CN220774328U

CN220774328U - Carrier device and wafer thinning machine

Info

Publication number: CN220774328U
Application number: CN202322398487.0U
Authority: CN
Inventors: 吴俊逸; 沈凌寒
Original assignee: Jimsi Semiconductor Technology Wuxi Co ltd
Current assignee: Jimsi Semiconductor Technology Wuxi Co ltd
Priority date: 2023-09-04
Filing date: 2023-09-04
Publication date: 2024-04-12
Anticipated expiration: 2033-09-04

Abstract

The utility model relates to a carrier device and a wafer thinning machine. The base is provided with a first air passage and a second air passage which are mutually independent, and a first air hole communicated with the first air passage is formed in the mounting surface of the base. Vacuum is pumped to the adsorption hole through the second air passage, so that negative pressure can be formed on the adsorption surface of the sucker to adsorb the workpiece; and the vacuum is broken to the adsorption hole through the second air passage, so that the adsorbed workpiece can be released. In the working process of the carrying platform device, the first air hole can be vacuumized through the first air channel no matter vacuumized through the second air channel or vacuumized through the second air channel, so that the suction disc is adsorbed on the mounting surface of the base. In this way, the mounting strength between the suction cup and the base is enhanced, and particles will not easily enter between the suction cup and the mounting surface. Therefore, the adsorption surface of the carrier device has high flatness, so that the workpiece on the adsorption surface is ensured to have high flatness, and the machining precision is improved.

Description

Carrier device and wafer thinning machine

Technical Field

The present utility model relates to the field of semiconductor devices, and in particular, to a carrier device and a wafer thinning machine.

Background

When the precise workpiece is processed, the precise workpiece is required to be adsorbed and fixed on a carrier to ensure stable position. The common carrier generally comprises a base and a sucker mounted on the base, wherein the sucker is fastened on the base through a plurality of screws distributed along the circumferential direction.

When the chuck draws a vacuum and begins to adsorb the workpiece, particulate matter on its surface may be drawn into the vacuum flow path. When the suction cup breaks the vacuum to release the workpiece, particles in the vacuum flow channel may enter and fly out with the air flow and be embedded between the suction cup and the base. When the chuck again attracts the workpiece, its part may be lifted up by the particles trapped between the chuck and the susceptor, resulting in a decrease in the flatness of the chuck. In this way, the flatness of the workpiece attached to the chuck surface is also affected, resulting in a decrease in machining accuracy.

Disclosure of Invention

In view of the above, it is necessary to provide a stage device and a wafer thinning machine capable of improving processing accuracy.

A carrier device, comprising:

the base is provided with a first air passage and a second air passage which are mutually independent, and a first air hole communicated with the first air passage is formed in the mounting surface of the base; and

The suction plate is arranged on the mounting surface, a suction hole is formed in the suction surface of the suction plate, the suction hole is communicated with the second air passage, and the suction hole can be vacuumized or broken through the second air passage;

the first air holes can be vacuumized through the first air passages, so that the suckers are adsorbed on the mounting surface.

In one embodiment, the suction cup is mounted to the mounting surface by a plurality of threaded fasteners disposed circumferentially about the suction surface.

In one embodiment, the adsorption hole penetrates through the sucker in the thickness direction, a second air hole communicated with the second air passage is formed in the mounting surface, and one end, away from the adsorption surface, of the adsorption hole is communicated with the second air hole.

In one embodiment, the mounting surface is provided with a communication groove, the second air hole is located at the bottom of the communication groove, and one end, away from the adsorption surface, of the adsorption hole is communicated with the second air hole through the communication groove.

In one embodiment, the communication grooves are annular and are provided with a plurality of communication grooves, the communication grooves are concentrically arranged, and the bottom of each communication groove is provided with the second air hole.

In one embodiment, a first adsorption groove is formed in the mounting surface, and the first air hole is located at the bottom of the first adsorption groove.

In one embodiment, the first adsorption tanks are ring-shaped and are provided with a plurality of first adsorption tanks, the first adsorption tanks are concentrically arranged, and the bottom of each first adsorption tank is provided with the first air holes.

