CN220155514U - Semiconductor packaging clamping structure - Google Patents
Semiconductor packaging clamping structure Download PDFInfo
- Publication number
- CN220155514U CN220155514U CN202321328521.0U CN202321328521U CN220155514U CN 220155514 U CN220155514 U CN 220155514U CN 202321328521 U CN202321328521 U CN 202321328521U CN 220155514 U CN220155514 U CN 220155514U
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- China
- Prior art keywords
- positioning
- negative pressure
- crystal plate
- air
- supporting seat
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 8
- 238000000605 extraction Methods 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 239000013078 crystal Substances 0.000 abstract description 46
- 230000000694 effects Effects 0.000 abstract description 6
- 238000005086 pumping Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a semiconductor packaging clamping structure, which belongs to the technical field of semiconductor production and comprises a supporting seat and a plurality of uniformly distributed discs, wherein negative pressure ports are formed in the tops of the discs, extraction ports which are in one-to-one correspondence with the negative pressure ports are formed in the tops of the supporting seat, and an extraction mechanism is arranged at the bottoms of the supporting seat. When the crystal plate is used, the crystal plate is placed between the two positioning plates, if the size of the crystal plate is larger, the positioning plates are pressed by fingers first, so that the two positioning plates move towards the direction away from each other, after the crystal plate is placed, the positioning plates can initially fix the crystal plate under the acting force of the positioning springs, the positioning springs can avoid clamping the crystal plate, then the controller is started, the air pump is enabled to work by the controller, the air pumping end of the air pump can enable the air pipe, the air pumping opening and the negative pressure opening to be in a negative pressure state, and the crystal plate can be fixed on the disc, so that the effect of avoiding damage of the crystal plate can be realized.
Description
Technical Field
The utility model belongs to the technical field of semiconductor production, and particularly relates to a semiconductor packaging clamping structure.
Background
The semiconductor packaging refers to a process of processing a wafer passing through a test according to a product model and a function requirement to obtain an independent chip, in this process, a plastic sealing cover is generally used to seal the top of the semiconductor, and then various high-end processes are used to process the semiconductor to manufacture the chip.
Currently, chinese patent with publication number CN218568815U discloses a semiconductor package clamping structure, which comprises a supporting seat, wherein a row of discs are arranged on the supporting seat, and the lower disc surface of the discs is provided with at least three sliding blocks and a rotating wheel positioned at one side of each sliding block. In the utility model, a turntable and a rotating wheel positioned at the periphery of the turntable are arranged below each disc, the turntable rotates to drive the rotating wheels to synchronously rotate, the lower part of each disc is provided with sliding blocks which radially slide, the sliding blocks are meshed with the adjacent rotating wheels, the number of the sliding blocks is at least three, the three sliding blocks radially move when the turntable rotates to drive clamping plates to clamp a wafer, a worm is arranged below one row of discs, the worm rotates to drive the rotating wheels below one row of discs to synchronously rotate in the same direction, and then the clamping plates on one row of discs can synchronously clamp.
However, when the device is used, the rotating wheel is driven to rotate by the turntable so that the sliding block moves, the clamping plate is driven to clamp the crystal disc, if the operation of a worker is careless, the movement of the clamping plate is slightly close to the crystal disc, and the damage to the crystal disc is easily caused.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a semiconductor package clamping structure. The advantages are that: the effect of avoiding the damage of the crystal disc can be realized.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a semiconductor package clamping structure, includes supporting seat and a plurality of evenly distributed's disc, the negative pressure mouth has been seted up at the top of disc, the extraction opening with negative pressure mouth one-to-one is seted up at the top of supporting seat, the bottom of supporting seat is provided with air extraction mechanism, the top of disc is provided with positioning mechanism.
The technical scheme is as follows: when the crystal plate is used, the crystal plate is placed between the two positioning plates, if the size of the crystal plate is larger, the positioning plates are extruded by fingers firstly, the two positioning plates move towards the direction away from each other, after the crystal plate is placed, the positioning plates can be used for primarily fixing the crystal plate under the action of the positioning springs, the positioning springs can avoid clamping the crystal plate, then the controller is started, the air pump is enabled to work by the controller, the air exhaust end of the air pump can enable the air pipe, the air exhaust opening and the negative pressure opening to be in a negative pressure state, the crystal plate can be fixed on the disc, the crystal plate can be prevented from being excessively clamped by continuous movement of the clamping plates, and therefore the effect of avoiding the damage of the crystal plate can be realized.
The utility model is further arranged as an air extracting pump of which the air extracting mechanism is positioned below the supporting seat, wherein the air extracting end of the air extracting pump is fixedly connected with an air conveying pipe, and the air extracting end of the air conveying pipe is fixedly connected with the inner wall of the air extracting opening.
The technical scheme is as follows: the air pipe is arranged to perform negative pressure operation under the air suction effect of the air pump.
