CN218350552U

CN218350552U - Optical module

Info

Publication number: CN218350552U
Application number: CN202222129012.7U
Authority: CN
Inventors: 迟亚勋; 潘红超; 王力; 司宝峰
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-08-12
Filing date: 2022-08-12
Publication date: 2023-01-20
Anticipated expiration: 2032-08-12

Abstract

The application discloses optical module, including first, second light transceiver module. The first light receiving and transmitting assembly is connected with the lower surface of the first circuit board through the second flexible circuit board. And the second optical transceiving component is arranged in parallel with the first optical transceiving component and is connected with the upper surface of the first circuit board through a third flexible circuit board. The second flexible circuit board and the third flexible circuit board each include a connection flexible circuit board and two sub flexible circuit boards. And the first end of the flexible circuit board is connected with the two sub flexible circuit boards respectively, and the second end of the flexible circuit board is connected with the surface of the first circuit board. In this application, second flexible circuit board and third flexible circuit board all include a connection flexible circuit board and two sub-flexible circuit boards, connect the first end of flexible circuit board and be connected with two sub-flexible circuit boards respectively, connect the surface connection of flexible circuit board second end and first circuit board, and direct the flexible circuit board that will connect welds on the surface of first circuit board, realizes being connected of optical transceiver subassembly and circuit board.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

The optical communication technology can be applied to novel services and application modes such as cloud computing, mobile internet, video and the like. The optical module realizes the function of photoelectric conversion in the technical field of optical communication, and is one of key devices in optical communication equipment, and the intensity of an optical signal input into an external optical fiber by the optical module directly influences the quality of optical fiber communication.

Generally, the optical module includes an optical transceiver module, a light emitting device of the optical transceiver module is connected to the circuit board through a first flexible circuit board, and a light receiving device of the optical transceiver module is connected to the circuit board through a second flexible circuit board. However, if the optical module includes two optical transceiver modules arranged in parallel, how to connect the optical transceiver modules with the circuit board is achieved.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module, realizes being connected of light receiving and dispatching subassembly and circuit board.

A light module, comprising:

a first circuit board including a first positioning hole;

the second circuit board is electrically connected with the first circuit board through the first flexible circuit board and comprises a second positioning hole which is arranged corresponding to the first positioning hole;

the fixing frame is used for fixing the first circuit board and the second circuit board;

the first optical transceiving component is connected with the lower surface of the first circuit board through a second flexible circuit board;

the second optical transceiving component is arranged in parallel with the first optical transceiving component and is connected with the upper surface of the first circuit board through a third flexible circuit board;

the second flexible circuit board and the third flexible circuit board respectively comprise a connecting flexible circuit board and two sub flexible circuit boards;

the first end of the connecting flexible circuit board is respectively connected with the two sub flexible circuit boards, and the second end of the connecting flexible circuit board is connected with the surface of the first circuit board;

the fixing frame comprises a base, a positioning column and a supporting column;

the positioning column is arranged corresponding to the second positioning hole, clamped at the first positioning hole and the second positioning hole, and one end far away from the base is provided with a limiting bulge;

the supporting column is connected with the lower surface of the first circuit board and used for supporting the first circuit board;

and the limiting bulge is connected with the upper surface of the second circuit board and used for limiting the position of the second circuit board.

Has the beneficial effects that: the application provides an optical module, including first circuit board, second circuit board, first light receiving and dispatching subassembly, second light receiving and dispatching subassembly and mount. The first circuit board includes a first positioning hole. The second circuit board is electrically connected with the first circuit board through the first flexible circuit board and comprises a second positioning hole. The first positioning hole and the second positioning hole are correspondingly arranged. The fixing frame is used for fixing the first circuit board and the second circuit board. The fixing frame comprises a base. The base is provided with a positioning column and a supporting column. And the positioning column is arranged corresponding to the second positioning hole, is clamped in the first positioning hole and the second positioning hole, and is provided with a limiting bulge at one end far away from the base. And the supporting column is connected with the lower surface of the first circuit board and is used for supporting the first circuit board. And the limiting bulge is connected with the upper surface of the second circuit board and used for limiting the position of the second circuit board. The positioning column is clamped in the first positioning hole and the second positioning hole, the supporting column is connected with the lower surface of the first circuit board, and the limiting bulge is connected with the upper surface of the second circuit board, so that the first circuit board and the second circuit board are integrated. The first light receiving and transmitting assembly is connected with the lower surface of the first circuit board through the second flexible circuit board. And the second optical transceiving component is arranged in parallel with the first optical transceiving component and is connected with the upper surface of the first circuit board through a third flexible circuit board. The second flexible circuit board and the third flexible circuit board each include a connection flexible circuit board and two sub flexible circuit boards. And the first end of the flexible circuit board is connected with the two sub flexible circuit boards respectively, and the second end of the flexible circuit board is connected with the surface of the first circuit board. The first end of the connecting flexible circuit board is respectively connected with the two sub flexible circuit boards, which shows that the connecting flexible circuit board connects one sub flexible circuit board and the other sub flexible circuit board into a whole. Because the connecting flexible circuit board connects one sub-flexible circuit board and the other sub-flexible circuit board into a whole, and the second end of the connecting flexible circuit board is connected with the surface of the first circuit board, when the connecting flexible circuit board is welded on the surface of the first circuit board, the connecting flexible circuit board is directly welded on the surface of the first circuit board without considering enough safety distance, and the connection of the optical transceiving component and the circuit board is realized. In this application, second flexible circuit board and third flexible circuit board all include one and connect flexible circuit board and two sub-flexible circuit boards, connect the first end of flexible circuit board and be connected with two sub-flexible circuit boards respectively, connect the surface connection of flexible circuit board second end and first circuit board, when will connect flexible circuit board and weld in the surface of first circuit board, directly will connect flexible circuit board weld on the surface of first circuit board can, realized being connected of optical transceiver module and circuit board.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a connection diagram of an optical communication system;

FIG. 2 is a block diagram of an optical network terminal;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is another block diagram of a light module according to some embodiments;

FIG. 5 is an exploded block diagram of a light module according to some embodiments;

FIG. 6 is another exploded block diagram of a light module according to some embodiments;

FIG. 7 is a block diagram of an optical transceiver component, circuit board and mounting bracket according to some embodiments;

FIG. 8 is another block diagram of an optical transceiver component, a circuit board, and a mounting bracket according to some embodiments;

FIG. 9 is an exploded block diagram of an optical transceiver component, a circuit board, and a mounting bracket according to some embodiments;

FIG. 10 is a block diagram of a second flexible circuit board according to some embodiments;

FIG. 11 is a block diagram of a third flexible circuit board according to some embodiments;

FIG. 12 is a block diagram of a circuit board and a mounting bracket according to some embodiments;

FIG. 13 is another block diagram of a circuit board and a mounting bracket according to some embodiments;

FIG. 14 is a block diagram of a holder and a first circuit board according to some embodiments;

FIG. 15 is an exploded view of a circuit board and a mount according to some embodiments;

fig. 16 is an exploded view of a circuit board according to some embodiments;

FIG. 17 is a block diagram of a first circuit board according to some embodiments;

FIG. 18 is a block diagram of a second circuit board according to some embodiments;

FIG. 19 is a block diagram of a mount according to some embodiments;

FIG. 20 is a block diagram of the upper housing, optical transceiver component, circuit board and mounting bracket according to some embodiments;

FIG. 21 is another block diagram of the upper housing, optical transceiver component, circuit board and mounting bracket according to some embodiments;

FIG. 22 is a block diagram of the upper housing and the first circuit board according to some embodiments;

FIG. 23 is another block diagram of the upper housing and the first circuit board according to some embodiments;

FIG. 24 is a block diagram of an upper housing, a first circuit board, and a mount according to some embodiments;

FIG. 25 is a block diagram of an upper housing and an unlocking member according to some embodiments;

FIG. 26 is a block diagram of an upper housing according to some embodiments;

FIG. 27 is another block diagram of an upper housing according to some embodiments;

FIG. 28 is a block diagram of a lower housing according to some embodiments;

FIG. 29 is a cross-sectional view of a light module according to some embodiments;

FIG. 30 is another cross-sectional view of a light module according to some embodiments;

FIG. 31 is a block diagram of an unlocking member according to some embodiments;

FIG. 32 is another block diagram of an unlocking member according to some embodiments;

FIG. 33 is a block diagram of an unlocker in accordance with some embodiments;

FIG. 34 is another block diagram of an unlocker in accordance with some embodiments;

fig. 35 is a block diagram of an unlock handle according to some embodiments.

