CN214672563U

CN214672563U - Positioning and clamping device for processing quartz component of semiconductor diffusion equipment

Info

Publication number: CN214672563U
Application number: CN202122456478.3U
Authority: CN
Inventors: 王卫良; 李士昌; 刘超平; 林保璋; 蒋建新
Original assignee: Shengjisheng Precision Manufacturing Shaoxing Co ltd; SGS Ningbo Semiconductor Technology Co Ltd
Current assignee: Shengjisheng Precision Manufacturing Shaoxing Co ltd; SGS Ningbo Semiconductor Technology Co Ltd
Priority date: 2021-10-13
Filing date: 2021-10-13
Publication date: 2021-11-09
Anticipated expiration: 2031-10-13

Abstract

The application relates to the technical field of semiconductor processing, in particular to a positioning and clamping device for processing a quartz component of semiconductor diffusion equipment, which comprises a disk body and a first vacuum suction hole formed in the disk body, wherein the first vacuum suction hole is used for being connected with a vacuumizing device; a convex ring is convexly arranged on the surface of the disc body where the first vacuum suction hole is located, and the convex ring and the disc body form a material groove for placing the bottom of a workpiece; and the inner wall of the convex ring is provided with a tightly-supporting component for tightly supporting the side surface of the workpiece. This application utilizes evacuating device to inhale the hole to first vacuum and carries out the evacuation, inhales the downthehole negative pressure that forms in first vacuum, utilizes this negative pressure to adsorb the quartzy product of semiconductor on the disk body, and simple structure can process the outer disc well when the quartzy product of clamping semiconductor.

Description

Positioning and clamping device for processing quartz component of semiconductor diffusion equipment

Technical Field

The application relates to the technical field of semiconductor processing, in particular to a positioning and clamping device for processing a quartz component of semiconductor diffusion equipment.

Background

The semiconductor quartz product is a semiconductor product prepared using a quartz material, such as: quartz covers, quartz tubes, quartz boats, etc.

When the clamping mode is adopted, the clamp is clamped on the outer circular surface of the semiconductor quartz product, only the end surface of the semiconductor quartz product can be processed, and when the outer circular surface of the semiconductor quartz product is processed, the clamp can block a processing cutter and cannot process the outer circular surface.

SUMMERY OF THE UTILITY MODEL

In order to process the outer circular surface well when clamping a semiconductor quartz product, the application provides a positioning and clamping device for processing a quartz component of semiconductor diffusion equipment.

The application provides a quartz member of semiconductor diffusion equipment processes and uses location clamping device adopts following technical scheme:

a positioning and clamping device for processing a quartz component of semiconductor diffusion equipment comprises a disk body and a first vacuum suction hole formed in the disk body, wherein the first vacuum suction hole is used for being connected with a vacuumizing device; a convex ring is convexly arranged on the surface of the disc body where the first vacuum suction hole is located, and the convex ring and the disc body form a material groove for placing the bottom of a workpiece; and the inner wall of the convex ring is provided with a tightly-supporting component for tightly supporting the side surface of the workpiece.

By adopting the technical scheme, when the vacuum chuck is used, the first vacuum suction hole is vacuumized by the vacuumizing device, negative pressure is formed in the first vacuum suction hole, and the semiconductor quartz product is adsorbed on the chuck body by the negative pressure, so that the structure is simple, and the outer circular surface can be well processed when the semiconductor quartz product is clamped; in addition, a trough is formed by the convex ring, and the inner ring surface of the convex ring limits the outer circle side wall of the semiconductor quartz product, so that the positioning and clamping effects are improved; the outer circle side wall of the semiconductor quartz product is tightly abutted by the abutting force of the abutting assembly, so that the positioning and clamping are more stable and firm.

Optionally, the abutting assembly comprises an abutting block and an elastic piece, the abutting block is arranged on the convex ring in a sliding mode along the radial direction of the disc body, one end of the abutting block extends out of the inner annular surface of the convex ring, and the elastic piece is arranged in the convex ring and connected with the abutting block to enable the abutting block to abut against the side surface of the workpiece.

Through adopting above-mentioned technical scheme, during the use, push away the piece that supports earlier in the convex ring, then put into the silo with the quartzy product of semiconductor, put into in-process support piece and support tightly on the excircle lateral wall of the quartzy product of semiconductor under the elastic component effect for the location clamping is more stable, firm, supports the simple structure of tight subassembly, and it is comparatively convenient to operate.

