CN220161532U - Laser film cutting mechanism based on vacuum film laminating system - Google Patents
Laser film cutting mechanism based on vacuum film laminating system Download PDFInfo
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- CN220161532U CN220161532U CN202321474917.6U CN202321474917U CN220161532U CN 220161532 U CN220161532 U CN 220161532U CN 202321474917 U CN202321474917 U CN 202321474917U CN 220161532 U CN220161532 U CN 220161532U
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- laser
- cutting mechanism
- chuck
- vacuum
- vacuum film
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- 238000005520 cutting process Methods 0.000 title claims abstract description 61
- 238000010030 laminating Methods 0.000 title claims abstract description 40
- 238000001816 cooling Methods 0.000 claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000003698 laser cutting Methods 0.000 claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 11
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 8
- 238000003825 pressing Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 102000046255 Type III Sodium-Phosphate Cotransporter Proteins Human genes 0.000 description 1
- 108091006286 Type III sodium-phosphate co-transporters Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
The utility model discloses a laser film cutting mechanism based on a vacuum film laminating system, which comprises a laser film cutting mechanism, wherein a laser on the laser film cutting mechanism is an ultraviolet skin second laser, a laser cutting head of the laser is suspended above a lower cover of vacuum film laminating equipment in the laser film cutting mechanism through a triaxial movement mechanism, a chuck is arranged on the lower cover of the vacuum film laminating equipment, and water cooling and heat dissipation are arranged on the chuck. The laser film cutting mechanism has the advantages that the laser film cutting mechanism adopts the ultraviolet skin second laser, so that the technical problem that complicated patterns cannot be cut by mechanical cutting in the prior art is solved; the chuck in the vacuum film laminating system is provided with water cooling heat dissipation to solve the technical problem that the cutting seam is deformed and has edge burrs due to the thermal effect in the laser cutting process.
Description
Technical Field
The utility model particularly relates to a laser film cutting mechanism based on a vacuum film laminating system.
Background
The steps of film pasting in the wafer processing process are as follows:
1. temporary bonding: convenient transportation and transfer, cutting protection (DAF/wafer mount), dust protection and the like
2. Chip molding material: instead of flowable materials, photolithographic dry films, multilayer die bond fill protective materials, nonconductive films NCF, and the like.
After the film pasting is completed in the wafer processing process, the redundant film on the periphery of the wafer needs to be cut off, and at present, a film cutting mechanism is adopted to cut off the redundant film on the periphery of the wafer.
At present, mechanical film cutting devices are widely applied to the market, but when facing complex patterns, the mechanical cutting devices are difficult to cut; meanwhile, the common laser generates larger deformation and edge burrs due to the thermal effect in the cutting process.
Disclosure of Invention
The technical problems to be solved by the utility model are as follows: the existing film cutting mechanism adopts a mechanical cutting device to cut complex patterns, and meanwhile, the common laser causes the technical problems of larger deformation and edge burrs of a cutting seam due to a thermal effect.
The utility model provides a laser film cutting mechanism based on a vacuum film laminating system, which comprises a laser film cutting mechanism, wherein a laser on the laser film cutting mechanism is an ultraviolet skin second laser, a laser cutting head of the laser is suspended above a lower cover of vacuum film laminating equipment in the laser film cutting mechanism through a triaxial movement mechanism, a chuck is arranged on the lower cover of the vacuum film laminating equipment, and water cooling and heat dissipation are arranged on the chuck.
According to the technical scheme, in a vacuum film laminating system and a laser film cutting mechanism which are involved in the known wafer film laminating process, an ultraviolet skin second laser is adopted for the laser film cutting mechanism, so that the technical problem that complicated patterns cannot be cut by mechanical cutting in the prior art is solved. Wherein the purple skin second laser is a known product and is obtained by direct purchase. Meanwhile, in order to solve the heat brought by the ultraviolet skin second laser during cutting, in the technical scheme of the utility model, the water cooling heat dissipation is arranged on the chuck in the vacuum film laminating system, so that the technical problem that the cutting seam is deformed and the edge burrs are generated due to the thermal effect in the laser cutting process is solved.
Further preferably, the chuck is made of aluminum alloy 6061. The chuck manufactured by the aluminum alloy 6061 can meet the rigidity requirement and the water cooling requirement.
Further preferably, the thickness of the chuck is 25mm-35mm.