Detailed Description

In an optical communication system, an optical signal is used to carry information to be transmitted, and the optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Since light has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost, low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for power supply, I2C signal transmission, data information transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system. As shown in fig. 1, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, theoretically, infinite distance transmission can be realized. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing apparatus 2000 and the remote server 1000 is made by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port configured to access the optical fiber 101 and an electrical port, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that an information connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101. Since the optical module 200 is a tool for implementing the interconversion between the optical signal and the electrical signal, and has no function of processing data, information is not changed in the above-mentioned photoelectric conversion process.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the electrical signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a configuration diagram of the optical network terminal, and fig. 2 only shows a configuration of the optical module 200 of the optical network terminal 100 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a circuit board 105 disposed within the housing, a cage 106 disposed on a surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, so that the optical module 200 is connected to the optical network terminal 100 by a bidirectional electrical signal. Further, the optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional optical signal connection with the optical fiber 101.

FIG. 3 is a first angular block diagram of a light module according to some embodiments. FIG. 4 is a second angular block diagram of a light module according to some embodiments. FIG. 5 is an exploded block diagram of a light module according to some embodiments. FIG. 6 is another exploded block diagram of a light module according to some embodiments. As shown in fig. 3 to 6, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, a first optical transceiver module 401, and a second optical transceiver module 402.

The shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two openings; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located at both sides of the bottom plate 2021 and disposed perpendicular to the bottom plate 2021; the upper case 201 includes a cover 2011, and the cover 2011 covers the two lower side plates 2022 of the lower case 202 to form the above case.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located at both sides of the bottom plate 2021 and disposed perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011 and two upper side plates located on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with the two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end portion (right end in fig. 3) of the optical module 200, and the opening 205 is also located at an end portion (left end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. The opening 204 is an electrical port, and a gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (for example, the optical network terminal 100); the opening 205 is an optical port configured to receive the external optical fiber 101, so that the external optical fiber 101 is connected to the optical transceiver module 400 inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined to facilitate the installation of the components such as the circuit board 300, the first optical transceiver module 401 and the second optical transceiver module 402 into the shells, and the upper shell 201 and the lower shell 202 form encapsulation protection for the components. In addition, when the components such as the circuit board 300, the first optical transceiver module 401, the second optical transceiver module 402 and the like are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the components are convenient to deploy, and the automatic production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component located outside its housing, and the unlocking component is configured to realize a fixed connection between the optical module 200 and the upper computer or release the fixed connection between the optical module 200 and the upper computer.

The unlocking member 203 is illustratively located on the bottom 2011 of the upper housing 201 and has a snap that mates with a host cage (e.g., the cage 106 of the onu 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging piece of the unlocking member; when the unlocking component is pulled, the clamping piece of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping piece and the upper computer is changed, the clamping relation between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. Examples of the electronic components include capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip includes, for example, a Micro Controller Unit (MCU), a laser driver chip, a limiting amplifier (limiting amplifier), a Clock and Data Recovery (CDR) chip, a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear the electronic components and chips; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide smooth bearing; the rigid circuit board can also be inserted into an electric connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The gold fingers may be disposed on only one side of the circuit board 300, or on both sides of the circuit board 300, so as to meet the situation of large pin number requirement. The golden finger is configured to establish an electrical connection with the upper computer to realize power supply, grounding, I2C signal transmission, data signal transmission and the like.

Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards. For example, a flexible circuit board may be used to connect the rigid circuit board and the optical transceiver module.

The optical transceiver component 400 includes a light emitting device configured to enable emission of an optical signal and a light receiving device configured to enable reception of the optical signal. Illustratively, the light emitting device and the light receiving device are combined together to form an integrated light transceiving component.

After the traditional optical module comprising a group of light emitting devices and a group of light receiving devices is improved into an optical module comprising two groups of light emitting devices and two groups of light receiving devices, the space of the optical module reserved for a circuit board is smaller and smaller, so that a new circuit board connected with the original circuit board needs to be added above or below the original circuit board to solve the problem of small space of the circuit board in the optical module.

In a traditional optical module, a first circuit board and a second circuit board are electrically connected through a flexible circuit board, and the first circuit board and the second circuit board are fixed by using a gasket in an extruding mode. However, the first circuit board and the second circuit board are fixed by pressing the gasket, so that the first circuit board and the second circuit board cannot be effectively fixed as a whole, which is inconvenient for assembling the optical module. Therefore, a fixing frame is required to be designed so that the first circuit board and the second circuit board are integrated.

Fig. 7 is a block diagram of an optical transceiver component, a circuit board, and a mounting bracket according to some embodiments. Fig. 8 is another block diagram of an optical transceiver component, a circuit board, and a mounting bracket according to some embodiments. Fig. 9 is an exploded structural view of an optical transceiver component, a circuit board and a fixing frame according to some embodiments. As can be seen from fig. 7 to 9, in some embodiments, the circuit board 300 includes a first circuit board 301 and a second circuit board 302, the first circuit board 301 and the second circuit board 302 are electrically connected through a first flexible circuit board 303, and the fixing frame 500 is used for fixing the first circuit board 301 and the second circuit board 302. The fixing frame 500 fixes the first circuit board 301 and the second circuit board 302 as a whole.

The end surface of the first circuit board 301 is provided with gold fingers. And the second circuit board 302 is located between the first circuit board 301 and the upper shell 201, the upper surface of the second circuit board is provided with a chip connected with the first heat-conducting gasket, and the lower surface of the second circuit board is provided with a second heat-conducting gasket. The first circuit board 301 and the second circuit board 302 are both hard circuit boards.

The first thermal pad, the upper surface of which is connected to the inner surface of the upper housing 201, and the lower surface of which is connected to the chip on the second circuit board 302, is used for absorbing part of the heat generated by the chip on the second circuit board 302 and transferring the heat generated by the chip on the second circuit board 302 to the upper housing 201, so as to reduce the temperature of the chip.

And a second thermal pad, an upper surface of which is connected to the lower surface of the second circuit board 302 and a lower surface of which is not connected to the upper surface of the first circuit board 301, for absorbing heat generated by the second circuit board 302 to lower the temperature of the second circuit board 302.

Fig. 10 is a block diagram of a second flexible circuit board according to some embodiments. Fig. 11 is a block diagram of a third flexible circuit board according to some embodiments. As can be seen in fig. 7-11, in some embodiments, the first optical transceiver component 401 is connected to the first circuit board 301 through the second flexible circuit board 304 for transmitting and receiving optical signals. The second optical transceiver module 402 is disposed in parallel with the first optical transceiver module 401, and is connected to the first circuit board 301 through the third flexible circuit board 305, so as to implement transmission and reception of optical signals. The second flexible circuit board 304 and the third flexible circuit board 305 each include one connection flexible circuit board and two sub flexible circuit boards. And the first end of the flexible circuit board is connected with the two sub flexible circuit boards respectively, and the second end of the flexible circuit board is connected with the surface of the first circuit board. And a sub flexible circuit board having a first end connected to the light emitting device of the first optical transceiver module 401 or the second optical transceiver module 402 and a second end connected to the first end of the flexible circuit board. And a first end of the other sub flexible circuit board is connected with the light receiving device of the first optical transceiver module 401 or the second optical transceiver module 402, and a second end of the other sub flexible circuit board is connected with the first end of the flexible circuit board.

The first end of the connecting flexible circuit board is respectively connected with the two sub flexible circuit boards, which shows that the connecting flexible circuit board connects one sub flexible circuit board and the other sub flexible circuit board into a whole. Because the connecting flexible circuit board connects one sub-flexible circuit board and the other sub-flexible circuit board into a whole, and the second end of the connecting flexible circuit board is connected with the surface of the first circuit board, when the connecting flexible circuit board is welded on the surface of the first circuit board, the connecting flexible circuit board is directly welded on the surface of the first circuit board without considering enough safety distance, and the connection of the optical transceiving component and the circuit board is realized.

