CN220099261U - Heat preservation plate for crystal cooling device - Google Patents
Heat preservation plate for crystal cooling device Download PDFInfo
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- CN220099261U CN220099261U CN202321549792.9U CN202321549792U CN220099261U CN 220099261 U CN220099261 U CN 220099261U CN 202321549792 U CN202321549792 U CN 202321549792U CN 220099261 U CN220099261 U CN 220099261U
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- 239000013078 crystal Substances 0.000 title claims abstract description 138
- 238000001816 cooling Methods 0.000 title claims abstract description 65
- 238000004321 preservation Methods 0.000 title description 6
- 238000009413 insulation Methods 0.000 claims abstract description 57
- 238000002360 preparation method Methods 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 22
- 230000000694 effects Effects 0.000 description 12
- 230000007246 mechanism Effects 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 238000002425 crystallisation Methods 0.000 description 7
- 230000008025 crystallization Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000002826 coolant Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
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- 238000006722 reduction reaction Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
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- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
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- 230000005611 electricity Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
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- 239000007788 liquid Substances 0.000 description 1
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- 238000004857 zone melting Methods 0.000 description 1
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- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model relates to a heat insulation plate for a crystal cooling device, which relates to the technical field of artificial crystal preparation.
Description
Technical Field
The utility model relates to the technical field of artificial crystal preparation, in particular to an insulation board for a crystal cooling device.
Background
Under this background, with the development of the photovoltaic industry, the global demand for poly/monocrystalline silicon has grown rapidly and the market is in short supply. Under the influence of this, the price of poly/monocrystalline silicon as a main raw material of solar cells is rapidly rising, and many enterprises in China are expanding production.
Taking poly/monocrystalline silicon as an example, the amount of silicon core used is very large in the whole production process of poly/monocrystalline silicon. The existing silicon core is mostly prepared by a zone melting mode (mainly through a high-frequency coil and a seed chuck to complete the drawing process). The working principle is as follows: when the device works, high-frequency current is introduced into the high-frequency coil, and high-frequency induction heating is performed, so that the high-frequency coil generates current to generate magnetic force lines for the raw material rod; the upper end of the heated raw material rod forms a melting area, and then seed crystals are inserted into the melting area; after the end of the seed crystal and the melting area of the raw material rod are melted into a whole, the seed crystal is slowly lifted, and the melted raw material melt rises along with the seed crystal to form a new columnar crystal. The new columnar crystal is the finished product of the silicon core.
In the actual production process, the multi/monocrystalline silicon production enterprises find that the treatment of the surplus materials, the carelessly broken silicon cores, the crushed aggregates generated in the process stages of reduction, cutting, grinding and polishing and the like in the silicon core preparation process is very complicated. Many enterprises can directly discard the residual materials, broken cores and crushed aggregates or stack the residual materials, broken cores and crushed aggregates in a warehouse for a long time for saving trouble. Still other enterprises recover the crushed materials, draw the crushed materials into silicon rods through a straight pulling furnace, and then use the silicon rods to draw the silicon rods into silicon cores. Thus, not only the cost of drawing the silicon core is increased, but also larger resource waste and the like are caused. Some enterprises also recover the crushed aggregates, draw the crushed aggregates into silicon rods through a straight-pull furnace, then cut the silicon rods into a plurality of columnar silicon rods with the size of 8mm x 8mm or 10mm x 10mm through a multi-wire saw, so that the production cost of the columnar silicon rods is increased, more impurities can be introduced in the cutting process, the product quality is reduced, and meanwhile, larger resource waste and the like are caused. How to reuse crushed silicon material is one of the long-term technical challenges for those skilled in the art.
In order to solve the above technical problems, the present inventors filed PCT patent application No. PCT/CN2023/082901 to the national institute on day 21 and 3 of 2023, which is a PCT/CN2023/082901 for a crystal cooling device and an artificial crystal preparation apparatus for simultaneously drawing a plurality of crystals, which enables a low temperature zone to be formed in a space above a crucible by using a cooling medium, thereby forming a temperature gradient from top to bottom, realizing a reduction in the temperature of molten silicon above the crucible, increasing the viscosity of the silicon, and facilitating the silicon to follow crystallization of seed crystals. Most importantly, the silicon core can be cooled, so that the drawing speed of the silicon core is improved. Simultaneously, the drawing speed of the silicon cores is improved, and simultaneously drawing of a plurality of silicon cores is realized. When the device is used for simultaneously drawing a plurality of silicon cores from crushed silicon materials, the resource waste of the crushed silicon materials is effectively avoided.
