CN220149658U - Backfill pipeline mechanism for transmission cavity and semiconductor process equipment - Google Patents
Backfill pipeline mechanism for transmission cavity and semiconductor process equipment Download PDFInfo
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- CN220149658U CN220149658U CN202321480108.6U CN202321480108U CN220149658U CN 220149658 U CN220149658 U CN 220149658U CN 202321480108 U CN202321480108 U CN 202321480108U CN 220149658 U CN220149658 U CN 220149658U
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 39
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 18
- 230000008569 process Effects 0.000 title claims abstract description 18
- 230000001105 regulatory effect Effects 0.000 claims abstract description 33
- 238000012546 transfer Methods 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 description 4
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Abstract
The embodiment of the utility model provides a transmission cavity backfill pipeline mechanism and semiconductor process equipment, and belongs to the technical field of semiconductors. The transmission cavity backfill pipeline mechanism comprises a pipeline, a gas flow controller and a pressure regulating valve. The gas flow controller and the pressure regulating valve are both arranged on the pipeline, and the pressure regulating valve is arranged on the gas inlet side of the gas flow controller. One end of the outlet side of the gas flow controller is adapted to communicate with the transfer chamber. The device can avoid influencing the pressure of the backfill pipeline of the transmission chamber when the backfill pipeline of the loading chamber runs, so as to avoid lifting particles.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a transmission cavity backfill pipeline mechanism and semiconductor process equipment.
Background
In the prior art, in a semiconductor process apparatus, such as a CVD apparatus, a gas flowing from a factory end into a machine end is shared by a transfer chamber and a backfill pipeline of a loading chamber, because the loading chamber needs to be frequently switched between vacuum and atmosphere, a pneumatic diaphragm valve at the front end of the backfill pipeline of the loading chamber needs to be frequently opened and closed, and because the front ends of the transfer chamber and the backfill pipeline of the loading chamber are not independent, when the loading chamber is backfilled, the front end pressure of a gas flow controller on the backfill pipeline of the transfer chamber suddenly changes, so that the flow of the gas flow controller is suddenly increased, and the transfer chamber uses a mode that the gas flow controller and a dry pump jointly control the pressure of the transfer chamber, the sudden increase of the flow of the gas flow controller may cause particles in the chamber to be lifted, thereby affecting the particle results of the machine and wafers.
Disclosure of Invention
The utility model aims to provide a transmission cavity backfill pipeline mechanism and semiconductor process equipment, which can avoid influencing the pressure of a transmission cavity backfill pipeline when the backfill pipeline of a loading cavity runs so as to avoid lifting particles.
Embodiments of the present utility model are implemented as follows:
in a first aspect, the present utility model provides a transmission chamber backfill line mechanism comprising a conduit, a gas flow controller and a pressure regulating valve;
the gas flow controller and the pressure regulating valve are both arranged on the pipeline, and the pressure regulating valve is arranged on the gas inlet side of the gas flow controller;
one end of the outlet side of the gas flow controller is used for communicating with the transmission cavity.
In an alternative embodiment, the transfer chamber backfill line mechanism further comprises a pressure gauge mounted to the conduit between the gas flow controller and the pressure regulating valve.
In an alternative embodiment, the transfer chamber backfill line mechanism further comprises a gas filter disposed in the conduit and on the inlet side of the pressure regulating valve.
In an alternative embodiment, the transmission chamber backfill line mechanism further comprises a pneumatic diaphragm valve disposed in the conduit between the pressure gauge and the gas flow controller.
In an alternative embodiment, the transfer chamber backfill line mechanism further comprises a hand valve disposed in the conduit and located on the intake side of the gas filter.
In an alternative embodiment, the transmission cavity backfill pipeline mechanism further comprises a second pneumatic diaphragm valve and a parallel pipeline, wherein the second pneumatic diaphragm valve is arranged in a parallel pipeline, one end of the parallel pipeline is connected with the outlet side of the pressure gauge, and the other end of the parallel pipeline is connected with one end of the pipeline, which is positioned at the outlet side of the gas flow controller, through a tee joint.