In particular, the method comprises the following steps of,

the first optical transceiver module 401 includes a first round-square tube 4011, a first light emitting device 4012, a first light receiving device 4013, a first optical module, and a first fiber adapter 4014. The first round and square tube 4011 is provided with a first tube opening, a second tube opening and a third tube opening. First light emitting device 4012 inlays in first mouth of pipe, and first light receiving device 4013 inlays in the second mouth of pipe, and first optical subassembly sets up in the inner chamber of first round square body 4011, and first optic fibre adapter 4014 inlays in the third mouth of pipe, and first light emitting device 4012 and first light receiving device 4013 establish optical connection with first optic fibre adapter 4014 respectively to realize the two-way light transmission mode of single fiber.

The second flexible circuit board 304 includes a first connection flexible circuit board 3041, a first sub flexible circuit board 3042, and a second sub flexible circuit board 3043. The first end of the first connecting flexible circuit board 3041 is connected to the second ends of the first sub-flexible circuit board 3042 and the second sub-flexible circuit board 3043, respectively, and the second end is connected to the lower surface of the first circuit board 301. A first end of the first sub flexible circuit board 3042 is connected to the light emitting device of the first optical transceiver module 401. The second sub flexible circuit board 3043 has a first end connected to the light receiving device of the first optical transceiver module 401, and is not connected to the first sub flexible circuit board 3042, and is located between the first sub flexible circuit board 3042 and the third flexible circuit board 305.

Since the vertical distance between first circular and square tube 4011 and first circuit board 301 is greater than the vertical distance between the first tube port of first circular and square tube 4011 and first circuit board 301, the length of second sub-flexible circuit board 3043 between first light receiving device 4013 on the second tube port connected to first circular and square tube 4011 and first circuit board 301 is greater than the length of first sub-flexible circuit board 3042 between first light emitting device 4012 on the first tube port connected to first circular and square tube 4011 and first circuit board 301.

A first light emitting device 4012 connected to a lower surface of the first circuit board 301 through a first sub flexible circuit board 3042 and a first connection flexible circuit board 3041 for emitting data light. The first light receiving device 4013 is connected to the lower surface of the first circuit board 301 through the second sub flexible circuit board 3043 and the first connection flexible circuit board 3041, and is configured to receive data light. The first optical component is disposed in the inner cavity of the first circular-square tube 4011 and used for adjusting the data light emitted by the first light emitting device 4012 and adjusting the data light incident on the first light receiving device 4013. A first fiber optic adapter 4014 for connecting optical fibers.

If the second flexible circuit board 304 only includes the first sub flexible circuit board and the second sub flexible circuit board which are not connected, and the first sub flexible circuit board and the second sub flexible circuit board which are not connected are soldered on the lower surface of the first circuit board 301, a sufficient safety distance must be left between the soldering point of the first circuit board 301 on the first sub flexible circuit board and the soldering point of the second sub flexible circuit board on the first circuit board 301, so as to avoid signal crosstalk caused by the overlapping of the soldering point of the first sub flexible circuit board on the first circuit board 301 and the soldering point of the second sub flexible circuit board on the first circuit board 301.

Since the first connecting flexible circuit board 3041 connects the first sub flexible circuit board 3042 and the second sub flexible circuit board 3043 into a whole, and the other side of the connecting flexible circuit board is connected to the lower surface of the first circuit board 301, when the first connecting flexible circuit board 3041 is soldered to the lower surface of the first circuit board 301, it is not necessary to consider that a sufficient safety distance is left, and the first connecting flexible circuit board 3041 is directly soldered to the lower surface of the first circuit board 301, so that the connection between the first optical transceiver module and the first circuit board is realized.

The second sub flexible circuit board 3043 includes a first connection portion 30431 and a second connection portion 30432, a first end of the first connection portion 30431 is electrically connected to the first light receiving device 4013, a second end of the first connection portion 30431 is connected to a first end of the second connection portion 30432, and a second end of the second connection portion 30432 is connected to the first connection flexible circuit board 3041.

A first end of the first connection portion 30431 is electrically connected to the first light receiving device 4013. Specifically, the first connection portion 30431 is provided with a first solder hole 304311, and a pin of the first receiving device 4013 is inserted into the first solder hole 304311 and soldered to the first solder hole 304311, so that the first receiving device 4013 is electrically connected to the second sub flexible circuit board 3043.

Since the signal lines laid on the first connecting portion 30431 need to avoid the first solder holes 304311, and the signal lines laid on the second connecting portion 30432 cannot avoid other devices, the width of the first connecting portion 30431 is greater than that of the second connecting portion 30432.

The second optical transceiver module 402 includes a second round square tube body 4021, a second light emitting device 4022, a second light receiving device 4023, a second optical module, and a second fiber adapter 4024. A first pipe orifice, a second pipe orifice and a third pipe orifice are also arranged on the second round and square pipe body 4021. The second light emitting device 4022 is embedded in the first pipe orifice, the second light receiving device 4023 is embedded in the second pipe orifice, the second optical component is arranged in the inner cavity of the second round and square pipe body 4021, the second optical fiber adapter 4024 is embedded in the third pipe orifice, and the second light emitting device 4022 and the second light receiving device 4023 are respectively connected with the second optical fiber adapter 4024 in an optical mode to realize a single-fiber bidirectional optical transmission mode.

The third flexible circuit board 305 includes a second connection flexible circuit board 3051, a third sub flexible circuit board 3052, and a fourth sub flexible circuit board 3053. The second connecting flexible circuit board 3051 has a first end connected to the second ends of the third sub flexible circuit board 3052 and the fourth sub flexible circuit board 3053, respectively, and a second end connected to the upper surface of the first circuit board 301. And a third sub flexible circuit board 3052, a first end of which is connected to the light emitting device of the second optical transceiver module 402. The fourth sub flexible circuit board 3053 is connected to the light receiving device of the second optical transceiver module 402 at a first end, is not connected to the third sub flexible circuit board 3052, and is located between the third sub flexible circuit board 3052 and the second flexible circuit board 304.

Since the vertical distance between the second circular and square tube body 4021 and the first circuit board 301 is greater than the vertical distance between the first nozzle of the second circular and square tube body 4021 and the first circuit board 301, the length dimension of the fourth sub flexible circuit board 3053 connected between the second light receiving device 4023 on the second nozzle of the second circular and square tube body 4021 and the first circuit board 301 is greater than the length dimension of the third sub flexible circuit board 3052 connected between the second light emitting device 4022 on the first nozzle of the second circular and square tube body 4021 and the first circuit board 301.

The second light emitting device 4022 is connected to the upper surface of the first circuit board 301 through the third sub flexible circuit board 3052 and the second connection flexible circuit board 3051, and emits data light. The second light receiving device 4023 is connected to the upper surface of the first circuit board 301 through the fourth sub flexible circuit board 3053 and the second connection flexible circuit board 3051, and receives data light. And the second optical component is arranged in the inner cavity of the second round and square tube 4021 and is used for adjusting the data light emitted by the second light emitting device 4022 and adjusting the data light incident to the second light receiving device 4023. A second fiber adapter 4024 for connecting an optical fiber. Wherein, the second connection flexible circuit board 3051 is connected with the upper surface of the first circuit board 301.

If the third flexible circuit board 305 only includes the third sub flexible circuit board and the fourth sub flexible circuit board which are not connected, and the third sub flexible circuit board and the fourth sub flexible circuit board which are not connected are soldered on the upper surface of the first circuit board 301, a sufficient safety distance must be left between the soldering point of the first circuit board 301 of the third sub flexible circuit board and the soldering point of the first circuit board 301 of the fourth sub flexible circuit board, so as to avoid signal crosstalk caused by the overlapping of the soldering point of the third sub flexible circuit board on the first circuit board 301 and the soldering point of the fourth sub flexible circuit board on the first circuit board 301.