In the technical scheme, the heat-insulating plate is arranged on the surface of the lower flange or the crystal cooling plate, and one of the main technical effects of the arrangement of the heat-insulating plate is that the temperature of the lower through hole or the crystal lifting hole of the crystal on the outer ring of the lower flange or the cooling plate is adjusted through the heat-insulating effect of the heat-insulating plate, and the diameter of the drawn columnar crystal is adjusted.
According to the technical scheme, in practical application, the thickness of the heat-insulating plate at the position of the crystal lower through hole or the crystal lifting hole on the lower flange or the crystal cooling plate is one of main technical indexes for realizing adjustment of the diameter of the pulled columnar crystals, namely, the larger the thickness of the heat-insulating plate at the position of the pulled columnar crystals is, the better the cooling effect is, the lower the temperature is, the larger the diameter of the pulled columnar crystals is, because the working condition of each crystal lower through hole or the crystal lifting hole is different, in order to enable the diameter of the columnar crystals pulled by each crystal lower through hole or the crystal lifting hole to be consistent, the working condition of each crystal lower through hole or the thickness of the heat-insulating plate at the position of the crystal lifting hole is realized by adjusting the thickness of the heat-insulating plate at each crystal lower through hole or the crystal lifting hole to be consistent, at the moment, if the heat-insulating plate with the existing structure is adopted, when the thickness of each crystal lower through hole or the crystal lifting hole is required to be adjusted, grooves with different depths are processed on the heat-insulating plate at the position of each crystal lower through hole or the crystal lifting hole through machine tool, or the depth of the heat-insulating plate is controlled to be the heat-insulating plate with the lowest depth at the position of the crystal lower through hole or the crystal lifting hole through hand-holding electric tool, and the heat-insulating plate is adjusted to be inferior in the heat-insulating plate.
Therefore, how to provide an insulation board for a crystal cooling device is one of the long-term technical appeal to those skilled in the art.
Disclosure of Invention
In order to achieve the purpose of the utility model, the utility model discloses a heat insulation plate for a crystal cooling device, and the purpose of adjusting different thicknesses of the heat insulation plate at a crystal lower through hole or a crystal lifting hole is achieved by arranging thickness adjusting blocks with different thicknesses in thickness adjusting block mounting holes, so that the working condition of each crystal lower through hole or each crystal lifting hole tends to be consistent, and the like.
In order to achieve the purpose of the utility model, the utility model adopts the following technical scheme:
the utility model provides a heated board for crystal cooling device, includes thickness adjusting block and heated board main part be provided with at least one thickness adjusting block mounting hole in the heated board main part, be provided with thickness adjusting block in every thickness adjusting block mounting hole respectively, be provided with the crystal bar perforation on every thickness adjusting block respectively, crystal bar perforation and crystal cooling plate are gone up crystal and are carried the draw hole one-to-one.
The thickness of the thickness adjusting block is larger than or equal to or smaller than the depth of the mounting hole of the thickness adjusting block.
The heat insulation plate for the crystal cooling device is characterized in that a through middle hole is formed in the middle of the heat insulation plate main body, at least one circle of thickness adjusting block mounting holes are radially formed in the periphery of the middle hole, and each circle of thickness adjusting block mounting holes comprise at least one thickness adjusting block mounting hole.
The heat insulation plate for the crystal cooling device is characterized in that the mounting hole of the thickness adjusting block is a threaded hole or a smooth hole or a stepped hole with a large upper end diameter and a small lower end diameter or a stepped hole with a small upper end diameter and a large lower end diameter.
When the thickness adjusting block mounting hole is a smooth hole or a stepped hole with a large upper end diameter and a small lower end diameter or a stepped hole with a small upper end diameter and a large lower end diameter, the cross section of the thickness adjusting block mounting hole is any one or combination of any two of a circular shape, an elliptic shape, a square shape and a polygonal shape.
The first structure of the thickness adjusting block is a cylindrical structure, external threads are arranged on the outer edge surface of the thickness adjusting block, and through crystal bar perforations are arranged on the thickness adjusting block.
