CN216700442U - Circuit board device mounting structure and circuit board - Google Patents
Circuit board device mounting structure and circuit board Download PDFInfo
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- CN216700442U CN216700442U CN202123174049.3U CN202123174049U CN216700442U CN 216700442 U CN216700442 U CN 216700442U CN 202123174049 U CN202123174049 U CN 202123174049U CN 216700442 U CN216700442 U CN 216700442U
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- circuit board
- device body
- mounting hole
- mounting structure
- paste layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model discloses a circuit board device mounting structure and a circuit board, wherein the circuit board device mounting structure comprises a substrate, a device body and pins, one ends of the pins are connected to the peripheral side of the device body, at least one mounting hole is formed in the substrate, and a solder paste layer is arranged on the side wall of each mounting hole; the device body is arranged in the mounting hole, and the other end of the pin is connected with the soldering paste layer. Compared with the prior art, the circuit board device mounting structure provided by the utility model can reduce the thickness of the circuit board, enlarge the model selection range of the device and reduce the production cost of the circuit board.
Description
Technical Field
The utility model relates to the technical field of electronic component installation, in particular to a circuit board device installation structure and a circuit board.
Background
SMT mounting refers to a circuit mounting technique in which surface mount components are mounted on the surface of a PCB (printed circuit board) or other substrate, and are soldered and assembled by a method such as reflow soldering or dip soldering. The existing mounting devices of the PCB include BGA devices, SOT, SOP, and QFP.
The PCB blank Board is processed by SMT (surface mount technology) loading or the whole processing procedure of the DIP plug-in unit to form the PCBA, wherein the PCBA is the abbreviation of English Printed Circuit Board Assembly, namely the PCB blank Board is processed by SMT loading or the whole processing procedure of the DIP plug-in unit, and the abbreviation of the PCBA is the PCBA.
In the prior art, electronic products are required to be miniaturized and ultra-thinned, but some high-power devices and low-cost devices have larger body heights, so that designers have to abandon such devices as SOT, SOP and QFP devices in order to achieve ultra-thinned design. During conventional mounting, the thickness of the PCBA is the sum of the thickness of the PCB blank plate, the thickness of the solder paste layer and the thickness of the device, the thickness of the circuit board depends on the sum of the PCB blank plate, the solder paste layer and the device, and in order to guarantee production cost, the device with lower cost and larger thickness has to be selected, so that the thickness of the whole PCBA is thicker.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a circuit board device mounting structure, and aims to solve the technical problem that a circuit board is thick in thickness in the prior art.
In order to achieve the above object, the present invention provides a circuit board device mounting structure, including:
the substrate is provided with at least one mounting hole, and the side wall of the mounting hole is provided with a welding paste layer; and
the device body and one end are connected to the pins on the periphery side of the device body, the device body is arranged in the mounting hole, and the other end of each pin is connected with the soldering paste layer.
Optionally, the pin includes a first straight section, a bent section, and a second straight section connected in sequence, the first straight section is connected to the device body, and the second straight section is connected to the solder paste layer.
Optionally, one end of the pin, which is far away from the device body, is provided with a connection section connected with the solder paste layer, and the length of the connection section is 0.5-0.7 times of the length of the pin.
Optionally, the bottom surface of the device body and the bottom surface of the substrate are parallel to each other.
Optionally, the mounting hole is a through hole, and the bottom surface of the device body is flush with the bottom surface of the substrate.
Optionally, the mounting hole is a blind hole, and the bottom surface of the device body is parallel to and connected with the bottom surface of the blind hole.
Optionally, a pad is disposed between the solder paste layer and the sidewall of the mounting hole.
Optionally, the mounting hole is a circular hole; or
The mounting hole is a square hole.
Optionally, the solder paste layer is a solder paste layer.
The utility model also provides a circuit board which comprises the circuit board device mounting structure.