Because the second connection flexible circuit board 3051 connects the third sub flexible circuit board 3052 and the fourth sub flexible circuit board 3053 as a whole, and the other side of the second connection flexible circuit board 3051 is connected to the lower surface of the first circuit board 301, when the second connection flexible circuit board 3051 is soldered to the upper surface of the first circuit board 301, it is not necessary to consider that a sufficient safety distance is left, it is sufficient to solder the second connection flexible circuit board 3051 directly to the upper surface of the first circuit board 301, and the connection of the second optical transceiver module and the first circuit board is achieved.

The fourth sub flexible circuit board 3053 includes a third connection portion 30531 and a fourth connection portion 30532, a first end of the third connection portion 30531 is electrically connected to the fourth connection portion 30532, a second end of the third connection portion 30531 is connected to a first end of the fourth connection portion 30532, and a second end of the fourth connection portion 30532 is connected to the second connection flexible circuit board 3051.

A first end of the third connection part 30531 is electrically connected to the second light receiver 30531. Specifically, the third connection portion 30531 is provided with a second solder hole 305311, and the pin of the second receiving device 4023 is inserted into the second solder hole 305311 and soldered at the second solder hole 305311, so that the second receiving device 4023 is electrically connected to the fourth sub flexible circuit board 3053.

Since the signal line laid on the third connecting portion 30531 needs to be free from the second solder hole 305311 and the signal line laid on the fourth connecting portion 30532 cannot be free from other devices, the width of the third connecting portion 30531 is larger than the width of the fourth connecting portion 30532.

In this application, second flexible circuit board and third flexible circuit board all include one and connect flexible circuit board and two sub-flexible circuit boards, connect the first end of flexible circuit board and be connected with two sub-flexible circuit boards respectively, connect the surface connection of flexible circuit board second end and first circuit board, when will connect flexible circuit board and weld in the surface of first circuit board, directly will connect flexible circuit board weld on the surface of first circuit board can, realized being connected of optical transceiver module and circuit board.

Fig. 12 is a block diagram of a circuit board and a mounting bracket according to some embodiments. Fig. 13 is another block diagram of a circuit board and a mounting bracket according to some embodiments. Fig. 14 is a block diagram of a holder and a first circuit board according to some embodiments. Fig. 15 is an exploded view of a circuit board and a mount according to some embodiments. Fig. 16 is an exploded view of a circuit board according to some embodiments. Fig. 17 is a block diagram of a first circuit board according to some embodiments. FIG. 18 is a block diagram of a second circuit board according to some embodiments. Fig. 19 is a block diagram of a mount according to some embodiments. As can be seen in fig. 7-19, in some embodiments, the first circuit board 301 includes a first positioning hole 3011, a first card interface 3012, a second card interface 3013, a first notch region 3014, and a second notch region 3015. In particular, the method comprises the following steps of,

the first positioning hole 3011 is formed by a sidewall of the first circuit board 301 being recessed inward. First positioning hole 3011 includes first sub-positioning hole 30111, second sub-positioning hole 30112, third sub-positioning hole 30113, and fourth sub-positioning hole 30114. The first sub-positioning hole 30111 and the second sub-positioning hole 30112 are each formed by a first side wall of the first circuit board 301 being recessed inward, and the third sub-positioning hole 30113 and the fourth sub-positioning hole 30114 are each formed by a second side wall of the first circuit board 301 being recessed inward. The first sub-positioning hole 30111 and the third sub-positioning hole 30113 are close to one end of the optical transceiver module 400, the second sub-positioning hole 30112 and the fourth sub-positioning hole 30114 are far from one end of the optical transceiver module 400, a vertical distance between the first sub-positioning hole 30111 and the optical transceiver module 400 is smaller than a vertical distance between the third sub-positioning hole 30113 and the optical transceiver module 400, and a vertical distance between the second sub-positioning hole 30112 and the optical transceiver module 400 is smaller than a vertical distance between the fourth sub-positioning hole 30114 and the optical transceiver module 400.

First card interface 3012 includes a first daughter card interface 30121 and a second daughter card interface 30122. The first daughter card interface 30121 is formed by a first end of the first circuit board 301 and a first sidewall of the first circuit board 301 being recessed inward, and the second daughter card interface 30122 is formed by a second sidewall of the first circuit board 301 being recessed inward. The vertical distance between the first daughter card interface 30121 and the optical transceiver module 400 is less than the vertical distance between the second daughter card interface 30122 and the optical transceiver module 400.

Second card interface 3013 includes a third daughter card interface 30131 and a fourth daughter card interface 30132. The third daughter card interface 30131 is formed by inward recessing of the second end of the first circuit board 301 and the first sidewall of the first circuit board 301, and the third daughter card interface 30132 is formed by inward recessing of the second sidewall of the first circuit board 301. The vertical distance between the third daughter card interface 30131 and the optical transceiver module 400 is greater than the vertical distance between the fourth daughter card interface 30132 and the end of the first circuit board 301 close to the optical transceiver module 400.

The first notch region 3014 is formed by both the first end of the first circuit board 301 and the first side wall of the first circuit board 301 being recessed inward. The first notched area 3014 is recessed relative to the recess of the first daughter card interface 30121 toward the first sidewall of the first circuit board 301.

Since the first end of the second flexible circuit board 304 is fixed on the first optical transceiver component 401, the second end of the second flexible circuit board 304 is fixed on the lower surface of the first circuit board 301, and the bent region of the second flexible circuit board 304 is connected with the first end of the first circuit board 301, which is easy to damage the second flexible circuit board 304. In order to avoid the connection of the bent region of the second flexible circuit board 304 with the first end of the first circuit board 301, in some embodiments, the first circuit board 301 is provided with a first notch region 3014. Due to the existence of the first gap area 3014, the bending area of the second flexible circuit board 304 is not connected to the first end of the first circuit board 301, so that the situation that the second flexible circuit board 304 is damaged due to the connection of the bending area of the second flexible circuit board 304 and the first end of the first circuit board 301 is avoided.

The second notch region 3015 is formed by the first sidewall of the first circuit board 301 being recessed inward. The second notch region 3015 is provided with a first sub-positioning hole 30111 and a second sub-positioning hole 30112.

Since the side view of the third flexible circuit board 305 is arc-shaped, and both side walls of the circuit board 300 are close to the inner wall of the lower housing 202, if the side wall of the first circuit board 301 connected to the third flexible circuit board 305 is not provided with a notch region, the third flexible circuit board 305 is easily connected to the inner wall of the lower housing 202 directly, which is easy to damage the third flexible circuit board 305, and therefore, in some embodiments, the first circuit board 301 is provided with the second notch region 3015. The existence of the second notch area 3015 makes the third flexible circuit board 305 disconnected with the inner wall of the lower housing 202, avoiding the situation that the third flexible circuit board 305 is damaged because the third flexible circuit board 305 is disconnected with the inner wall of the lower housing 202.

Since the first sub-positioning holes 30111 are not connected to the first sub-card interface 30121, the area between the first sub-positioning holes 30111 and the first sub-card interface 30121 is a first connection area 3016. Since the second sub-positioning holes 30112 are not connected to the third daughter card interface 30131, the area between the second sub-positioning holes 30112 and the third daughter card interface 30131 is a second connection area 3017. Since the third sub-positioning holes 30113 are not connected to the second daughter card interface 30122, the area between the third sub-positioning holes 30113 and the second daughter card interface 30122 is a third connection area 3018. Since fourth sub-alignment holes 30114 are connected to fourth daughter card interface 30132, there is no connection area between fourth sub-alignment holes 30114 and fourth daughter card interface 30132.

As can be seen in fig. 7-19, in some embodiments, the second circuit board 302 includes a second positioning hole 3021. The second positioning holes 3021 are disposed corresponding to the first positioning holes 3011. The second positioning hole 3021 includes a fifth sub-positioning hole 30211, a sixth sub-positioning hole 30212, a seventh sub-positioning hole 30213, and an eighth sub-positioning hole 30214. Each of the fifth sub positioning hole 30211 and the sixth sub positioning hole 30212 is formed by the first side wall of the second circuit board 302 being recessed inward, the seventh sub positioning hole 30213 is formed by the second side wall of the second circuit board 302 being recessed inward, and the eighth sub positioning hole 30214 is formed by the second side wall of the second circuit board 302 and the second end of the second circuit board 302 being recessed inward. The fifth sub-positioning hole 30211 corresponds to the first sub-positioning hole 30111, the sixth sub-positioning hole 30212 corresponds to the second sub-positioning hole 30112, the seventh sub-positioning hole 30213 corresponds to the third sub-positioning hole 30113, and the eighth sub-positioning hole 30214 corresponds to the fourth sub-positioning hole 30114. The vertical distance between the fifth sub-positioning hole 30211 and the optical transceiver module 400 is shorter than the vertical distance between the sixth sub-positioning hole 30212 and the optical transceiver module 400, and the vertical distance between the seventh sub-positioning hole 30213 and the optical transceiver module 400 is shorter than the vertical distance between the eighth sub-positioning hole 30214 and the optical transceiver module 400.