Optionally, a balance air hole communicated with an end face of the abutting block back to the axis of the disc body is formed in the outer annular surface of the convex ring.

Through adopting above-mentioned technical scheme, when the elastic component will support the piece and promote to the excircle lateral wall of semiconductor quartz product, inside the air got into the bulge loop through balanced gas pocket, the negative pressure that produces when balanced tight piece slides supported, supported tightly the effect better.

Optionally, a vacuum pumping cavity communicated with the first vacuum suction hole is formed in the disc body, and the vacuum pumping cavity is used for being connected with a vacuum pumping device.

By adopting the technical scheme, the vacuum pumping cavity can pump more gas, and the loss reducing effect on the whole vacuum tight-suction semiconductor quartz product is smaller under the same gas leakage condition.

Optionally, the end face of the tray body, which faces away from the first vacuum suction hole, is provided with a plurality of connecting holes which are distributed in the circumferential direction of the tray body and are used for being connected with a vacuum pumping device, and the tray body is provided with a plurality of connecting holes which are distributed in the circumferential direction of the tray body and are connected with the vacuum pumping cavity and the connecting holes.

Through adopting above-mentioned technical scheme, utilize the connecting hole of circumference distribution to make the mass distribution of disk body more even, more steady when the disk body rotates.

Optionally, at least one group of second vacuum suction holes is formed in the tray body, and the second vacuum suction holes in the same group are distributed along the circumferential direction of the tray body.

Through adopting above-mentioned technical scheme, the second vacuum is inhaled the hole and is inhaled the hole with first vacuum and carry out the negative pressure simultaneously and absorb to the tip of semiconductor quartz product, and holistic clamping effect is more stable.

Optionally, an annular groove communicated with the same group of second vacuum suction holes is formed in the tray body, a sealing ring sheet is arranged in the annular groove, and a sealing plug used for sealing the second vacuum suction holes is arranged on the surface, facing the bottom of the annular groove, of the sealing ring sheet in a protruding manner.

By adopting the technical scheme, when the diameter of the semiconductor quartz product needing to be clamped and positioned is smaller than the trough, the second vacuum suction holes outside the end face range of the semiconductor quartz product are blocked, the sealing ring piece and the sealing plug are utilized to block the same group of second vacuum suction holes, and the sealing plug is fixed with the second vacuum suction holes by virtue of the elasticity of the sealing plug, so that the possibility that the sealing ring piece drops is reduced, and the structure is simple and the operation is convenient.

Optionally, the disk body back to the end face of the first vacuum suction hole is provided with an installation part used for being connected with the rotating shaft.

By adopting the technical scheme, the disc body of the mounting part can be connected to the rotating shaft, so that the positioning and clamping device is convenient to mount.

In summary, the present application includes at least one of the following beneficial technical effects:

1. when the device is used, the first vacuum suction hole is vacuumized by the vacuumizing device, negative pressure is formed in the first vacuum suction hole, and the semiconductor quartz product is adsorbed on the disc body by the negative pressure, so that the structure is simple, and the outer circular surface can be well processed when the semiconductor quartz product is clamped;

2. the design of the second vacuum suction hole enables the clamping effect to be more stable, and the pump positioning and clamping device can also adapt to the clamping work of semiconductor quartz products with the size smaller than that of the material tank by utilizing the sealing ring sheet and the sealing plug;

3. the abutting block abuts against the outer circle side wall of the semiconductor quartz product under the action of the elastic piece, so that the positioning and clamping are more stable and firm, the abutting assembly is simple in structure, and the operation is more convenient.

Drawings

Fig. 1 is a schematic structural diagram of a positioning and clamping device for processing a quartz component of a semiconductor diffusion device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a positioning and clamping device for processing a quartz component of a semiconductor diffusion apparatus according to an embodiment of the present application, which is used for illustrating the structure of a mounting plate.

Fig. 3 is a cross-sectional view of a positioning and clamping device for processing a quartz member of a semiconductor diffusion apparatus according to an embodiment of the present application.

Description of reference numerals: 1. a tray body; 11. vacuumizing the cavity; 12. connecting holes; 13. a convex ring; 14. a trough; 15. an air extraction channel; 2. a first vacuum suction hole; 3. a second vacuum suction hole; 4. an annular groove; 5. a sealing ring sheet; 51. a sealing plug; 6. a propping component; 61. a propping block; 62. an elastic member; 63. a sliding hole; 64. a drive ramp; 65. balancing air holes; 7. an installation part; 71. a first mounting hole; 72. a stud; 73. an elastic washer; 74. and locking the nut.