In one embodiment, a second adsorption groove is formed in the surface, facing away from the adsorption surface, of the sucker, and the first air hole is communicated with the second adsorption groove.

In one embodiment, the device further comprises a pneumatic slip ring, the pneumatic slip ring comprises a fixed part and a rotating part, and the first air passage and the second air passage are communicated with the rotating part.

A wafer thinning machine comprising a stage apparatus as in any of the preceding preferred embodiments.

According to the carrier device and the wafer thinning machine, the suction holes are vacuumized through the second air passage, so that negative pressure can be formed on the suction surface of the suction disc to suck a workpiece; and the vacuum is broken to the adsorption hole through the second air passage, so that the adsorbed workpiece can be released. In the working process of the carrying platform device, the first air hole can be vacuumized through the first air channel no matter vacuumized through the second air channel or vacuumized through the second air channel, so that the suction disc is adsorbed on the mounting surface of the base. In this way, the mounting strength between the suction cup and the base is enhanced, and particles will not easily enter between the suction cup and the mounting surface. Therefore, the adsorption surface of the carrier device has high flatness, so that the workpiece on the adsorption surface is ensured to have high flatness, and the machining precision is improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a front view of a stage apparatus according to a preferred embodiment of the present utility model;

FIG. 2 is a top view of a base of the stage apparatus of FIG. 1;

FIG. 3 is a top view of the chuck of the stage assembly of FIG. 1;

fig. 4 is a bottom view of the suction cup of fig. 3.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Referring to fig. 1, a stage apparatus 10 and a wafer thinning machine (not shown) are provided. The wafer thinning machine includes a stage device 10.

The wafer thinning machine is used for thinning the back surface of the wafer 20 to remove redundant materials, thereby reducing the thickness of the wafer 20 and being beneficial to realizing the miniaturization of integrated circuits. The carrier device 10 is used for carrying and adsorbing a wafer 20 to be thinned, so as to keep the position of the wafer 20 stable.

Referring to fig. 2 and 3, a stage apparatus 10 according to a preferred embodiment of the present utility model includes a base 100 and a chuck 200.

The base 100 is supported and is typically formed of metal. A relatively flat mounting surface 110 is formed on one side of the base 100, and the suction cup 200 is mounted on the mounting surface 110. The suction cup 200 may be formed of a material having a relatively high hardness such as ceramic. Furthermore, an adsorption surface 210 is formed on a side of the chuck 200 facing away from the base 100, and the adsorption surface 210 is capable of carrying and adsorbing a workpiece, such as a wafer 20. The base 100 and the suction cup 200 are generally plate-shaped. In particular, in the present embodiment, the susceptor 100 and the chuck 200 are both disk-shaped, so that the suction surface 210 matches the shape of the wafer 20.

In the present embodiment, the suction cup 200 is mounted to the mounting surface 110 by a plurality of threaded fasteners (not shown) provided along the circumferential direction of the suction surface 210. The threaded fasteners may be screws, and the plurality of threaded fasteners may be capable of increasing the strength of the installation between the suction cup 200 and the base 100. Obviously, in other embodiments, the sucker 200 may be fixedly mounted with the base 100 by means of a snap, a plug, or the like.

Wherein, the base 100 is formed with a first air passage (not shown) and a second air passage (not shown) which are independent from each other. The first air passage and the second air passage can be formed by mutually communicated holes, cavities and channels, and gas can flow along the first air passage and the second air passage. The first air passage and the second air passage can be respectively communicated with an air source. Moreover, because the first air passage and the second air passage are mutually independent, the first air passage and the second air passage can respectively vacuumize or break the vacuum, and the first air passage and the second air passage can not mutually interfere.