As seen in fig. 7-19, in some embodiments, mount 500 includes a base 501. A positioning column 502 and a supporting column 503 are arranged on the base 501. In particular, the method comprises the following steps of,

the base 501 is located between the lower case 202 and the first circuit board 301. The supporting posts 503 disposed on the base 501 are connected to the first circuit board 301, so that the fixing frame 500 and the first circuit board 301 are integrated. The positioning posts 502 correspond to the first positioning holes 3011 of the first circuit board 301 and the second positioning holes 3021 of the second circuit board 302. The positioning posts 502 are clamped in the first positioning holes 3011 and the second positioning holes 3021, so that the first circuit board 301 and the second circuit board 302 are integrated.

The base 501 includes a first fixing plate 5011, a second fixing plate 5012, a third fixing plate 5013, and a fourth fixing plate 5014. The second end of the first fixing plate 5011 is connected to the first end of the second fixing plate 5012, the second end of the second fixing plate 5012 is connected to the first end of the third fixing plate 5013, the second end of the third fixing plate 5013 is connected to the first end of the fourth fixing plate 5014, and the second end of the fourth fixing plate 5014 is connected to the first end of the first fixing plate 5011.

The base is also provided with a third card interface 5015 and a fourth card interface 5016. In particular, the method comprises the following steps of,

the third card interface 5015 is provided corresponding to the first card interface 3012. The third card interface 5015 includes a fifth daughter card interface 50151 and a sixth daughter card interface 50152. Fifth daughter card interface 50151 is disposed corresponding to first daughter card interface 30121, and sixth daughter card interface 50152 is disposed corresponding to second daughter card interface 30122. The fifth daughter card interface 50151 is formed by inwardly recessing a sidewall of the first fixing plate 5011, and the sixth daughter card interface 50152 is formed by inwardly recessing a sidewall of the third fixing plate 5013.

Fourth card interface 5016 is provided corresponding to second card interface 3013. The fourth card interface 5016 includes a seventh daughter card interface 50161 and an eighth daughter card interface 50162. The seventh daughter card interface 50161 is disposed corresponding to the third daughter card interface 30131, and the eighth daughter card interface 50162 is disposed corresponding to the fourth daughter card interface 30132. The seventh daughter card interface 50161 is formed by inwardly recessing both sidewalls of the first fixing plate 5011 and sidewalls of the second fixing plate 5012, and the eighth daughter card interface 50162 is formed by inwardly recessing both sidewalls of the third fixing plate 5013.

Post 502 includes first sub-post 5021, second sub-post 5022, third sub-post 5023, and fourth sub-post 5024. First sub-positioning post 5021 and second sub-positioning post 5022 are both disposed on first fixing plate 5011, and third sub-positioning post 5023 and fourth sub-positioning post 5024 are both disposed on third fixing plate 5013. Fourth sub-positioning post 5024 is located at the end of the first end of third fixing plate 5013.

The positioning posts 502 correspond to the second positioning holes 3021. Specifically, first sub-positioning post 5021 corresponds to first sub-positioning hole 30111 and fifth sub-positioning hole 30211, second sub-positioning post 5022 corresponds to second sub-positioning hole 30112 and sixth sub-positioning hole 30212, third sub-positioning post 5023 corresponds to third sub-positioning hole 30113 and seventh sub-positioning hole 30213, and fourth sub-positioning post 5024 corresponds to fourth sub-positioning hole 30114 and eighth sub-positioning hole 30214.

Since the vertical distance between the first sub-positioning hole 30111 and the optical transceiver module 400 is smaller than the vertical distance between the third sub-positioning hole 30113 and the optical transceiver module 400, the vertical distance between the second sub-positioning hole 30112 and the optical transceiver module 400 is smaller than the vertical distance between the fourth sub-positioning hole 30114 and the optical transceiver module 400, the vertical distance between the first sub-positioning column 5021 and the optical transceiver module 400 is smaller than the vertical distance between the third sub-positioning column 5023 and the optical transceiver module 400, and the vertical distance between the second sub-positioning column 5022 and the optical transceiver module 400 is smaller than the vertical distance between the fourth sub-positioning column 5024 and the optical transceiver module 400. The vertical distance between first sub-positioning post 5021 and optical transceiver module 400 is less than the vertical distance between third sub-positioning post 5023 and optical transceiver module 400, and the vertical distance between second sub-positioning post 5022 and optical transceiver module 400 is less than the vertical distance between fourth sub-positioning post 5024 and optical transceiver module 400, which means that first sub-positioning post 5021 and second sub-positioning post 5022 on first fixing plate 5011 are asymmetrically arranged with third sub-positioning post 5023 and fourth sub-positioning post 5024 on third fixing plate 5013.

The first circuit board 301 is provided with a main chip, and the position of the main chip is set according to the signal lines laid on the first circuit board 301, so that the position of the main chip is fixed. If it is desired to fix the first circuit board 301 and the second circuit board 302 into a whole by the fixing frame 500 without changing the position of the main chip, the first sub-positioning post 5021 and the second sub-positioning post 5022 on the first fixing plate 5011 and the third sub-positioning post 5023 and the fourth sub-positioning post 5024 on the third fixing plate 5013 need to be arranged asymmetrically.

First sub-positioning post 5021 and second sub-positioning post 5022 on first fixing plate 5011 and third sub-positioning post 5023 and fourth sub-positioning post 5024 on third fixing plate 5013 are asymmetrically arranged, so that first circuit board 301 and second circuit board 302 are fixed into a whole by fixing frame 500 without changing the position of the main chip on the first circuit board.

One end of the positioning column 502, which is far away from the base 501, is provided with a supporting notch and a limiting protrusion, the supporting notch is connected with the lower surface of the upper side plate of the upper shell 201, the lower surface of the limiting protrusion is connected with the upper surface of the second circuit board 302, and the height difference between the limiting protrusion and the base is greater than that between the supporting notch and the base. For example, first sub-positioning post 5021 includes a first supporting notch 50211 and a first limit protrusion 50212. The first support gap 50211 is connected with the lower surface of the upper side plate of the upper housing 201, and the lower surface of the first limit protrusion 50212 is connected with the upper surface of the second circuit board 302.

The limiting protrusions are used for limiting the position of the second circuit board 302, so as to further integrate the second circuit board 302, the first circuit board 301 and the fixing frame 500.

The lower surface of the supporting column 503 is connected to the upper surface of the base 501, and the upper surface of the supporting column 503 is connected to the lower surface of the first circuit board 301, so that the first circuit board 301 and the fixing frame 500 form a whole.

The support columns 503 include a first sub-support column 5031, a second sub-support column 5032, a third sub-support column 5033, and a fourth sub-support column 5034. The first sub-supporting post 5031 and the second sub-supporting post 5032 are disposed on the first fixing plate 5011, and the first sub-supporting post 5031 is connected to the first sub-positioning post 5021, the second sub-supporting post 5032 is connected to the second sub-positioning post 5022, the first sub-supporting post 5031 is disposed corresponding to the first connection region 3016, and the second sub-supporting post 5032 is disposed corresponding to the second connection region 3017. The first sub-support posts 5031 are connected to the lower surface of the first connection region 3016, and the second sub-support posts 5032 are connected to the lower surface of the second connection region 3017. The third sub-supporting post 5033 and the fourth sub-supporting post 5034 are both disposed on the third fixing plate 5013, the third sub-supporting post 5033 is connected to the third sub-positioning post 5023, the third sub-supporting post 5033 is disposed corresponding to the third connection region 3018, and the fourth sub-supporting post 5034 is not connected to the fourth sub-positioning post 5024. The third sub-supporting posts 5033 are connected to the lower surface of the third connection region 3018, and the fourth sub-supporting posts 5034 are connected to the lower surface of the first circuit board 301 in the region between the third sub-positioning holes 30113 and the fourth sub-card interface 30132.

