WO2024032004A1

WO2024032004A1 - Optical module

Info

Publication number: WO2024032004A1
Application number: PCT/CN2023/084327
Authority: WO
Inventors: 迟亚勋; 潘红超; 王力; 司宝峰
Original assignee: 青岛海信宽带多媒体技术有限公司
Priority date: 2022-08-12
Filing date: 2023-03-28
Publication date: 2024-02-15

Abstract

An optical module (200), comprising circuit boards (301, 302) and an optical transceiving component (400). A first circuit board (301) is connected to a second circuit board (302) by means of a fixing support (500), and positioning holes (3011, 3012) are respectively formed in the first circuit board (301) and the second circuit board (302). The optical transceiving component (400) is connected to the first circuit board (301) by means of a flexible circuit board (304). The flexible circuit board (304) comprises a connecting flexible circuit board (3041) and sub-flexible circuit boards (3042, 3043). The fixing support (500) comprises a positioning column (502) and a support column (503). The positioning column (502) is fitted in the positioning holes (3011, 3012), is provided with a limiting protrusion (50212), and comprises first, second, third, and fourth sub-positioning columns (5021, 5022, 5023, 5024). The support column (503) is connected to the lower surface of the first circuit board (301). The limiting protrusion (50212) is connected to the upper surface of the second circuit board (302). The vertical distance between the first sub-positioning column (5021) and the optical transceiving component (400) is less than the vertical distance between the third sub-positioning column (5023) and the optical transceiving component (400), and the vertical distance between the second sub-positioning column (5022) and the optical transceiving component (400) is less than the vertical distance between the fourth sub-positioning column (5024) and the optical transceiving component (400). The first circuit board (301) and the second circuit board (302) are fixed by means of the fixing support (500), thereby facilitating assembly of the optical module (200).

Description

Optical module

This application claims priority with application number 202210967208.5 submitted to the China Patent Office on August 12, 2022; priority with application number 202222129012.7 submitted to the China Patent Office on August 12, 2022; on August 12, 2022 Priority is filed with the Chinese Patent Office with application number 202222131199.4, the entire content of which is incorporated into this application by reference.

Technical field

The present disclosure relates to the field of communication technology, and in particular, to an optical module.

Background technique

With the development of new services and application models such as cloud computing, mobile Internet, and video, the progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing mutual conversion of photoelectric signals and are one of the key components in optical communication equipment. With the development of optical communication technology, the transmission rate of optical modules is required to continue to increase.

Contents of the invention

Some embodiments of the present disclosure provide an optical module. The optical module includes a circuit board, a first optical transceiver component and a second optical transceiver component. The circuit board includes a first circuit board and a second circuit board. The first circuit board has a first positioning hole. The second circuit board is electrically connected to the first circuit board. The second circuit board has a second positioning hole. The second positioning hole is arranged corresponding to the first positioning hole. The fixing bracket is configured to fix the first circuit board and the second circuit board. The fixed frame includes a base, a positioning column and a supporting column. The base is provided with a first fixing plate and a third fixing plate that are oppositely arranged. The support column is connected to the lower surface of the first circuit board, and the support column is configured to support the first circuit board. The positioning post is arranged corresponding to the second positioning hole. The positioning post is clamped at the first positioning hole and the second positioning hole. An end of the positioning post away from the first circuit board has a limiting protrusion. The limiting protrusion is connected to the upper surface of the second circuit board, and the limiting protrusion is configured to limit the position of the second circuit board. Wherein, the positioning column includes a first sub-positioning column, a second sub-positioning column, a third sub-positioning column and a fourth sub-positioning column. The first sub-positioning post and the second sub-positioning post are both arranged on the first fixed plate. The third sub-positioning post and the fourth sub-positioning post are both arranged on the third fixed plate. The vertical distance between the first sub-positioning post and the first optical transceiver component is smaller than the vertical distance between the third sub-positioning post and the first optical transceiver component. The vertical distance between the second sub-positioning post and the first optical transceiver component is smaller than the vertical distance between the second sub-positioning post and the first optical transceiver component. The vertical distance from the first optical transceiver component. The first optical transceiver component is connected to the lower surface of the first circuit board through the second flexible circuit board. Wherein, the second flexible circuit board includes a first sub-flexible circuit board, a second sub-flexible circuit board and a first connecting flexible circuit board. The first end of the first sub-flexible circuit board is connected to the light emitting component of the first optical transceiver component. The first end of the second sub-flexible circuit board is connected to the light receiving component of the first optical transceiver component, and the second sub-flexible circuit board is not connected to the first sub-flexible circuit board. The first end of the first connecting flexible circuit board is connected to the second end of the first sub-flexible circuit board and the second sub-flexible circuit board respectively, and the second end of the first connecting flexible circuit board is connected to the lower surface of the first circuit board. . The second optical transceiver component is arranged in parallel with the first optical transceiver component. The second optical transceiver component is connected to the upper surface of the first circuit board through a third flexible circuit board. Wherein, the third flexible circuit board includes a third sub-flexible circuit board, a fourth sub-flexible circuit board and a second connection flexible circuit board. The first end of the third sub-flexible circuit board is connected to the light emitting component of the second optical transceiver component. The first end of the fourth sub-flexible circuit board is connected to the light receiving component of the second optical transceiver component. The fourth sub-flexible circuit board is not connected to the third sub-flexible circuit board. The fourth sub-flexible circuit board is located on the third sub-flexible circuit. between the board and the second flexible circuit board. The first end of the second connecting flexible circuit board is connected to the second end of the third sub-flexible circuit board and the fourth sub-flexible circuit board respectively, and the second end of the second connecting flexible circuit board is connected to the upper surface of the first circuit board. .

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required to be used in some embodiments of the present disclosure will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of the present disclosure.

Figure 1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

Figure 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure;

Figure 5 is an assembly diagram of an optical transceiver component, a circuit board and a fixing frame from one perspective according to some embodiments of the present disclosure;

Figure 6 is an assembly diagram of the optical transceiver component, circuit board and fixing bracket provided according to some embodiments of the present disclosure from another perspective;

Figure 7 is an exploded view of an optical transceiver component, a circuit board and a fixing frame provided according to some embodiments of the present disclosure;

Figure 8 is a structural diagram of a second flexible circuit board provided according to some embodiments of the present disclosure;

Figure 9 is a structural diagram of a third flexible circuit board provided according to some embodiments of the present disclosure;

Figure 10 is an assembly diagram of a circuit board and a fixing bracket from one perspective according to some embodiments of the present disclosure;

Figure 11 is an assembly diagram of a circuit board and a fixing bracket from another perspective according to some embodiments of the present disclosure;

Figure 12 is an assembly diagram of a fixing bracket and a first circuit board provided according to some embodiments of the present disclosure;

Figure 13 is an exploded view of a circuit board and a fixing bracket provided according to some embodiments of the present disclosure;

Figure 14 is a structural diagram of a first circuit board provided according to some embodiments of the present disclosure;

Figure 15 is a structural diagram of a second circuit board provided according to some embodiments of the present disclosure;

Figure 16 is a structural diagram of a fixed frame provided according to some embodiments of the present disclosure;

Figure 17 is an assembly diagram of an upper housing, an optical transceiver component, a circuit board and a fixing frame provided according to some embodiments of the present disclosure;

Figure 18 is an assembly diagram of the upper housing and the first circuit board provided according to some embodiments of the present disclosure;

Figure 19 is a structural diagram of an upper housing provided from one perspective according to some embodiments of the present disclosure;

Figure 20 is an assembly diagram of an upper housing and an unlocking component according to some embodiments of the present disclosure;

Figure 21 is a structural diagram of the upper housing provided according to some embodiments of the present disclosure from another perspective;

Figure 22 is a cross-sectional view of an optical module provided according to some embodiments of the present disclosure;

Figure 23 is a structural diagram of an unlocking component provided according to some embodiments of the present disclosure;

Figure 24 is a structural diagram of an unlocking handle provided according to some embodiments of the present disclosure;

Figure 25 is a structural diagram of an unlocker provided according to some embodiments of the present disclosure from one perspective;

Figure 26 is a structural diagram of an unlocker provided according to some embodiments of the present disclosure from another perspective.

Detailed ways

Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to realize the transmission of information. Light loaded with information is an optical signal. The propagation of optical signals in information transmission equipment can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. The information that information processing equipment can process exists in the form of electrical signals. Optical network terminals/gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing equipment. Optical fibers and optical waveguides are common information processing equipment. transmission device.

The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is achieved through optical modules. For example, an optical fiber is connected to the optical signal input end and/or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and/or the electrical signal output end of the optical module; the first optical signal transmission from the optical fiber Entering the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, and the optical module transmits the second electrical signal into the optical module. The electrical signal is converted into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing equipment can be connected to each other through electrical signal networks, at least one type of information processing equipment needs to be directly connected to the optical module. It is not required that all types of information processing equipment are directly connected to the optical module. The information of the optical module is directly connected. The processing equipment is called the host computer of the optical module.

Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system is partially represented by a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101 and a network cable 103.

One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can undergo total reflection in the optical fiber 101. The propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes total reflection multiple times in the optical fiber 101 and will come from the direction of the remote information processing device 1000. The optical signal is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000 to realize long-distance information transmission with low power loss.

The number of optical fibers 101 may be one or multiple (two or more); the optical fibers 101 and the optical module 200 may be pluggable or fixedly connected.

The host computer 100 has an optical module interface 102, and the optical module interface 102 is configured to access the optical module 200, so that the host computer 100 and the optical module 200 establish a one-way/bi-directional electrical signal connection; the host computer 100 is configured to connect to the optical module 200. 200 provides data signals, or receives data signals from the optical module 200, or monitors and controls the working status of the optical module 200.

The host computer 100 has an external electrical interface, such as a Universal Serial Bus interface (Universal Serial Bus, USB) and a network cable interface 104. The external electrical interface can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103 so that the host computer 100 and the network cable 103 establish a one-way/bi-directional electrical signal connection.

Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (Optical Network Terminal, ONT) and data center servers are common host computers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100. The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal, and the second electrical signal from the host computer 100 is transmitted into the optical module. 200, the optical module 200 will be The second electrical signal is converted into a second optical signal, the optical module 200 transmits the second optical signal into the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

For example, the first optical signal from the direction of the remote information processing device 1000 is propagated through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted into the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal. The host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

The optical module is a tool that realizes the mutual conversion of optical signals and electrical signals. During the above-mentioned conversion process of optical signals and electrical signals, the information does not change, and the encoding and decoding method of the information can change.

Figure 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG. 2 only shows the structures related to the host computer 100 and the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 provided in the housing, a cage 106 provided on the surface of the PCB circuit board 105, a radiator 107 provided on the cage 106, and a heat sink 107 provided inside the cage 106. In the electrical connector (not shown in the figure), the heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-like structure is a common protruding structure.

The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure. Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in FIGS. 3 and 4 , the optical module 200 includes a shell, a circuit board 300 and an optical transceiver component 400 disposed in the shell.

The housing includes an upper housing 201 and a lower housing 202. The upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings 204 and 205; the outer contour of the housing generally presents a square body.

In some embodiments, the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper case 201 includes a cover plate 2011, and the cover plate 2011 covers the lower case. on the two lower side plates 2022 of 202 to form the above-mentioned housing.

In some embodiments, the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper case 201 includes a cover plate 2011, and two lower side plates 2022 located on both sides of the cover plate 2011. The two upper side plates arranged perpendicularly to the cover plate 2011 are combined with the two lower side plates 2022 to realize that the upper housing 201 is covered on the lower housing 202 .

The above two openings are the first opening 204 and the second opening 205 respectively. The direction of the connecting line of the first opening 204 and the second opening 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. . For example, the first opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the second opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ). Alternatively, the first opening 204 is located at an end of the optical module 200 , and the second opening 205 is located at a side of the optical module 200 .

The first opening 204 is an electrical interface, and the golden finger of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the second opening 205 is an optical port, configured to access the optical fiber 101 so that the optical fiber 101 is connected The optical transceiver component 400 in the optical module 200.

The assembly method of combining the upper housing 201 and the lower housing 202 is used to facilitate the installation of components such as the circuit board 300 and the optical transceiver component 400 into the above-mentioned housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the shape of these components. . In addition, when assembling components such as the circuit board 300 and the optical transceiver component 400, the deployment of positioning components, heat dissipation components, and electromagnetic shielding components of these devices is facilitated, which is conducive to automated production.

In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

In some embodiments, the light module 200 also includes an unlocking component 203 located outside its housing. The unlocking component 203 is configured to realize a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

For example, the unlocking component 203 is located outside the two lower side plates 2022 of the lower housing 202 and includes an engaging component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging parts of the unlocking part 203; when the unlocking part 203 is pulled, the engaging parts of the unlocking part 203 move accordingly, thereby changing the engaging parts. The connection relationship with the host computer is to release the fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106 .

The circuit board 300 includes circuit wiring, electronic components, chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit wiring to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chip may include, for example, a microcontroller unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (limiting amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), and a power supply. Management chip, digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be easily inserted into the host computer cage. in electrical connectors.

The circuit board 300 also includes gold fingers formed on its end surface, and the gold fingers are composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the golden finger is connected to the electrical connector in the cage 106. The golden fingers can be provided only on one side of the circuit board 300 (for example, the upper surface shown in FIG. 4 ), or they can be provided on the upper and lower surfaces of the circuit board 300 to provide more pins. The golden finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.

Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

The optical transceiver component 400 is located on the side of the circuit board 300 away from the gold finger; in some embodiments, the optical transceiver component 400 is physically separated from the circuit board 300, and then connected to the circuit board 300 through a corresponding flexible circuit board or electrical connector. Electrical connection: In some embodiments, the optical transceiver component 400 can be directly disposed on the circuit board 300, on the surface of the circuit board, or on the side of the circuit board.

The optical transceiver component 400 includes a light emitting component and a light receiving component. The light emitting component is configured to transmit data light, and the light receiving component is configured to receive data light. For example, the light emitting component and the light receiving component are combined together to form an integrated light transceiver component 400.

In some embodiments, the optical transceiver component 400 includes a first optical transceiver component 401 and a second optical transceiver component 402 arranged in parallel. The first optical transceiver component 401 and the second optical transceiver component 402 are both electrically connected to the circuit board 300. Both the first optical transceiver component 401 and the second optical transceiver component 402 are configured to transmit and receive data light.

In some embodiments, the first optical transceiver component includes a first round square tube body, a first light emitting component, a first light receiving component, a first optical component and a first optical fiber adapter. The first round and square pipe body has a first pipe opening, a second pipe opening and a third pipe opening. The first light emitting component is placed on the first tube opening. The first light receiving component is placed on the second pipe opening. The first optical component is disposed in the inner cavity of the first rectangular tube body. The first optical component is configured to adjust the data light emitted by the first light emitting component and adjust the data light received by the first light receiving component. The first optical fiber adapter is placed in the third nozzle, and the first optical transmitting component and the first optical receiving component respectively establish optical connections with the first optical fiber adapter to realize a single-fiber bidirectional optical transmission mode.

In some embodiments, the second optical transceiver component includes a second round square tube body, a second light emitting component, a second light receiving component, a second optical component and a second optical fiber adapter. The second round square pipe body also has a first pipe opening, a second pipe opening and a third pipe opening. The second light emitting component is placed on the first tube opening. The second light receiving component is placed on the second tube opening. The second optical component is disposed in the inner cavity of the second rectangular tube body, and the second optical component is configured to adjust the data light emitted by the second light emitting component and adjust the data light received by the second light receiving component. The second optical fiber adapter is placed in the third tube opening, and the second optical transmitting component and the second optical receiving component respectively establish optical connections with the second optical fiber adapter to achieve a single-fiber bidirectional optical transmission mode.

In some embodiments, two optical transceiver components and a circuit board are provided in the housing of the optical module, and both optical transceiver components are connected to the circuit board. The space in the casing of the optical module is limited. The two optical transceiver components occupy a large space in the casing of the optical module, so the space left for the circuit board in the casing of the optical module is small. Therefore, it is necessary to design two stacked circuit boards in the housing of the optical module.

In some embodiments, two circuit boards stacked in the optical module are electrically connected through a flexible circuit board, and a gasket is used to squeeze and fix the two circuit boards. However, the stability of the two circuit boards fixed by gasket extrusion is poor, making it inconvenient to assemble the optical module. In order to improve the stability of the two circuit boards, in some embodiments, a fixing bracket is provided in the housing of the optical module, and the fixing bracket is used to fix the two circuit boards.

FIG. 5 is an assembly diagram of an optical transceiver component, a circuit board and a fixing frame from one perspective according to some embodiments of the present disclosure. FIG. 6 is an assembly diagram of an optical transceiver component, a circuit board, and a fixing frame from another perspective according to some embodiments of the present disclosure. Figure 7 is an exploded view of an optical transceiver component, a circuit board and a fixing frame provided according to some embodiments of the present disclosure. As shown in Figure 5, Figure 6 and Figure 7, in some embodiments, the circuit board 300 includes a first circuit board 301 and a second circuit board 302 arranged in a stack, between the first circuit board 301 and the second circuit board 302 The first flexible circuit board 303 is electrically connected, and the first circuit board 301 and the second circuit board 302 are fixed by the fixing bracket 500 . Among them, the first circuit board 301 and the second circuit board 302 are both rigid circuit boards.