The utility model is further characterized in that the top of the supporting seat is fixedly connected with a controller, and the controller is connected with the air pump through a wire.
The technical scheme is as follows: the controller can control the pumping operation of the air pump, and before the crystal plate is placed, the air pump can be closed, and after the crystal plate is placed, the air pump can be opened.
The utility model is further arranged that the section of the negative pressure port is in a trapezoid structure, and the top surface of the negative pressure port is larger than the bottom surface area.
The technical scheme is as follows: the design of the trapezoid structure can increase the contact area between the negative pressure port and the crystal plate, and can ensure that the crystal plate is adsorbed stably.
The utility model is further arranged that the positioning mechanism comprises clamping plates fixedly connected with both sides of the top of the disc.
The technical scheme is as follows: the setting of splint can carry out certain adjustment to the placement position of brilliant dish.
The utility model is further provided with positioning grooves on opposite sides of the two clamping plates, wherein a plurality of uniformly distributed positioning springs are fixedly connected to the inner wall of one side of each positioning groove, and one end of each positioning spring is fixedly connected with a positioning plate which forms sliding fit with the inner wall of each positioning groove.
The technical scheme is as follows: when the crystal plate is placed, the positioning plate slides in the inner wall of the positioning groove to enable the positioning spring to be extruded, and the crystal plate placing device can adapt to the placement of the crystal plate with different sizes.
The utility model is further arranged that one surface of the locating plate far away from the clamping plate is in an arc-shaped structure.
The technical scheme is as follows: the design of the arc structure can increase the contact area between the locating plate and the crystal plate, and can lead the crystal plate to be placed stably.
The beneficial effects of the utility model are as follows:
1. this semiconductor package clamping structure, during the use, place the brilliant dish between two locating plates, if brilliant dish size is great, then press from both sides the locating plate with the finger earlier for two locating plates move towards the direction that keeps away from mutually, after the brilliant dish was placed, the locating plate can carry out preliminary fixed to the brilliant dish at the effort of locating spring, locating spring can avoid pressing from both sides the brilliant dish to hinder moreover, then start the controller, the controller makes the aspiration pump work, the end of bleeding pump can make gas-supply pipe, extraction opening and negative pressure mouth be negative pressure state, can make the brilliant dish fixed on the disc, can avoid appearing the continuous removal of splint to carry out excessive clamp with the brilliant dish, consequently, can realize avoiding the effect that the damage appears to the brilliant dish.
2. According to the semiconductor packaging clamping structure, the contact area between the negative pressure port and the crystal disc can be increased through the negative pressure port with the trapezoid structure, so that the crystal disc is adsorbed stably.
3. According to the semiconductor packaging clamping structure, the contact area between the positioning plate and the crystal disc can be increased through the positioning plate with the arc-shaped structure, so that the crystal disc can be placed stably.
Drawings
Fig. 1 is a schematic perspective view of a semiconductor package clamping structure according to the present utility model;
fig. 2 is a schematic diagram of a partial cross-sectional structure of a semiconductor package clamping structure according to the present utility model;
fig. 3 is an enlarged schematic view of the structure at a in fig. 2.
In the figure: 1. a support base; 2. a disc; 4. an extraction opening; 5. a gas pipe; 6. an air extracting pump; 7. a controller; 8. a clamping plate; 9. a positioning groove; 10. a positioning spring; 11. a positioning plate; 12. and a negative pressure port.
Detailed Description
The technical scheme of the patent is further described in detail below with reference to the specific embodiments.
Embodiments of the present patent are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the patent and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be configured and operated in a particular orientation, and are therefore not to be construed as limiting the patent.
In the description of this patent, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "disposed" are to be construed broadly, and may be fixedly connected, disposed, detachably connected, disposed, or integrally connected, disposed, for example. The specific meaning of the terms in this patent will be understood by those of ordinary skill in the art as the case may be.
Referring to fig. 1-3, a semiconductor package clamping structure comprises a supporting seat 1 and a plurality of evenly distributed discs 2, wherein negative pressure ports 12 are formed in the tops of the discs 2, extraction ports 4 corresponding to the negative pressure ports 12 one by one are formed in the tops of the supporting seat 1, an air extraction mechanism is arranged at the bottom of the supporting seat 1, and a positioning mechanism is arranged at the tops of the discs 2.
It should be noted that, in this embodiment, the air extraction mechanism is located the air extraction pump 6 below the supporting seat 1, the air extraction end of the air extraction pump 6 is fixedly connected with the air pipe 5, the air extraction end of the air pipe 5 is fixedly connected with the inner wall of the air extraction opening 4, and negative pressure operation can be performed under the air extraction action of the air extraction pump 6 through the air pipe 5.