Further, the mounting surface 110 of the base 100 is provided with a first air hole 101, and the first air hole 101 is communicated with the first air channel. The first air hole 101 can be vacuumized through the first air passage, so that negative pressure is generated in the first air hole 101, and the sucker 200 is adsorbed on the mounting surface 110. The adsorption surface 210 of the sucker 200 is provided with an adsorption hole 201, and the adsorption hole 201 is communicated with the second air passage. The suction holes 201 can be evacuated through the second air passage, thereby forming a negative pressure to suck the wafer 20. Further, the vacuum can be broken to the suction holes 201 through the second air passage, thereby releasing the sucked wafer 20. The adsorption holes 201 are generally uniformly distributed on the adsorption surface 210, so that the wafer 20 can be stably adsorbed.

During operation, the suction holes 201 are vacuumized or broken through the second air passage, and the first air holes 101 are vacuumized through the first air passage, so that the suction cup 200 is kept sucked with the mounting surface 110 of the base 100. In this way, the mounting strength between the suction cup 200 and the base 100 is enhanced. Further, the suction cup 200 is more tightly attached to the mounting surface 110 with a smaller gap, so that particles will not easily enter between the suction cup 200 and the mounting surface 110 when the suction holes 201 break the vacuum. Therefore, the suction surface 210 can be kept at a high flatness to ensure that the workpiece on the suction surface 210 also has a high flatness, thereby improving the machining accuracy.

Referring to fig. 2 again, in the present embodiment, the suction hole 201 penetrates the suction cup 200 along the thickness direction, the mounting surface 110 is provided with a second air hole 102 communicating with the second air passage, and one end of the suction hole 201 away from the suction surface 210 is communicated with the second air hole 102. Thus, after the suction cup 200 is fixed on the mounting surface 110, the suction hole 201 can be communicated with the second air channel through the second air hole 102, so that no additional connection structure is needed, which is helpful for simplifying the structure of the carrier device 10.

Further, in the present embodiment, the mounting surface 110 is provided with a communication groove 103, the second air hole 102 is located at the bottom of the communication groove 103, and one end of the adsorption hole 201 away from the adsorption surface 210 is communicated with the second air hole 102 through the communication groove 103. The opening range of the communication groove 103 is larger than that of the second air hole 102, and when the suction cup 200 is mounted on the base 100, the suction hole 201 is aligned with the communication groove 103 at the end far from the suction surface 210, so that the allowable error range is larger. In this way, the adsorption hole 201 and the second air hole 102 are more easily communicated.

Further, in the present embodiment, the communication grooves 103 are annular and are provided in plurality, the plurality of communication grooves 103 are concentrically arranged, and the bottom of each communication groove 103 is provided with the second air hole 102. In this way, the second air holes 102 can be distributed more uniformly, and the negative pressure formed on the adsorption surface 210 can be more uniform while the communication with the adsorption holes 201 is further facilitated.

In this embodiment, the mounting surface 110 is provided with a first adsorption groove 104, and the first air hole 101 is located at the bottom of the first adsorption groove 104. The suction cup 200 is mounted on the mounting surface 110 to cover the first suction groove 104, so that the interior of the whole first suction groove 104 is in a negative pressure state when the first air hole 101 is vacuumized through the first air channel. Thus, the suction area of the suction cup 200 on the mounting surface 110 can be increased, so that the suction effect between the two is better.

Further, in the present embodiment, the first adsorption tanks 104 are annular and are provided in plurality, the first adsorption tanks 104 are concentrically arranged, and the bottom of each first adsorption tank 104 is provided with the first air hole 101. When the first air passage is vacuumized, negative pressure can be formed in each first adsorption groove 104, so that the suction cup 200 is adsorbed. Since the plurality of first suction grooves 104 having the circular ring shape are uniformly distributed on the mounting surface 110, the suction force provided to the suction cup 200 is also more uniformly distributed, thereby helping to promote the stability of the mounting of the suction cup 200.

Further, in the present embodiment, a plurality of first air holes 101 are formed at the bottom of each first adsorption groove 104, and a plurality of first air holes 101 located in the same first adsorption groove 104 are disposed at equal intervals along the circumferential direction of the first adsorption groove 104. In this way, the negative pressure formed in each first adsorption groove 104 can be more uniform, and the stability of the installation of the sucker 200 can be further improved.