Gold fingers are provided on the end surface of the first circuit board 301 . The second circuit board 302 is located between the first circuit board 301 and the upper case 201. The second chip is provided on the upper surface of the second circuit board 302, and the second thermal pad is provided on the lower surface of the second circuit board 302.

The upper surface of the second thermally conductive pad is connected to the lower surface of the second circuit board 302 , and the lower surface of the second thermally conductive pad is not connected to the upper surface of the first circuit board 301 . The second thermal pad is configured to absorb heat generated by the second circuit board 302 to reduce the temperature of the second circuit board 302 .

The second chip on the second circuit board 302 generates heat when working. In order to reduce the impact of the heat generated by the second chip on the second chip, in some embodiments, the second chip is connected to a first thermal pad provided on the inner surface of the cover plate 2011 of the upper housing 201 . The first thermal pad can not only absorb the heat of the second chip on the second circuit board 302, but also transfer the heat of the second chip to the upper case 201 to reduce the temperature of the second chip.

As shown in Figures 5, 6 and 7, in some embodiments, the first optical transceiver component 401 is connected to the lower surface of the first circuit board 301 through the second flexible circuit board 304, and the second optical transceiver component 402 is connected to the lower surface of the first circuit board 301. The upper surface of a circuit board 301 is connected through a third flexible circuit board 305 .

In some embodiments, the light emitting component and the light receiving component of the two optical transceiver components and the first circuit board 301 pass through a Flexible circuit board connections. When two flexible circuit boards are directly welded to the surface of the first circuit board, a sufficient safety distance must be reserved between the two flexible circuit boards between the welding points of the first circuit board to prevent the two flexible circuit boards from interfering with the first circuit board. Signal crosstalk caused by overlapping solder joints on boards.

In order to avoid signal crosstalk, in some embodiments, the second flexible circuit board 304 and the third flexible circuit board 305 each include a connecting flexible circuit board and two sub-flexible circuit boards, and the two sub-flexible circuit boards are not connected. The first end of the flexible circuit board is connected to the two sub-flexible circuit boards respectively, and the second end of the flexible circuit board is connected to the surface of the first circuit board. The first end of a sub-flexible circuit board is connected to the light emitting component of the first optical transceiver component 401 or the second optical transceiver component 402, and the second end of the sub-flexible circuit board is connected to the first end of the flexible circuit board. The first end of the other sub-flexible circuit board is connected to the light receiving component of the first optical transceiver component 401 or the second optical transceiver component 402, and the second end of the other sub-flexible circuit board is connected to the first end of the flexible circuit board. .

Figure 8 is a structural diagram of a second flexible circuit board provided according to some embodiments of the present disclosure. As shown in FIG. 8 , in some embodiments, the second flexible circuit board 304 includes a first connection flexible circuit board 3041 , a first sub-flexible circuit board 3042 and a second sub-flexible circuit board 3043 . The second sub-flexible circuit board 3043 is not connected to the first sub-flexible circuit board 3042, and the second sub-flexible circuit board 3043 is located between the first sub-flexible circuit board 3042 and the third sub-flexible circuit board 305. The first end of the first connection flexible circuit board 3041 is connected to the second end of the first sub-flexible circuit board 3042 and the second sub-flexible circuit board 3043 respectively, and the second end of the first connection flexible circuit board 3041 is connected to the first circuit board. The lower surface of 301 is connected. The first end of the first sub-flexible circuit board 3042 is connected to the light emitting component of the first optical transceiver component 401 . The first end of the second sub-flexible circuit board 3043 is connected to the light receiving component of the first optical transceiver component 401 .

The first light emitting component is connected to the lower surface of the first circuit board 301 through the first sub-flexible circuit board 3042 and the first connecting flexible circuit board 3041. The first light receiving component is connected to the lower surface of the first circuit board 301 through the second sub-flexible circuit board 3043 and the first connection flexible circuit board 3041.

The vertical distance between the second nozzle of the first round square tube body and the first circuit board 301 is greater than the vertical distance between the first nozzle of the first round square tube body and the first circuit board 301, then the connection is at The first light-receiving component of the second nozzle and the second sub-flexible circuit board 3043 of the first circuit board 301 have a length greater than the first light-emitting component connected to the first nozzle and the first sub-flexible circuit board 3043 of the first circuit board 301. The length dimension of the sub-flexible circuit board 3042.

The first connecting flexible circuit board 3041 connects the first sub-flexible circuit board 3042 and the second sub-flexible circuit board 3043 as a whole, and then welds the second end of the second flexible circuit board 304 to the lower surface of the first circuit board 301 When the first connection flexible circuit board 3041 is directly welded to the lower surface of the first circuit board 301, the connection between the first optical transceiver component and the first circuit board can be realized.

In some embodiments, the second sub-flexible circuit board 3043 includes a first connection part 30431 and a second connection part 30432. The first end of the first connection part 30431 is electrically connected to the first light receiving component. The first connection part 30431 The second end is connected to the first end of the second connection part 30432, and the second end of the second connection part 30432 is connected to the first connection flexible circuit board 3041.

In some embodiments, the first connection portion 30431 has a first welding hole 304311. The pins of the first light receiving component are inserted into the first welding holes 304311 and soldered to the first welding holes 304311, so that the first light receiving component is electrically connected to the second sub-flexible circuit board 3043.

Since the signal lines laid on the first connection part 30431 need to avoid the first welding hole 304311, and the signal lines laid on the second connection part 30432 do not need to avoid other devices, the width of the first connection part 30431 is larger than that of the second connection part 30432 width size.

Figure 9 is a structural diagram of a third flexible circuit board provided according to some embodiments of the present disclosure. As shown in Figure 9, in some embodiments, the third flexible circuit board 305 includes a second connection flexible circuit board 3051, a third sub-flexible circuit board 3052 and a fourth sub-flexible circuit board 3053. The fourth sub-flexible circuit board 3053 It is not connected to the third sub-flexible circuit board 3052, and the fourth sub-flexible circuit board 3053 is located between the third sub-flexible circuit board 3052 and the second flexible circuit board 304. The first end of the second connection flexible circuit board 3051 is connected to the second end of the third sub-flexible circuit board 3052 and the fourth sub-flexible circuit board 3053 respectively, and the second end of the second connection flexible circuit board 3051 is connected to the first circuit board. 301 upper surface connection. The first end of the third sub-flexible circuit board 3052 is connected to the light emitting component of the second optical transceiver component 402 . The first end of the fourth sub-flexible circuit board 3053 is connected to the light receiving component of the second optical transceiver component 402 .

The second light emitting component is connected to the upper surface of the first circuit board 301 through the third sub-flexible circuit board 3052 and the second connecting flexible circuit board 3051. The second light receiving component is connected to the upper surface of the first circuit board 301 through the fourth sub-flexible circuit board 3053 and the second connecting flexible circuit board 3051.

Since the vertical distance between the second nozzle of the second round square tube body and the first circuit board 301 is greater than the vertical distance between the first nozzle of the second round square tube body and the first circuit board 301, then the connection location The length of the fourth sub-flexible circuit board 3053 between the second light-receiving component of the second nozzle and the first circuit board 301 is larger than the length of the second light-emitting component connected to the first nozzle and the first circuit board 301 between the length dimensions of the third sub-flex circuit board 3052.

The second connection flexible circuit board 3051 connects the third sub-flexible circuit board 3052 and the fourth sub-flexible circuit board 3053 as a whole, and then the second end of the third flexible circuit board 305 is welded to the upper surface of the first circuit board 301 When the second connection flexible circuit board 3051 is directly welded to the upper surface of the first circuit board 301, the connection between the second optical transceiver component and the first circuit board can be realized.

In some embodiments, the fourth sub-flexible circuit board 3053 includes a third connection part 30531 and a fourth connection part 30532. The first end of the third connection part 30531 is electrically connected to the fourth connection part 30532. The third connection part 30531 The second end is connected to the first end of the fourth connecting part 30532, and the second end of the fourth connecting part 30532 is connected to the second connecting flexible circuit board 3051.

In some embodiments, the third connection part 30531 has a second welding hole 305311, and the pin of the second light receiving component is inserted into the second welding hole 305311 and soldered to the second welding hole 305311, so that the second light receiving component It is electrically connected to the fourth sub-flexible circuit board 3053.

Since the signal lines laid on the third connection part 30531 need to avoid the second welding hole 305311, and the signal lines laid on the fourth connection part 30532 do not need to avoid other devices, the width of the third connection part 30531 is larger than that of the fourth connection part 30532 width size.

In some embodiments, the second flexible circuit board and the third flexible circuit board each include a connecting flexible circuit board and two sub-flexible circuit boards. The first end of the connecting flexible circuit board is respectively connected to the two sub-flexible circuit boards. The connecting flexible circuit board The second end of the board is connected to the surface of the first circuit board. When welding the second flexible circuit board or the third flexible circuit board to the surface of the first circuit board, directly weld the corresponding connecting flexible circuit board of the second flexible circuit board or the third flexible circuit board to the surface of the first circuit board. , the connection between the optical transceiver component and the circuit board can be realized.

