CN220162887U - Vacuum adsorption rotating device for wafer sample - Google Patents

Abstract

The utility model relates to a vacuum adsorption rotating device for a wafer sample, belongs to the technical field of wafer processing, and solves the problems that an existing vacuum chuck easily enables a wafer body to deviate, is poor in sealing performance and cannot rotate continuously. The utility model discloses a vacuum adsorption rotating device for a wafer sample, which comprises a vacuum chuck, a pneumatic slip ring and an air duct, wherein the vacuum chuck comprises an annular side wall and an adsorption assembly, and the adsorption assembly comprises a connecting assembly, a first connecting pipe, a second connecting pipe, a first connecting block and a plurality of second connecting blocks. The vacuum adsorption rotating device for the wafer sample provided by the utility model has high tightness and strong adsorptivity, and can avoid the winding of the air duct.

Description

Vacuum adsorption rotating device for wafer sample

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a vacuum adsorption rotating device for a wafer sample.

Background

Wafer refers to the base substrate material silicon wafer used to fabricate the chips. In the wafer processing technology, a wafer needs to be uniformly diced by a dicing saw, so that the wafer needs to be fixed on a rotating vacuum chuck during dicing, wherein the vacuum chuck rotates by a rotating motor and is connected with a vacuum pump by an air pipe to generate vacuum negative pressure for adsorption; in the semiconductor wafer dicing process, a wafer sample is generally adsorbed and fixed by using a vacuum chuck, wherein the wafer sample is composed of an annular outer frame, a wafer body and a bearing film, the wafer body is inlaid in an inner ring of the outer frame, the bearing film covers the surface of the wafer body, and the vacuum chuck is used for fixing the whole wafer sample by adsorbing the bearing film.

The blade generates a large cutting force on the wafer in the dicing process, but the existing vacuum chuck only adsorbs the wafer body through the bearing film, so that the wafer body is easily deviated from a preset position by the action of the dicing saw in the rotating process, the processing precision of the wafer body is reduced, and the product quality is adversely affected; moreover, the existing vacuum ceramic sucker has no sealing property, so that the slag generated by cutting is easy to fall into equipment such as a motor, and the like, thereby adversely affecting the equipment; in addition, because the length of the air pipe between the vacuum chuck and the vacuum pump is limited, the air pipe is easy to wind in the rotating process of the vacuum chuck, so that the vacuum chuck cannot continuously rotate.

Therefore, in order to solve the problems that the conventional vacuum chuck easily deflects the wafer body, has poor sealing property, and cannot rotate continuously, a new vacuum chuck needs to be provided.

Disclosure of Invention

In view of the above analysis, the present utility model aims to provide a vacuum adsorption rotating device for a wafer sample, which solves the problems that the existing vacuum chuck easily deflects a wafer body, has poor sealing performance and cannot rotate continuously.

The aim of the utility model is mainly realized by the following technical scheme:

the utility model provides a vacuum adsorption rotating device for a wafer sample, which comprises a vacuum chuck, a pneumatic slip ring and an air duct, wherein the vacuum chuck comprises an annular side wall and an adsorption assembly, and the adsorption assembly comprises a connecting assembly, a first connecting pipe, a second connecting pipe, a first connecting block and a plurality of second connecting blocks; the first connecting block and the second connecting block are evenly distributed on the annular side wall, one end of the first connecting pipe is connected with the air duct, the other end of the first connecting pipe is connected with the first connecting block, the air duct is connected with the pneumatic slip ring, the second connecting pipe is arranged between the adjacent first connecting block and the second connecting block or between the adjacent two second connecting blocks, and the first connecting block and the second connecting block are all provided with connecting components.

Further, still include the rotating electrical machines, annular lateral wall is located on the rotating electrical machines, and vacuum chuck still includes top shell and first cavity, and on the annular lateral wall was located to the top shell, top shell and annular lateral wall enclosed into first cavity, and pneumatic sliding ring connects the rotating electrical machines and is located first cavity.