Further preferably, the chuck is provided with a plurality of parallel cooling channels, and both ends of all the cooling channels are communicated and respectively extend out of a water inlet channel and a water outlet channel. The processing technology is convenient, and the heat dissipation effect is obvious.
In a further preferred embodiment of the utility model, the cooling channel is formed by a chuck end face facing the inner bore, and is sealed at the chuck end face by a plug.
Further preferably, the three-axis motion mechanism is a three-axis motion mechanical arm, the three-axis motion mechanical arm is arranged on a frame based on a vacuum film laminating system, and the laser cutting head is arranged at the free end of the three-axis motion mechanical arm. The triaxial movement mechanical arm is a known product, a commercial part is directly purchased, and the triaxial movement mechanism in the technical scheme of the utility model moves X, Y, Z in three directions, moves the laser cutting head above the wafer, and starts cutting after positioning correction.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the technical scheme, the purple crust second laser can adapt to a plurality of patterns through self system adjustment, so that the special-shaped piece is cut; the non-contact cutting is fast, and the mechanical damage is not easy to cause.
2. According to the technical scheme, the chuck in the vacuum film laminating system is provided with water cooling heat dissipation, and as the ultraviolet skin second laser has low cutting heat effect, the water cooling heat dissipation on the chuck at the bottom of the wafer is matched, so that heat dissipation is further realized, and the deformation of the film in the cutting process is reduced.
Drawings
FIG. 1 is a schematic view of the appearance structure of the present utility model;
FIG. 2 is a side view of FIG. 1;
FIG. 3 is a schematic diagram of water cooling of a chuck according to the present utility model;
fig. 4 is a side view of fig. 3.
Detailed Description
The following describes the technical solution in the embodiment of the present utility model in detail with reference to fig. 1 to 4 in the embodiment of the present utility model.
As shown in fig. 1 and 2, the present embodiment is a laser film cutting mechanism based on a vacuum film laminating system, which is improved on the basis of the known vacuum film laminating system and laser film cutting mechanism, so as to solve the technical problems that in the prior art, mechanical cutting cannot be performed on complex pattern cutting and cutting seams generate larger deformation and edge burrs due to thermal effect.
A laser film cutting mechanism based on a vacuum film laminating system comprises vacuum film laminating equipment and a laser film cutting mechanism, wherein the vacuum film laminating equipment is known in the art and is known to a person skilled in the art.
The working flow of the vacuum film laminating equipment is as follows: the wafer 5 with the film is placed on a chuck 4 of a vacuum film laminating device, a film 7 is fed by an external film conveying roller 6, the film 7 is pasted on the wafer 5, and in the film laminating process, an upper cover 8 of the vacuum film laminating device and a lower cover 3 of the vacuum film laminating device are pressed together, and the inside is vacuumized to form a vacuum lower film laminating environment. After the wafer film is pasted, the next process is carried out for film cutting, and in the film cutting process, the upper cover 8 of the vacuum film pasting and pressing device needs to be put aside, and the upper cover 8 of the vacuum film pasting and pressing device moves to the side of the vacuum film pasting and pressing device through the guide rail mechanism 9, specifically, the upper cover 8 of the vacuum film pasting and pressing device moves away along the X direction and the Z direction.
The laser cutting mechanism of this embodiment, the laser instrument on the laser cutting mechanism is purple crust second laser instrument, and the laser cutting head 1 of laser instrument is hung in the top of the vacuum laminating equipment lower cover 3 in the laser cutting mechanism through triaxial motion mechanism 2, sets up chuck 4 on the vacuum laminating equipment lower cover 3, set up the water-cooling heat dissipation on the chuck 4.
The ultraviolet skin second laser can adapt to a plurality of patterns through self system adjustment, so that the special-shaped piece is cut; the non-contact cutting is fast, and the mechanical damage is not easy to cause. The laser cutting head 1 of the ultraviolet skin second laser is suspended above the lower cover 3 of the vacuum film laminating equipment in the laser film cutting mechanism through the triaxial moving mechanism 2 and is used for cutting off redundant films around the periphery of the crystal.
In this embodiment, the triaxial movement mechanism 2 is preferably a triaxial movement mechanical arm, the triaxial movement mechanical arm is mounted on a frame based on a vacuum film laminating device, and the laser cutting head 1 is disposed at a free end of the triaxial movement mechanical arm. The triaxial movement mechanical arm is a known product, a commercial part is directly purchased, and the triaxial movement mechanism 2 in the technical scheme of the utility model moves in X, Y, Z directions, moves a laser cutting head above a wafer, and starts cutting after positioning correction. In the film cutting process, the upper cover 8 of the vacuum film laminating equipment is moved away along the X and Z directions, the laser cutting mechanism is moved above the wafer, positioning correction is performed first, then cutting action is started, and cutting is started by utilizing the movement of three shafts.