Detailed Description

The present application is described in further detail below with reference to figures 1-3.

The embodiment of the application discloses a positioning and clamping device for processing a quartz component of semiconductor diffusion equipment. Referring to fig. 1 and 2, the tray body 1 and the first vacuum suction hole 2 are included. The first vacuum suction hole 2 is formed in one end face of the tray body 1 and is located at the axis of the tray body 1.

As shown in fig. 2 and 3, a circular vacuum pumping chamber 11 is formed in the tray body 1, the first vacuum suction hole 2 is communicated with the vacuum pumping chamber 11, four air exhaust channels 15 are formed in one side of the vacuum pumping chamber 11, which is opposite to the first vacuum suction hole 2, are distributed along the circumferential direction of the tray body 1 and are used for being connected with a vacuum pumping device, the air exhaust channels 15 penetrate through the end surface of the tray body 1 along the direction far away from the first vacuum suction hole 2, a connecting hole 12 is formed in the position penetrating through the tray body 1, and the connecting hole 12 is used for being connected with a negative pressure port of the vacuum pumping device.

Two groups of second vacuum suction holes 3 are formed in the disc body 1, and the second vacuum suction holes 3 in each group are distributed along the circumferential direction of the disc body 1.

The ring channel 4 has been seted up on the disk body 1, every ring channel 4 communicates the second vacuum suction hole 3 of the same group, second vacuum suction hole 3 is in the width range of ring channel 4, the embedding has sealing ring piece 5 in the ring channel 4, the shape size of sealing ring piece 5 is the same with ring channel 4, sealing ring piece 5 is towards the fixed surface of second vacuum suction hole 3 and is connected with sealing plug 51, sealing plug 51 is rubber sealing plug 51, thereby sealing plug 51 stretches into in the second vacuum suction hole 3 and blocks up second vacuum suction hole 3, make second vacuum suction hole 3 sealed, and simultaneously, effort between the pore wall through sealing plug 51 and second vacuum suction hole 3, make sealing ring piece 5 can not drop.

As shown in fig. 1 and 3, a convex ring 13 is integrally and convexly arranged on the surface of the tray body 1 provided with the first vacuum suction hole 2, the convex ring 13 is positioned on the periphery of the second vacuum suction hole 3, the convex ring 13 and the tray body 1 form a trough 14 for placing a workpiece at the bottom, and the convex ring 13 is provided with a clamping assembly 6.

As shown in fig. 1 and 3, the abutting assembly 6 includes an abutting block 61 and an elastic member 62, the elastic member 62 is a spring, a sliding hole 63 extending along the radial direction of the disk body 1 is further formed in the inner annular surface of the protruding ring 13, one end of the spring is connected to the bottom of the sliding hole 63, the other end of the spring is connected to the abutting block 61, the abutting block 61 is connected to the sliding hole 63 in a sliding manner, one end of the abutting block 61, which is far away from the spring, extends out of the inner annular surface of the protruding ring 13, and a driving inclined surface 64 is formed in a portion of the abutting block 61, which extends out of the protruding ring 13.

Balance air holes 65 with the same number as the sliding holes 63 are formed in the outer annular surface of the convex ring 13, and the balance air holes 65 are communicated with the sliding holes 63.

As shown in fig. 2 and 3, an end surface of the tray body 1 facing away from the first vacuum suction hole 2 is provided with a mounting portion 7 for connection with the rotating shaft. The installation portion 7 comprises a connecting cylinder, two first installation holes 71 are formed in the connecting cylinder, the first installation holes 71 are radially arranged along the connecting cylinder and penetrate through the connecting cylinder, the two first installation holes 71 are arranged at ninety degrees, a stud 72 is arranged in each first installation hole 71 in a penetrating mode, two ends of the stud 72 extend out of the connecting cylinder, an elastic washer 73 is sleeved on the portion, extending out of the outer wall of the connecting cylinder, of the stud 72, and a locking nut 74 is connected with the threaded portion.

And a second mounting hole corresponding to the threaded hole is formed in the rotating shaft connected with the disc body 1, the locking stud 72 passes through the mounting hole, and the locking nut 74 is screwed down to fixedly connect the connecting cylinder with the rotating shaft.