The second structure of the thickness adjusting block is a stepped structure with a large upper end and a small lower end, a through crystal bar through hole is formed in the upper surface of the thickness adjusting block, the cross section of the upper end of the thickness adjusting block is any one of a round shape, an oval shape, a square shape or a polygonal shape, and the cross section of the lower end of the thickness adjusting block is any one of a round shape, an oval shape, a square shape or a polygonal shape.
The third structure of the thickness adjusting block is a stepped structure with a small upper end and a large lower end, a through crystal bar through hole is formed in the upper surface of the thickness adjusting block, the cross section of the upper end of the thickness adjusting block is any one of a round shape, an oval shape, a square shape and a polygonal shape, and the cross section of the lower end of the thickness adjusting block is any one of a round shape, an oval shape, a square shape and a polygonal shape.
The heat insulation plate for the crystal cooling device is characterized in that a heat insulation ring extending upwards is arranged on the heat insulation plate main body.
The heat insulation plate for the crystal cooling device is characterized in that at least one bolt connecting hole is formed in the heat insulation plate body.
By adopting the technical scheme, the utility model has the following beneficial effects:
according to the utility model, at least one thickness adjusting block mounting hole is formed in the heat insulation plate main body, each thickness adjusting block mounting hole is respectively provided with a thickness adjusting block, each thickness adjusting block is respectively provided with a crystal bar through hole, the purpose of adjusting different thicknesses of the heat insulation plate at the position of the through holes or the crystal lifting holes under the crystals is realized by placing the thickness adjusting blocks with different thicknesses in the thickness adjusting block mounting holes, and further, the condition that the working conditions of the through holes or the crystal lifting holes under each crystal tend to be consistent is ensured.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic top view of the thermal insulation board of the present utility model with a circular thickness adjusting block mounting hole;
FIG. 3 is a schematic top view of the insulation board of the present utility model with square thickness adjusting block mounting holes;
FIG. 4 is a schematic top view of the insulation board according to the present utility model, wherein the insulation board is provided with a plurality of rings of mounting holes for thickness adjusting blocks;
FIG. 5 is a schematic top view of the insulation board of the present utility model with insulation rings;
FIG. 6 is a schematic view of the structure of the utility model when the thickness adjusting block is screwed with the mounting hole of the thickness adjusting block;
FIG. 7 is a schematic view of the structure of the circular thickness adjusting block of the present utility model;
FIG. 8 is a schematic view of the structure of a square thickness adjusting block according to the present utility model;
FIG. 9 is a schematic view of the structure of the utility model when the thickness adjusting block is connected with the mounting hole of the thickness adjusting block;
FIG. 10 is a schematic illustration of the application of the present utility model;
in the figure: 1. a middle hole; 2. perforating the crystal bar; 3. a thickness adjusting block; 4. a thickness adjusting block mounting hole; 5. a bolt connection hole; 6. a thermal insulation board main body; 7. a heat-insulating ring; 8. a groove; 9. a crystal cooling plate; 10. and pulling the hole by the crystal.
Description of the embodiments
The utility model is described in detail below by way of examples, but is not meant to be limiting in any way. The present utility model has been described in detail herein, and specific embodiments thereof are also disclosed, it will be apparent to those skilled in the art that various changes and modifications can be made to the specific embodiments of the utility model without departing from the spirit and scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "side", "length", "width", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "side", etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in fig. 1 are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The innovation point of the utility model is mainly that at least one thickness adjusting block mounting hole 4 is arranged on the heat insulation plate main body 6, each thickness adjusting block mounting hole 4 is respectively provided with a thickness adjusting block 3, each thickness adjusting block 3 is respectively provided with a crystal bar perforation 2, the purpose of adjusting different thicknesses of the heat insulation plate at the position of the perforation under the crystal or the crystal lifting hole is realized by placing the thickness adjusting blocks 3 with different thicknesses in the thickness adjusting block mounting holes 4, and the working conditions of the perforation under the crystal or the crystal lifting hole tend to be consistent and the like are further ensured.