As shown in fig. 3 and 4, in the present embodiment, the chuck 4 placed on the lower cover 3 of the vacuum lamination apparatus is made of an aluminum alloy 6061. The chuck manufactured by the aluminum alloy 6061 can meet the rigidity requirement and the water cooling requirement. The thickness of the chuck 4 is preferably 30mm, a plurality of parallel cooling channels 41 are formed by facing the inward rotation holes at the end face of the chuck 4, the aperture of the cooling channels 41 is preferably 10mm in this embodiment, two ends of all the cooling channels 41 are communicated and respectively extend out of a water inlet channel 42 and a water outlet channel 43, the end of the cooling channels 41 on the end face of the chuck is sealed by a plug 44, the plug 44 is preferably, and the joint NPT1/2".
When in use, a wafer is placed on the chuck 4, the water inlet channel 42 is connected with water, cold water enters the cooling channel 41 for cooling, and then is discharged from the water outlet channel 43, and the water outlet of the water outlet channel 43 is connected with the collector.
In this embodiment, the cooling channel 41 is formed by directly drilling the chuck 4, which is simple in process and strong in operability.
In the embodiment, the laser film cutting mechanism adopts an ultraviolet skin second laser, so that the technical problem that complicated patterns cannot be cut by mechanical cutting in the prior art is solved. Wherein the purple skin second laser is a known product and is obtained by direct purchase. Meanwhile, in order to solve the heat brought by the ultraviolet skin second laser during cutting, in the technical scheme of the utility model, the water cooling heat dissipation is arranged on the chuck in the vacuum film laminating system, so that the technical problem that the cutting seam is deformed and the edge burrs are generated due to the thermal effect in the laser cutting process is solved.
The above embodiments are only for illustrating the technical idea of the present utility model, and the protection scope of the present utility model is not limited thereto, and any modification made on the basis of the technical scheme according to the technical idea of the present utility model falls within the protection scope of the present utility model.
Claims (6)
1. Laser film cutting mechanism based on vacuum pad pasting system, including laser film cutting mechanism, its characterized in that: the laser on the laser film cutting mechanism is an ultraviolet skin second laser, a laser cutting head (1) of the laser is suspended above a lower cover (3) of vacuum film laminating equipment in the laser film cutting mechanism through a triaxial movement mechanism (2), a chuck (4) is arranged on the lower cover (3) of the vacuum film laminating equipment, and water cooling and heat dissipation are arranged on the chuck (4).
2. The laser film cutting mechanism based on a vacuum film laminating system according to claim 1, wherein: the chuck (4) is made of aluminum alloy 6061.
3. The laser film cutting mechanism based on the vacuum film laminating system according to claim 2, wherein: the thickness of the chuck (4) is 25mm-35mm.
4. The laser film cutting mechanism based on the vacuum film laminating system according to claim 2, wherein: a plurality of parallel cooling channels (41) are arranged on the chuck (4), and two ends of all the cooling channels (41) are communicated and respectively extend out of a water inlet channel (42) and a water outlet channel (43).
5. The laser film cutting mechanism based on the vacuum film laminating system according to claim 4, wherein: the cooling passage (41) is formed by the inner hole facing the end face of the chuck (4), and is sealed by a plug (44) on the end face of the chuck.
6. The laser film cutting mechanism based on a vacuum film laminating system according to claim 1, wherein: the triaxial movement mechanism (2) is a triaxial movement mechanical arm which is arranged on a frame based on a vacuum film laminating system, and the laser cutting head (1) is arranged at the free end of the triaxial movement mechanical arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321474917.6U CN220161532U (en) | 2023-06-12 | 2023-06-12 | Laser film cutting mechanism based on vacuum film laminating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321474917.6U CN220161532U (en) | 2023-06-12 | 2023-06-12 | Laser film cutting mechanism based on vacuum film laminating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220161532U true CN220161532U (en) | 2023-12-12 |
Family
ID=89067362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321474917.6U Active CN220161532U (en) | 2023-06-12 | 2023-06-12 | Laser film cutting mechanism based on vacuum film laminating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220161532U (en) |
-
2023
- 2023-06-12 CN CN202321474917.6U patent/CN220161532U/en active Active
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