Further, the vacuum pump further comprises a base, a base vent hole is formed in a block body of the base, the rotating motor is arranged on the base, a second cavity communicated with the first cavity is formed in a machine body of the rotating motor, an air passage on the pneumatic slip ring is communicated with the second cavity, the base vent hole is communicated with the second cavity, and the base vent hole is connected with the vacuum pump.

Further, the first connecting block comprises a first block body, a second block body and a fourth block body, wherein the second block body is symmetrically arranged at two opposite ends of the first block body and is connected with the annular side wall, and the fourth block body is arranged at the bottom end of the first block body.

Further, a first through hole, a first air hole and a second air hole are formed in the body of the fourth block, the first air hole is vertically communicated with the first through hole, and the second air hole is vertically communicated with the first through hole.

Further, the second connecting block comprises a fifth block body, a sixth block body and an eighth block body, wherein the sixth block body is symmetrically arranged at two opposite ends of the fifth block body and is connected with the annular side wall, and the eighth block body is arranged at the bottom end of the fifth block body.

Further, a second through hole and a third air hole are formed in the body of the eighth block body, and the third air hole is vertically communicated with the second through hole.

Further, the first air hole and the third air hole are internally provided with connecting components.

Further, the plate body of the annular side wall is provided with a through hole communicated with the second air hole, and one end of the first connecting pipe penetrates through the through hole in the annular side wall to be connected with the second air hole.

Further, the second connecting pipe is arranged between the adjacent first through hole and the adjacent second through hole or between the adjacent two second through holes.

Compared with the prior art, the utility model has at least one of the following beneficial effects:

(1) According to the vacuum adsorption rotating device for the wafer sample, the second cavity port of the rotating motor and the pneumatic sliding ring can be sealed in the first cavity through the annular side wall, so that the broken slag generated by cutting the wafer body can be prevented from falling into a gap of the rotating motor or the pneumatic sliding ring, the rotating motor and the pneumatic sliding ring are protected, and the service life of equipment is prolonged.

(2) According to the vacuum adsorption rotating device for the wafer sample, the wafer body is adsorbed and fixed through the top shell, and the wafer outer frame is adsorbed and fixed through the outer frame sucker, so that double fixing of the wafer sample is realized, the stability of the wafer sample on the vacuum sucker is improved, and the reduction of the cutting precision of the wafer body caused by the deviation of the wafer body is avoided.

(3) According to the vacuum adsorption rotating device for the wafer sample, the air duct in the first cavity can be prevented from winding in the rotating process of the vacuum chuck through the pneumatic slip ring to prevent the rotation of the vacuum chuck, so that the vacuum chuck can continuously rotate, and the uniform cutting of the wafer body is improved.

In the utility model, the technical schemes can be mutually combined to realize more preferable combination schemes. Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model may be realized and attained by the structure particularly pointed out in the written description and drawings.

Drawings

The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the utility model, like reference numerals being used to refer to like parts throughout the several views.

FIG. 1 is a schematic diagram of a vacuum chuck rotating apparatus for wafer samples according to the present utility model;

FIG. 2 is a cross-sectional view of a vacuum chuck rotating apparatus for wafer samples according to the present utility model;

FIG. 3 is a diagram showing the connection relationship between the connection assembly and the first connection block of the vacuum chuck and rotation device for wafer samples according to the present utility model;

FIG. 4 is a front view of an adsorption assembly of the vacuum adsorption spin device for wafer samples of the present utility model;

fig. 5 is a diagram showing a connection relationship between a connection assembly of the vacuum adsorption rotating device for a wafer sample and a second connection block according to the present utility model.