Referring to fig. 1 to 10, the heat insulation board for a crystal cooling device of the present utility model comprises a thickness adjusting block 3 and a heat insulation board main body 6, wherein the upper surface of the heat insulation board main body 6 is connected with the lower flange or the lower surface of a crystal cooling disk 9 in the crystal cooling device, at least one thickness adjusting block mounting hole 4 is arranged on the heat insulation board main body 6, thickness adjusting blocks 3 are respectively arranged in each thickness adjusting block mounting hole 4, crystal bar through holes 2 are respectively arranged on each thickness adjusting block 3, and the crystal bar through holes 2 are in one-to-one correspondence with crystal lifting holes 10 on the crystal cooling disk 9. That is, the number of the thickness adjusting blocks 3 and the positions of the crystal bar through holes 2 on the thickness adjusting blocks 3 are arranged in one-to-one correspondence with the crystal pulling holes 10 on the crystal cooling plate 9.
In practice, the thickness of the thickness adjustment block 3 is greater than or equal to or less than the depth of the thickness adjustment block mounting hole 4. The materials of the heat insulation plate main body 6 and the thickness adjusting block 3 can be selected as graphite felt, graphite plate, carbon-carbon composite material plate and the like.
Further, as shown in fig. 1, 2, 3, 4, 5 and 6, the illustrated insulation board main body 6 has a circular structure, a through middle hole 1 is provided in the middle of the insulation board main body 6, at least one circle of thickness adjusting block mounting holes 4 are radially provided on the periphery of the middle hole 1, and each circle of thickness adjusting block mounting holes 4 includes at least one thickness adjusting block mounting hole 4. In order to realize that a larger number of thickness adjusting block mounting holes 4 are arranged on the insulation board main body 6, each circle of thickness adjusting block mounting holes 4 is as close to the outer ring of the insulation board main body 6 as possible, but in the implementation, the arrangement number and arrangement positions of the thickness adjusting block mounting holes 4 are in one-to-one correspondence with the lower flange or the crystal lower through holes or the crystal lifting holes 10 on the crystal cooling disk 9. The present utility model is an improvement of the heat-insulating plate of PCT patent application (international application No. PCT/CN 2023/082901) filed by the inventor of the present utility model to the national institute at 3 and 21 of 2023, in which the function of the heat-insulating plate main body 6 is identical to that of the heat-insulating plate of the above PCT application, and therefore, the applicant does not make a cumulative description of the function of the heat-insulating plate main body 6, and particularly, refer to the description of the above PCT application.
Further, as shown in fig. 1 to 6, the thickness adjusting block mounting hole 4 is a screw hole, a smooth hole, a stepped hole with a large upper end diameter and a small lower end diameter, or a stepped hole with a small upper end diameter and a large lower end diameter.
Further, when the thickness adjusting block mounting hole 4 is formed as a smooth hole or a stepped hole with a large upper end diameter and a small lower end diameter or a stepped hole with a small upper end diameter and a large lower end diameter, the cross section of the thickness adjusting block mounting hole 4 is circular, elliptical, square, or a combination of any two or more of them.
When the thickness adjusting block mounting hole 4 is formed as a screw hole, the thickness adjusting block 3 which is engaged with the thickness adjusting block mounting hole 4 is formed as a cylindrical structure, the outer edge surface of the thickness adjusting block 3 is provided with an external screw thread, the upper surface of the thickness adjusting block 3 is provided with a through ingot through hole 2, the external screw thread on the outer edge surface of the thickness adjusting block 3 is engaged with the screw hole by screwing, and when the thickness adjusting block mounting hole is formed, the upper surface of the thickness adjusting block 3 is kept flush with the upper surface of the insulation board main body 6 as much as possible, and further, in order to enable the thickness adjusting block 3 to be screwed into the thickness adjusting block mounting hole 4 more conveniently, the screw hole is formed above or below the thickness adjusting block 3. The thickness of the thickness adjusting block 3 is larger than or equal to or smaller than the depth of the thickness adjusting block mounting hole 4, and the thickness of the thickness adjusting block 3 is selected according to actual working conditions.
When the thickness adjusting block mounting hole 4 is set as a unthreaded hole, the cross section of the thickness adjusting block mounting hole 4 is any one of a circle, an ellipse, a square or a polygon, the cross section of the thickness adjusting block 3 matched with the thickness adjusting block mounting hole 4 is any one of a circle, an ellipse, a square or a polygon, when the thickness adjusting block mounting hole 4 is implemented, the cross section of the thickness adjusting block mounting hole 4 is consistent with the cross section of the thickness adjusting block 3, when the cross section of the thickness adjusting block 3 is a circle, the thickness adjusting block 3 is set as a cylindrical structure, the outer diameter of the thickness adjusting block 3 is slightly larger than the inner diameter of the thickness adjusting block mounting hole 4, so that the thickness adjusting block 3 and the upper surface of the heat insulation plate body 6 are in interference fit connection, and when the thickness of the thickness adjusting block 3 is larger than or equal to or smaller than the depth of the thickness adjusting block mounting hole 4, the thickness of the thickness adjusting block 3 is selected according to practical working conditions.