Figure 10 is an assembly diagram of a circuit board and a fixing bracket from one perspective according to some embodiments of the present disclosure. Figure 11 is an assembly diagram of a circuit board and a fixing bracket from another perspective according to some embodiments of the present disclosure. Figure 12 is an assembly diagram of a fixing bracket and a first circuit board according to some embodiments of the present disclosure. As shown in Figures 10, 11 and 12, the fixing bracket 500 is used to fix the first circuit board 301 and the second circuit board 302. Both the first circuit board 301 and the second circuit board 302 have positioning holes, and the fixing frame 500 has positioning posts, support posts and limiting protrusions. The positioning holes are arranged correspondingly to the positioning posts, and the positioning posts are clamped at the positioning holes. The support pillar is connected to the lower surface of the first circuit board 301 to support the first circuit board. The limiting protrusion is connected to the upper surface of the second circuit board 302 to limit the second circuit board.

Figure 13 is an exploded view of a circuit board and a fixing bracket provided according to some embodiments of the present disclosure. Figure 14 is a structural diagram of a first circuit board provided according to some embodiments of the present disclosure. As shown in Figures 13 and 14, in some embodiments, the first circuit board 301 includes a first positioning hole 3011, a first card interface 3012, a second card interface 3013, a first notch area 3014 and a second notch area 3015 .

In some embodiments, the first positioning hole 3011 is formed by an inward recess of the side wall of the first circuit board 301 . The first positioning hole 3011 includes a first sub-positioning hole 30111, a second sub-positioning hole 30112, a third sub-positioning hole 30113 and a fourth sub-positioning hole 30114. The first sub-positioning hole 30111 and the second sub-positioning hole 30112 are both formed by the first side wall of the first circuit board 301 being recessed inward. The third sub-positioning hole 30113 and the fourth sub-positioning hole 30114 are both formed by the first circuit board 301 The second side wall is formed by an inward recess.

The first sub-positioning hole 30111 and the third sub-positioning hole 30113 are close to one end of the optical transceiver component 400. The second sub-positioning hole 30112 and the fourth sub-positioning hole 30114 are away from one end of the optical transceiver component 400. The first sub-positioning hole 30111 is in contact with the optical transceiver component 400. The vertical distance of the transceiver component 400 is less than the vertical distance between the third sub-positioning hole 30113 and the optical transceiver component 400. The vertical distance between the second sub-positioning hole 30112 and the optical transceiver component 400 is smaller than the vertical distance between the fourth sub-positioning hole 30114 and the optical transceiver component 400. distance. For example, the vertical distance between the first sub-positioning hole 30111 and the first optical transceiver component 401 is less than the vertical distance between the third sub-positioning hole 30113 and the first optical transceiver component 401 , and the vertical distance between the second sub-positioning hole 30112 and the first optical transceiver component 401 The vertical distance is smaller than the vertical distance between the fourth sub-positioning hole 30114 and the first optical transceiver component 401 .

In some embodiments, the first card interface 3012 includes a first daughter card interface 30121 and a second daughter card interface 30122. The first daughter card interface 30121 is formed by the first end of the first circuit board 301 and the first side wall of the first circuit board 301 being recessed inward, and the second daughter card interface 30122 is formed by the second side wall of the first circuit board 301 An inward depression is formed. The vertical distance between the first daughter card interface 30121 and the optical transceiver component 400 is smaller than the vertical distance between the second daughter card interface 30122 and the optical transceiver component 400 . For example, the vertical distance between the first daughter card interface 30121 and the first optical transceiver component 401 is smaller than the vertical distance between the second daughter card interface 30122 and the first optical transceiver component 401 .

In some embodiments, the second card interface 3013 includes a third daughter card interface 30131 and a fourth daughter card interface 30132. The third daughter card interface 30131 is formed by the second end of the first circuit board 301 and the first side wall of the first circuit board 301 being recessed inward. The fourth daughter card interface 30132 is formed by the second side wall of the first circuit board 301 An inward depression is formed.

The first end of the second flexible circuit board 304 is fixed on the first optical transceiver component, and the second end of the second flexible circuit board 304 is fixed on the lower surface of the first circuit board 301 . When the first optical transceiver component and the first circuit board 301 are connected through the second flexible circuit board 304, the second flexible circuit board 304 needs to extend from the lower surface of the first circuit board 301 and cross the upper surface of the first circuit board 301. Since the distance between the bending area of the second flexible circuit board 304 and the first end of the first circuit board 301 is relatively close, when the first optical transceiver component 401 and the first circuit board 301 are connected through the second flexible circuit board 304, the The first end of a circuit board 301 can easily squeeze the bending area of the second flexible circuit board 304, thereby damaging the second flexible circuit board 304. In order to avoid damaging the second flexible circuit board 304, in some embodiments, the first circuit board 301 has a first notch area 3014.

The first notch area 3014 is formed by both the first end of the first circuit board 301 and the first side wall of the first circuit board 301 being indented inward. The first notch area 3014 prevents the first end of the first circuit board 301 from pressing the bending area of the second flexible circuit board 304, thereby preventing damage to the second flexible circuit board 304.

The side view of the first flexible circuit board 303 is arc-shaped, and both side walls of the circuit board 300 are close to the inner wall of the lower side plate 2022 of the lower housing 202 . If the side wall of the first circuit board 301 connected to the first flexible circuit board 303 is not provided with a notch area, the inner wall of the lower side plate 2022 of the lower housing 202 will easily squeeze the first flexible circuit board 303, thereby damaging the first flexible circuit board 303. Circuit Board 303. In order to avoid damaging the first flexible circuit board 303, in some embodiments, the first circuit board 301 has a second notch area 3015.

The second notch area 3015 is formed by an inward recess of the first side wall of the first circuit board 301 . The second notch area 3015 has a first sub-positioning hole 30111 and a second sub-positioning hole 30112. The second notch area 3015 prevents the inner wall of the lower side plate 2022 from pressing the first flexible circuit board 303, thereby preventing damage to the first flexible circuit board 303.

The first sub-positioning hole 30111 is not connected to the first sub-card interface 30121, and the area between the first sub-positioning hole 30111 and the first sub-card interface 30121 is the first connection area 3016.

The second sub-positioning hole 30112 is not connected to the third sub-card interface 30131, and the area between the second sub-positioning hole 30112 and the third sub-card interface 30131 is the second connection area 3017.

The third sub-positioning hole 30113 is not connected to the second sub-card interface 30122, and the area between the third sub-positioning hole 30113 and the second sub-card interface 30122 is the third connection area 3018.

The third sub-positioning hole 30113 is connected to the fourth sub-card interface 30132, and the area between the third sub-positioning hole 30113 and the fourth sub-card interface 30132 is the fourth connection area 3019.

Figure 15 is a structural diagram of a second circuit board provided according to some embodiments of the present disclosure. As shown in FIG. 15 , in some embodiments, the second circuit board 302 includes a second positioning hole 3021 , and the second positioning hole 3021 is provided corresponding to the first positioning hole 3011 .

In some embodiments, the second positioning hole 3021 includes a fifth sub-positioning hole 30211, a sixth sub-positioning hole 30212, a seventh sub-positioning hole 30213 and an eighth sub-positioning hole 30214. The fifth sub-positioning hole 30211 and the sixth sub-positioning hole 30212 are both formed by an inward recess of the first side wall of the second circuit board 302 . The seventh sub-positioning hole 30213 is formed by an inward recess of the second side wall of the second circuit board 302 . The eighth sub-positioning hole 30214 is formed by an inward recess of the second side wall of the second circuit board 302 and the second end of the second circuit board 302 . The fifth sub-positioning hole 30211 is provided correspondingly to the first sub-positioning hole 30111, the sixth sub-positioning hole 30212 is provided correspondingly to the second sub-positioning hole 30112, the seventh sub-positioning hole 30213 is provided correspondingly to the third sub-positioning hole 30113, and the eighth sub-positioning hole 30213 is provided correspondingly to the third sub-positioning hole 30113. The sub-positioning hole 30214 is provided correspondingly to the fourth sub-positioning hole 30114.

The vertical distance between the fifth sub-positioning hole 30211 and the optical transceiver component 400 is smaller than the vertical distance between the sixth sub-positioning hole 30212 and the optical transceiver component 400, and the vertical distance between the seventh sub-positioning hole 30213 and the optical transceiver component 400 is smaller than the eighth sub-positioning hole 30213. The vertical distance between 30214 and the optical transceiver component 400. For example, the vertical distance between the fifth sub-positioning hole 30211 and the first optical transceiver component 401 is less than the vertical distance between the sixth sub-positioning hole 30212 and the first optical transceiver component 401 , and the vertical distance between the seventh sub-positioning hole 30213 and the first optical transceiver component 401 The vertical distance is smaller than the vertical distance between the eighth sub-positioning hole 30214 and the first optical transceiver component 401 .