Reference numerals:

1-a base; 11-a base vent; 2-a rotating electrical machine; 3-a vacuum chuck; 31-top shell; 311-connecting ring; 312-a first housing; 313-a second housing; 314-a third cavity; 32-annular side walls; 33-a first cavity; 34-an adsorption module; 341-a connection assembly; 3411-third connection tube; 3412-intermediate tube; 3413-outer frame suction cups; 342-a second connecting tube; 343-a first connection block; 3431-a first block; 3432-a second block; 3433-a third block; 3434-fourth block; 3434A-first via; 3434B-first air holes; 3434C-second air holes; 344-a second connection block; 3441-fifth block; 3442-sixth block; 3443-seventh block; 3444-eighth block; 3444A-second via; 3444B-third air holes; 4-pneumatic slip rings; 5-airway.

Detailed Description

The following detailed description of preferred embodiments of the utility model is made in connection with the accompanying drawings, which form a part hereof, and together with the description of the embodiments of the utility model, are used to explain the principles of the utility model and are not intended to limit the scope of the utility model.

The embodiment of the utility model is specifically described below with reference to fig. 1 to 5:

the embodiment provides a vacuum adsorption rotary device for wafer sample, as shown in fig. 1, 2, including base 1, rotating electrical machines 2, vacuum chuck 3 and pneumatic sliding ring 4, rotating electrical machines 2 are located on base 1, vacuum chuck 3 is used for adsorbing the wafer sample and locates on rotating electrical machines 2, rotating electrical machines 2 can drive vacuum chuck 3 and rotate, pneumatic sliding ring 4 connects rotating electrical machines 2 and is located vacuum chuck 3's first cavity 33, pneumatic sliding ring 4 is connected with vacuum chuck 3 through air duct 5, and pneumatic sliding ring 4 communicates with each other with the vacuum pump through rotating electrical machines 2, base 1, thereby make vacuum chuck 3 go up with the contact surface of wafer sample form the negative pressure in order to realize the absorption fixed to the wafer sample.

It should be noted that, the pneumatic slip ring 4 can avoid the winding of the air duct 5 in the rotation process of the vacuum chuck 3, and the continuous rotation of the vacuum chuck 3 can be realized through the pneumatic slip ring 4, which is beneficial to improving the safety of the device and realizing uniform cutting of the wafer body.

Specifically, a second cavity communicated with the first cavity 33 on the vacuum chuck 3 is arranged on the body of the rotating motor 2, the air passage on the pneumatic slip ring 4 is communicated with the second cavity of the rotating motor 2, a base vent hole 11 communicated with the second cavity is arranged on the block body of the base 1, and the vacuum pump is connected with the base vent hole 11 through an air pipe, so that the vacuum pump is communicated with the air passage of the pneumatic slip ring 4 through the base vent hole 11 and the second cavity of the rotating motor 2.

Further, be equipped with the screw hole on the base 1, be equipped with first mounting hole on the rotating electrical machines 2, screw hole on the base 1 can dock with the first mounting hole on the rotating electrical machines 2, adopts the bolt can install the rotating electrical machines 2 on the base 1.

The vacuum chuck 3 comprises a top shell 31 and an annular side wall 32, the annular side wall 32 is arranged on the rotating motor 2, the top shell 31 is used for adsorbing a wafer sample and is vertically arranged at the top end port of the annular side wall 32, the top end port of the annular side wall 32 can be closed through the top shell 31, so that a first cavity 33 with an opening facing the rotating motor 2 is formed, the pneumatic slip ring 4 is arranged in the first cavity 33 and is connected with the rotating motor 2, one end of the air duct 5 is connected with the top shell 31, the other end of the air duct 5 is connected with the pneumatic slip ring 4, the air duct of the pneumatic slip ring 4 is communicated with a vacuum pump, and the air conduction between the inside and the outside of the vacuum chuck 3 can be realized through the pneumatic slip ring 4 and the air duct 5, so that the top shell 31 forms negative pressure vacuum to adsorb the wafer sample under negative pressure.

It should be noted that, the second cavity port of the rotating motor 2 and the pneumatic slip ring 4 can be sealed in the first cavity 33 through the annular side wall 32, so that the broken slag generated by cutting the wafer body can be prevented from falling into the gap of the rotating motor 2 or the pneumatic slip ring 4, the rotating motor 2 and the pneumatic slip ring 4 are protected, and the service life of the device is prolonged.