In a second aspect, the present utility model provides a semiconductor processing apparatus comprising a processing apparatus body and a transfer chamber backfill line mechanism as described in any one of the preceding embodiments;
the process equipment body is provided with a transmission chamber;
one end of the outlet side of the gas flow controller is connected with the transmission chamber.
In an alternative embodiment, the process tool body further has a loading chamber;
the semiconductor process equipment further comprises a loading chamber backfill pipeline mechanism, wherein the conveying chamber backfill pipeline mechanism and the loading chamber backfill pipeline mechanism are mutually independent;
the loading chamber backfill line mechanism is connected with the loading chamber to supply air to the loading chamber.
In an alternative embodiment, the loading chamber backfill pipeline mechanism comprises a connecting pipe, a second hand valve, a second gas filter, a second pressure regulating valve and a second pressure gauge which are sequentially arranged on the connecting pipe, and the second pressure gauge is communicated with the loading chamber.
In an alternative embodiment, the semiconductor processing apparatus further comprises a vacuum pump in communication with the transfer chamber for evacuating the transfer chamber cavity.
The transmission cavity backfill pipeline mechanism and the semiconductor process equipment provided by the embodiment of the utility model have the beneficial effects that:
according to the utility model, the pressure regulating valve is arranged on the air inlet side of the air flow controller of the transmission cavity backfill pipeline mechanism, so that the pressure entering the air flow controller can be regulated, the pressure is kept consistent, and the pressure of the transmission cavity backfill pipeline is prevented from being influenced when the backfill pipeline of the loading cavity runs, so that particles are prevented from being raised.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a mechanism for backfilling a transmission cavity according to an embodiment of the present utility model;
FIG. 2 is a graph of flow pressure curve detection at the outlet side of a conventional gas flow controller;
fig. 3 is a flow pressure curve detection chart of the outlet side of the gas flow controller according to the embodiment of the present utility model.
Icon 1-hand valve; 2-a gas filter; 3-a pressure regulating valve; 4-a pressure gauge; 5-pneumatic diaphragm valve; 6-a gas flow controller; 7-piping; 8-a second pneumatic diaphragm valve; 9-parallel pipes.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Examples
Referring to fig. 1, the present utility model provides a semiconductor processing apparatus, which may be a CVD furnace, for coating a wafer surface with a film.
In this embodiment, the semiconductor processing apparatus includes a processing apparatus body and a transfer chamber backfill line mechanism. The process equipment body has a transfer chamber. The transmission cavity backfill pipeline mechanism comprises a pipeline 7, a gas flow controller 6 and a pressure regulating valve 3. The gas flow controller 6 and the pressure regulating valve 3 are both provided in the pipe 7, and the pressure regulating valve 3 is provided on the gas inlet side of the gas flow controller 6. One end of the outlet side of the gas flow controller 6 is connected to the transfer chamber. One end of the pipeline 7 close to the pressure regulating valve 3 is connected with a factory air supply pipeline 7. The gas of the gas supply pipe 7 flows into the transfer chamber through the pressure regulating valve 3 and the gas flow controller 6 in this order.
In this embodiment, the pressure regulating valve 3 is disposed on the air inlet side of the air flow controller 6 of the transmission cavity backfill pipeline mechanism, so that the pressure entering the air flow controller 6 can be regulated, so that the pressure is kept consistent, and the pressure of the transmission cavity backfill pipeline is prevented from being influenced when the backfill pipeline of the loading cavity runs, so as to prevent particles from being raised.
In this embodiment, the transfer chamber backfill line mechanism further comprises a pressure gauge 4, the pressure gauge 4 being mounted to the conduit 7 and located between the gas flow controller 6 and the pressure regulating valve 3.
According to the embodiment, the pressure gauge 4 is arranged, so that the pressure on the outlet side of the pressure regulating valve 3 can be intuitively and conveniently detected through the pressure gauge 4.
Referring to fig. 1, in the present embodiment, the transmission cavity backfill line mechanism further includes a gas filter 2, wherein the gas filter 2 is disposed in the pipe 7 and located on the air inlet side of the pressure regulating valve 3.