The implementation principle of the positioning and clamping device for processing the quartz component of the semiconductor diffusion equipment in the embodiment of the application is as follows:

when the quartz vacuum sucking device is used, the sealing ring piece 5 is taken down, one end of a quartz workpiece is placed into the material groove 14, the outer wall of the quartz workpiece is tightly propped through the propping block 61, then the vacuumizing device is used for vacuumizing, and negative pressure is generated at the first vacuum sucking hole 2 and the second vacuum sucking hole 3 and sucks the quartz workpiece.

When the quartz workpiece which is smaller than the material tank 14 and even has a smaller radius than the sealing ring piece 5 needs to be clamped, the sealing ring piece 5 is arranged in the annular groove 4, and then the quartz workpiece is adsorbed only by the first vacuum suction holes 2.

The sealing ring 5 can be removed by blowing or aerating the first vacuum suction hole 2.

The sealing ring piece 5 can be pulled out through the gap between the sealing ring piece 5 and the annular groove 4, can be taken out through the reverse work of the vacuumizing device, and can be conveniently taken down through the bump, the hole and the like of the sealing ring piece 5 in the surface design of the sealing ring piece 5 back to the disk body 1 so as to conveniently take down the sealing ring piece 5.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A quartz member of semiconductor diffusion equipment processes and uses location clamping device which characterized in that: the vacuum disc comprises a disc body (1) and a first vacuum suction hole (2) formed in the disc body (1), wherein the first vacuum suction hole (2) is used for being connected with a vacuumizing device; a convex ring (13) is convexly arranged on the surface of the tray body (1) where the first vacuum suction hole (2) is located, and the convex ring (13) and the tray body (1) form a trough (14) for placing a workpiece at the bottom; and a tight abutting component (6) for abutting against the side surface of the workpiece is arranged on the inner wall of the convex ring (13).

2. The positioning and clamping device for processing the quartz component of the semiconductor diffusion equipment as claimed in claim 1, wherein: support tight subassembly (6) including supporting tight piece (61) and elastic component (62), support tight piece (61) along disk body (1) radially slide set up in on bulge loop (13), just the one end of supporting tight piece (61) stretches out bulge loop (13) inner ring face, elastic component (62) set up in bulge loop (13) and with support tight piece (61) be connected be used for with support tight piece (61) support tightly on the work piece side surface.

3. The positioning and clamping device for processing the quartz component of the semiconductor diffusion equipment as claimed in claim 2, wherein: and a balance air hole (65) communicated with the end face of the abutting block (61) back to the axis of the disc body (1) is formed in the outer annular surface of the convex ring (13).

4. The positioning and clamping device for processing the quartz component of the semiconductor diffusion equipment as claimed in claim 1, wherein: a vacuum pumping cavity (11) communicated with the first vacuum suction hole (2) is formed in the tray body (1), and the vacuum pumping cavity (11) is used for being connected with a vacuum pumping device.

5. The positioning and clamping device for processing the quartz component of the semiconductor diffusion equipment as claimed in claim 4, wherein: disk body (1) back to the terminal surface of first vacuum suction hole (2) has seted up a plurality of edges connecting hole (12) that disk body (1) circumference distributes and is used for being connected with evacuating device, disk body (1) has seted up a plurality of edges disk body (1) circumference distributes and connects evacuating chamber (11) with bleed-off passageway (15) of connecting hole (12).

6. The positioning and clamping device for processing the quartz component of the semiconductor diffusion equipment as claimed in claim 1, wherein: the tray body (1) is provided with at least one group of second vacuum suction holes (3), and the second vacuum suction holes (3) in the same group are distributed along the circumferential direction of the tray body (1).

7. The positioning and clamping device for processing the quartz component of the semiconductor diffusion equipment as claimed in claim 6, wherein: the disc body (1) is provided with an annular groove (4) communicated with the same group of second vacuum suction holes (3), a sealing ring piece (5) is arranged in the annular groove (4), and the sealing ring piece (5) protrudes towards the surface of the bottom of the annular groove (4) and is provided with a sealing plug (51) used for sealing the second vacuum suction holes (3).

8. The positioning and clamping device for processing the quartz component of the semiconductor diffusion equipment as claimed in claim 1, wherein: the end face of the disc body (1), back to the first vacuum suction hole (2), is provided with an installation part (7) used for being connected with the rotating shaft.