The utility model provides a circuit board device mounting structure, which comprises a substrate, a device body and a pin, wherein one end of the pin is connected with the device body, a mounting hole for mounting a device is formed in the substrate, the pin is connected with the wall of the mounting hole, a soldering paste layer is arranged on the side wall of the mounting hole, and the other end of the pin is connected with the soldering paste layer. In the prior art, a device is mounted on the surface of a substrate, and the thickness of the whole circuit board is the sum of the thickness of the device, the thickness of a solder paste layer and the thickness of the substrate. The utility model is provided with the mounting hole for mounting the device, thereby avoiding the situation that the device is arranged on the surface of the substrate, the pins are connected with the side wall of the mounting hole, the soldering paste layer for connecting the pins is arranged on the side wall of the mounting hole, the thickness of the circuit board is irrelevant to the thickness of the soldering paste layer, and the thickness of the whole circuit board is the thickness of the device body and the thickness of the substrate minus the depth of the mounting hole. Compared with the prior art, the circuit board device mounting structure provided by the utility model can reduce the thickness of the circuit board, can expand the model selection range of the device and reduce the production cost of the circuit board.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic view of a prior art substrate and device connection thickness configuration;
fig. 2 is a schematic view of a circuit device mounting structure according to an embodiment of the present invention (mounting holes are through holes);
fig. 3 is a schematic diagram of a circuit device mounting structure according to an embodiment of the present invention (the mounting hole is a blind hole).
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1 to fig. 3, the circuit board device mounting structure provided by the present invention includes a substrate 100, a device body 200, and a pin 201 having one end connected to the peripheral side of the device body 200, wherein the substrate 100 is provided with at least one mounting hole 400, and the side wall of the mounting hole 400 is provided with a solder paste layer 300; the device body 200 is arranged in the mounting hole 400 and the pins 201; and the other end is connected to the solder paste layer 300.
It can be understood that: in the prior art, the device in the circuit board is usually mounted by directly mounting the device body 200 on one side of the substrate 100, and the connection is realized by soldering the pins 201 connected with the device body 200 on one side of the substrate 100, and the thickness of the whole circuit board is the sum of the thickness of the substrate 100, the thickness of the device body 200 and the thickness of the solder paste layer 300. The mounting hole 400 is arranged to mount the device body 200, so that the situation that the device body 200 is arranged on the surface of the substrate 100 is avoided, the pin 201 is connected to the side wall of the mounting hole 400, the soldering paste layer 300 is arranged between the pin 201 and the side wall of the mounting hole 400, the thickness of the circuit board is unrelated to the thickness of the soldering paste layer 300, and the thickness of the whole circuit board is equal to the thickness of the device body 200 and the thickness of the substrate 100 minus the depth of the mounting hole 400. Compared with the prior art, the device body 200 can be mounted by using the mounting structure of the device body 200, the thickness of the solder paste layer 300 can be eliminated on the basis of the original thickness, and the depth of the mounting hole 400 can be reduced, so that the thickness of the circuit board device can be reduced, the type selection types of devices can be enlarged, and the production cost of the circuit board can be reduced.
In one embodiment of the present invention, the mounting hole 400 is a through hole, that is, the depth of the mounting hole 400 is the thickness of the substrate 100, and the thickness of the whole circuit board is determined only by the height of the device body 200.
It should be noted that: the area of the bottom surface of the mounting hole 400 is slightly larger than that of the bottom surface of the device body 200, if the difference between the two is too large, the welding difficulty is easily increased, and the length of the pin 201 needs to be increased, so that the cost of the device body 200 is increased, and the overlong pin 201 is easily broken and has other risks; and the areas of the two are close, so that the whole circuit board structure can be compactly installed and has more attractive appearance.
In one embodiment of the present invention, the area of the device body 200 is 0.7 to 0.9 times the area of the mounting hole 400.
As an alternative embodiment, the lead 201 includes a first straight section, a bent section, and a second straight section connected in sequence, the first straight section is connected with the device body 200, and the second straight section is connected with the solder paste layer 300.
It should be noted that: the first straight section is parallel to and connected with the periphery of the device body 200, the second straight section is parallel to and connected with the solder paste layer 300, the bending section is connected with the first straight section and the second straight section, the bending structure is utilized to reduce the distance between the periphery of the device body 200 and the side wall of the mounting hole 400 under the condition of pins with the same length, and the hole opening diameter of the mounting hole is reduced as much as possible.
In one embodiment of the present invention, the lead 201 has a U-shaped bent structure.
