CN220085125U - Optical module - Google Patents

Abstract

The embodiment of the utility model provides an optical module, which comprises: light emitting component and circuit board. Wherein the light emitting member includes: and the light emitting assembly is positioned inside the emitting shell and is formed by the emitting shell and the emitting upper cover. The transmitting shell is provided with a first through hole, and the first through hole is connected with the optical fiber adapter. The opposite side of the first through hole is provided with a switching block which is used for connecting the circuit board and the light emitting component. The outside one side of the switching piece is equipped with the second high frequency metal level, and the high frequency pin wire bonding on second high frequency metal level and the circuit board is connected, reduces the impedance between circuit board and the optical emission subassembly, improves communication rate. The circuit board is also provided with an upper protective cover and a lower protective cover, the upper protective cover and the lower protective cover are respectively positioned at two sides of the circuit board, and the upper protective cover and the lower protective cover are detachably connected. The upper protective cover protects the metal wire between the second high-frequency metal layer and the high-frequency pin.

Description

Optical module

Technical Field

The utility model relates to the technical field of communication, in particular to an optical module.

Background

In a novel service mode and an application mode of cloud computing, mobile internet, video and the like, an optical communication technology can be used. In optical communication, an optical module is a tool for realizing mutual conversion of optical and electrical signals, and is one of key devices in optical communication equipment. With the rapid development of 5G networks, optical modules at the core position of optical communications have been developed.

The optical module is internally provided with a light emitting component for converting an electric signal into an optical signal. The connection quality of the light emitting component and the circuit board affects the signal transmission quality.

Disclosure of Invention

The utility model provides an optical module, which is used for improving the high-frequency transmission performance of the optical module.

In order to solve the technical problems, the embodiment of the utility model discloses the following technical scheme:

the embodiment of the utility model discloses an optical module, which comprises:

the circuit board is provided with a first through hole, and the upper surface of the circuit board is provided with a high-frequency pin;

the light emitting component is positioned in the first avoidance hole and positioned in the first avoidance hole;

the light emitting member includes:

a transmitting upper cover;

a transmitting shell, which is provided with an opening at one side, is formed with the transmitting upper cover;

the light emitting assembly is positioned inside the emitting shell and is hoisted on the inner wall of the emitting upper cover;

the switching block is positioned at the opening; the adapter block is provided with a first high-frequency metal layer, the first high-frequency metal layer is positioned in the emission shell, and the first high-frequency metal layer is electrically connected with the light emission assembly;

the transfer block is provided with a second high-frequency metal layer, and is positioned outside the transmitting shell, and the second high-frequency metal layer is connected with the high-frequency pin in a wire bonding manner;

the second high-frequency metal layer is electrically connected with the first high-frequency metal layer;

the upper protection cover is positioned on one side of the circuit board, the lower surface of the upper protection cover is sunken to form a first avoidance groove, and the second high-frequency metal layer and the high-frequency pin are positioned in the first avoidance groove;

the lower protection cover is positioned on the opposite side of the upper protection cover, and the upper protection cover is detachably connected with the lower protection cover.

Compared with the prior art, the utility model has the beneficial effects that:

the embodiment of the utility model provides an optical module, which comprises: light emitting component and circuit board. Wherein the light emitting member includes: and the light emitting assembly is positioned inside the emitting shell and is formed by the emitting shell and the emitting upper cover. The transmitting shell is provided with a first through hole, and the first through hole is connected with the optical fiber adapter. The opposite side of the first through hole is provided with a switching block which is used for connecting the circuit board and the light emitting component. And a second high-frequency metal layer is arranged on one side of the outer part of the switching block, and the second high-frequency metal layer is connected with high-frequency pins on the circuit board in a wire bonding manner. The other side of the outer part of the switching block is provided with a second low-frequency metal layer which is connected with the low-frequency pins on the circuit board in a wire bonding way. The circuit board is also provided with an upper protective cover and a lower protective cover, the upper protective cover and the lower protective cover are respectively positioned at two sides of the circuit board, and the upper protective cover and the lower protective cover are detachably connected. The upper protective cover is provided with a first avoidance groove, the second high-frequency metal layer and the high-frequency pins are positioned in the first avoidance groove, and the first avoidance groove is used for protecting a metal wire between the second high-frequency metal layer and the high-frequency pins. And the second high-frequency metal layer is connected with the high-frequency pins by gold wires, so that the impedance between the circuit board and the light emitting component is reduced, and the communication rate is improved. The upper protective cover protects gold wires between the light emitting component and the circuit board, and damage caused by external pressure is avoided.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