Figure 16 is a structural diagram of a fixation bracket provided according to some embodiments of the present disclosure. As shown in FIG. 16 , in some embodiments, the fixing bracket 500 includes a base 501 located between the lower housing 202 and the first circuit board 301 . The base 501 is provided with positioning posts 502 and support posts 503 . The positioning posts 502 are respectively provided corresponding to the first positioning holes 3011 and the second positioning holes 3021, and the positioning posts 502 are engaged with the first positioning holes 3011 and the second positioning holes 3021. The support column 503 is connected to the first circuit board 301 .

In some embodiments, the base 501 includes a first fixing plate 5011, a second fixing plate 5012, a third fixing plate 5013 and a fourth fixing plate 5014. The second end of the first fixing plate 5011 is connected to the first end of the second fixing plate 5012, the second end of the second fixing plate 5012 is connected to the first end of the third fixing plate 5013, and the second end of the third fixing plate 5013 is connected to the first end of the first fixing plate 5011. The first end of the fourth fixing plate 5014 is connected to the first end of the fourth fixing plate 5014 , and the second end of the fourth fixing plate 5014 is connected to the first end of the first fixing plate 5011 .

The base has a third card interface 5015 and a fourth card interface 5016. The third card interface 5015 is provided corresponding to the first card interface 3012. The fourth card interface 5016 is provided correspondingly to the second card interface 3013.

In some embodiments, the third card interface 5015 includes a fifth daughter card interface 50151 and a sixth daughter card interface 50152. The fifth sub-card interface 50151 is formed by an inward recess of the side wall of the first fixing plate 5011, and the sixth sub-card interface 50152 is formed by an inward recess of the side wall of the third fixing plate 5013. The fifth subcard interface 50151 is configured correspondingly to the first subcard interface 30121, and the sixth subcard interface 50152 is configured correspondingly to the second subcard interface 30122.

In some embodiments, the fourth card interface 5016 includes a seventh daughter card interface 50161 and an eighth daughter card interface 50162. The seventh sub-card interface 50161 is formed by both the side walls of the first fixing plate 5011 and the second fixing plate 5012 being recessed inward, and the eighth sub-card interface 50162 is formed by the side walls of the third fixing plate 5013 being recessed inward. . The seventh subcard interface 50161 is configured correspondingly to the third subcard interface 30131, and the eighth subcard interface 50162 is configured correspondingly to the fourth subcard interface 30132.

In some embodiments, the positioning post 502 is provided corresponding to the second positioning hole 3021 , and the positioning post 502 includes a first sub-positioning post 5021 , a second sub-positioning post 5022 , a third sub-positioning post 5023 and a fourth sub-positioning post 5024 . The first sub-positioning column 5021 and the second sub-positioning column 5022 are both provided on the first fixed plate 5011, and the third sub-positioning column 5023 and the fourth sub-positioning column 5024 are both provided on the third fixed plate 5013. The fourth sub-positioning post 5024 is located at the end of the first end of the third fixing plate 5013 .

Among them, the first sub-positioning post 5021 is respectively provided correspondingly to the first sub-positioning hole 30111 and the fifth sub-positioning hole 30211, and the second sub-positioning post 5022 is provided correspondingly to the second sub-positioning hole 30112 and the sixth sub-positioning hole 30212, respectively. The third sub-positioning post 5023 is provided correspondingly to the third sub-positioning hole 30113 and the seventh sub-positioning hole 30213 respectively, and the fourth sub-positioning post 5024 is provided corresponding to the fourth sub-positioning hole 30114 and the eighth sub-positioning hole 30214 respectively.

The first chip is provided on the first circuit board 301. Since the position of the first chip on the first circuit board 301 is set according to the signal lines laid on the first circuit board 301, the position of the first chip on the first circuit board 301 is fixed. In order not to change the position of the first chip on the first circuit board 301, when the fixing bracket 500 is used to fix the first circuit board 301 and the second circuit board 302, the first sub-positioning post 5021 and the third sub-positioning post 5023 are required to be along the The fixed frame 500 is arranged asymmetrically, and the second sub-positioning post 5022 and the fourth sub-positioning post 5024 are arranged asymmetrically along the fixed frame 500 .

In some embodiments, the vertical distance between the first sub-positioning hole 30111 and the optical transceiver component 400 is smaller than the third sub-positioning hole 30113 The vertical distance between the first sub-positioning post 5021 and the optical transceiver component 400 is smaller than the vertical distance between the third sub-positioning post 5023 and the optical transceiver component 400 . That is, the first sub-positioning post 5021 and the third sub-positioning post 5023 are arranged asymmetrically along the fixed frame 500 . For example, the vertical distance between the first sub-positioning hole 30111 and the first optical transceiver component 401 is less than the vertical distance between the third sub-positioning hole 30113 and the first optical transceiver component 401 , and the first sub-positioning post 5021 and the first optical transceiver component 401 The vertical distance is less than the vertical distance between the third sub-positioning post 5023 and the first optical transceiver component 401 .

The vertical distance between the second sub-positioning hole 30112 and the optical transceiver component 400 is less than the vertical distance between the fourth sub-positioning hole 30114 and the optical transceiver component 400. Then the vertical distance between the second sub-positioning post 5022 and the optical transceiver component 400 is smaller than the fourth sub-positioning hole 30112. The vertical distance between the post 5024 and the optical transceiver component 400 , that is, the second sub-positioning post 5022 and the fourth sub-positioning post 5024 are arranged asymmetrically along the fixing frame 500 .

In some embodiments, one end of the positioning post 502 away from the base 501 has a support notch and a limiting protrusion, and the support notch and the limiting protrusion are respectively located on different surfaces of the positioning post 502. The support notch is connected to the lower surface of the upper side plate of the upper housing 201 to support the upper side plate 2012 of the upper housing 201 . The lower surface of the limiting protrusion is connected to the upper surface of the second circuit board 302 to limit the position of the second circuit board. For example, the first sub-positioning post 5021 includes a first support notch 50211 and a first limiting protrusion 50212. The first support notch 50211 is connected to the lower surface of the upper side plate of the upper housing 201 , and the lower surface of the first limiting protrusion 50212 is connected to the upper surface of the second circuit board 302 .

In some embodiments, the support column 503 includes a first sub-support column 5031, a second sub-support column 5032, a third sub-support column 5033 and a fourth sub-support column 5034.

The first sub-support column 5031 is disposed on the first fixed plate 5011. The first sub-support column 5031 is connected to the first sub-positioning column 5021. The first sub-support column 5031 is disposed corresponding to the first connection area 3016. The first sub-support column 5031 is disposed on the first fixed plate 5011. 5031 is connected to the lower surface of the first connection area 3016.

The second sub-support column 5032 is provided on the first fixed plate 5011. The second sub-support column 5032 is connected to the second sub-positioning column 5022. The second sub-support column 5032 is provided correspondingly to the second connection area 3017. 5032 is connected to the lower surface of the second connection area 3017.

The third sub-support column 5033 is provided on the third fixed plate 5013. The third sub-support column 5033 is connected to the third sub-positioning column 5023. The third sub-support column 5033 is provided correspondingly to the third connection area 3018. The third sub-support column 5033 is disposed on the third fixed plate 5013. 5033 is connected to the lower surface of the third connection area 3018.

The fourth sub-support pillar 5034 is disposed on the third fixed plate 5013, and the fourth sub-support pillar 5034 is not connected to the fourth sub-positioning pillar 5024. The fourth sub-support pillar 5034 is connected to the lower surface of the fourth connection area 3019.

In some embodiments, the positioning post is engaged with the first positioning hole and the second positioning hole, the support post is connected to the lower surface of the first circuit board, and the limiting protrusion is connected to the upper surface of the second circuit board, so as to facilitate The fixing bracket fixes the first circuit board and the second circuit board. The vertical distance between the first sub-positioning post and the first optical transceiver component is smaller than the vertical distance between the third sub-positioning post and the first optical transceiver component, that is, the first sub-positioning post and the third sub-positioning post are arranged asymmetrically along the fixed frame. The vertical distance between the second sub-positioning post and the first optical transceiver component is smaller than the vertical distance between the fourth sub-positioning post and the first optical transceiver component. That is, the second sub-positioning post and the fourth sub-positioning post are arranged symmetrically and asymmetrically along the fixed frame. set up. The first sub-positioning column and the third sub-positioning column are asymmetrically arranged along the fixed frame, and the second sub-positioning column and the fourth sub-positioning column are asymmetrically arranged along the fixed frame. There is no need to change the position of the first chip on the first circuit board. position, you can use the fixing bracket to fix the first circuit board and the second circuit board.