It can be understood that: one end of a pin 201 of the device body 200 is fixedly connected to the side wall of the device body 200, the other end of the pin 201 is connected with the side wall of the mounting hole 400, and as the distance between the side wall of the device body 200 and the side wall of the mounting hole 400 is smaller, two choices can be made for adapting to the mounting distance between the side wall of the device body and the side wall of the mounting hole 400, the first is to specially design the pin 201, namely to design an ultra-short pin 201, by adopting the method, the production cost of the device body 200 is increased, and the ultra-short pin 201 can only enable two end parts of the pin 201 to be connected with the two side walls, so that the connection stability is poor, and the device is not universal; the second is to bend the pins 201 of the device body 200 to adapt to the mounting space between the side wall of the mounting hole 400 and the side wall of the device body 200, and the U-shaped bending is a simple straight bending mode and has universality for metal equipment with weak flexibility.
In an embodiment of the present invention, the leads 201 of the device body 200 are bent in a V shape or in an inverse "L" shape, and it can be understood that a plurality of bending modes can be adopted as long as the installation distance between the side wall of the installation hole 400 and the side wall of the device body 200 can be satisfied, and the description of the present application is omitted.
In an alternative embodiment, the end of the pin 201 away from the device body 200 has a connection section connected to the side wall of the mounting hole 400, and the length of the connection section is 0.5-0.7 times the length of the pin 201.
It can be understood that: the connecting section is connected with the side wall of the mounting hole 400, so that the connecting area between the pin 201 and the side wall of the mounting hole 400 can be increased, compared with the connection between the end part of the pin 201 of the device body 200 and the side wall, the connecting stability between the device body 200 and the mounting hole 400 can be improved, and in order to ensure the connecting stability between the pin 201 and the side wall of the mounting hole 400, a longer connecting section is needed, but if the connecting section is too long, the whole pin 201 structure can be influenced, so that the length of the connecting section is more suitable for being 0.5-0.7 times of the length of the whole pin 201.
In one embodiment of the present invention, the molten solder paste is disposed on the sidewall of the mounting hole 400, the connection segment is disposed in the molten solder paste, the solder paste layer 300 is formed after the solder paste is cooled, and the connection segment is fixedly connected to the solder paste layer 300.
In one embodiment of the present invention, solder paste is provided as solder on the connection section of the lead 201, the connection section of the lead 201 is connected to the side wall of the mounting hole 400, the solder paste is bonded to the side wall of the mounting hole 400, and after cooling, the solder paste layer 300 is formed and the connection section is fixedly connected to the side wall of the mounting hole 400.
As an alternative embodiment, the mounting hole 400 is a through hole, and the bottom surface of the device body 200 is flush with the bottom surface of the substrate 100.
It can be understood that: in a conventional mounting process, the bottom surface of the substrate 100 is usually used as a mounting bottom surface of a circuit board, and if the bottom surface of the device body 200 is beyond the bottom surface of the substrate 100, the bottom surface of the device body 200 protrudes out of the bottom surface of the substrate 100 to form a bump, so that the circuit board is not matched with other mounting structures in the mounting process, and mounting is affected; when the mounting hole 400 is a through hole, the bottom surface of the device body 200 is flush with the bottom surface of the substrate 100, and generally, the thickness of the substrate 100 is smaller than that of the device body 200, so that the thickness of the circuit board depends only on the height of the device body 200, that is, the thickness of the substrate 100 is the depth of the mounting hole 400.
In an embodiment of the present invention, a mounting tray is disposed at the bottom of the substrate 100, the substrate 100 is placed on the mounting tray, the device body 200 is disposed in the mounting hole 400, it is ensured that the bottom surface of the device body 200 is flush with the bottom surface of the substrate 100, the pins 201 of the device body 200 are connected with the side walls of the mounting hole 400, after the connection between the device body 200 and the mounting hole 400 is completed, the substrate 100 is removed, at this time, the connection between the substrate 100 and the device body 200 is completed, and the bottom surface of the device body 200 is flush with the bottom surface of the substrate 100.
As an alternative embodiment, the mounting hole 400 is a blind hole, and the bottom surface of the device body 200 is connected in parallel with the bottom surface of the blind hole.