The present embodiment provides a gas filter 2 so that gas entering the duct 7 through the gas filter 2 cabinet can be filtered.
Referring to fig. 1, in the present embodiment, the transmission cavity backfill line mechanism further includes a pneumatic diaphragm valve 5, wherein the pneumatic diaphragm valve 5 is disposed in the pipe 7 and between the pressure gauge 4 and the gas flow controller 6.
In the embodiment, the pneumatic diaphragm valve 5 is arranged on the transmission cavity backfill pipeline mechanism, and the pneumatic diaphragm valve 5 can be used for conveniently realizing pipeline control.
In this embodiment, the transfer chamber backfill line mechanism further comprises a hand valve 1, the hand valve 1 being disposed in the conduit 7 and on the intake side of the gas filter 2.
The hand valve 1 of the device of the embodiment can simply, conveniently and rapidly control pipelines so as to facilitate maintenance and the like.
In this embodiment, the transmission cavity backfill pipeline mechanism further includes a second pneumatic diaphragm valve 8 and a parallel pipeline 9, the second pneumatic diaphragm valve 8 is disposed in the parallel pipeline 9, one end of the parallel pipeline 9 is connected with the outlet side of the pressure gauge 4, and the other end is connected with one end of the pipeline 7 located at the outlet side of the gas flow controller 6 through a tee joint.
The second pneumatic diaphragm valve 8 and the parallel pipeline 9 are arranged in the embodiment, so that two branches can be formed with the gas flow controller 6, and gas can be supplied to the transmission cavity according to different requirements.
In this embodiment, the semiconductor processing apparatus further includes a vacuum pump in communication with the transfer chamber for evacuating the transfer chamber cavity.
The embodiment can better control the pressure of the transmission cavity by arranging the vacuum pump.
In this embodiment, the process tool body also has a loading chamber. The semiconductor process equipment further comprises a loading chamber backfill pipeline mechanism, wherein the conveying chamber backfill pipeline mechanism and the loading chamber backfill pipeline mechanism are mutually independent, and one end of the loading chamber backfill pipeline mechanism is connected with the loading chamber so as to supply air to the loading chamber. The loading chamber backfill pipeline mechanism is connected with another gas supply pipe of the factory.
In the embodiment, the two air supply pipes of the loading chamber backfill pipeline mechanism and the transmission chamber backfill pipeline mechanism are connected in a one-to-one correspondence manner, so that the air supply pressure is prevented from being influenced mutually.
In this embodiment, the loading chamber backfill pipeline mechanism includes a connecting pipe, and the second hand valve, the second gas filter, the plurality of pressure regulating valves and the second pressure gauge are sequentially disposed on the connecting pipe, and the second pressure gauge is communicated with the loading chamber. When the loading chamber is backfilled, backfilling gas is backfilled into the loading chamber through the second hand valve, the second gas filter, the plurality of pressure regulating valves and the second pressure gauge from the gas supply pipe at the factory end, and the gas of the backfilling pipeline at the front end of the transmission chamber is from the other gas supply pipe at the factory end, so that the gas supply pipe cannot be influenced by the pressure change in the pipeline of the loading chamber, the pressure at the front end of the gas flow controller 6 cannot be changed, the condition that the gas flow controller 6 fluctuates is avoided, the flow of the gas flow controller 6 is ensured to be a fixed value, and the pressure cannot be changed.
As can be seen from a comparison of the existing flow pressure curve detection diagram of fig. 2 and the improved flow pressure curve detection diagram of fig. 3, the outlet side pressure of the gas flow controller 6 of the improved transfer chamber backfill line mechanism of the present utility model is not affected by the loading chamber backfill line mechanism.