Figure 17 is an assembly diagram of an upper housing, an optical transceiver component, a circuit board and a fixing frame according to some embodiments of the present disclosure. Figure 18 is an assembly diagram of an upper case and a first circuit board according to some embodiments of the present disclosure. Figure 19 is a structural diagram of an upper housing provided from one perspective according to some embodiments of the present disclosure. As shown in Figures 17, 18 and 19, in some embodiments, the upper side plate 2012 of the upper housing 201 has a third notch area 20121, a fourth notch area 20122, a positioning plate 20123 and a fixing protrusion 20124. The third notch area 20121 is formed by the lower surface of the upper side plate 2012 being recessed toward the cover plate 2011 . The fourth notch area 20122 is also formed by the lower surface of the upper side plate 2012 being recessed toward the cover plate 2011. The fourth notch area 20122 is not connected to the third notch area 20121.

In some embodiments, the third notch area 20121 has a first sub-notch area 201211 and a second sub-notch area 201212 according to the degree of depression. The first sub-notch area 201211 is more concave than the second sub-notch area 201212. The second sub-notch area 201212 is not connected to the fixing bracket 500 .

In some embodiments, the fourth notch area 20122 has a third sub-notch area 201221, a fourth sub-notch area 201222 and a fifth sub-notch area 201223 according to the degree of depression. The third sub-notch area 201221 is located between the fourth sub-notch area 201222 and the fifth sub-notch area 201223, and the third sub-notch area 201221 is more recessed relative to the fourth sub-notch area 201222 and the fifth sub-notch area 201223. The third sub-notch area 201221 is connected to the support notch (for example, the first support notch 50211) of the fixing frame 500, the fourth sub-notch area 201222 is connected to the first connection area 3016 of the first circuit board 301, and the fifth sub-notch area 201223 is connected to the first connection area 3016 of the first circuit board 301. The second connection area 3017 of the first circuit board 301 is connected.

In some embodiments, the positioning plate 20123 is located between the third notch area 20121 and the fourth notch area 20122, and the positioning plate 20123 is clamped at the first card interface 3012 and the third card interface 5015.

As shown in Figures 17, 18 and 19, in some embodiments, the lower side plate 2022 of the lower housing 202 has a fixing hole 20221, and the fixing hole 20221 is provided correspondingly to the fixing protrusion 20124. The fixing protrusion 20124 is engaged in the fixing hole 20221, so that the upper shell 201 is fixed with the lower housing 202.

Figure 20 is an assembly diagram of an upper housing and an unlocking component according to some embodiments of the present disclosure. Figure 21 is a structural diagram of the upper housing provided from another perspective according to some embodiments of the present disclosure. Figure 22 is a cross-sectional view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 20, 21 and 22, in some embodiments, the unlocking component 203 is provided on the housing of the optical module 200.

The unlocking component 203 includes an unlocking handle 2031, an unlocker 2032 and an elastic member 2033. The unlocking handle 2031 is clamped on the housing surface of the optical module. The unlocker 2032 is connected to the upper housing 201 through a connecting shaft 2034. One end of the unlocker 2032 is connected to the unlocking handle 2031, and the second end of the unlocker 2032 is connected to the elastic member 2033.

In some embodiments, the upper housing 201 has first connection holes 2016 on both side plates. The unlocker 2032 has a second connection hole corresponding to the position of the first connection hole 2016. The second connection hole extends from one side of the unlocker 2032 to the other side of the unlocker 2032 . The connecting shaft 2034 passes through a first connecting hole 2016, a second connecting hole and another first connecting hole 2016 in sequence, so that the unlocker 2032 and the upper housing 201 are connected through the connecting shaft 2034.

In some embodiments, the elastic member 2033 includes a movable end and a fixed end. The fixed end of the elastic member 2033 is fixed on the second end of the unlocker 2032 , and the movable end of the elastic member 2033 is placed on the second limiting plate of the upper housing 201 2018 in the limiting cavity 20181. When the second end of the unlocker 2032 sinks downward, the elastic member 2033 is compressed in the limiting cavity 20181; when the second end of the unlocker 2032 no longer sinks, the elastic member 2033 is compressed in the limiting cavity 20181. The state reverts to the uncompressed state.

Figure 23 is a structural diagram of an unlocking component provided according to some embodiments of the present disclosure. As shown in Figure 23, in some embodiments, the unlocking handle 2031 has a first protrusion 20315 that protrudes toward the optical port. The first protrusion 20315 is placed in the storage slot 2015 on the inner surface of the cover 2011 of the upper case 201 . The inner surface of the first end of the unlocker 2032 (near the optical port) is connected to the unlocking handle 2031. The outer surface of the second end of the unlocker 2032 (near the electrical port) has a snap piece 203221. The inner surface of the second end of the unlocker 2032 is The surface has fixed posts 203222. The movable end of the elastic member 2033 is fixed to the fixed post 203222.

When the optical module is inserted into the host computer, the engaging member 203221 snaps into the bayonet of the cage of the host computer to realize the engagement relationship between the optical module 200 and the host computer. When the unlocking handle 2031 is turned, the first end of the unlocking device 2032 lifts upward, and the second end of the unlocking device 2032 sinks downwards, and the engaging part 203221 of the unlocking device 2032 also sinks until the engaging part 203221 is disengaged from the upper position. The bayonet of the machine's cage is released to release the engagement between the optical module 200 and the host computer.

When the unlocking handle 2031 is not rotated, the angle between the first protrusion 20315 and the inner surface of the upper housing is approximately 0°. When the unlocking handle 2031 starts to rotate, the angle between the first protrusion 20315 and the inner surface of the upper housing gradually increases from approximately 0°. When the unlocking handle 2031 cannot continue to rotate, the angle between the first protrusion 20315 and the inner surface of the upper housing is approximately 90°.

When the unlocking handle 2031 rotates, the angle between the first protrusion 20315 and the inner surface of the upper housing gradually increases from approximately 0°, then the first end of the unlocker 2032 connected to the first protrusion 20315 and the upper housing The distance between the inner surfaces gradually increases. That is, when the unlocking handle 2031 is rotated, the first end of the unlocking device 2032 is lifted upward.

The unlocker 2032 is connected to the upper housing 201 through a connecting shaft 2034. The connecting shaft 2034 serves as a fulcrum, and the unlocker 2032 serves as a lever. According to the lever principle, when the unlocking handle 2031 rotates, the first end of the unlocker 2032 lifts upward, and the unlocker 2032 The second end of the unlocker 2032 sinks downwards, and the engaging member 203221 on the outer surface of the second end of the unlocker 2032 also sinks accordingly.

In order to make the second end of the unlocker 2032 rise and sink as the first end of the unlocker 2032 is raised, it is required that the cover 2011 of the upper housing 201 and the second end of the unlocker 2032 have a certain distance when the unlocking handle 2031 is not turned. a certain distance. In order to achieve a certain distance between the cover plate 2011 of the upper housing 201 and the second end of the unlocker 2032 when the unlocking handle 2031 is not turned, in some embodiments, the middle position of the inner surface of the cover plate 2011 of the upper housing 201 Has a limit plate.

The first end of the limiting plate is more recessed relative to the storage slot, and the second end of the limiting plate is more recessed relative to the first end of the limiting plate. Then, when the unlocking handle 2031 is not turned, the second end of the unlocking device 2032 is in contact with the first end of the limiting plate. The distance between the upper shells 201 is not equal to zero (when the unlocking handle 2031 is not rotated). The limiting plate can cause the second end of the unlocker 2032 to sink as the first end of the unlocker 2032 is lifted.

The limiting plate and the upper side plate 2012 of the upper housing 201 form two first storage cavities 2019, and the two first storage cavities 2019 are respectively configured to place the first optical fiber adapter and the second optical fiber adapter.

In some embodiments, the limiting plate includes a first limiting plate 2017 and a second limiting plate 2018. The first limiting plate 2017 and the second limiting plate 2018 are both formed by the inner surface of the bottom plate 2021 of the upper housing 201 being recessed inward. The second end of the first limiting plate 2017 (near the electrical port) is more recessed relative to the first end of the first limiting plate 2017 (near the optical port). The second limiting plate 2018 is more recessed relative to the second end of the first limiting plate 2017 .

When the second end of the second limiting plate 2018 is recessed to the same degree as the second end of the first limiting plate 2017, or the second end of the first limiting plate 2017 is more recessed relative to the second limiting plate 2018, the third end of the unlocker 2032 The sinking distance of the two ends is small, and the engaging part 203221 of the second end of the unlocker 2032 sinks a small distance, which may cause the engaging part 203221 to be unable to detach from the bayonet of the cage of the host computer.