It can be understood that: when the mounting hole 400 is a blind hole, the mounting hole 400 does not penetrate through the substrate 100, in order to ensure that the thickness of the whole circuit board structure is minimum, it is necessary to ensure that the bottom surface of the device body 200 is parallel to the bottom surface of the blind hole and also to ensure that the bottom surface of the blind hole is parallel to the bottom surface of the substrate 100, that is, the bottom surface of the device body 200 is parallel to the bottom surface of the blind hole, the actual thickness of the circuit board is the sum of the thickness of the device body 200 and the thickness of the substrate 100 minus the depth of the blind hole, compared with the prior art, when the thickness of the solder paste layer 300 is eliminated, the device body 200 is mounted by setting the blind hole, a part of the height of the device body 200 is offset by the depth of the blind hole, and thus the thickness of the whole circuit board is reduced.
As an alternative embodiment, the side wall of the mounting hole 400 is provided with a pad, the pin 201 of the device body 200 is connected with the pad, and the solder paste layer 300 is disposed between the pad and the pin 201 of the device body 200.
It can be understood that: the bonding pads are used for bonding the leads 201, and protect the substrate 100 from high temperature damage during high temperature bonding.
As an alternative embodiment, the mounting hole 400 is a circular hole; or
The mounting hole 400 is a square hole.
It can be understood that: the shape of the mounting hole 400 may be selected according to the actual shape of the device body 200, and if the device body 200 is a circular device body 200, the mounting hole 400 is preferably a circular hole; if the device body 200 is a square device body 200, the mounting hole 400 is preferably a square hole.
In an embodiment of the present invention, a plurality of device bodies 200 are disposed in the same mounting hole 400, and in order to ensure the connection stability of the plurality of device bodies 200 with the mounting hole 400, the plurality of device bodies 200 may be connected into a whole by using a connector. The connector only structurally connects the device bodies 200 without affecting the operation of the circuit between the device bodies 200. The connecting piece can be a connecting rod, a connecting sleeve and the like made of insulating materials.
The utility model also provides a circuit board, which comprises the circuit board device mounting structure, and the circuit board adopts part or all of the technical scheme of the embodiment, so that the circuit board at least has all the beneficial effects brought by the technical scheme of the embodiment, and the description is omitted.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the technical solutions of the present invention that are made by using the contents of the specification and the drawings or directly/indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. A circuit board device mounting structure, comprising:
the welding paste layer is arranged on the side wall of the mounting hole; and
the device body and one end are connected to the pins on the periphery side of the device body, the device body is arranged in the mounting hole, and the other end of each pin is connected with the soldering paste layer.
2. A circuit board device mounting structure according to claim 1, wherein:
the pin comprises a first straight section, a bent section and a second straight section which are connected in sequence, the first straight section is connected with the device body, and the second straight section is connected with the soldering paste layer.
3. A circuit board device mounting structure according to claim 1, wherein:
one end of the pin, which is far away from the device body, is provided with a connecting section connected with the soldering paste layer, and the length of the connecting section is 0.5-0.7 times of the length of the pin.
4. A circuit board device mounting structure according to claim 1, wherein:
the bottom surface of the device body and the bottom surface of the substrate are parallel to each other.
5. A circuit board device mounting structure according to claim 1, wherein:
the mounting hole is a through hole, and the bottom surface of the device body is flush with the bottom surface of the substrate.
6. A circuit board device mounting structure according to claim 1, wherein:
the mounting hole is a blind hole, and the bottom surface of the device body is parallel to and connected with the bottom surface of the blind hole.
7. A circuit board device mounting structure according to claim 1, wherein:
and a welding pad is arranged between the welding paste layer and the side wall of the mounting hole.
8. A circuit board device mounting structure according to claim 1, wherein:
the mounting hole is a circular hole; or
The mounting hole is a square hole.
9. A circuit board device mounting structure according to claim 1, wherein:
the solder paste layer is a solder paste layer.
10. A circuit board, characterized by: a circuit board device mounting structure comprising any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123174049.3U CN216700442U (en) | 2021-12-15 | 2021-12-15 | Circuit board device mounting structure and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123174049.3U CN216700442U (en) | 2021-12-15 | 2021-12-15 | Circuit board device mounting structure and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216700442U true CN216700442U (en) | 2022-06-07 |
Family
ID=81841064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123174049.3U Active CN216700442U (en) | 2021-12-15 | 2021-12-15 | Circuit board device mounting structure and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216700442U (en) |
-
2021
- 2021-12-15 CN CN202123174049.3U patent/CN216700442U/en active Active
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