In summary, the working distance and beneficial effects of the transmission cavity backfill pipeline mechanism and the semiconductor process equipment provided by the embodiment of the utility model comprise:
the pressure regulating valve 3 is arranged on the air inlet side of the air flow controller 6 of the transmission cavity backfill pipeline mechanism, so that the pressure entering the air flow controller 6 can be regulated, the pressure is kept consistent, the pressure of the transmission cavity backfill pipeline is prevented from being influenced when the backfill pipeline of the loading cavity runs, and the particles are prevented from being lifted. The loading chamber and the transmission chamber are independently backfilled, and the pressure of the backfilling gas can be adjusted by respectively providing the pressure regulating valve, so that the backfilling speed is adjusted, the two chambers are not affected, and the pressure of the front-end gas cannot be shared together.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (10)
1. The transmission cavity backfill pipeline mechanism is characterized by comprising a pipeline (7), a gas flow controller (6) and a pressure regulating valve;
the gas flow controller (6) and the pressure regulating valve are both arranged on the pipeline (7), and the pressure regulating valve (3) is arranged on the gas inlet side of the gas flow controller (6);
one end of the outlet side of the gas flow controller (6) is used for communicating with the transmission cavity.
2. The transmission chamber backfill line mechanism according to claim 1, further comprising a pressure gauge (4), the pressure gauge (4) being mounted to the pipe (7) and being located between the gas flow controller (6) and the pressure regulating valve (3).
3. The transfer chamber backfill line mechanism according to claim 2, further comprising a gas filter (2), the gas filter (2) being arranged in the conduit (7) and being located on the inlet side of the pressure regulating valve (3).
4. A transfer chamber backfill line mechanism according to claim 3, further comprising a pneumatic diaphragm valve (5), the pneumatic diaphragm valve (5) being arranged in the conduit (7) between the pressure gauge and the gas flow controller (6).
5. A transfer chamber backfill line mechanism according to claim 3, characterized in that the transfer chamber backfill line mechanism further comprises a hand valve (1), the hand valve (1) being arranged in the conduit (7) and being located on the inlet side of the gas filter (2).
6. The transmission cavity backfill pipeline mechanism according to claim 2, further comprising a second pneumatic diaphragm valve (8) and a parallel pipeline (9), wherein the second pneumatic diaphragm valve (8) is arranged in the parallel pipeline (9), one end of the parallel pipeline (9) is connected with the outlet side of the pressure gauge (4), and the other end is connected with one end of the pipeline (7) located at the outlet side of the gas flow controller (6) through a tee joint.
7. A semiconductor process tool comprising a process tool body and the transfer chamber backfill line mechanism of any one of claims 1-6;
the process equipment body is provided with a transmission chamber;
one end of the outlet side of the gas flow controller (6) is connected with the transmission chamber.
8. The semiconductor processing tool of claim 7 wherein said tool body further has a loading chamber;
the semiconductor process equipment further comprises a loading chamber backfill pipeline mechanism, wherein the conveying chamber backfill pipeline mechanism and the loading chamber backfill pipeline mechanism are mutually independent;
the loading chamber backfill line mechanism is connected with the loading chamber to supply air to the loading chamber.
9. The semiconductor processing apparatus of claim 8, wherein the loading chamber backfill line mechanism comprises a connecting tube, a second hand valve, a second gas filter, and a second pressure regulating valve and a second pressure gauge disposed in sequence in the connecting tube, the second pressure gauge in communication with the loading chamber.
10. The semiconductor processing apparatus of claim 7, further comprising a vacuum pump in communication with the transfer chamber for evacuating the transfer chamber cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321480108.6U CN220149658U (en) | 2023-06-12 | 2023-06-12 | Backfill pipeline mechanism for transmission cavity and semiconductor process equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321480108.6U CN220149658U (en) | 2023-06-12 | 2023-06-12 | Backfill pipeline mechanism for transmission cavity and semiconductor process equipment |
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| Publication Number | Publication Date |
|---|---|
| CN220149658U true CN220149658U (en) | 2023-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321480108.6U Active CN220149658U (en) | 2023-06-12 | 2023-06-12 | Backfill pipeline mechanism for transmission cavity and semiconductor process equipment |
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| Country | Link |
|---|---|
| CN (1) | CN220149658U (en) |
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2023
- 2023-06-12 CN CN202321480108.6U patent/CN220149658U/en active Active
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