Figure 24 is a structural diagram of an unlocking handle provided according to some embodiments of the present disclosure. As shown in Figure 24, in some embodiments, in addition to the first protrusion 20315 protruding toward the optical port, the unlocking handle 2031 also includes a first side 20311, a second side 20312, a third side 20313, a fourth side The side 20314 and the fifth side 20316, the first side 20311, the second side 20312, the third side 20313, the fourth side 20314, the first protrusion 20315, the fifth side 20316 and the first side 20311 are connected in sequence.

The fourth side 20314, the fifth side 20316 and the first protrusion 20315 form the first end of the unlocking handle 2031, and the second side 20312 serves as To unlock the second end of the handle 2031, the first side 20311 and the third side 20313 serve as the middle part of the unlocking handle 2031, and the middle part of the unlocking handle 2031 is connected to the first end of the unlocking handle 2031 and the second end of the unlocking handle 2031 respectively.

The first protrusion 20315 is located at the same level as the fourth side 20314 and the fifth side 20316, and protrudes toward the optical port relative to the fourth side 20314 and the fifth side 20316.

In some embodiments, the storage slot 2015 includes a first limiting member 20151 and a second limiting member 20152. The first limiting member 20151 and the second limiting member 20152 form a storage slot 2015.

The first limiting member 20151 includes a connecting member 201511 and two fixing members 201512. The two fixing members 201512 are respectively connected to both ends of the connecting member 201511. The connecting member 201511 and the second limiting member 20152 form a second storage cavity. The first protrusion 20315 is placed in the second storage cavity. The fixing member 201512 has a limiting hole, which is formed by a recess of the fixing member 201512 toward the optical port. The fourth side 20314 and the fifth side 20316 of the unlocking handle 2031 are placed in the limiting hole.

In order to define the position of the first protrusion 20315, in some embodiments, the unlocker 2032 has a limiting block 203214. The limiting block 203214 is obtained by protruding outward from the unlocker 2032. The limiting block 203214 is configured to limit the position of the first protrusion 20315 of the unlocking handle 2031.

In some embodiments, the second limiting member 20152 has a fifth gap area 201521, and the fifth gap area 201521 is formed by the second limiting member 20152 being recessed toward the electrical port direction. The limiting block 203214 is provided correspondingly to the fifth gap area 201521, and the limiting block 203214 is located in the fifth gap area 201521.

Figure 25 is a structural diagram of an unlocker provided according to some embodiments of the present disclosure from one perspective. Figure 26 is a structural diagram of an unlocker provided according to some embodiments of the present disclosure from another perspective. As shown in Figures 25 and 26, in some embodiments, the unlocker 2032 includes a connecting body 20321 and an unlocker body 20322. The inner surface of the first end (near the optical port) of the connecting body 20321 is connected to the first end of the unlocking handle 2031, and the second end of the connecting body 20321 is connected to the first end (near the optical port) of the unlocker body 20322. The outer surface of the second end (near the electrical port) of the unlocker body 20322 has a latch 203221, and the inner surface of the second end (near the electrical port) of the unlocker body 20322 has a fixing post 203222.

In some embodiments, the connector 20321 includes a first sub-connector 203211, a second sub-connector 203212 and a third sub-connector 203213. The first sub-connector 203211 is close to the optical port, and the second sub-connector 203212 is located at the first Between the sub-connector 203211 and the third sub-connector 203213, the third sub-connector 203213 is close to the electrical port. The first sub-connector 203211 is provided correspondingly to the unlocking handle 2031, the second sub-connector 203212 is provided correspondingly to the second limiting member 20152, and the third sub-connector 203213 is provided correspondingly to the first limiting plate 2017 of the upper housing 201. The inner surface of the first sub-connector 203211 is connected to the first end of the unlocking handle 2031. The first sub-connector 203211 is provided with a limiting block 203214, and the third sub-connector 203213 is provided with a second connection hole 203215.

In some embodiments, the thickness dimension of the first sub-connector 203211<the thickness dimension of the second sub-connector 203212<the thickness dimension of the third sub-connector 203213.

When the strength of the unlocker 2032 is not considered, the thickness dimension of the first sub-connector 203211 may be equal to the thickness dimension of the second sub-connector 203212. When considering the strength of the unlocker 2032 , that is, increasing the strength of the unlocker 2032 , the thickness dimension of the first sub-connector 203211 is < the thickness dimension of the second sub-connector 203212 .

Before turning the unlocking handle, the inner surface of the first sub-connector 203211 is connected to the unlocking handle 2031, the inner surface of the third sub-connector 203213 is connected to the first end of the first limiting plate 2017, and the first limiting plate 2017 The first end is more recessed relative to the first storage cavity where the unlocking handle 2031 is located. In order to make the outer surface of the first sub-connector 203211 and the outer surface of the third sub-connector 203213 be at the same level or a similar level, then the thickness dimension of the first sub-connector 203211 < that of the third sub-connector 203213 Thickness size.

Before the unlocking handle is turned, the inner surface of the second sub-connector 203212 is not connected to the second limiting member 20152, the inner surface of the third sub-connector 203213 is connected to the first end of the first limiting plate 2017, and the first The first end of the limiting plate 2017 is more recessed relative to the second limiting member 20152. In order to make the outer surface of the second sub-connector 203212 and the outer surface of the third sub-connector 203213 at the same level or a similar level, then the thickness dimension of the second sub-connector 203212 < that of the third sub-connector 203213 Thickness size.

Since the second end of the first limiting plate 2017 (near the electrical port) is more recessed than the first end (near the optical port) of the first limiting plate 2017, the third sub-section provided corresponding to the first limiting plate 2017 There is a certain distance difference between the second end of the connecting body 203213 (near the electrical port) and the second end of the first limiting plate 2017. When the unlocking handle 2031 rotates and lifts up the first sub-connector 203211, the third sub-connector 203213 can sink downward.

In some embodiments, when the optical module is inserted into the host computer, the engaging member snaps into the bayonet of the cage of the host computer to realize the engaging relationship between the optical module and the host computer. When the unlocking handle is not rotated, the engaging piece cooperates with the bayonet of the host computer to realize the engagement relationship between the optical module and the host computer. When the unlocking handle is rotated, the first end of the unlocker is lifted upward, the second end of the unlocker sinks downward, and the engaging piece sinks downward until the engaging piece is disengaged from the bayonet, and the engagement between the optical module and the host computer is released. . In some embodiments, the unlocking handle has a first protrusion protruding toward the optical port, the first protrusion is connected to the inner surface of the first end of the unlocker, and the unlocker is connected to the upper housing through a connecting shaft. When the unlocking handle is rotated, the first end of the unlocker is lifted upward under the action of the first protrusion, and the second end of the unlocker sinks downward until the engaging piece is separated from the bayonet of the host computer, and the optical module is released from the host computer. The snapping relationship.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present disclosure, but not to limit it; although with reference to the foregoing embodiments The embodiments describe the present disclosure in detail. Those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions , does not cause the essence of the corresponding technical solution to deviate from the spirit and scope of the technical solution of each embodiment of the present disclosure.

Claims

An optical module includes:

a first circuit board having a first positioning hole;

A second circuit board is electrically connected to the first circuit board, wherein the second circuit board has a second positioning hole, and the second positioning hole is provided corresponding to the first positioning hole;

A fixing bracket configured to fix the first circuit board and the second circuit board, wherein the fixing bracket includes:

A base with a first fixing plate and a third fixing plate, the third fixing plate being arranged opposite to the first fixing plate;

a support column connected to the lower surface of the first circuit board, the support column being configured to support the first circuit board;

A positioning post is provided corresponding to the second positioning hole. The positioning post is clamped at the first positioning hole and the second positioning hole. The end of the positioning post away from the first circuit board has a limiting protrusion. , the limiting protrusion is connected to the upper surface of the second circuit board, and the limiting protrusion is configured to limit the position of the second circuit board; wherein the positioning post includes a first sub-positioning column, a second sub-positioning column, a third sub-positioning column and a fourth sub-positioning column, the second sub-positioning column and the first sub-positioning column are both arranged on the first fixed plate; the third sub-positioning column The sub-positioning post and the fourth sub-positioning post are both arranged on the third fixed plate; the vertical distance between the first sub-positioning post and the first optical transceiver component is smaller than the vertical distance between the third sub-positioning post and the third sub-positioning post. The vertical distance of an optical transceiver component; the vertical distance between the second sub-positioning post and the first optical transceiver component is smaller than the vertical distance between the fourth sub-positioning post and the first optical transceiver component;

The first optical transceiver component is connected to the lower surface of the first circuit board through a second flexible circuit board; wherein the second flexible circuit board includes:

The first sub-flexible circuit board has a first end connected to the light emitting component of the first optical transceiver component;