In some embodiments, the positioning columns are clamped at the first positioning holes and the second positioning holes, the supporting columns are connected with the lower surface of the first circuit board, and the limiting bulges are connected with the upper surface of the second circuit board, so that the first circuit board and the second circuit board are integrated. The vertical distance between the first sub-positioning column and the optical transceiving component is smaller than that between the third sub-positioning column and the optical transceiving component, and the vertical distance between the second sub-positioning column and the optical transceiving component is smaller than that between the fourth sub-positioning column and the optical transceiving component, which means that the first sub-positioning column and the second sub-positioning column on the first fixing plate are arranged asymmetrically with the third sub-positioning column and the fourth sub-positioning column on the third fixing plate. The first sub-positioning column and the second sub-positioning column on the first fixing plate are arranged asymmetrically with the third sub-positioning column and the fourth sub-positioning column on the third fixing plate, so that the first circuit board and the second circuit board are fixed into a whole by the fixing frame under the condition that the position of the main chip on the first circuit board is not changed.

Fig. 20 is a block diagram of an upper housing, optical transceiver component, circuit board, and mounting bracket according to some embodiments. Fig. 21 is another block diagram of the upper housing, the optical transceiver module, the circuit board, and the fixing frame according to some embodiments. Fig. 22 is a block diagram of an upper housing and a first circuit board according to some embodiments. Fig. 23 is another block diagram of the upper housing and the first circuit board according to some embodiments. Fig. 24 is a block diagram of an upper housing, a first circuit board, and a mount according to some embodiments. Fig. 25 is a block diagram of an upper housing and an unlocking component according to some embodiments. FIG. 26 is a block diagram of an upper housing according to some embodiments. FIG. 27 is another block diagram of an upper housing according to some embodiments. As shown in fig. 3-27, in some embodiments, the upper housing 201 includes a cover 2011 and two upper side plates 2012 disposed at two sides of the cover 2011 and perpendicular to the cover 2011. The upper plate 2012 is provided with a third notched area 20121, a fourth notched area 20122, a positioning plate 20123, and a fixing boss 20124. In particular, the method comprises the following steps of,

the third notch area 20121 is formed by recessing the lower surface of the upper plate 2012 toward the cap plate 2011 near the light opening.

The third notched area 20121 is provided with a first sub-notched area 201211 and a second sub-notched area 201212 according to the degree of concavity. First sub-notch region 201211 is more concave relative to second sub-notch region 201212. The second sub-notch area 201212 is not connected to the fixing frame 500.

The fourth notched region 20122 is formed by recessing the lower surface of the upper plate 2012 toward the cap plate 2011 near the electric port, and is not connected to the third notched region 20121.

Fourth notch area 20122 provides third sub-notch area 201221, fourth sub-notch area 201222 and fifth sub-notch area 201223 according to the degree of depression. Third sub-notched area 201221 is located between fourth sub-notched area 201222 and fifth sub-notched area 201223, and third sub-notched area 201221 is more concave relative to fourth sub-notched area 201222 and fifth sub-notched area 201223. The third sub-notch region 201221 is connected to a support notch (e.g., the first support notch 50211) of the holder 500, the fourth sub-notch region 201222 is connected to the first connection region 3016 of the first circuit board 301, and the fifth sub-notch region 201223 is connected to the second connection region 3017 of the first circuit board 301.

The positioning plate 20123 is located between the third gap area 20121 and the fourth gap area 20122, and is clamped at the first card interface 3012 and the third card interface 5015.

FIG. 28 is a block diagram of a lower housing according to some embodiments. Fig. 29 is a cross-sectional view of a light module according to some embodiments. Fig. 30 is another cross-sectional view of a light module according to some embodiments. As can be seen in fig. 3-30, in some embodiments, the lower side plate 2022 of the lower housing 202 is provided with a fixing hole 20221, and the fixing hole 20221 is disposed corresponding to the fixing protrusion 20124. The fixing protrusions 20124 are engaged with the fixing holes 20221, so that the upper housing 201 and the lower housing 202 are fixed.

In this application, the reference column joint of mount is in first locating hole and second locating hole department, the support column is connected with the lower surface of first circuit board, spacing arch and the upper surface connection of second circuit board, the perpendicular distance of first sub-reference column and light receiving and dispatching subassembly is less than the perpendicular distance of third sub-reference column and light receiving and dispatching subassembly, the perpendicular distance of second sub-reference column and light receiving and dispatching subassembly is less than the perpendicular distance of fourth sub-reference column and light receiving and dispatching subassembly, make first circuit board and second circuit board become a whole, the optical module of being convenient for equipment.

FIG. 31 is a block diagram of an unlocking feature according to some embodiments. Fig. 32 is another block diagram of an unlocking component according to some embodiments. Fig. 33 is a block diagram of an unlocker according to some embodiments. FIG. 34 is another block diagram of an unlocker according to some embodiments. Fig. 35 is a block diagram of an unlocking handle according to some embodiments. As seen in fig. 25 and 31-35, in some embodiments, the unlocking member 203 includes an unlocking handle 2031, an unlocking means 2032, and a resilient member 2033.

The unlocking handle 2031 is provided with a first protrusion 20315 protruding toward the optical port direction, the inner surface of the first end (close to the optical port end) of the unlocking device 2032 is connected to the unlocking handle 2031, the outer surface of the second end (close to the electrical port end) of the unlocking device 2032 is provided with a snap-in 203221, and the inner surface of the second end of the unlocking device 2032 is provided with a fixing column 203222.

When the optical module is inserted into the upper computer, the clamping piece 203221 is clamped into a bayonet of the cage of the upper computer, so that the clamping relation between the optical module 200 and the upper computer is realized. When the unlocking member, that is, the unlocking handle 2031 is rotated, the first end of the connecting body 20321 of the unlocking device 2032 is lifted up, the unlocking device body 20322 of the unlocking device 2032 is lowered down, and the engaging piece 203221 on the unlocking device body 20322 is also lowered down until the engaging piece 203221 is disengaged from the cage bayonet of the upper computer, so as to release the engaging relationship between the optical module 200 and the upper computer.

When the unlock handle 2031 is not rotated, the angle between the first protrusion 20315 and the inner surface of the upper housing is approximately 0 °; when the unlocking handle 2031 starts to rotate, the angle between the first protrusion 20315 and the inner surface of the upper housing gradually increases from approximately 0 °; when the unlocking handle 2031 cannot be rotated further, the angle of the first protrusion 20315 is approximately 90 ° to the inner surface of the upper housing.

Since the angle between the first protrusion 20315 and the inner surface of the upper housing gradually increases from approximately 0 ° when the unlocking handle 2031 is rotated, the distance between the first end of the unlocking means 2032 connected to the first protrusion 20315 and the inner surface of the upper housing gradually increases, that is, the first end of the unlocking means 2032 is lifted upward.

When the unlocking handle 2031 is rotated, the first protrusion 20315 is gradually turned from an approximately horizontal direction to an approximately vertical direction, and the inner surface of the first end of the unlocking member 2032 is lifted upward. Since the unlocking means 2032 is connected to the upper housing 201 via the connecting shaft 2034, the second end of the unlocking means 2032 is lowered downward according to the lever principle, that is, the engaging member 203221 and the fixing post 203222 are lowered downward. Since the second end of the unlocking means 2032 sinks downward, the engaging member 203221 on the outer surface of the second end of the unlocking means 2032 also sinks correspondingly until the optical module is separated from the cage of the upper computer. And because one end of the elastic element 2033 is fixed on the fixing post 203222, when the fixing post 203222 sinks, the elastic element 2033 compresses downwards.