Further, the top shell 31 is a double-layer shell, and comprises a connecting ring 311, a first shell 312, a second shell 313 and a third cavity 314, wherein the connecting ring 311 is fixedly arranged on the annular side wall 32, the first shell 312 and the second shell 313 are sequentially arranged on the inner ring of the connecting ring 311 from top to bottom, and the first shell 312 is not contacted with the second shell 313, so that the third cavity 314 is formed between the first shell 312 and the second shell 313; the first housing 312 is used for contacting the wafer sample, and a plurality of vent holes penetrating the first housing 312 are formed in the first housing so that the vent holes communicate with the third cavity 314; the second housing 313 is provided with a connection port penetrating through the housing to be connected with the air duct 5, and the top housing 31 can be pumped through the air duct 5, so that gas enters from the first housing 312 and is pumped out from the air duct 5 through the third cavity 314, and a negative pressure environment is formed in the third cavity 314, and because the vent hole on the first housing 312 is communicated with the third cavity 314, the vent hole of the first housing 312 is also in the negative pressure environment, so that the wafer sample is adsorbed and fixed.

The pneumatic slip ring 4 comprises an upper part and a lower part, and the upper part and the lower part can rotate relatively; wherein the bottom end of the lower part is connected with the rotating motor 2, and the top end of the lower part is rotationally connected with the bottom end of the upper part; the upper part of the pneumatic slip ring 4 is provided with an air guide port, the lower part is provided with an air channel, the air guide port is communicated with the air channel, the air guide port is used for being connected with an air guide pipe 5, and the air channel is communicated with the second inner cavity of the rotating motor 2.

In order to strengthen the fixation to the wafer sample, the vacuum chuck 3 is further provided with an adsorption component 34 to adsorb and fix the outer frame in the wafer sample, so that the vacuum chuck 3 is further fixed, the wafer body is prevented from shifting relative to the first shell 312, the real-time cutting track of the wafer body is consistent with the preset track, and the cutting precision of the wafer body is ensured.

Specifically, referring to fig. 3 to 5, the adsorption assembly 34 includes a connection assembly 341, a first connection pipe, a second connection pipe 342, a first connection block 343, and a plurality of second connection blocks 344, the first connection block 343 and the second connection block 344 are uniformly distributed on the annular sidewall 32, one end of the first connection pipe is connected with the air duct 5, the other end is connected with the first connection block 343, and the second connection pipe 342 is disposed between the adjacent first connection block 343 and the second connection block 344 or between the adjacent two second connection blocks 344, so that the second connection pipe 342 is disposed around the annular sidewall 32, and the connection assembly 341 is disposed on each of the first connection block 343 and the second connection block 344.

Specifically, the first connecting block 343 includes a first block 3431, a second block 3432, a third block 3433 and a fourth block 3434, where the first block 3431 is a square block, the second block 3432 is symmetrically disposed on opposite side surfaces of the first block 3431, the third block 3433 is disposed on a front surface of the first block 3431, such that a surface of the third block 3433 is perpendicular to a surface of the second block 3432, the fourth block 3434 is disposed at a bottom end of the first block 3431 and protrudes out of the front surface of the first block 3431, the second block 3432 is provided with a second mounting hole to mount the second block 3432 on the annular sidewall 32, and a clamping groove 341 is disposed on a body of the third block 3433 to mount the connecting component in a clamping manner.

Further, the body of the fourth block 3434 is provided with a first through hole 3434A, a first air hole 3434B and a second air hole 3434C, the first through hole 3434A penetrates through the body, the surface where the two end ports are located is perpendicular to the front surface of the first block 3431, the first air hole 3434B is opened at the upper end and is vertically communicated with the first through hole 3434A, the second air hole 3434C is vertically communicated with the first through hole 3434A and is opened towards the back surface of the fourth block 3434, the annular side wall 32 is provided with a through hole communicated with the second air hole 3434C, the second air hole 3434C is communicated with the first cavity 33 through the through hole, and one end of the first connecting pipe penetrates through the through hole in the annular side wall 32 to be connected with the second air hole 3434C.