Further, in this embodiment, the top fixedly connected with controller 7 of supporting seat 1, through wire connection between controller 7 and the aspiration pump 6, can control aspiration pump 6 operation through controller 7, before placing the brilliant disc, can close aspiration pump 6, place the back, can open aspiration pump 6.
The cross section of the negative pressure port 12 is of a trapezoid structure, the top surface of the negative pressure port 12 is larger than the bottom surface area, and the contact area between the negative pressure port 12 and the crystal disc can be increased through the negative pressure port 12 of the trapezoid structure, so that the crystal disc is adsorbed stably.
In one embodiment, the positioning mechanism comprises clamping plates 8 fixedly connected with two sides of the top of the disc 2, and the placement position of the crystal disc can be adjusted to a certain extent through the clamping plates 8.
It should be noted that, in this embodiment, the positioning slots 9 are all provided on opposite sides of the two clamping plates 8, a plurality of uniformly distributed positioning springs 10 are fixedly connected to an inner wall of one side of each positioning slot 9, one end of each positioning spring 10 is fixedly connected with a positioning plate 11 which forms a sliding fit with an inner wall of each positioning slot 9, and when a wafer is placed, the positioning plates 11 slide in the inner walls of the positioning slots 9 to enable the positioning springs 10 to be extruded, so that the wafer placement device can adapt to the placement of wafers with different sizes.
Further, in this embodiment, the surface of the positioning plate 11 far away from the clamping plate 8 is in an arc structure, and the contact area between the positioning plate 11 and the wafer can be increased by the positioning plate 11 in the arc structure, so that the wafer can be placed stably.
Working principle: when the crystal plate is used, the crystal plate is placed between the two positioning plates 11, if the size of the crystal plate is larger, the positioning plates 11 are extruded by fingers firstly, so that the two positioning plates 11 move towards the direction away from each other, after the crystal plate is placed, the crystal plate can be preliminarily fixed by the acting force of the positioning spring 10 by the positioning plates 11, the crystal plate can be prevented from being clamped by the positioning spring 10, then the controller 7 is started, the controller 7 enables the air pump 6 to work, the air pumping end of the air pump 6 can enable the air pipe 5, the air pumping port 4 and the negative pressure port 12 to be in a negative pressure state, the crystal plate can be fixed on the disc 2, the crystal plate can be prevented from being excessively clamped by continuous movement of the clamping plate, and therefore the effect of avoiding damage to the crystal plate can be realized.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (7)
1. The utility model provides a semiconductor package clamping structure, includes supporting seat (1) and a plurality of evenly distributed's disc (2), its characterized in that, negative pressure mouth (12) have been seted up at the top of disc (2), extraction opening (4) with negative pressure mouth (12) one-to-one are seted up at the top of supporting seat (1), the bottom of supporting seat (1) is provided with air extraction mechanism, the top of disc (2) is provided with positioning mechanism.
2. The semiconductor package clamping structure according to claim 1, wherein the air extraction mechanism is located at an air extraction pump (6) below the supporting seat (1), an air delivery pipe (5) is fixedly connected to an air extraction end of the air extraction pump (6), and the air extraction end of the air delivery pipe (5) is fixedly connected with an inner wall of the air extraction opening (4).
3. The semiconductor package clamping structure according to claim 2, wherein a controller (7) is fixedly connected to the top of the supporting seat (1), and the controller (7) is connected with the air pump (6) through a wire.
4. The semiconductor package clamping structure according to claim 1, wherein the negative pressure port (12) has a trapezoidal cross section, and the top surface of the negative pressure port (12) is larger than the bottom surface area.
5. The semiconductor package clamping structure according to claim 1, wherein the positioning mechanism comprises clamping plates (8) fixedly connected with both sides of the top of the disc (2).
6. The semiconductor packaging clamping structure according to claim 5, wherein positioning grooves (9) are formed in opposite faces of the two clamping plates (8), a plurality of uniformly distributed positioning springs (10) are fixedly connected to the inner wall of one side of each positioning groove (9), and one end of each positioning spring (10) is fixedly connected with a positioning plate (11) which forms sliding fit with the inner wall of each positioning groove (9).
7. The semiconductor package clamping structure according to claim 6, wherein the surface of the positioning plate (11) away from the clamping plate (8) has an arc-shaped structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321328521.0U CN220155514U (en) | 2023-05-29 | 2023-05-29 | Semiconductor packaging clamping structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321328521.0U CN220155514U (en) | 2023-05-29 | 2023-05-29 | Semiconductor packaging clamping structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220155514U true CN220155514U (en) | 2023-12-08 |
Family
ID=89018453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321328521.0U Active CN220155514U (en) | 2023-05-29 | 2023-05-29 | Semiconductor packaging clamping structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220155514U (en) |
-
2023
- 2023-05-29 CN CN202321328521.0U patent/CN220155514U/en active Active
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