However, in order to make the second end of the unlocking means 2032 sink as the first end of the unlocking means 2032 is lifted, when the unlocking handle 2031 is not rotated, the upper housing 201 has a certain distance from the second end of the unlocking means 2032, that is, the inner surface of the upper housing 201 is provided with a stopper plate. The limiting plate is located in the middle of the inner surface of the cover 2011 of the upper housing 201, the first end is more recessed relative to the article holding groove, and the second end is more recessed relative to the first end, so that the distance between the second end of the unlocking device 2032 and the upper housing 201 is not equal to zero (when the unlocking handle 2031 is not rotated). The presence of the limiting plate allows the upper housing 201 to be spaced from the second end of the unlocker 2032, which facilitates the sinking of the second end of the unlocker 2032 as the first end of the unlocker 2032 is lifted.

Two second article placing cavities 2019 are enclosed by the limiting plate and the upper side plate of the upper shell 201, and the two second article placing cavities 2019 are respectively used for placing a first optical fiber adapter 4014 or a second optical fiber adapter 4024.

The limiting plates include a first limiting plate 2017 and a second limiting plate 2018. Each of the first and

second limit plates

2017, 2018 is formed by an inner surface of the bottom plate 2011 of the upper case 201 being recessed inward. The second end of the first stop plate 2017 (near the electrical port end) is more concave relative to the first end of the first stop plate 2017 (near the optical port end). The second limit plate 2018 is more recessed relative to the second end of the first limit plate 2017. The optical port end refers to one end of the optical module where an optical port is located, and the electrical port end refers to one end of the optical module where an electrical port is located.

When the recessed degree of the second end of the second limiting plate 2018 and the second end of the first limiting plate 2017 are the same, or the second end of the first limiting plate 2017 is recessed more than the second limiting plate 2018, the degree of the unlocking device body 20322 sinking downward is low, and the degree of the clamping piece 203221 sinking downward on the unlocking device body 20322 is low, so that the clamping piece 203221 cannot be disengaged from the bayonet of the cage of the upper computer.

The presence of the first and second limit stops 2017, 2018 allows the second end of the unlocker 2032 to be spaced from the inner surface of the upper housing 201 before the unlock handle 2031 is turned, which facilitates the sinking of the second end of the unlocker 2032 as the first end of the unlocker 2032 is raised.

The unlock handle 2031 includes, in addition to the first protrusion 20315 protruding toward the light exit, a first side 20311, a second side 20312, a third side 20313, a fourth side 20314, and a fifth side 20316, and the first side 20311, the second side 20312, the third side 20313, the fourth side 20314, the first protrusion 20315, the fifth side 20316, and the first side 20311 are connected in this order.

The fourth side 20314, the fifth side 20316 and the first protrusion 20315 form a first end of the unlocking handle 2031, the second side 20312 serves as a second end of the unlocking handle 2031, the first side 20311 and the third side 20313 serve as an intermediate portion of the unlocking handle 2031, and the intermediate portion of the unlocking handle 2031 is respectively connected to the first end of the unlocking handle 2031 and the second end of the unlocking handle 2031.

The first protrusion 20315 is located at the same level as the fourth side 20314 and the fifth side 20316, and protrudes towards the light exit direction relative to the fourth side 20314 and the fifth side 20316.

The unlock handle 2031 is fixed in the storage tray 2015 of the upper housing 201. Specifically, the inner surface of the upper housing 201 (the inner surface of the cover plate 2011 of the upper housing 201) is provided with a storage groove 2015, the storage groove 2015 is surrounded by a first limit part 20151 and a second limit part 20152, the first limit part 20151 comprises a connecting plate 201511 and two fixing plates 201512, the two fixing plates 201512 are respectively connected with two ends of the connecting plate 201511, the connecting plate 201511 is surrounded by a first storage cavity in the city with the second limit part 20152, the first storage cavity is more recessed relative to the second limit part 20152, the fixing plate 201512 is provided with a limit hole, the limit hole is formed by the fixing plate 201512 towards the light opening direction, the fourth edge 20314 and the fifth edge 20316 of the unlocking handle 2031 are respectively placed in the limit hole, and the first protrusion 20315 is located in the first storage cavity.

To define the location of the first protrusion 20315, in some embodiments, the unlocker 2032 is provided with a stop block 203214. The limiting block 203214 is formed by the outward protrusion of the unlocking device 2032. The limiting block 203214 is used for limiting the position of the first protrusion 20315 of the unlocking handle 2031 and preventing the first protrusion 20315 from exceeding the position of the limiting block 203214, so that when the first protrusion 20315 is connected with the limiting block 203214, the angle between the first protrusion 20315 and the inner surface of the upper housing is 90 °.

The second limit 20152 is provided with a fifth gap region 201521, and the fifth gap region 201521 is formed by the second limit 20152 being concaved towards the electric port direction. The stopper 203214 is disposed corresponding to the fifth cut-out region 201521, and the stopper 203214 is disposed in the fifth cut-out region 201521.

The lock release 2032 is connected to the upper housing 201 via a connecting shaft 2034. Specifically, two side plates of the upper housing 201 are each provided with a first connection hole 2016, the position of the unlocking device 2032 corresponding to the first connection hole 2016 is provided with a second connection hole 203215, the second connection hole 203215 extends from one side of the unlocking device 2032 to the other side, and the connection column 2031 sequentially passes through one first connection hole 2016, the second connection hole 203215 and the other first connection hole 2016, so that the unlocking device 2032 and the upper housing 201 are connected through the connection shaft 2034.

The unlocking means 2032 comprises a connecting body 20321 and an unlocking means body 20322, the unlocking means body 20322 is formed by an outer surface of a second end (close to the electric port end) of the connecting body 20321 and both side walls of the connecting body 20321 being recessed inwards, an inner surface of a first end (close to the optical port end) of the connecting body 20321 is connected to a first end of the unlocking handle 2031, and a second end of the connecting body 20321 is connected to the unlocking means body 20322.

The connector 20321 comprises a first sub-connector 203211, a second sub-connector 203212 and a third sub-connector 203213, the first sub-connector 203211 being proximate to the port end, the second sub-connector 203212 being located between the first sub-connector 203211 and the third sub-connector 203213, the third sub-connector 203213 being proximate to the port end. The first sub-connector 203211 is disposed corresponding to the unlocking handle 2031, the second sub-connector 203212 is disposed corresponding to the second stopper 20152, and the third sub-connector 203213 is disposed corresponding to the first stopper 2017 of the upper housing 201. The inner surface of the first sub-connecting body 203211 is connected with the first end of the unlocking handle 2031, the first sub-connecting body 203211 is provided with a limiting block 203214, and the third sub-connecting body 203213 is provided with a second connecting hole 203215.

The difference in height between the inner surface of the first sub-connector 203211 and the outer surface of the first sub-connector 203211 < the difference in height between the inner surface of the second sub-connector 203212 and the outer surface of the second sub-connector 203212 < the difference in height between the inner surface of the third sub-connector 203213 and the outer surface of the third sub-connector 203213.

The difference in height between the inner surface of the first sub-connector 203211 and the outer surface of the first sub-connector 203211 may be equal to the difference in height between the inner surface of the second sub-connector 203212 and the outer surface of the second sub-connector 203212, regardless of the strength of the unlocker 2032. When considering the strength of the unlocking means 2032, i.e., increasing the strength of the unlocking means 2032, the height difference between the inner surface of the first sub-connection body 203211 and the outer surface of the first sub-connection body 203211 < the height difference between the inner surface of the second sub-connection body 203212 and the outer surface of the second sub-connection body 203212.

Before the unlocking handle is not rotated, the inner surface of the first sub-connecting body 203211 is connected with the unlocking handle 2031, the inner surface of the third sub-connecting body 203213 is connected with the first end of the first limiting plate 2017, and the first end of the first limiting plate 2017 is more recessed relative to the first object placing cavity where the unlocking handle 2031 is located. In order to make the outer surface of the first sub-connector 203211 and the outer surface of the third sub-connector 203213 at the same level or a similar level, the height difference between the inner surface of the first sub-connector 203211 and the outer surface of the first sub-connector 203211 < the height difference between the inner surface of the third sub-connector 203213 and the outer surface of the third sub-connector 203213.

Before the unlocking handle is not rotated, the inner surface of the second sub-connecting body 203212 is not connected to the second limiting member 20152, the inner surface of the third sub-connecting body 203213 is connected to the first end of the first limiting plate 2017, and the first end of the first limiting plate 2017 is recessed relative to the second limiting member 20152. In order to make the outer surface of the second sub-connector 203212 and the outer surface of the third sub-connector 203213 at the same level or a similar level, the height difference between the inner surface of the second sub-connector 203212 and the outer surface of the second sub-connector 203212 < the height difference between the inner surface of the third sub-connector 203213 and the outer surface of the third sub-connector 203213.