As shown in fig. 1, 2, 3, 4, 5, 7 and 8, when the thickness-adjustment-block mounting hole 4 is provided as a stepped hole with a larger diameter at the upper end and a smaller diameter at the lower end, the cross-sectional shape of the thickness-adjustment-block mounting hole 4 is any one or a combination of any two of a circle, an ellipse, a square and a polygon, and the cross-sectional shape of the thickness-adjustment-block 3 mated with the thickness-adjustment-block mounting hole 4 is any one or a combination of any two of a circle, an ellipse, a square and a polygon, and when the thickness-adjustment-block mounting hole 4 is implemented, the cross-sectional shape of the thickness-adjustment-block mounting hole 4 everywhere is consistent with the cross-sectional shape of the thickness-adjustment-block 3, by providing the thickness-adjustment-block mounting hole 4 as a stepped hole, the positioning of the thickness-adjustment-block 3 in the thickness-adjustment-block mounting hole 4 can be achieved through the stepped hole, the thickness-adjustment-block 3 is prevented from dropping downward, and further, the thickness-adjustment-block 3 is prevented from rotating in the adjustment-block mounting hole 4 for better positioning, and the cross-sectional shape of the thickness-adjustment-block 3 is now rotated into an ellipse, a shape or a square structure; the thickness adjusting block 3 is in a stepped structure with a large upper end and a small lower end, a through crystal bar through hole 2 is arranged on the thickness adjusting block 3, the cross section of the upper end of the thickness adjusting block 3 is any one of a circle, an ellipse, a square or a polygon, and the cross section of the lower end of the thickness adjusting block 3 is any one of a circle, an ellipse, a square or a polygon. That is, when the thickness adjustment block mounting hole 4 is provided as a stepped hole, the outer shapes of the upper end and the lower end of the stepped hole may be identical or may be provided in different shapes, for example, the upper end of the stepped hole is provided as a square, the lower end of the stepped hole is provided as a circle, or the like.
As shown in fig. 9, when the thickness-adjusting-block mounting hole 4 is provided as a stepped hole with a small upper end diameter and a large lower end diameter, the cross-sectional shape of the thickness-adjusting-block mounting hole 4 is any one or any combination of two of a circle, an ellipse, a square and a polygon, the cross-sectional shape of the thickness-adjusting-block 3 mated with the thickness-adjusting-block mounting hole 4 is any one or any combination of two of a circle, an ellipse, a square and a polygon, and when the method is implemented, the cross-sectional shape of each place of the thickness-adjusting-block mounting hole 4 is consistent with the cross-sectional shape of the thickness-adjusting-block 3, and the thickness-adjusting-block mounting hole 4 is provided as a stepped hole with a small upper end diameter and a large lower end diameter, and then the thickness-adjusting-block 3 is inserted into the adjusting-block mounting hole 4. Further, the thickness adjusting block 3 has a stepped structure with a small upper end and a large lower end, the through crystal bar through holes 2 are arranged on the thickness adjusting block 3, the cross section of the upper end of the thickness adjusting block 3 is any one of a circle, an ellipse, a square or a polygon, and the cross section of the lower end of the thickness adjusting block 3 is any one of a circle, an ellipse, a square or a polygon. That is, when the thickness adjustment block mounting hole 4 is provided as a stepped hole, the outer shapes of the upper end and the lower end of the stepped hole may be identical or may be provided in different shapes, for example, the upper end of the stepped hole is provided as a square, the lower end of the stepped hole is provided as a circle, or the like.
Further, as shown in fig. 5, an upwardly extending heat-insulating ring 7 is provided on the heat-insulating plate main body 6, and the heat-insulating ring 7 can insulate the outer wall of the lower flange or the crystal cooling plate 9.
Further, as shown in fig. 1, 2, 3, 4, 5, 6 and 9, at least one bolt connection hole 5 is provided on the upper surface of the insulation board main body 6, and when in use, the connection bolt passes through the bolt connection hole 5 to be connected with the lower flange or the crystal cooling plate 9.