FIG. 1 is a partial architectural diagram of an optical communication system according to some embodiments;

FIG. 2 is a partial block diagram of a host computer according to some embodiments;

FIG. 3 is a block diagram of an optical module according to some embodiments;

fig. 4 is an exploded view of a light module according to some embodiments;

FIG. 5 is an exploded schematic view of a light emitting component and a circuit board provided in accordance with some embodiments of the present disclosure;

FIG. 6 is an exploded schematic view of a light emitting component provided in accordance with some embodiments of the present disclosure;

FIG. 7 is a schematic structural view of a launch housing provided according to some embodiments of the present disclosure;

FIG. 8 is a schematic partial cross-sectional view of a light emitting component and a circuit board provided in accordance with some embodiments of the present disclosure;

FIG. 9 is a schematic block diagram of an adapter according to some embodiments of the present disclosure;

FIG. 10 is a schematic block diagram of an adapter according to some embodiments of the present disclosure;

FIG. 11 is an exploded view of a first adapter block provided in accordance with some embodiments of the present disclosure;

FIG. 12 is an exploded schematic view II of a joint block provided in accordance with some embodiments of the present disclosure;

FIG. 13 is a schematic diagram of an exploded structure of a protective cover and a circuit board according to some embodiments of the present disclosure;

FIG. 14 is a schematic view of a first construction of upper and lower protective covers provided in accordance with some embodiments of the present disclosure;

FIG. 15 is a second schematic structural view of an upper protective cover and a lower protective cover provided in accordance with some embodiments of the present disclosure;

fig. 16 is a schematic cross-sectional view of a portion of an optical module provided in accordance with some embodiments of the present disclosure.

Detailed Description

The optical communication technology establishes information transfer between information processing apparatuses, and the optical communication technology loads information onto light, and uses propagation of light to realize information transfer, and the light loaded with information is an optical signal. The optical signal propagates in the information transmission device, so that the loss of optical power can be reduced, and the high-speed, long-distance and low-cost information transmission can be realized. Information that can be processed by the information processing device exists in the form of an electrical signal, and an optical network terminal/gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer and a television are common information processing devices, and an optical fiber and an optical waveguide are common information transmission devices.

The mutual conversion of optical signals and electric signals between the information processing equipment and the information transmission equipment is realized through an optical module. For example, an optical fiber is connected to an optical signal input end and/or an optical signal output end of the optical module, and an optical network terminal is connected to an electrical signal input end and/or an electrical signal output end of the optical module; the optical module converts the first optical signal into a first electric signal, and the optical module transmits the first electric signal into an optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Because the information processing devices can be connected with each other through an electrical signal network, at least one type of information processing device is required to be directly connected with the optical module, and not all types of information processing devices are required to be directly connected with the optical module, and the information processing device directly connected with the optical module is called an upper computer of the optical module.

Fig. 1 is a partial architectural diagram of an optical communication system according to some embodiments. As shown in fig. 1, a part of the optical communication system is represented as a remote information processing apparatus 1000, a local information processing apparatus 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 extends toward the remote information processing apparatus 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, the propagation of the optical signal in the total reflection direction can almost maintain the original optical power, the optical signal can be totally reflected in the optical fiber 101 for a plurality of times, the optical signal from the direction of the far-end information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated towards the direction of the far-end information processing device 1000, so that the information transmission with long distance and low power consumption is realized.

The number of the optical fibers 101 may be one or plural (two or more); the optical fiber 101 and the optical module 200 are movably connected in a pluggable mode, and can also be fixedly connected.

The upper computer 100 is provided with an optical module interface 102, and the optical module interface 102 is configured to be connected with the optical module 200, so that the upper computer 100 and the optical module 200 are connected by unidirectional/bidirectional electric signals; the upper computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working state of the optical module 200.

The upper computer 100 has an external electrical interface, such as a universal serial bus interface (Universal Serial Bus, USB), a network cable interface 104, and the external electrical interface can access an electrical signal network. Illustratively, the network cable interface 104 is configured to access the network cable 103, thereby enabling the host computer 100 to establish a unidirectional/bidirectional electrical signal connection with the network cable 103.

Optical network terminals (ONU, optical Network Unit), optical line terminals (OLT, optical Line Terminal), optical network devices (ONT, optical Network Terminal), and data center servers are common upper computers.

One end of the network cable 103 is connected to the local information processing device 2000, the other end is connected to the host computer 100, and the network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

Illustratively, the third electrical signal sent by the local information processing apparatus 2000 is transmitted to the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal based on the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, the optical module 200 transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing apparatus 1000 in the optical fiber 101.

Illustratively, the first optical signal from the direction of the remote information processing apparatus 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal into the local information processing apparatus 2000.

The optical module is a tool for realizing the mutual conversion of the optical signal and the electric signal, and the information is not changed in the conversion process of the optical signal and the electric signal, and the encoding and decoding modes of the information can be changed.

Fig. 2 is a partial block diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, fig. 2 only shows the structure of the host computer 100 and the optical module 200. As shown in fig. 2, the upper computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector (not shown in the drawing) disposed inside the cage 106, wherein the heat sink 107 has a convex structure for increasing a heat dissipation area, and the fin-like structure is a common convex structure.

The optical module 200 is inserted into the cage 106 of the host computer 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected with an electrical connector inside the cage 106.

Fig. 3 is a block diagram of an optical module according to some embodiments, and fig. 4 is an exploded view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed within the housing, a light emitting part 400, and a light receiving part. The present disclosure is not limited thereto and in some embodiments, the optical module 200 includes one of a light emitting part 400 and a light receiving part.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical interface, and the golden finger 301 of the circuit board 300 extends out of the electrical interface and is inserted into an electrical connector of the upper computer; the opening 205 is an optical port configured to access the optical fiber 101 such that the optical fiber 101 connects to the light emitting component 400 and/or the light receiving component in the optical module 200.

By adopting the assembly mode of combining the upper shell 201 and the lower shell 202, the circuit board 300, the light emitting component 400, the light receiving component and other components are convenient to be installed in the shells, and the shapes of the components can be packaged and protected by the upper shell 201 and the lower shell 202. In addition, when the circuit board 300, the light emitting part 400, the light receiving part, and the like are assembled, the positioning part, the heat radiating part, and the electromagnetic shielding part of these devices are easily disposed, which is advantageous for automatized production.

In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the light module 200 further includes an unlocking member 600 located outside its housing. The unlocking part 600 is configured to achieve a fixed connection between the optical module 200 and the upper computer, or to release the fixed connection between the optical module 200 and the upper computer.

For example, the unlocking member 600 is located outside of the two lower side plates 2022 of the lower housing 202, and includes an engaging member that mates with the cage 106 of the upper computer. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging member of the unlocking member 600; when the unlocking member 600 is pulled, the engaging member of the unlocking member 600 moves along with the unlocking member, so that the connection relationship between the engaging member and the host computer is changed, and the engagement and fixed connection between the optical module 200 and the host computer is released, so that the optical module 200 can be pulled out from the cage 106.

The circuit board 300 includes circuit traces, electronic components, chips, etc., and the electronic components and the chips are connected together according to a circuit design through the circuit traces to realize functions of power supply, electric signal transmission, grounding, etc. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (limiting amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; the hard circuit board is also convenient to insert into an electric connector in the host computer cage.

The circuit board 300 further includes a gold finger 301 formed on an end surface thereof, the gold finger 301 being composed of a plurality of independent leads. The circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connector within the cage 106 by the gold finger 301. The gold finger 301 may be disposed on only one surface (such as the upper surface shown in fig. 4) of the circuit board 300, or may be disposed on both upper and lower surfaces of the circuit board 300, so as to provide more pins. The golden finger 301 is configured to establish electrical connection with an upper computer to achieve power supply, grounding, I2C signal transfer, data signal transfer, and the like.

Of course, a flexible circuit board is also used in some optical modules, and the flexible circuit board is generally used in cooperation with a hard circuit board to supplement the hard circuit board.

The light emitting part 400 and/or the light receiving part are located at a side of the circuit board 300 away from the gold finger 301; in some embodiments, the light emitting and receiving components 400 and 300, respectively, are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors, respectively; in some embodiments, the light emitting and/or light receiving components may be disposed directly on the circuit board 300, may be disposed on a surface of the circuit board, or may be disposed on a side of the circuit board.

Fig. 5 is an exploded view of a light emitting device and a circuit board according to some embodiments of the present disclosure. Fig. 6 is an exploded schematic view of a light emitting component provided according to some embodiments of the present disclosure. As shown in fig. 5 and 6, the circuit board 300 is provided with a first escape hole 302 in which the light emitting member is located.

The light emitting part includes an emission housing 411 and an emission upper cover 412. An inner cavity is formed on the emission shell 411, and an emission upper cover 412 is connected with the emission shell 411 in a covering manner, and forms a cavity structure with one side opening with the emission shell 411. A fiber optic adapter 700 is provided on one side wall of the launch housing 411, and a splice block 413 is provided on the opposite side wall of the fiber optic adapter 700. A light emitting assembly is provided within the emission housing 411. The transfer block 413 seals the emission top cover 412 to form an opening side with the emission housing 411.

In some embodiments of the present utility model, the upper surface of the adapter block is provided with a second high-frequency signal line, and the lower surface of the adapter block is provided with a second low-frequency signal line. One end of the adapter block is located inside the emission housing 411, and the other end is located outside the emission housing 411. The transfer block 413 is connected to the circuit board 300 by a wire.

In general, the metal wires of the switching block and the circuit board protrude from the surface of the circuit board, and are easily contacted and pressed by external objects, so that connection is not smooth. In order to protect the metal wires, the circuit board is provided with a protective cover, the protective cover is arranged above the metal wires, and the contact between an external object and the metal wires is prevented, so that the situation that the metal wires are broken under stress or external conductive substances fall into the space between the metal wires to cause short circuit can be avoided.

For convenience of description, in the embodiment of the present utility model, the length direction of the circuit board is referred to as the X direction, the width direction of the circuit board is referred to as the Y direction, and the direction perpendicular to the circuit board is the Z direction.

Fig. 7 is a schematic structural view of a launch housing provided according to some embodiments of the present disclosure. Fig. 8 is a schematic partial cross-sectional view of a light emitting component and a circuit board provided according to some embodiments of the present disclosure. As shown in fig. 7 and 8, a fixing surface 4101 is provided at the top of the emission housing 411, and an emission upper cover 412 is fixedly connected to the fixing surface 4101; the launching housing 411 is provided with a first through hole 4103, the first through hole 4103 is communicated with the inner cavity of the launching housing 411, and the first through hole 4103 is connected with the optical fiber adapter 700.

In some embodiments, the light emitting assembly includes a first isolator. Illustratively, a first spacer is disposed within the first throughbore 4103, the first spacer sealing the first throughbore 4103, the first spacer for preventing external optical signals from being incident within the emitter housing 411.

In some embodiments, the opposite end of the first through hole 4103 of the emission housing 411 is provided with a adapter block 413, one side of the adapter block 413 is inserted into the emission housing 411, and the other side is exposed outside the emission housing 411, so that the emission housing 411, the emission upper cover 412 and the adapter block are assembled to form a second cavity.

The outer wall of the emission shell 411 is provided with a convex strip, and the convex strip protrudes out of the outer wall of the emission shell. The lower surface of the convex strip is connected with the upper surface of the circuit board, so that the limit of the transmitting shell on the circuit board is realized. In some embodiments, the launching casing 411 has a first protrusion 4111 and a second protrusion 4112, wherein the first protrusion 4111 and the second protrusion 4112 are symmetrically disposed on the outer wall of the launching casing 411. The first protrusion 4111 is located on the first side wall 4413 of the emission housing 411, and the first side wall 4113 is adjacent to the side wall of the first through hole 4103. The second protrusion 4112 is located on the second side wall 4114 of the emission housing, and the second side wall 4114 is located opposite to the first side wall 4113. The convex strips and the emission shell are integrally formed.

The emission housing 411 is provided with a laser assembly 440 and a lens assembly 450. In the present example, the laser assembly 440 is lifted from the bottom of the emission top cover 412 for convenience of heat dissipation.

One end of the switching block 413 located in the emission housing is connected with each laser of the laser assembly 440 through a gold wire, one end of the switching block 413 located outside the emission housing is connected with the circuit board through a gold wire, and electric signals, working signals and the like generated by the circuit board 300 are switched to each laser so as to drive each laser to emit laser beams with different wavelengths.

In order to realize the electrical connection inside and outside the shell through the adapter block 413, the adapter block 413 is plated with a metal layer, the metal layer of the adapter block 413 positioned at the inner side of the shell is provided with a signal pad and a grounding pad, the metal layer of the adapter block 413 positioned at the outer side of the shell is also provided with a signal pad and a grounding pad, and the signal pads in the adapter block 413 and the signal pads in the outer side are connected to realize the electrical connection in the adapter block 413 and the electrical connection in the outer side, so that the transfer of electric signals, working signals and the like is realized through the adapter block 413.

Fig. 9 is a schematic structural diagram of a switching block according to some embodiments of the present disclosure. Fig. 10 is a schematic structural diagram of a joint block according to some embodiments of the present disclosure. Fig. 9 and 10 show the adapter block from different angles. Fig. 11 is an exploded view of a joint block provided in accordance with some embodiments of the present disclosure. Fig. 12 is an exploded view of a second embodiment of a transfer block according to some embodiments of the present disclosure. As shown in fig. 9, 10, 11 and 12, the adapter block 413 includes a first adapter plate 4131, a second adapter plate 4132 and a third adapter plate 4133. The lower surface of the first adapter plate 4131 is provided with a first high-frequency metal layer 41311, and the first high-frequency metal layer 41311 is electrically connected with the laser assembly to transmit the high-speed signal of the circuit board to the laser assembly. In the example of the present utility model, the first high-frequency metal layer 41311 of the first adapter plate 4131 is located inside the transmitting housing.

The second adapter plate 4132 is located below the first adapter plate 4131, and the second adapter plate 4132 and the first adapter plate 4131 form a step surface. The second interposer 4132 does not cover the first high frequency metal layer 41311, so that the first high frequency metal layer 41311 is exposed inside the emitter housing, and the first high frequency metal layer 41311 is convenient to electrically connect with the laser assembly. The lower surface of the second adapter plate 4132 is provided with a first low frequency metal layer 41324, and the first low frequency metal layer 41324 is electrically connected to the laser assembly to transmit the low speed signal of the circuit board to the laser assembly.

The lower surface of the first adapter plate 4131 is flush with the lower surface of the laser assembly, reducing the length of the connecting line between the first high frequency metal layer 41311 and the signal line of the laser assembly, and reducing signal loss. The lower surface of the first adapter plate 4131 is provided with a positioning part 41312, and the second adapter plate 4132 is in limit connection with the positioning part 41312, so that the first adapter plate 4131 and the second adapter plate 4132 are convenient to install.

For example, the positioning portion 41312 includes a first positioning post 41313 and a second positioning post 41314, the first positioning post protrudes from the lower surface of the first adapter plate 4131, and the first positioning post 41313 is not located at the edge of the first adapter plate 4131. That is, a certain gap is formed between the first positioning post 41313 and the edge of the first adapter plate 4131, so as to facilitate positioning and installation of the second adapter plate 4132. The second positioning posts protrude from the lower surface of the first adapter plate 4131, and the second positioning posts 41314 are not located at the edge of the first adapter plate 4131.

In some embodiments of the utility model, the lower surface of the first adapter plate 4131 is the surface facing in the direction of the lower housing.

The second adapter plate 4132 has a first stopper 41321 and a second stopper 41322 extending inward of the emission housing 411. The second adaptor plate 4132 has a third limiting portion 41323, and the third limiting portion 41323 protrudes from the lower surface of the second adaptor plate 4132. The lower surface of the third limiting portion 41323 is flush with the lower surface of the first positioning post 41313 and the lower surface of the second positioning post 41314.

The inner wall of the first limiting portion 41321 is in contact connection with the first positioning post 41313, and the first positioning post 41313 defines the positional relationship of the first limiting portion 41321 on the first adapter plate 4131. The inner wall of the second limiting portion 41322 is in contact with the second positioning post 41314, and the second positioning post 41314 defines the positional relationship of the second limiting portion 41322 on the first adapter plate 4131. The first and second stopper portions 41321 and 41322 define the positioning of the first and second adapter plates 4131 and 4132 in the front-rear direction. The front-rear direction is the illustrated Y direction.

The side wall of one end of the third limiting portion 41323 is in contact connection with the first positioning post 41313, and the first positioning post 41313 defines the positional relationship of the second adapter plate 4132 in the X direction. The side wall at the other end of the third limiting portion 41323 is in contact connection with the second positioning column 41314, and the second positioning column 41314 defines the positional relationship of the second adaptor plate 4132 in the X direction.

The lower surface of the second adapter plate 4132 has a second low-frequency metal layer 41325, and the third limiting portion is located between the first low-frequency metal layer and the second low-frequency metal layer 41325. The upper surface of the second adapter plate 4132 has a second high-frequency metal layer 41326, and the first low-frequency metal layer is electrically connected with the second low-frequency metal layer; the first high-frequency metal layer 41311 is electrically connected to the second high-frequency metal layer 41326. The second low frequency metal layer 41325 and the second high frequency metal layer 41326 are located outside the transmit housing.