In addition, referring to fig. 4, in the present embodiment, a second adsorption groove 202 is formed on a surface of the suction cup 200 facing away from the adsorption surface 210, and the first air hole 101 is communicated with the second adsorption groove 202.

The second adsorption grooves 202 may have a bar shape or a circular arc shape, and may be equally spaced along the circumferential direction of the suction cup 200. Specifically, the second adsorption tank 202 communicates with the first air hole 101 through the first adsorption tank 104. When the vacuum is pumped through the first air passage, a vacuum cavity can be formed in the second adsorption groove 202, so that the adsorption fixing effect of the base 100 on the sucker 200 is better.

Referring to fig. 1 again, in the present embodiment, the carrier device 10 further includes a pneumatic slip ring 300, and the pneumatic slip ring 300 includes a fixed portion (not shown) and a rotating portion (not shown), and the first air passage and the second air passage are in communication with the rotating portion.

In the process of the wafer thinning machine, the carrier device 10 needs to rotate around the axis, so as to drive the wafer 20 to rotate. The rotation portion is rotatable about an axis with respect to the fixed portion, and the rotation axis of the rotation portion coincides with the rotation axis of the stage device 10. Specifically, air passages (not shown) are formed in the fixing portion and the rotating portion, and the air passages in the fixing portion and the rotating portion can be communicated with each other along with rotation of the rotating portion. The first air passage and the second air passage are communicated with the air passages in the rotating part, and the air passages in the fixed part can be communicated with the air source, so that the first air passage and the second air passage are communicated with the corresponding air source. Therefore, when the carrier device 10 rotates around the axis, the first air passage and the second air passage can be always communicated with the corresponding air sources through the pneumatic slip ring 300, so as to ensure normal operation.

The carrier device 10 and the wafer thinning machine can form negative pressure on the suction surface 210 of the suction cup 200 to suck the workpiece by vacuumizing the suction hole 201 through the second air passage; and the vacuum is broken to the suction hole 201 through the second air passage, so that the sucked workpiece can be released. In the operation of the stage device 10, the first air holes 101 may be evacuated through the first air passage, so that the suction cup 200 and the mounting surface 110 of the base 100 may be kept to be sucked. In this way, the strength of the mounting between the suction cup 200 and the base 100 is enhanced, and particles will not easily enter between the suction cup 200 and the mounting surface 110. Therefore, the suction surface 210 of the stage device 10 can have a high flatness to ensure that the workpiece on the suction surface 210 has a high flatness, thereby improving the machining precision.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. A carrier device, comprising:

2. The stage device according to claim 1, wherein the suction cup is mounted to the mounting surface by a plurality of threaded fasteners disposed circumferentially of the suction surface.

3. The stage device according to claim 1, wherein the suction hole penetrates the suction cup in a thickness direction, a second air hole communicating with the second air passage is formed in the mounting surface, and an end of the suction hole away from the suction surface communicates with the second air hole.

4. The carrier device of claim 3, wherein the mounting surface is provided with a communication groove, the second air hole is located at the bottom of the communication groove, and one end of the adsorption hole away from the adsorption surface is communicated with the second air hole through the communication groove.

5. The carrier device of claim 4, wherein the communication grooves are annular and are provided in plurality, the communication grooves are concentrically arranged, and the bottom of each communication groove is provided with the second air hole.

6. The stage device according to claim 1, wherein the mounting surface is provided with a first adsorption groove, and the first air hole is located at the bottom of the first adsorption groove.

7. The carrier device of claim 6, wherein the first adsorption grooves are annular and are provided in plurality, the first adsorption grooves are concentrically arranged, and the bottom of each first adsorption groove is provided with the first air hole.

8. The stage device according to claim 1, wherein a second adsorption groove is formed in a surface of the suction cup facing away from the adsorption surface, and the first air hole is communicated with the second adsorption groove.

9. The stage device according to any one of claims 1 to 8, further comprising a pneumatic slip ring comprising a stationary portion and a rotating portion, the first air passage and the second air passage being in communication with the rotating portion.

10. A wafer thinning machine comprising a stage apparatus according to any one of claims 1 to 9.