Further, the structure of the heat-insulating plate main body 6 can be also set to be that the heat-insulating plate main body 6 is of a flat plate structure, at least one stage of step which is raised upwards is arranged on the heat-insulating plate main body 6 from outside to inside, and the step is correspondingly matched with the step surface below the lower flange or the crystal cooling disk 9. That is, the shape above the heat-insulating plate main body 6 is kept uniform corresponding to the shape below the lower flange or the crystal cooling plate 9.
In the concrete implementation of the utility model, as shown in fig. 10, thickness adjusting blocks 3 with different thicknesses are respectively placed in the thickness adjusting block mounting holes 4, then the heat insulation plate main body 6 is fixed below the crystal cooling disk 9, at the moment, the upper surface of the heat insulation plate main body 6 is connected with the lower surface of the crystal cooling disk 9, crystal bar through holes 2 on each thickness adjusting block 3 are respectively in one-to-one correspondence with crystal lifting holes 10 on the crystal cooling disk 9, when the thickness of one thickness adjusting block 3 is required to be adjusted, only the heat insulation plate main body 6 is required to be detached, and then the thickness adjusting block 3 with the corresponding thickness is directly placed. Further, the cooling medium in the crystal cooling mechanism can forcedly cool the columnar crystals just crystallized through the lifting holes on the crystals. The heat-insulating plate provided by the utility model can prevent volatile matters from adhering to the surface of the crystal cooling mechanism, and can adjust the heat-insulating effect of the lifting holes on each circle of crystals, thereby realizing adjustment of the diameter of cylindrical crystals drawn by the lifting holes on the inner and outer circles of crystals.
Further, by the application of the utility model, the heat-insulating plate is arranged below the crystal cooling mechanism, so that the surface of the crystal cooling mechanism is insulated by the heat-insulating plate, and the phenomenon that volatile matters adhere to the lower surface and the side wall of the crystal cooling mechanism due to condensation is effectively avoided. The device has the advantages that the device can prevent volatile matters from adhering to the crystal cooling mechanism, and meanwhile, due to the heat preservation effect of the heat preservation plate, the temperature of a crucible area opposite to the lower surface of the crystal cooling mechanism is prevented from being reduced due to the low temperature of the lower surface of the crystal cooling mechanism, the crystal cooling mechanism is prevented from taking away excessive temperature, the effect of reducing heating energy consumption is achieved, and the like. Meanwhile, due to the heat preservation effect of the heat preservation plate, the cooling effect of the cooling medium in the crystal cooling mechanism is completely acted on the inner hole wall of the lifting hole on the crystal, so that the cooling effect on the pulled crystal is improved, the rapid crystallization of the crystal is realized, and the purposes of improving the crystal pulling speed, adjusting the diameter of the pulled crystal and the like are achieved.
Further, by using the heat-insulating plate provided by the utility model, the temperature of the crystallization area in the crucible tends to be uniform, and the undesirable cooling of the crystallization area in the crucible caused by the cooling medium in the lower flange or the crystal cooling disc 9 is reduced or avoided (the surface temperature of the lower flange or the crystal cooling disc 9 is low, a part of heat can be taken away, and the temperature is reduced after heat loss). Further, since the temperature of the crystallization area in the crucible is not reduced, the temperature of the crystallization area in the crucible is not reduced by a method of increasing heating power, and the effect of reducing energy consumption is achieved (namely, the absorption of the lower flange or the crystal cooling disc 9 to the liquid level temperature of the melt in the crucible can be reduced or regulated by the arrangement of the heat insulation plate, thereby avoiding unnecessary heat loss, avoiding the increase of electricity consumption and the like), and further, the temperature uniformity of the crystallization area of the crucible can be achieved.
The utility model can increase the surface thickness of the lower flange or the crystal cooling disk 9, and further improve the cold insulation effect of the lower flange or the crystal cooling disk 9 (the wall thickness of the lower flange or the crystal cooling disk 9 is adjusted by the arrangement of the heat insulation plate, and further improve the cooling effect, namely, the cooling at the thin wall part is fast and the cooling at the wall thickness part is slow), after the surface thickness of the lower flange or the crystal cooling disk 9 is increased, thereby reducing the low-temperature dissipation in the lower flange or the crystal cooling disk 9.
