rod 31 is closed, the switches of the first motor 61 and the second motor 8 are opened, the first motor 61 drives the first rotating shaft 62 to rotate, the first rotating shaft 62 drives the rotary disc 63 to rotate, the rotary disc 63 drives the mounting plate 7 to rotate, thereby realizing the rotation of the cleaning basket 5 in the cleaning box 4, the second motor 8 drives the second rotating shaft 81 to rotate, the second rotating shaft 81 drives the cleaning box 4 to rotate, so that the cleaning agent in the cleaning box 4 can bidirectionally clean the silicon wafers placed in the cleaning basket 5, and the cleaning effect of the cleaning agent in the cleaning box 4 on the silicon wafers in the cleaning basket 5 is improved.
Through the arrangement of the first motor 61 and the second motor 8, the first motor 61 drives the first rotating shaft 62 to rotate, the first rotating shaft 62 drives the rotating disc 63 to rotate, the rotating disc 63 drives the mounting plate 7 to rotate, the mounting plate 7 drives the hook 71 to rotate, and the hook 71 drives the cleaning basket 5 to rotate, so that silicon wafers in the cleaning basket 5 are cleaned; the second motor 8 drives the second rotating shaft 81 to rotate, the second rotating shaft 81 drives the cleaning box 4 to rotate, and the cleaning agent in the cleaning box 4 can carry out bidirectional cleaning on the silicon wafer in the cleaning basket 5 through the bidirectional rotation of the first motor 61 and the second motor 8, so that the cleaning effect of the silicon wafer is improved, and meanwhile, the quality of the silicon wafer is also ensured.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a conveniently get silicon chip cleaning machine of material, includes workstation (1), be equipped with first driving case (2) on workstation (1), its characterized in that still includes:
the cleaning box (4) is arranged on the workbench (1), the workbench (1) is provided with a containing groove (101) for containing the cleaning box (4) and used for storing cleaning agents for cleaning silicon wafers, and the workbench (1) is internally provided with a first rotating part for driving the cleaning box (4) to rotate;
the cleaning basket (5), cleaning basket (5) are located in cleaning box (4) for place the silicon chip that needs to carry out the washing, and be equipped with in first drive box (2) and be used for driving the drive division one that cleaning basket (5) removed along the horizontal direction.
2. A convenient-to-take silicon wafer cleaning machine as set forth in claim 1 wherein: the rotary part I comprises a second rotating shaft (81) arranged in the workbench (1), a power source used for driving the second rotating shaft (81) to rotate is arranged in the workbench (1), a supporting plate (9) is arranged on the inner wall of the accommodating groove (101), the second rotating shaft (81) penetrates through the supporting plate (9), and a limiting part is arranged between the second rotating shaft (81) and the supporting plate (9).
3. A convenient-to-take silicon wafer cleaning machine as set forth in claim 2 wherein: the limiting part comprises a limiting ring fixed on the second rotating shaft (81), and the supporting plate (9) is provided with an annular groove matched with the limiting ring.
4. A convenient-to-take silicon wafer cleaning machine as set forth in claim 1 wherein: the first driving part comprises a first electric push rod (21) arranged in a first driving box (2), a first connecting rod (22) is arranged on a piston rod in the first electric push rod (21), a supporting frame (23) is arranged on the first connecting rod (22), a second driving box (3) is arranged on the supporting frame (23), and a second driving part used for driving the cleaning basket (5) to move along the vertical direction is arranged in the second driving box (3).
5. A convenient-to-take silicon wafer cleaning machine as set forth in claim 4 wherein: the second electric push rod (31) arranged in the second driving box (3) is included in the driving part II, a connecting plate (32) is arranged on a piston rod in the second electric push rod (31), second connecting rods (33) are arranged on two sides of the connecting plate (32), a machine box (6) is arranged on the second connecting rods (33), and a rotating part II used for driving the cleaning basket (5) to rotate is arranged in the machine box (6).
6. A convenient-to-take silicon wafer cleaning machine as set forth in claim 5 wherein: the second rotating part comprises a first rotating shaft (62) arranged in the case (6), and a second power source for driving the first rotating shaft (62) to rotate is arranged in the case (6).
7. A convenient-to-take silicon wafer cleaning machine as set forth in claim 6 wherein: one end of the first rotating shaft (62) is provided with a rotating disc (63), and the bottom of the rotating disc (63) is provided with a mounting plate (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320738101.3U CN220172087U (en) | 2023-04-06 | 2023-04-06 | Silicon wafer cleaning machine convenient for taking materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320738101.3U CN220172087U (en) | 2023-04-06 | 2023-04-06 | Silicon wafer cleaning machine convenient for taking materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220172087U true CN220172087U (en) | 2023-12-12 |
Family
ID=89059923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320738101.3U Active CN220172087U (en) | 2023-04-06 | 2023-04-06 | Silicon wafer cleaning machine convenient for taking materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220172087U (en) |
-
2023
- 2023-04-06 CN CN202320738101.3U patent/CN220172087U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101001730B (en) | Bi-directional singulation system and method | |
| JP2002280343A (en) | Cleaning process apparatus and cutting work apparatus | |
| JP5580066B2 (en) | Cutting equipment | |
| CN212967650U (en) | Wafer cleaning machine | |
| CN220172087U (en) | Silicon wafer cleaning machine convenient for taking materials | |
| CN116967235B (en) | Wafer box automatic cleaning and detecting integrated equipment and method | |
| JP2013080811A (en) | Cutting device | |
| CN212145917U (en) | Ultra-thin quartz glass wafer polishing device | |
| CN220439565U (en) | Automatic wafer double-sided cleaning device | |
| KR20020028481A (en) | Index machine for handler | |
| CN220312801U (en) | Basin frock of polishing | |
| CN220456364U (en) | Machine tool for processing special wafer | |
| CN220499984U (en) | Automatic feeding type high-frequency welding machine | |
| CN113035751B (en) | Chip rotating device of stress-relief etching machine and equipment thereof | |
| CN214022332U (en) | Surface cleaning device for silicon wafer | |
| CN217943848U (en) | Cutting device for chip wafer processing | |
| CN219486205U (en) | Vacuum air suction disc for wafer dicing saw | |
| CN117542752A (en) | Multi-station semiconductor material preparation equipment | |
| CN218769453U (en) | Silicon wafer conveying machine | |
| CN220825765U (en) | Material transfer device and chamfering machine comprising same | |
| CN219521669U (en) | Multi-spindle hole polishing device | |
| CN214026486U (en) | Automatic feeding and discharging device suitable for glass carving machine | |
| CN215247943U (en) | Unloader on cnc engraving and milling machine | |
| CN215549948U (en) | High-efficiency multi-wire cutting machine | |
| KR102635867B1 (en) | Substrate processing method and substrate processing apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |