CN114624826B - Optical module - Google Patents
Optical module Download PDFInfo
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- CN114624826B CN114624826B CN202011466259.7A CN202011466259A CN114624826B CN 114624826 B CN114624826 B CN 114624826B CN 202011466259 A CN202011466259 A CN 202011466259A CN 114624826 B CN114624826 B CN 114624826B
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- circuit board
- optical module
- electrically connected
- flexible circuit
- speed signal
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4278—Electrical aspects related to pluggable or demountable opto-electronic or electronic elements
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The application discloses an optical module, which comprises a first circuit board, wherein a golden finger is arranged on the surface of one end of the first circuit board, a first high-speed signal bonding pad is arranged on the upper surface of the other end of the first circuit board, and a second high-speed signal bonding pad is arranged on the lower surface of the other end of the first circuit board; the second circuit board is arranged above the first circuit board, is electrically connected with the first circuit board, and is provided with a non-high-speed signal bonding pad on the surface; the light emitting device is arranged above the first circuit board and is electrically connected with the first flexible circuit board and the second flexible circuit board respectively; the light receiving device is arranged below the light emitting device and is electrically connected with the third flexible circuit board; one end of the first flexible circuit board is electrically connected with the light emitting device, and the other end of the first flexible circuit board is electrically connected with the non-high-speed signal bonding pad; one end of the second flexible circuit board is electrically connected with the light emitting device, and the other end of the second flexible circuit board is electrically connected with the first high-speed signal bonding pad; and one end of the third flexible circuit board is electrically connected with the light receiving device, and the other end of the third flexible circuit board is electrically connected with the second high-speed signal bonding pad.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to an optical module.
Background
In the novel business and application modes of cloud computing, mobile internet, video and the like, an optical communication technology is used, and in optical communication, an optical module is a tool for realizing the interconversion of photoelectric signals and is one of key devices in optical communication equipment. The optical module is mainly used for photoelectric and electro-optical conversion, wherein a transmitting end of the optical module converts an electric signal into an optical signal and transmits the optical signal out through an optical fiber, and a receiving end of the optical module converts a received optical signal into an electric signal.
Disclosure of Invention
The application provides an optical module to solve the problem of miniaturization development of the optical module.
The application discloses an optical module, which comprises a first circuit board, wherein a golden finger is arranged on the surface of one end of the first circuit board, a first high-speed signal bonding pad is arranged on the upper surface of the other end of the first circuit board, and a second high-speed signal bonding pad is arranged on the lower surface of the other end of the first circuit board; the second circuit board is arranged above the first circuit board, is electrically connected with the first circuit board, and is provided with a non-high-speed signal bonding pad on the surface; the light emitting device is arranged above the first circuit board and is electrically connected with the first flexible circuit board and the second flexible circuit board respectively; the light receiving device is arranged below the light emitting device and is electrically connected with the third flexible circuit board; one end of the first flexible circuit board is electrically connected with the light emitting device, and the other end of the first flexible circuit board is electrically connected with the non-high-speed signal bonding pad; one end of the second flexible circuit board is electrically connected with the light emitting device, and the other end of the second flexible circuit board is electrically connected with the first high-speed signal bonding pad; and one end of the third flexible circuit board is electrically connected with the light receiving device, and the other end of the third flexible circuit board is electrically connected with the second high-speed signal bonding pad.
The second circuit board is arranged above the first circuit board, the area of the circuit board layout is expanded by utilizing the height space of the optical module through the stacking arrangement between the first circuit board and the second circuit board, the light receiving device is arranged below the light emitting device, and the layout volume of the device is expanded by utilizing the height space of the optical module through the stacking arrangement between the light emitting device and the light receiving device; the second flexible circuit board is adopted to establish high-speed signal electric connection from the first circuit board to the light emitting device, the third flexible circuit board is adopted to establish high-speed signal electric connection from the first circuit board to the light receiving device, a high-speed signal path can be directly established outwards through a gold finger on the first flexible circuit board, the transfer of high-speed signals is reduced, the low-loss transmission of the high-speed signals is facilitated, the first flexible circuit board is adopted to establish non-high-speed signal electric connection from the second circuit board to the light emitting device, and the number of connecting pins is enough for the light emitting device.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal;
fig. 2 is a schematic diagram of an optical network terminal structure;
fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present application;
fig. 5 is a schematic view of a partial structure of an optical module provided in an embodiment of the present application;
fig. 6 is an exploded schematic view of a partial structure of an optical module according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a light emitting device and a light receiving device provided in an embodiment of the present application;
fig. 8 is a side view of a partial structure of a light module provided in an embodiment of the present application;
fig. 9 is an enlarged view of a partial structure of an optical module provided in the embodiment of the present application;
fig. 10 is a schematic view of a partial structure of a lower housing of an optical module according to an embodiment of the present application;
fig. 11 is a schematic view of a partial structure of an upper housing of an optical module according to an embodiment of the present application;
fig. 12 is a schematic cross-sectional view of a housing of an optical module provided in an embodiment of the present application;
fig. 13 is a cross-sectional view of a partial structure of a circuit board according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.
The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the optical module realizes optical connection with external optical fibers through an optical interface, and the external optical fibers have various connection modes, so that various optical fiber connector types are derived; the method is characterized in that the gold fingers are used for realizing electric connection at an electric interface, and the electric connection becomes a mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of pins on the gold fingers forms various industry protocols/specifications; the optical connection mode realized by adopting the optical interface and the optical fiber connector has become the mainstream connection mode in the optical module industry, on the basis of the mainstream connection mode, the optical fiber connector also forms various industrial standards, such as an LC interface, an SC interface, an MPO interface and the like, the optical interface of the optical module also has adaptive structural design aiming at the optical fiber connector, and the optical fiber adapters arranged at the optical interface have various types.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;
one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.
An optical interface of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; the electrical interface of the optical module 200 is externally connected to the optical network terminal 100, and establishes a bidirectional electrical signal connection with the optical network terminal 100; bidirectional interconversion of optical signals and electric signals is realized inside the optical module, so that information connection is established between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber 101.
The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal has a network cable interface 104, which is used for accessing the network cable 103 and establishing a bidirectional electrical signal connection (generally, an electrical signal of an ethernet protocol, which is different from an electrical signal used by an optical module in protocol/type) with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits a signal from the network cable to the optical module, and the optical network terminal is used as an upper computer of the optical module to monitor the operation of the optical module. The optical network terminal is an upper computer of the optical module, provides data signals for the optical module and receives the data signals from the optical module, and a bidirectional signal transmission channel is established between the remote server and the local information processing equipment through the optical fiber, the optical module, the optical network terminal and a network cable.
Common local information processing apparatuses include routers, home switches, electronic computers, and the like; common optical network terminals include an optical network unit ONU, an optical line terminal OLT, a data center server, a data center switch, and the like.
Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electrical connector is arranged in the cage 106 and used for accessing an electrical interface (such as a gold finger) of the optical module; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.
The optical module 200 is inserted into an optical network terminal, the electrical interface of the optical module is inserted into the electrical connector inside the cage 106, and the optical interface of the optical module is connected to the optical fiber 101.
The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, the optical module is held by the cage, and heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.
Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is an exploded schematic view of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, a light emitting device 500, and a light receiving device 400;
the upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.
The two openings may be two openings (204, 205) located at the same end of the optical module, or two openings located at different ends of the optical module; one of the openings is an electrical interface 204, and a gold finger of the circuit board extends out of the electrical interface 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical interface 205 where a fiber optic adapter inside the optical module is located for connection with an external fiber optic connector (external fiber); the photoelectric devices such as the circuit board 300, the light emitting device 500 and the light receiving device 400 are located in the package cavity.
The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the light emitting device 500, the light receiving device 400 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form an outermost packaging protection shell of the optical module; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, and the integrated housing is not beneficial to the assembly of devices in the housing.
The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202 and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.
The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.
The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).
The circuit board connects electrical appliances in the optical module together according to circuit design through circuit wiring to realize power supply, electrical signal transmission, grounding and other electrical functions.
The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.
A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device by using the flexible circuit board.
Fig. 5 is a schematic diagram of a partial structure of an optical module provided in an embodiment of the present application, and fig. 6 is an exploded schematic diagram of a partial structure of an optical module provided in an embodiment of the present application. As shown in fig. 5 and fig. 6, in the optical module provided in the embodiment of the present application, the circuit board includes a first circuit board 301 and a second circuit board 302, and the first circuit board 301 and the second circuit board 302 are electrically connected to each other, and the first circuit board 301 supplies power to the second circuit board 302.
A golden finger 303 is arranged at the end part of the first circuit board 301, and is inserted into an upper computer outside the optical module, so that power supply and signals required by the operation of the optical module are obtained from the upper computer; the other end of the flexible printed circuit board is connected with the flexible printed circuit board;
a second circuit board 302 stacked on the first circuit board 301 and located above the first circuit board 301; the stacking arrangement utilizes the height space in the shell of the optical module, and the second circuit board is additionally arranged to increase the wiring area, so that more electric devices can be arranged in the optical module, and a design space is provided for the distribution of the electric devices. The second circuit board is electrically connected with the first circuit board, and the first circuit board supplies power and provides signals for the second circuit board. The end of the second circuit board is connected with the flexible circuit board.
In the optical module provided by the embodiment of the present application, the light receiving device 400 and the light emitting device 500 are disposed in a stacked manner, and the light receiving device 400 and the light emitting device 500 are respectively connected to the flexible circuit boards and are respectively connected to the surface of the first circuit board and the surface of the second circuit board. The flexible circuit board includes a first flexible circuit board 601, a second flexible circuit board 602, and a third flexible circuit board 603.
The light receiving device 400 is provided with a light receiving chip and a receiving optical element in an internal cavity, the receiving light is transmitted to the light receiving chip through the receiving optical element, the light receiving chip converts an optical signal into an electrical signal, the electrical signal is a high-speed signal, the high-speed signal is transmitted to the first circuit board through the third flexible circuit board, and the first circuit board externally transmits the electrical signal to the upper computer.
A light emitting device 500 having a light emitting chip and an emitting optical element disposed in an inner cavity thereof, wherein light emitted from the light emitting chip is transmitted to an external optical fiber of the optical module through the emitting optical element; the high-speed signal from the upper computer is connected into the first circuit board, the first circuit board transmits the high-speed signal to the light emitting device through the second flexible circuit board, and the light emitting chip converts the high-speed signal into an optical signal.
The high-speed signals mainly refer to high-speed signals transmitted between the first circuit board and the second flexible circuit board and between the first circuit board and the third flexible circuit board; on the first circuit board, the high-speed signal can be processed by a plurality of electric devices, and the concrete form of the high-speed signal can be changed.
A first flexible circuit board 601 having one end connected to the light emitting device 500 and the other end connected to the upper surface of the second circuit board 302;
a second flexible circuit board 602 having one end connected to the light emitting device 500 and the other end connected to the upper surface of the first circuit board 301;
the third flexible circuit board 603 has one end connected to the light receiving device 400 and the other end connected to the lower surface of the first circuit board 301.
Fig. 7 is a schematic structural diagram of a light emitting device and a light receiving device provided in an embodiment of the present application. As shown in fig. 7, the end of the light emitting device 500 is provided with a pin connector 501, the upper surface of the pin connector 501 is connected to the first flexible circuit board 601, and the lower surface of the pin connector 501 is connected to the second flexible circuit board 602. The end of the light emitting device 500 is provided with a notch into which a pin connector is inserted for electrical connection between the inside and the outside of the light emitting device. Since many electrical pins are required inside the light emitting device, the first flexible circuit board 601 is connected to the upper surface of the pin connector 501 and the second flexible circuit board 602 is connected to the lower surface of the pin connector 501 by using the upper surface and the lower surface of the pin connector at the same time. The end of the light receiving device 400 is provided with an opening 401, and the third flexible circuit board 603 extends into the light receiving device 400 through the opening 401, for realizing electrical connection between the inside and the outside of the light receiving device.
Fig. 8 is a side view of a partial structure of an optical module according to an embodiment of the present application, and fig. 9 is an enlarged view of a partial structure of the optical module according to the embodiment of the present application. As shown in fig. 8 and 9, since the second circuit board 302 and the first circuit board 301 are stacked up and down, the light emitting device 500 and the light receiving device 400 are stacked up and down, and the first flexible circuit board 601, the second flexible circuit board 602, and the third flexible circuit board 603, which achieve an electrical connection function between the circuit boards and the devices, are also stacked up and down. The first flexible circuit board 601 is located at the uppermost layer, the second flexible circuit board 602 is located at the middle layer, and the third flexible circuit board 603 is located at the lowermost layer.
The first circuit board 301 is directly electrically connected with an upper computer outside the optical module, and is a direct component for high-speed signal interaction between the optical module and the upper computer; the high-speed signal requires to provide a low-loss transmission mode, and a second circuit board connected with the first circuit board is used for transmitting the high-speed signal, so that the transmission mode is not good;
the high-speed signal is finally transmitted to a light emitting driving chip or a light emitting chip in the light emitting device 500, the high-speed signal received and converted by the light receiving device is finally transmitted to an upper computer outside the optical module, and the first circuit board 301 is electrically connected with the high-speed signal of the light emitting device and the high-speed signal of the light receiving device respectively according to the requirement of the high-speed signal transmission mode, and the second circuit board 302 is not used for electrically connecting the high-speed signal of the light emitting device and the high-speed signal of the light receiving device respectively.
The traces for transmitting the high-speed signals are disposed on the surface of the first circuit board 301, and the high-speed signal traces may be disposed on the upper surface and the lower surface of the first circuit board 301, respectively, so as to prevent the high-speed signal traces from using via holes to transit in the first circuit board 301.
The first high-speed signal bonding pad is electrically connected with the golden finger on the upper surface of the circuit board through the upper surface of the first circuit board; the second high-speed signal pad is electrically connected with the golden finger on the lower surface of the circuit board through the lower surface of the first circuit board.
The number of electric devices provided in the light emitting device 500 is large, and the number of signal lines externally connected thereto is larger than that of the light receiving device 400, so that two layers of flexible circuit boards are used for connection with the circuit board, and the light receiving device 400 may be connected with the circuit board using one layer of flexible circuit board.
In consideration of the above wiring design requirement and the overall space utilization of the optical module, the first circuit board and the second circuit board are stacked, as shown in fig. 8, the first circuit board 301 is located below the second circuit board 302; the light receiving device and the light emitting device are stacked, and as shown in fig. 8, the light receiving device 400 is located below the light emitting device 500;
the upper surface of the first circuit board 301 and the upper surface of the second circuit board 302 are used to be connected to the light emitting device 500, respectively, and the lower surface of the first circuit board 301 is used to be connected to the light receiving device 400.
A first high-speed signal pad is arranged at the end part of the upper surface of the first circuit board 301; one end of the second flexible circuit board 602 is connected to the first high-speed signal pad, and the other end is connected to the lower surface of the pin connector 501 of the light emitting device 500;
a second high-speed signal pad is arranged at the end part of the lower surface of the first circuit board 301; one end of the third flexible circuit board 603 is connected to the second high-speed signal pad, and the other end is connected to the inside of the light receiving device 400.
Since the airtightness requirement of the light emitting device 500 is higher than that of the light receiving device 400, the flexible circuit board may directly protrude into the light receiving device 400, but may not directly protrude into the light emitting device 500.
The upper surface of the second circuit board 302 is provided with a non-high-speed signal pad; one end of the first flexible circuit board 601 is connected to the non-high-speed signal pad, and the other end is connected to the upper surface of the pin connector 501 of the light emitting device 500; optionally, the lower surface of the second circuit board 302 is provided with a non-high-speed signal pad, and one end of the first flexible circuit board may be further connected to the lower surface of the second circuit board 302.
The second circuit board is arranged above the first circuit board, the area of the circuit board layout is expanded by utilizing the height space of the optical module through the stacking arrangement between the first circuit board and the second circuit board, the light receiving device is arranged below the light emitting device, and the layout volume of the device is expanded by utilizing the height space of the optical module through the stacking arrangement between the light emitting device and the light receiving device; the second flexible circuit board is adopted to establish high-speed signal electric connection from the first circuit board to the light emitting device, the third flexible circuit board is adopted to establish high-speed signal electric connection from the first circuit board to the light receiving device, a high-speed signal path can be directly established outwards through the gold fingers on the first flexible circuit board, the transfer of high-speed signals is reduced, the low-loss transmission of the high-speed signals is facilitated, the first flexible circuit board is adopted to establish non-high-speed signal electric connection from the second circuit board to the light emitting device, and the number of connecting pins is enough for the light emitting device.
Fig. 10 is a partial structural schematic view of an optical module lower housing provided in the embodiment of the present application. As shown in fig. 10, a groove 2021 is formed on an edge side plate of the optical module lower case 202. The edge curb plate of casing buckles relatively the mainboard of casing down, and the edge curb plate is towards last casing, links up with last casing in order to form the lateral wall of whole optical module, and the unblock part setting of optical module is in the outside of edge curb plate. The edge side plate is recessed toward the surface of the upper case to form a groove 2021. The trend of the edge side plates can be a straight line or a bent line.
Fig. 11 is a partial structural schematic diagram of an upper housing of an optical module according to an embodiment of the present application. As shown in fig. 11, the bottom surface of the upper case 201 is provided with a heat dissipation block 2012, and the edge side wall of the upper case 201 is provided with a protrusion 2011, and when the edge side wall of the upper case is combined with the edge side wall of the lower case, the protrusion 2011 of the upper case is inserted into the groove 2021 of the lower case.
Fig. 12 is a schematic cross-sectional view of a housing of an optical module provided in an embodiment of the present application. As shown in fig. 12, the upper case 201 and the lower case 202 are formed into a cross section in a joined state, the edge side wall of the upper case 201 is abutted against the edge side plate of the lower case 202, and the protrusion 2011 on the edge side wall of the upper case is inserted into the groove 2021 on the edge side plate of the lower case 202.
The upper shell and the lower shell of the optical module are combined to form a wrapping cavity, and the wrapping cavity has an electromagnetic shielding effect. The packaging cavity comprises the butt joint of the edge side wall of the upper shell 201 and the edge side plate of the lower shell 202, and the butt joint of the plane and the plane often has a gap, so that electromagnetic waves can pass through the gap and the requirement of electromagnetic shielding cannot be met; the gap can be blocked by the matching of the protrusion and the groove.
As shown in fig. 11, the protrusions are a plurality of protrusions spaced apart from each other, and although there is a space between the protrusions, the space can achieve an effect of blocking electromagnetic waves.
Fig. 13 is a cross-sectional view of a partial structure of a circuit board according to an embodiment of the present application. As shown in fig. 13, a chip 3011 is disposed between the first circuit board 301 and the second circuit board 302, and the chip 3011 is disposed on the surface of the first circuit board 301. In order to dissipate heat from the chip 3011, the second circuit board 302 is provided with a through hole 3021, and the heat dissipation block 2012 on the bottom surface of the upper case in fig. 11 can directly contact with the chip 3011 through the through hole 3021 in a heat conducting manner, so that the chip 3011 can dissipate heat through the heat conduction block and the upper case.
The heat conduction contact can be direct contact, and a heat conduction cushion can also be arranged between the chip and the heat conduction block to realize indirect contact; the cushion may act as a soft cushion to protect the chip 3011.
It should be noted that, in the present specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the statement "comprises a" \8230; "8230;" defines an element and does not exclude the presence of additional like elements in circuit structures, articles, or devices comprising the element.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
The above embodiments of the present application do not limit the scope of the present application.
Claims (7)
1. An optical module, characterized by comprising
The device comprises a first circuit board, a second circuit board and a third circuit board, wherein a golden finger is arranged on the surface of one end of the first circuit board, a first high-speed signal bonding pad is arranged on the upper surface of the other end of the first circuit board, and a second high-speed signal bonding pad is arranged on the lower surface of the other end of the first circuit board;
the second circuit board is arranged above the first circuit board, is electrically connected with the first circuit board, and is provided with a non-high-speed signal bonding pad on the surface;
the light emitting device is arranged above the first circuit board and is electrically connected with the first flexible circuit board and the second flexible circuit board respectively;
the light receiving device is arranged below the light emitting device and is electrically connected with the third flexible circuit board;
one end of the first flexible circuit board is electrically connected with the light emitting device, and the other end of the first flexible circuit board is electrically connected with the non-high-speed signal bonding pad;
one end of the second flexible circuit board is electrically connected with the light emitting device, and the other end of the second flexible circuit board is electrically connected with the first high-speed signal bonding pad;
one end of the third flexible circuit board is electrically connected with the light receiving device, and the other end of the third flexible circuit board is electrically connected with the second high-speed signal bonding pad; the light emitting device and the light receiving device are arranged in a stacked mode, a pin connector is arranged at the tail end of the light emitting device, the first flexible circuit board is electrically connected with the upper surface of the pin connector, and the second flexible circuit board is electrically connected with the lower surface of the pin connector.
2. The optical module of claim 1, wherein the first high speed signal pads establish electrical connection with gold fingers on the upper surface of the first circuit board through the upper surface of the first circuit board; and the second high-speed signal bonding pad is electrically connected with the golden finger on the lower surface of the first circuit board through the lower surface of the first circuit board.
3. The optical module according to claim 1, further comprising an upper case provided with a heat conduction block on a bottom surface thereof facing the second circuit board; the surface of the second circuit board is provided with a through hole, the surface of the first circuit board facing the second circuit board is provided with a chip, and the surface of the chip is in heat conduction contact with the heat conduction block through the through hole.
4. The optical module according to claim 1, comprising an upper housing and a lower housing, wherein a protrusion is disposed on a side wall of an edge of the upper housing, and a groove is formed on a side plate of an edge of the lower housing, and the protrusion is inserted into the groove.
5. The light module as claimed in claim 4, wherein said protrusion is a plurality of protrusions spaced from each other.
6. The optical module according to claim 1, wherein an end of the light receiving device is provided with an opening, and the third flexible circuit board extends into the light receiving device through the opening for electrical connection between the inside and the outside of the light receiving device.
7. The optical module of claim 1, wherein the first circuit board and the second circuit board are connected by a pin electrical connector or a plug electrical connector.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011466259.7A CN114624826B (en) | 2020-12-14 | 2020-12-14 | Optical module |
| PCT/CN2021/134678 WO2022127593A1 (en) | 2020-12-14 | 2021-12-01 | Optical module |
| US18/331,933 US20230314741A1 (en) | 2020-12-14 | 2023-06-09 | Optical Module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011466259.7A CN114624826B (en) | 2020-12-14 | 2020-12-14 | Optical module |
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| CN114624826A CN114624826A (en) | 2022-06-14 |
| CN114624826B true CN114624826B (en) | 2023-04-07 |
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| WO2024032004A1 (en) * | 2022-08-12 | 2024-02-15 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111751940A (en) * | 2020-06-19 | 2020-10-09 | 河北华美光电子有限公司 | High-speed optical module |
| CN212086203U (en) * | 2020-05-22 | 2020-12-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4940628B2 (en) * | 2005-10-31 | 2012-05-30 | ソニー株式会社 | Optical transmission module, optical transmission / reception module, and optical communication device |
| JP5839274B2 (en) * | 2011-11-11 | 2016-01-06 | 日立金属株式会社 | Optical module |
| CN104503044B (en) * | 2014-12-31 | 2016-08-24 | 苏州旭创科技有限公司 | Optical module |
| JP2016197634A (en) * | 2015-04-02 | 2016-11-24 | 日立金属株式会社 | Optical module |
| CN210093667U (en) * | 2019-05-24 | 2020-02-18 | 宁波东立创芯光电科技有限公司 | Connection structure of rigid plate and flexible plate, circuit board and optical module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212086203U (en) * | 2020-05-22 | 2020-12-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN111751940A (en) * | 2020-06-19 | 2020-10-09 | 河北华美光电子有限公司 | High-speed optical module |
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