The second connecting block 344 includes a fifth block 3441, a sixth block 3442, a seventh block 3443 and an eighth block 3444, the fifth block 3441 is a square block, the sixth block 3442 is symmetrically arranged on opposite sides of the fifth block 3441, the seventh block 3443 is arranged on the front surface of the fifth block 3441, the eighth block 3444 is arranged at the bottom end of the fifth block 3441 and protrudes out of the front surface of the fifth block 3441, the sixth block 3442 is provided with a third mounting hole for mounting, and the seventh block 3443 is provided with a clamping groove for mounting the connecting component 341; the body of the eighth block 3444 is provided with a second through hole 3444A and a third air hole 3444B, the second through hole 3444A penetrates through the body of the eighth block 3444, the surface of the end where the two end ports are located is perpendicular to the front surface of the fifth block 3441, and the third air hole 3444B is opened at the upper end and is vertically communicated with the second through hole 3444A.

The first connecting block 343 and the second connecting block 344 are both provided with a connecting component 341, the connecting component 341 comprises a third connecting pipe 3411, a middle pipe 3412 and an outer frame sucker 3413 which are communicated, for the first connecting block 343, the third connecting pipe 3411 is arranged in a first air hole 3434B, and a pipe body passes through a clamping groove of a third block 3433, so that an inner cavity of the third connecting pipe 3411 is communicated with the first air hole 3434B, and the third connecting pipe 3411 is limited in the vertical direction through nuts on the pipe bodies at two ends of the clamping groove; for the second connection block 344, the third connection pipe 3411 is disposed in the third air hole 3444B and the pipe body passes through the clamping groove of the seventh block 3443, so that the inner cavity of the third connection pipe 3411 is communicated with the third air hole 3444B, and the third connection pipe 3411 is limited in the vertical direction by nuts on the pipe body at two ends of the clamping groove; the middle pipe 3412 is arranged between the third connecting pipe 3411 and the outer frame sucker 3413; the outer frame suction cup 3413 is configured as a trapezoid column having a through hole and is capable of sucking an outer frame in a wafer sample such that the inner cavity of the third connection tube 3411, the inner cavity of the middle tube 3412, and the through hole of the outer frame suction cup 3413 are communicated.

One end of the second connection pipe 342 is connected with the first through hole 3434A, and the other end is connected with the second through hole 3444A, so that connection between the adjacent first connection block 343 and the second connection block 344 is realized; alternatively, the second connection pipe 342 is disposed between two adjacent second through holes 3444A, so that connection between two adjacent second connection blocks 344 is achieved, and it is known that connection between the adjacent first connection blocks 343 and the second connection blocks 344 and connection between the adjacent second connection blocks 344 can be achieved through the second connection pipe 342, and thus, the adjacent first through holes 3434A and the second through holes 3444A can be communicated through the second connection pipe 342, and similarly, two adjacent second through holes 3444A can be communicated through the second connection pipe 342.

The air duct 5 comprises a main pipe body and a three-way joint, one end of the main pipe body is connected with the pneumatic slip ring 4, the other end of the main pipe body is connected with the three-way joint, the three-way joint is connected with a connecting port of the first shell 312, one end of the first connecting pipe is connected with the second air hole 3434C, the other end of the first connecting pipe is connected with the three-way joint, so that the first connecting pipe is communicated with the main pipe body, the first through hole 3434A, the first air hole 3434B and the second air hole 3434C in the first connecting block 343 can generate negative pressure through the first connecting pipe, so that the cavity of the second connecting pipe 342, the second through hole 3444A and the third air hole 3444B of the second connecting block 344 generate vacuum negative pressure, and therefore, negative pressure vacuum is generated in the connecting component 341 arranged in the first air hole 3434B and the third air hole 3444B, and the outer frame of the outer frame sucker 3413 can realize adsorption fixation on the outer frame in a wafer sample through the negative pressure environment in the through holes.

