CN220106939U

CN220106939U - Connecting device and electronic equipment

Info

Publication number: CN220106939U
Application number: CN202321500948.4U
Authority: CN
Inventors: 孙秀源; 崔今花; 杨斌; 王超; 徐铖; 方恒
Original assignee: Guangdong Qiyang Technology Co ltd
Current assignee: Guangdong Qiyang Technology Co ltd
Priority date: 2023-06-13
Filing date: 2023-06-13
Publication date: 2023-11-28
Anticipated expiration: 2033-06-13

Abstract

The utility model provides a connecting device and electronic equipment, which are applied to the technical field of electronic equipment, wherein the connecting device comprises: and the connecting device is welded with the printed circuit board through the welding surfaces respectively, and the corresponding working heights are different. Through a plurality of soldering surfaces of connecting device design, can select different soldering surfaces when with connecting device and printed circuit board welding, change connecting device's working height to the realization can be suitable for different working heights to the connecting device of same specification, need not to produce connecting device of different specifications to different heights, reduced the cost of producing connecting device, thereby also can not appear compounding, the problem of wrong material during production.

Description

Connecting device and electronic equipment

Technical Field

The present utility model relates to the field of electronic devices, and in particular, to a connecting device and an electronic device.

Background

The pogo pin is a precise connector applied to electronic products such as mobile phones and the like, and is widely applied to semiconductor equipment to play a role in connection.

However, when the main board has several working heights different, pogo pins with different heights are needed, the cost for producing pogo pins is increased, and meanwhile, the problems of material mixing and material misplacement of different specifications are easily caused when pogo pins with different types are produced.

Disclosure of Invention

The utility model provides a connecting device and electronic equipment, which are used for reducing the cost of pogo pin production and avoiding the problems of material mixing and material error.

In one aspect, the present utility model provides a connection device comprising:

and the connecting device is welded with the printed circuit board through the welding surfaces respectively, and the corresponding working heights are different.

In the embodiment of the utility model, the connecting device is designed with a plurality of welding surfaces, and different welding surfaces can be selected when the connecting device is welded with the printed circuit board, so that the working height of the connecting device is changed, different working heights can be suitable for the connecting device with the same specification, the connecting device with different specifications does not need to be produced for different heights, the cost for producing the connecting device is reduced, and the problems of mixing and material error in production are avoided.

Optionally, each welding face comprises: a first sub-soldering surface parallel to the printed circuit board and a second sub-soldering surface perpendicular to the printed circuit board.

Optionally, the plurality of soldering surfaces are a first soldering surface and a second soldering surface, and when the connecting device is soldered with the printed circuit board through the first soldering surface, the connecting device corresponds to the first working height; and when the connecting device is welded with the printed circuit board through the second welding surface, the connecting device corresponds to a second working height.

In the embodiment of the utility model, different working heights can be corresponding to the welding of the different welding surfaces of the connecting device and the printed circuit board, the specification of the connecting device is not required to be changed when the working heights are changed, the connecting device with different specifications is not required to be produced aiming at the different working heights, and the production cost is reduced.

Optionally, the first working height is less than the second working height.

Optionally, the first welding surface is located a first welding base, the second welding surface is located a second welding base, the second welding base is located right below the first welding base, and the central axis of the second welding base coincides with the central axis of the first welding base.

Optionally, the first welding base and the second welding base are an integrated structure.

Optionally, the first welding base and the second welding base are made of metal materials.

Optionally, the area of the first welding surface is larger than the area of the second welding surface.

Optionally, the connection device is a pogo pin connector.

The embodiment of the utility model provides electronic equipment, which comprises:

any of the above-described connection devices.

Drawings

In order to more clearly illustrate the technical solutions of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a connecting device according to the present utility model;

FIG. 2 is a schematic view of a sub-bonding surface of a connector according to the present utility model;

FIG. 3 is a schematic diagram of a soldering surface of a connector according to the present utility model;

FIG. 4 is a schematic view of the working height of a connector according to the present utility model;

fig. 5 is a schematic view of a soldering base of a connection device according to the present utility model.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be described in further detail below with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1, the present utility model provides a connection device, which includes a plurality of soldering surfaces 100, and when the connection device is soldered to a printed circuit board through the plurality of soldering surfaces, the corresponding working heights of the connection device are different. The connection device is a pogo pin connector.

In particular, the connection device of the present utility model may be a pogo pin for soldering on a printed circuit board (Printed circuit boards, abbreviated as PCB), which is a provider of electrical connections for electronic components. The pogo pin connector is designed with a plurality of welding surfaces, and different welding surfaces correspond to different heights when being welded with a PCB.

In some embodiments, each weld face comprises: a first sub-soldering surface 201 parallel to the printed circuit board and a second sub-soldering surface 202 perpendicular to the printed circuit board.

Specifically, each welding surface of the pogo pin connector provided by the utility model comprises a first sub-welding surface and a second sub-welding surface. The soldering surface parallel to the PCB is referred to as a first sub-soldering surface, and the soldering surface perpendicular to the PCB is referred to as a second sub-soldering surface, as shown in fig. 2.

In some embodiments, referring to fig. 3 and 4, the plurality of soldering surfaces are a first soldering surface 301 and a second soldering surface 302, and when the connection device is soldered to the printed circuit board through the first soldering surface 301, the first working height h1 corresponds to the first working height h; the second working height h2 corresponds to the soldering of the connection device to the printed circuit board via the second soldering surface 302. The first working height is less than the second working height.

For example, the connection device is a pogo pin connector, which has two soldering surfaces, a first soldering surface 301 and a second soldering surface 302, respectively. The first soldering surface 301 of the pogo pin connector corresponds to a working height when soldered to the PCB, which is referred to as a first working height h1; the second soldering surface 302 of the pogo pin connector corresponds to another working height when soldering to the PCB, which is referred to as a second working height h2, and the first working height h1 is smaller than the second working height h2.

In some embodiments, referring to fig. 5, the first welding surface 301 is located on the first welding base 501, the second welding surface 302 is located on the second welding base 502, the second welding base 502 is located directly below the first welding base 501, and the central axis of the second welding base 502 coincides with the central axis of the first welding base 501. The first welding base 501 and the second welding base 502 are an integrated structure. The first welding base 501 and the second welding base 502 are made of a metal material. The area of the first welding surface 301 is larger than the area of the second welding surface 302.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

1. A connector device, comprising:

2. The device of claim 1, wherein each bonding surface comprises: a first sub-soldering surface parallel to the printed circuit board and a second sub-soldering surface perpendicular to the printed circuit board.

3. The device of claim 1, wherein the plurality of soldering surfaces is a first soldering surface and a second soldering surface, the connection device corresponding to a first working height when soldered to a printed circuit board via the first soldering surface; and when the connecting device is welded with the printed circuit board through the second welding surface, the connecting device corresponds to a second working height.

4. The device of claim 3, wherein the first operational height is less than the second operational height.

5. The device of claim 3, wherein the first bonding surface is located on a first bonding base, the second bonding surface is located on a second bonding base, the second bonding base is located directly below the first bonding base, and a central axis of the second bonding base coincides with a central axis of the first bonding base.

6. The device of claim 5, wherein the first solder mount and the second solder mount are a unitary structure.

7. The device of claim 5, wherein the first solder mount and the second solder mount are made of a metallic material.

8. The device of claim 3, wherein an area of the first bonding surface is greater than an area of the second bonding surface.

9. The device of any one of claims 1 to 8, wherein the connection device is a POGO PIN connector.

10. An electronic device, comprising: the connection device of any one of claims 1 to 9.