Since the second end (close to the electric port end) of the first limiting plate 2017 is more recessed relative to the first end (close to the optical port end) of the first limiting plate 2017, a certain distance difference exists between the second end (close to the electric port end) of the third sub-connecting body 203213, which is correspondingly arranged to the first limiting plate 2017, and the second end of the first limiting plate 2017. When the unlocking handle 2031 is rotated to jack up the first sub-connection body 203211, the third sub-connection body 203213 may sink downward.

The outer surface of the unlocking device body 20322 is provided with an engaging piece 203221, and the inner surface is provided with a fixing column 203222. Specifically, a first end (close to the optical port end) of the unlocking device body 20322 is connected to a second end of the connecting body 20321, an engaging member 203221 is disposed on an outer surface of the second end (close to the electrical port end) of the unlocking device body 20322, and a fixing post 203222 is disposed on an inner surface of the second end (close to the electrical port end) of the unlocking device body 20322.

The elastic component 2033 comprises a movable end and a fixed end, the fixed end of the elastic component 2033 is fixed on the fixed column 203222, and the movable end of the elastic component 2033 is placed in the limit cavity 20181 of the second limit plate 2018 of the upper housing 201. When the second end of the unlocker body 20322 is lowered, the elastic member 2033 is compressed in the limiting cavity 20181; when the second end of the unlocker body 20322 is no longer depressed, the resilient member 2033 returns from the compressed state to the uncompressed state within the spacing cavity 20181.

In some embodiments, when the optical module is inserted into the upper computer, the clamping piece is clamped into a bayonet of the cage of the upper computer, so that the clamping relation between the optical module and the upper computer is realized. When the unlocking handle does not rotate, the clamping piece is matched with the bayonet of the upper computer, and the clamping relation between the optical module and the upper computer is realized. When the unlocking handle rotates, the first end of the unlocking device is lifted upwards, the second end of the unlocking device sinks downwards, the clamping piece sinks downwards until the clamping piece is separated from the bayonet, and the clamping relation between the optical module and the upper computer is released. In this application, towards the convex first arch of light mouthful direction, first arch is connected with the internal surface of the first end of unlocking ware, and unlocking ware passes through the connecting axle with last casing for when the unblock handle rotated, the first end of unlocking ware upwards lifted under the effect of first arch, and the second end of unlocking ware sinks downwards, until the fastener breaks away from the bayonet socket of host computer, relieves the block relation of optical module and host computer.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

the first circuit board comprises a first positioning hole;

the second circuit board is electrically connected with the first circuit board through a first flexible circuit board and comprises a second positioning hole which is arranged corresponding to the first positioning hole;

the second flexible circuit board and the third flexible circuit board each include a connection flexible circuit board and two sub-flexible circuit boards;

the fixed frame comprises a base, a positioning column and a supporting column;

the positioning column is arranged corresponding to the second positioning hole, clamped in the first positioning hole and the second positioning hole, and one end of the positioning column, which is far away from the base, is provided with a limiting bulge;

the limiting bulge is connected with the upper surface of the second circuit board and used for limiting the position of the second circuit board.

2. The optical module of claim 1, wherein the second flexible circuit board comprises a first connection flexible circuit board, a first sub flexible circuit board, and a second sub flexible circuit board;

the first end of the first connecting flexible circuit board is connected with the second ends of the first sub flexible circuit board and the second sub flexible circuit board respectively, and the second end of the first connecting flexible circuit board is connected with the lower surface of the first circuit board;

the first end of the first sub flexible circuit board is connected with the light emitting device of the first light transceiving component;

the first end of the second sub flexible circuit board is connected with the light receiving device of the first light receiving and transmitting assembly, is not connected with the first sub flexible circuit board, is positioned between the first sub flexible circuit board and the third flexible circuit board, and comprises a first connecting part and a second connecting part;

a first end of the first connecting part is connected with the light receiving device of the first light receiving and transmitting assembly, and a second end of the first connecting part is connected with a first end of the second connecting part;

and the second end of the second connecting part is connected with the first connecting flexible circuit board, and the width dimension of the second connecting part is smaller than that of the first connecting part.

3. The optical module of claim 2, wherein the third flexible circuit board comprises a second connection flexible circuit board, a third sub-flexible circuit board, and a fourth sub-flexible circuit board;

a first end of the second connection flexible circuit board is connected with second ends of the third sub flexible circuit board and the fourth sub flexible circuit board respectively, and the second ends are connected with the upper surface of the first circuit board;

the first end of the third sub flexible circuit board is connected with the light emitting device of the second light transceiving component;

the first end of the fourth sub flexible circuit board is connected with the light receiving device of the second light transceiving component, is not connected with the third sub flexible circuit board, is positioned between the third sub flexible circuit board and the second flexible circuit board, and comprises a third connecting part and a fourth connecting part;

a first end of the third connecting part is connected with the light receiving device of the second light transceiving component, and a second end of the third connecting part is connected with a first end of the fourth connecting part;

and the second end of the fourth connecting part is connected with the second connecting flexible circuit board, and the width dimension of the fourth connecting part is smaller than that of the third connecting part.

4. The optical module according to claim 3, wherein a length dimension of the first sub flexible circuit board is smaller than a length dimension of the second sub flexible circuit board, and a length dimension of the third sub flexible circuit board is smaller than a length dimension of the fourth sub flexible circuit board.

5. The optical module of claim 1, wherein the base comprises a first fixed plate, a second fixed plate, a third fixed plate, and a fourth fixed plate;

the second end of the first fixing plate is connected with the first end of the second fixing plate, and a first sub-supporting column, a first sub-positioning column, a second sub-positioning column and a second sub-supporting column are arranged on the first fixing plate;

the second end of the second fixing plate is connected with the first end of the third fixing plate;

a second end of the third fixing plate is connected with a first end of the fourth fixing plate, and a third sub-supporting column, a third sub-positioning column, a fourth sub-positioning column and a fourth sub-supporting column are arranged on the third fixing plate;

the second end of the fourth fixing plate is connected with the first end of the first fixing plate;

the first sub-support column is connected with the second sub-support column, the third sub-support column and the fourth sub-support column and the lower surface of a first circuit board;

the first sub-positioning column, the second sub-positioning column, the third sub-positioning column and the fourth sub-positioning column are provided with supporting notches and limiting bulges;

the supporting notch and the limiting bulge are respectively positioned on different surfaces of the positioning column.

6. The optical module of claim 5, wherein a vertical distance between the first sub-positioning post and the optical transceiver module is smaller than a vertical distance between the third sub-positioning post and the optical transceiver module, and a vertical distance between the second sub-positioning post and the optical transceiver module is smaller than a vertical distance between the fourth sub-positioning post and the optical transceiver module.

7. The optical module of claim 5, wherein the first circuit board further comprises a first card interface and a second card interface;

the first card interface comprises a first sub card interface and a second sub card interface;

the first daughter card interface is formed by inwards recessing a first end of the first circuit board and a first side wall of the first circuit board;

the second daughter card interface is formed by inwards recessing the second end of the first circuit board and the second side wall of the first circuit board;

the second card interface comprises a third card interface and a fourth card interface;

the third daughter card interface is formed by inwards recessing the second end of the first circuit board and the first side wall of the first circuit board;

the fourth daughter card interface is formed by inward recess of the second end of the first circuit board and the second side wall of the first circuit board.

8. The optical module of claim 7, wherein the first circuit board further comprises a first notched area;

the first gap area is formed by inward recess of the first end of the first circuit board and the first side wall of the first circuit board and is communicated with the first daughter card interface.

9. The optical module as claimed in claim 5, wherein the first sub-supporting column is connected to the first sub-positioning column, the second sub-supporting column is connected to the first sub-positioning column, and the third sub-supporting column is connected to the third sub-positioning column; the fourth sub-supporting column is not connected with the fourth sub-positioning column.

10. The optical module as claimed in claim 1, wherein the positioning column is further provided with a support notch;