The upper surface of the circuit board is provided with a high-speed pin 305, and the high-speed pin 305 is in wire bonding connection with the second high-frequency metal layer 41326 to provide high-speed signals for the light emitting component; the lower surface of the circuit board has a low-speed pin 306, and the low-speed pin 306 is wire-bonded with the second low-frequency metal layer 41325 to provide a low-speed signal for the light emitting component.

In some embodiments of the present disclosure, the thickness of the circuit board is the same as or similar to the thickness of the second interposer 4132, so that the metal wires between the circuit board and the second interposer 4132 are reduced as much as possible, reducing losses.

The thickness of the circuit board is the same as or similar to the thickness of the second adapter plate 4132, and may be that the ratio of the thickness of the circuit board to the thickness of the second adapter plate 4132 is greater than or equal to 0.95, and the ratio of the thickness of the circuit board to the thickness of the second adapter plate 4132 is less than or equal to 1.2.

The third adapter plate 4133 surrounds the first low frequency metal layer 41324 and is in limited connection with the third adapter plate 4133. The third adapter plate 4133 includes a limiting body 41331, and a first limiting plate 41332 and a second limiting plate 41333 extending toward the inside of the transmitting housing, where the two limiting plates are located on two sides of the limiting body. The first limiting plate 41332 is in contact connection with a first positioning column, and the first positioning column defines the positional relationship of the second adapter plate 4132 in the X direction. The second stopper 41333 is in contact connection with a second positioning post defining the X-directional positional relationship of the second adapter plate 4132.

The third adapter plate 4133 is provided with a relief opening 41334, and the third limiting portion 41323 abuts against the side wall of the relief opening 41334.

Fig. 13 is an exploded view of a protective cover and a circuit board according to some embodiments of the present disclosure. As shown in fig. 5 and 13, the protective cover includes: an upper protective cover 810 and a lower protective cover 820. The upper protection cover 810 is disposed above the circuit board and covers the second high-frequency metal layer 41326 and the high-speed pins 305 to protect the metal wires between the second high-frequency metal layer 41326 and the high-speed pins 305. The lower protection cover is located below the circuit board and covers the second low-frequency metal layer 41325 and the low-speed pins 306 to protect the metal wires between the second high-frequency metal layer 41326 and the high-speed pins 305. Typically, the wire is gold wire.

The upper surface of the upper protective cover 810 is provided with a clamping part 815, and the width of the clamping part 815 is smaller than that of the upper protective cover 810 body, so that the installation and the clamping are convenient.

The upper protective cover 810 is detachably connected to the lower protective cover 820. Illustratively, the circuit board is provided with a second through hole 303 and a third through hole 304, and the lower surface of the upper protective cover 810 is provided with a third positioning column 811 and a fourth positioning column 812. The lower protective cover 820 is provided with a fourth through hole 821 and a fifth through hole 822, the third positioning column 811 passes through the second through hole 303 and the fourth through hole 821, and the fourth positioning column 812 passes through the third through hole 304 and the fifth through hole 822. The third and fourth positioning posts 811 and 820 are threaded, and the upper and lower protective covers 810 and 820 are detachably coupled by nuts.

The clamping part 813 protrudes out of the upper surface of the upper protection cover 810, the thickness of the clamping part is smaller than that of the upper protection cover 810, and the clamping devices are used for clamping two sides of the clamping part in the installation process, so that the upper protection cover 810 is prevented from sliding down from the clamping device.

Fig. 14 is a schematic view of the structure of an upper protective cover and a lower protective cover provided according to some embodiments of the present disclosure. Fig. 15 is a schematic diagram of a second structure of an upper protective cover and a lower protective cover according to some embodiments of the present disclosure. Fig. 16 is a schematic cross-sectional view of a portion of an optical module provided in accordance with some embodiments of the present disclosure. Fig. 14 and fig. 15 are schematic views of different angles. As shown in fig. 14, 15 and 16, the lower surface of the upper protection cover 810 is provided with a third positioning column 811 and a fourth positioning column 812, and the lower surface of the upper protection cover 810 is concavely provided with a first avoiding groove 814, and the first avoiding groove 814 is covered above the second high-frequency metal layer 41326 and the high-speed pin 305 to protect the metal wire between the second high-frequency metal layer 41326 and the high-speed pin 305.

The first avoiding groove 814 does not penetrate through the width direction of the upper protection cover 810, improves the compression resistance of the upper protection cover, and avoids deformation caused by extrusion of external force in the installation process of the upper protection cover, thereby affecting the product performance.

The upper surface of the lower protective cover 820 is recessed to form a second avoidance groove 823, and the second avoidance groove 823 is covered above the second low-frequency metal layer and the low-speed pins to protect metal wires between the second low-frequency metal layer and the low-speed pins.

For ease of installation, the third positioning post 811 includes: first mounting portion 8111 and second mounting portion 8112. One end of the first mounting portion 8111 is connected to the lower surface of the upper protective cap 810, and the other end is connected to the second mounting portion 8112. The cross-sectional area of the first mounting portion 8111 is larger than the cross-sectional area of the second mounting portion 8112. When mounted, the first mounting portion 8111 is inserted into the second through hole 303, and the lower surface of the upper protective cover 810 abuts against the circuit board. The second mounting portion 8112 is fitted into the fourth through hole 821.

The fourth positioning column 812 includes: third mounting portion 8121 and fourth mounting portion 8122. One end of the third mounting portion 8121 is connected to the lower surface of the upper protective cap 810, and the other end is connected to the fourth mounting portion 8122. The cross-sectional area of the third mounting portion 8121 is larger than the cross-sectional area of the fourth mounting portion 8122, and therefore a mounting step surface is provided between the third mounting portion 8121 and the fourth mounting portion 8122, and the upper surface of the lower protective cover 820 abuts against the mounting step surface. When mounted, the third mounting portion 8121 is embedded in the third through hole, and the lower surface of the upper protective cap 810 abuts against the circuit board. The fourth mounting portion 8122 is embedded in the fifth through hole.

By way of example, the second through-hole 303, the third through-hole 304, the fourth through-hole 821, and the fifth through-hole 822 may be square; the second through-hole 303, the third through-hole 304, the fourth through-hole 821, and the fifth through-hole 822 may be circular. The area of the second through hole 303 is larger than the cross-sectional area of the first mounting portion 8111, and the area of the fourth through hole 821 is larger than the cross-sectional area of the second mounting portion 8112. The area of the third through hole is larger than the cross-sectional area of the third mounting portion 8121, and the area of the fifth through hole 822 is larger than the cross-sectional area of the fourth mounting portion 8122.

The embodiment of the utility model provides an optical module, which comprises: light emitting component and circuit board. Wherein the light emitting member includes: and the light emitting assembly is positioned inside the emitting shell and is formed by the emitting shell and the emitting upper cover. The transmitting shell is provided with a first through hole, and the first through hole is connected with the optical fiber adapter. The opposite side of the first through hole is provided with a switching block which is used for connecting the circuit board and the light emitting component. And a second high-frequency metal layer is arranged on one side of the outer part of the switching block, and the second high-frequency metal layer is connected with high-frequency pins on the circuit board in a wire bonding manner. The other side of the outer part of the switching block is provided with a second low-frequency metal layer which is connected with the low-frequency pins on the circuit board in a wire bonding way. The circuit board is also provided with an upper protective cover and a lower protective cover, the upper protective cover and the lower protective cover are respectively positioned at two sides of the circuit board, and the upper protective cover and the lower protective cover are detachably connected. The upper protective cover is provided with a first avoidance groove, the second high-frequency metal layer and the high-frequency pins are positioned in the first avoidance groove, and the first avoidance groove is used for protecting a metal wire between the second high-frequency metal layer and the high-frequency pins. The outside of the emission casing is provided with a convex strip, the lower surface of the convex strip is fixedly connected with the upper surface of the circuit board, and the positioning and the installation of the emission casing and the circuit board are realized. And the second high-frequency metal layer is connected with the high-frequency pins by gold wires, so that the impedance between the circuit board and the light emitting component is reduced, and the communication rate is improved.

Since the foregoing embodiments are all described in other modes by reference to the above, the same parts are provided between different embodiments, and the same and similar parts are provided between the embodiments in the present specification. And will not be described in detail herein.

It should be noted that in this specification, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the statement "comprises" or "comprising" a … … "does not exclude that an additional identical element is present in a circuit structure, article or apparatus that comprises the element.

Other embodiments of the utility model will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure of the utility model. This utility model is intended to cover any variations, uses, or adaptations of the utility model following, in general, the principles of the utility model and including such departures from the present disclosure as come within known or customary practice within the art to which the utility model pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the utility model being indicated by the following claims. The embodiments of the present utility model described above do not limit the scope of the present utility model.

Claims (10)

1. An optical module, comprising:

the circuit board is provided with a first avoidance hole, and the upper surface of the circuit board is provided with a high-frequency pin;

the light emitting component is positioned in the first avoidance hole;

the light emitting member includes:

a transmitting upper cover;

a transmitting shell, which is provided with an opening at one side, is formed with the transmitting upper cover;

the light emitting assembly is positioned inside the emitting shell and is hoisted on the inner wall of the emitting upper cover;

the switching block is positioned at the opening; the adapter block is provided with a first high-frequency metal layer, the first high-frequency metal layer is positioned in the emission shell, and the first high-frequency metal layer is electrically connected with the light emission assembly;

the transfer block is provided with a second high-frequency metal layer, and is positioned outside the transmitting shell, and the second high-frequency metal layer is connected with the high-frequency pin in a wire bonding manner;

the second high-frequency metal layer is electrically connected with the first high-frequency metal layer;

the upper protection cover is positioned on one side of the circuit board, the lower surface of the upper protection cover is sunken to form a first avoidance groove, and the second high-frequency metal layer and the high-frequency pin are positioned in the first avoidance groove;

the lower protection cover is positioned on the opposite side of the upper protection cover, and the upper protection cover is detachably connected with the lower protection cover.

2. The optical module of claim 1, wherein the circuit board further has a low frequency pin located opposite the high frequency pin;

the transfer block is provided with a second low-frequency metal layer, and the second low-frequency metal layer is connected with the low-frequency pin in a wire bonding manner;

the upper surface of the lower protective cover is sunken to form a second avoidance groove, and the second low-frequency metal layer and the low-frequency pins are positioned in the second avoidance groove.

3. The optical module according to claim 1, wherein a lower surface of the upper protective cover is provided with a third positioning column and a fourth positioning column;

the lower protective cover is provided with a fourth through hole and a fifth through hole;

the circuit board is provided with a second through hole and a third through hole;

the third positioning column is embedded into the second through hole and the fourth through hole; the fourth positioning column is embedded into the third through hole and the fifth through hole.

4. A light module as recited in claim 3, wherein the third positioning column comprises: a first mounting portion and a second mounting portion;

the first mounting part is positioned between the lower surface of the upper protective cover and the second mounting part, and the sectional area of the first mounting part is larger than that of the second mounting part;

the first mounting portion is embedded in the second through hole, and the second mounting portion is embedded in the fourth through hole.

5. A light module as recited in any one of claims 1-3, wherein the upper protective cover is provided with a clip portion which protrudes from an upper surface of the upper protective cover.

6. The optical module according to claim 1 or 2, wherein the adapter block comprises: the first adapter plate, the second adapter plate and the third adapter plate;

the second adapter plate is positioned between the first adapter plate and the third adapter plate;

the lower surface of the first adapter plate is provided with a first high-frequency metal layer; the second adapter plate does not cover the first high-frequency metal layer;

the upper surface of the second adapter plate is provided with a second high-frequency metal layer, and the lower surface of the second adapter plate is provided with a second low-frequency metal layer.

7. The light module of claim 6 wherein the lower surface of the first adapter plate is provided with a first positioning post and a second positioning post;

the second adapter plate is provided with a first limiting part, a second limiting part and a third limiting part, the first limiting part and the second limiting part extend towards the inside of the emission shell, and the third limiting part protrudes out of the lower surface of the second adapter plate;

the lower surface of the second adapter plate is provided with a first low-frequency metal layer and a second low-frequency metal layer, and the upper surface of the second adapter plate is provided with a second high-frequency metal layer;

the inner wall of the first limiting part is in contact connection with the first positioning column;

the inner wall of the second limiting part is in contact connection with the second positioning column;

the side wall at one end of the third limiting part is in contact connection with the first positioning column; the side wall at the other end of the third limiting part is in contact connection with the second positioning column.

8. The optical module according to claim 7, wherein the third adapter plate is provided with an avoidance opening, and the third limiting portion abuts against a side wall of the avoidance opening;

the third adapter plate is located between the first low-frequency metal layer and the second low-frequency metal layer.

9. The optical module of claim 1, wherein the outer wall of the emission housing is provided with a protrusion, and a lower surface of the protrusion is connected to an upper surface of the circuit board.

10. The light module of claim 9 wherein the ribs comprise a first rib and a second rib;

the first raised strips are symmetrically arranged on two sides of the emission shell respectively.