The first end of the second sub-flexible circuit board is connected to the light receiving component of the first optical transceiver component, and the second sub-flexible circuit board is not connected to the first sub-flexible circuit board;

The first connecting flexible circuit board has a first end connected to the second end of the first sub-flexible circuit board and the second sub-flexible circuit board respectively. The second end of the first connecting flexible circuit board is connected to the second end of the first sub-flexible circuit board and the second sub-flexible circuit board. The lower surface of the first circuit board is connected;

A second optical transceiver component is arranged in parallel with the first optical transceiver component, and the second optical transceiver component is connected to the upper surface of the first circuit board through a third flexible circuit board; wherein, the third flexible circuit Boards include:

The third sub-flexible circuit board has a first end connected to the light emitting component of the second optical transceiver component;

The fourth sub-flexible circuit board has a first end connected to the light receiving component of the second optical transceiver component. The fourth sub-flexible circuit board is not connected to the third sub-flexible circuit board. The fourth sub-flexible circuit board The circuit board is located between the third sub-flexible circuit board and the second flexible circuit board;

The first end of the second connecting flexible circuit board is connected to the second end of the third sub-flexible circuit board and the fourth sub-flexible circuit board respectively, and the second end of the second connecting flexible circuit board is connected to the second end of the second connecting flexible circuit board. The upper surface of the first circuit board is connected.
The optical module according to claim 1, wherein the first positioning hole includes:

The first sub-positioning hole is connected to the first sub-positioning post;

The second sub-positioning hole is connected to the second sub-positioning post;

The third sub-positioning hole is connected to the third sub-positioning post; the vertical distance between the first sub-positioning hole and the first optical transceiver component is smaller than the vertical distance between the third sub-positioning hole and the first optical transceiver component. vertical distance;

The fourth sub-positioning hole is connected to the fourth sub-positioning post; the vertical distance between the second sub-positioning hole and the first optical transceiver component is smaller than the vertical distance between the fourth sub-positioning hole and the first optical transceiver component. vertical distance.
The optical module according to claim 2, wherein the first circuit board further includes:

The first card interface includes:

The first sub-card interface is formed by an inward recess between the first end of the first circuit board and the first side wall of the first circuit board. The first sub-card interface is not in contact with the first sub-positioning hole. connected;

The second sub-card interface is formed by an inward recess between the second end of the first circuit board and the second side wall of the first circuit board. The second sub-card interface is not in contact with the second sub-positioning hole. connected;

The second card interface includes:

The third sub-card interface is formed by an inward recess between the second end of the first circuit board and the first side wall of the first circuit board. The third sub-card interface is not in contact with the third sub-positioning hole. connected;

A fourth sub-card interface is formed by an inward recess of the second side wall of the first circuit board, and the fourth sub-card interface is connected with the fourth sub-positioning hole;

A first notch area is formed by an inward recess between the first end of the first circuit board and the first side wall of the first circuit board, and the first notch area is connected to the first daughter card interface;

The second notch area is formed by an inward recess of the first side wall of the first circuit board, and the second notch area has the first sub-positioning hole and the second sub-positioning hole.
The optical module according to claim 3, wherein the base includes:

A third card interface is provided corresponding to the first card interface. The third card interface includes:

A fifth sub-card interface is provided corresponding to the first sub-card interface, and the fifth sub-card interface is formed by an inward recess of the side wall of the first fixing plate;

A sixth sub-card interface is provided corresponding to the second sub-card interface, and the sixth sub-card interface is formed by an inward recess of the side wall of the third fixing plate;

A fourth card interface is provided corresponding to the second card interface, and the fourth card interface includes:

A seventh sub-card interface is provided corresponding to the third sub-card interface. The seventh sub-card interface is formed by inward recesses of the side walls of the first fixing plate and the second fixing plate;

The eighth sub-card interface is provided corresponding to the fourth sub-card interface. The eighth sub-card interface is formed by the side walls of the third fixing plate being recessed inward.
The optical module according to claim 1, wherein the support column includes:

The first sub-support column is connected to the first sub-positioning column;

The second sub-support column and the first sub-support column are both arranged on the first fixed plate, and the second sub-support column is connected to the second sub-positioning column;

The third sub-support column is connected to the third sub-positioning column;

The fourth sub-support column and the third sub-support column are both arranged on the third fixed plate, and the fourth sub-support column is not connected to the fourth sub-positioning column.
The optical module according to claim 1, wherein the base further includes:

a second fixed plate with a second end connected to the first end of the third fixed plate;

The second end of the fourth fixing plate is connected to the first end of the first fixing plate.
The optical module according to claim 3, wherein the positioning post further has:

The support notch and the limiting protrusion are respectively located on different surfaces of the positioning post.
The optical module according to claim 7, further comprising:

The upper shell includes an upper side plate, wherein the upper side plate has:

third gap area;

A fourth notch area is not connected to the third notch area, the fourth notch area includes a third sub-notch area, a fourth sub-notch area and a fifth sub-notch area, the third sub-notch area is connected to the The support notches are connected, and the fifth sub-notch area and the fourth sub-notch area are more recessed relative to the third sub-notch area;

The positioning plate is located between the third notch area and the fourth notch area, and is snap-connected to the first card interface and the second card interface.
The optical module according to claim 1, further comprising:

The upper shell has:

Storage slot;

first connection hole;

The first end of the limiting plate is more recessed relative to the storage slot, and the second end of the limiting plate is more recessed relative to the first end; wherein, the limiting plate has a limiting cavity;

The unlocking component is configured to realize or release the engagement relationship between the optical module and the host computer. The unlocking component has a second connection hole and a connection shaft. The second connection hole and the first connection hole pass through the The connecting shaft realizes the connection; wherein, the unlocking component includes:

The second end of the unlocking handle is located in the storage slot of the upper housing. The second end of the unlocking handle has a first protrusion, and the first protrusion protrudes toward the optical port;

The inner surface of the first end of the unlocker is connected to the first protrusion. The second end of the unlocker has a fixing post and a latch. The fixing post is located on the inner surface of the unlocker. The latch The coupling piece is located on the outer surface of the unlocker, and the coupling piece cooperates with the bayonet of the host computer to realize the engagement relationship between the optical module and the host computer;

The elastic member has a fixed end fixed on the fixed post of the unlocker and a movable end placed in the limiting cavity of the upper housing.
The optical module according to claim 9, wherein the unlocker includes:

The inner surface of the first end of the connecting body is connected to the first protrusion of the unlocking handle, wherein the connecting body includes:

The first sub-connector has a limiting block on its inner surface, and the limiting block is configured to limit the position of the first protrusion;

A second sub-connector is located between the first sub-connector and the third sub-connector;

A third sub-connector has the second connection hole; the thickness dimension of the first sub-connector, the thickness dimension of the second sub-connector and the thickness dimension of the third sub-connector increase in sequence;

The unlocker body has a first end connected to the second end of the connecting body, and the inner surface of the second end of the unlocker body has the Fixing post, the outer surface of the second end of the unlocker body has the engaging piece.
The optical module according to claim 9, wherein the limiting plate includes:

The first limiting plate has a second end that is more concave than the first end;

A second limiting plate is connected to the second end of the first limiting plate, and the second limiting plate is more recessed relative to the first limiting plate; wherein the second limiting plate has Describe the limiting cavity.
The optical module according to claim 9, wherein the storage slot includes:

The first limiting part includes:

connectors;

Fixing parts are respectively connected to both ends of the connecting part. The fixing part has a limiting hole, and the limiting hole is formed by the fixing plate being recessed toward the optical port;

The second limiting member and the connecting member of the first limiting member form a second storage cavity. The second storage cavity is configured to place the first protrusion. The second limiting member have:

The fifth notch area is formed by the second limiting member being recessed toward the electrical port direction, and the fifth notch area is provided correspondingly to the limiting block.
The optical module according to claim 1, wherein the second sub-flexible circuit board includes:

A first connection part, a first end connected to the light receiving component of the first optical transceiver component;

The second connection part has a first end connected to the second end of the first connection part, a second end of the second connection part connected to the first connection flexible circuit board, and the width of the second connection part The size is smaller than the width size of the first connecting portion.
The optical module according to claim 1, wherein the fourth sub-flexible circuit board includes:

The third connection part has a first end connected to the light receiving component of the second optical transceiver component;

The fourth connecting part has a first end connected to the second end of the third connecting part, a second end of the fourth connecting part connected to the second connecting flexible circuit board, and the width of the fourth connecting part The size is smaller than the width size of the third connecting portion.
The optical module according to claim 1, wherein the length dimension of the first sub-flexible circuit board is smaller than the length dimension of the second sub-flexible circuit board, and the length dimension of the third sub-flexible circuit board is smaller than the length dimension of the second sub-flexible circuit board. The length dimension of the fourth sub-flexible circuit board.