The present utility model is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present utility model are intended to be included in the scope of the present utility model.

Claims (10)

1. A vacuum adsorption rotation device for a wafer sample, characterized by comprising a vacuum chuck (3), a pneumatic slip ring (4) and an air duct (5), wherein the vacuum chuck (3) comprises an annular side wall (32) and an adsorption assembly (34), and the adsorption assembly (34) comprises a connection assembly (341), a first connection pipe, a second connection pipe (342), a first connection block (343) and a plurality of second connection blocks (344); the utility model discloses a pneumatic sliding ring type air conditioner, including annular lateral wall (32) and connecting assembly, annular lateral wall (32) are connected to first connecting block (343), connecting assembly (341) are all equipped with on first connecting block (343) and second connecting block (344), connecting assembly (341) are connected to air duct (5) with pneumatic sliding ring (4), second connecting pipe (342) are located adjacently between first connecting block (343) and second connecting block (344) or between two adjacent second connecting blocks (344).

2. The vacuum adsorption spin device for a wafer sample according to claim 1, further comprising a rotating electric machine (2), wherein the annular side wall (32) is provided on the rotating electric machine (2), the vacuum chuck (3) further comprises a top shell (31) and a first cavity (33), wherein the top shell (31) is provided on the annular side wall (32), the top shell (31) and the annular side wall (32) enclose the first cavity (33), and the pneumatic slip ring (4) is connected to the rotating electric machine (2) and is located in the first cavity (33).

3. The vacuum adsorption rotating device for a wafer sample according to claim 2, further comprising a base (1), wherein a base vent hole (11) is formed in a block of the base (1), the rotating motor (2) is arranged on the base (1), a second cavity communicated with the first cavity (33) is formed in a machine body of the rotating motor (2), an air passage on the pneumatic sliding ring (4) is communicated with the second cavity, the base vent hole (11) is communicated with the second cavity, and the base vent hole (11) is connected with a vacuum pump.

4. A vacuum adsorption rotation device for a wafer sample according to claim 3 wherein the first connection block (343) comprises a first block (3431), a second block (3432) and a fourth block (3434), the second block (3432) being symmetrically disposed at opposite ends of the first block (3431) and connected to the annular sidewall (32), the fourth block (3434) being disposed at a bottom end of the first block (3431).

5. The vacuum adsorption rotating device for a wafer sample according to claim 4, wherein a first through hole (3434A), a first air hole (3434B) and a second air hole (3434C) are provided on the body of the fourth block (3434), the first air hole (3434B) is vertically communicated with the first through hole (3434A), and the second air hole (3434C) is vertically communicated with the first through hole (3434A).

6. The vacuum adsorption rotation device for a wafer sample according to claim 5, wherein the second connection block (344) includes a fifth block (3441), a sixth block (3442) and an eighth block (3444), the sixth block (3442) being symmetrically provided at opposite ends of the fifth block (3441) and connected to the annular sidewall (32), the eighth block (3444) being provided at a bottom end of the fifth block (3441).

7. The vacuum adsorption rotating device for a wafer sample according to claim 6, wherein a second through hole (3444A) and a third air hole (3444B) are provided on the body of the eighth block (3444), and the third air hole (3444B) is vertically communicated with the second through hole (3444A).

8. The vacuum adsorption spin device for a wafer sample of claim 7, wherein the connection assembly (341) is disposed within each of the first air hole (3434B) and the third air hole (3444B).

9. The vacuum adsorption spin device for a wafer sample according to claim 8, wherein a through hole communicating with the second air hole (3434C) is provided in a plate body of the annular sidewall (32), and one end of the first connection pipe is connected to the second air hole (3434C) through the through hole in the annular sidewall (32).

10. The vacuum adsorption spin device for a wafer sample of claim 9, wherein the second connection tube (342) is provided between the adjacent first through hole (3434A) and second through hole (3444A) or between the adjacent two second through holes (3444A).