The above-described preferred embodiments of the present utility model are only illustrative and not restrictive, and it will be apparent to those skilled in the art that the above-described embodiments of the present utility model may be combined with each other and that various modifications and variations of the present utility model are possible. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (10)
1. An insulation board for a crystal cooling device comprises a thickness adjusting block (3) and an insulation board main body (6), and is characterized in that: at least one thickness adjusting block mounting hole (4) is formed in the heat insulation plate main body (6), thickness adjusting blocks (3) are respectively arranged in each thickness adjusting block mounting hole (4), and crystal bar perforation holes (2) are respectively formed in each thickness adjusting block (3).
2. The thermal insulation board for a crystal cooling apparatus as set forth in claim 1, wherein: the thickness of the thickness adjusting block (3) is larger than or equal to or smaller than the depth of the thickness adjusting block mounting hole (4).
3. The thermal insulation board for a crystal cooling apparatus as set forth in claim 1, wherein: the middle part of heated board main part (6) is equipped with middle part hole (1) that link up the periphery in middle part hole (1) is radially provided with at least round thickness adjustment piece mounting hole (4), and every round thickness adjustment piece mounting hole (4) include at least one thickness adjustment piece mounting hole (4).
4. The thermal insulation board for a crystal cooling apparatus as set forth in claim 1, wherein: the thickness adjusting block mounting hole (4) is a threaded hole or a smooth hole or a stepped hole with a large upper end diameter and a small lower end diameter or a stepped hole with a small upper end diameter and a large lower end diameter.
5. The thermal insulation board for a crystal cooling apparatus as set forth in claim 4, wherein: when the thickness adjusting block mounting hole (4) is arranged as a unthreaded hole or a stepped hole with a large upper end diameter and a small lower end diameter or a stepped hole with a small upper end diameter and a large lower end diameter, the cross section of the thickness adjusting block mounting hole (4) is circular, elliptical, square or polygonal or a combination of any two of the two.
6. The thermal insulation board for a crystal cooling apparatus as set forth in claim 1, wherein: the first structure of the thickness adjusting block (3) is a cylindrical structure, the outer edge surface of the thickness adjusting block (3) is provided with external threads, and the upper surface of the thickness adjusting block (3) is provided with a through crystal bar perforation (2).
7. The thermal insulation board for a crystal cooling apparatus as set forth in claim 1, wherein: the second structure of the thickness adjusting block (3) is a stepped structure with a large upper end and a small lower end, a through crystal bar through hole (2) is formed in the upper surface of the thickness adjusting block (3), the cross section of the upper end of the thickness adjusting block (3) is any one of a round shape, an oval shape, a square shape and a polygonal shape, and the cross section of the lower end of the thickness adjusting block (3) is any one of a round shape, an oval shape, a square shape and a polygonal shape.
8. The thermal insulation board for a crystal cooling apparatus as set forth in claim 1, wherein: the third structure of the thickness adjusting block (3) is a stepped structure with a small upper end and a large lower end, a through crystal bar through hole (2) is formed in the upper surface of the thickness adjusting block (3), the cross section of the upper end of the thickness adjusting block (3) is any one of a round shape, an oval shape, a square shape and a polygonal shape, and the cross section of the lower end of the thickness adjusting block (3) is any one of a round shape, an oval shape, a square shape and a polygonal shape.
9. The thermal insulation board for a crystal cooling apparatus as set forth in claim 1, wherein: an upward extending heat insulation ring (7) is arranged on the heat insulation plate main body (6).
10. The thermal insulation board for a crystal cooling apparatus as set forth in claim 1, wherein: at least one bolt connecting hole (5) is formed in the upper surface of the heat insulation plate main body (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321549792.9U CN220099261U (en) | 2023-06-17 | 2023-06-17 | Heat preservation plate for crystal cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321549792.9U CN220099261U (en) | 2023-06-17 | 2023-06-17 | Heat preservation plate for crystal cooling device |
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| Publication Number | Publication Date |
|---|---|
| CN220099261U true CN220099261U (en) | 2023-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321549792.9U Active CN220099261U (en) | 2023-06-17 | 2023-06-17 | Heat preservation plate for crystal cooling device |
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| Country | Link |
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| CN (1) | CN220099261U (en) |
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2023
- 2023-06-17 CN CN202321549792.9U patent/CN220099261U/en active Active
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