CN216526403U

CN216526403U - Optical module

Info

Publication number: CN216526403U
Application number: CN202122784337.4U
Authority: CN
Inventors: 张加傲; 王欣南; 邵宇辰; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-11-12
Filing date: 2021-11-12
Publication date: 2022-05-13
Anticipated expiration: 2031-11-12

Abstract

The application discloses optical module includes: the upper shell and the lower shell cover to form a wrapping cavity; the light source emitter is arranged in the packaging cavity; the sub circuit board is arranged on one side of the light source emitter, is connected with the light source emitter and provides an electric signal for the light source emitter; base, support column and clamp plate. One side of the base is fixedly connected with the upper shell, and the other side of the base is connected with the sub circuit board and the light source emitter; the supporting column is arranged below the base, and one end of the supporting column is connected with the base. One end of the pressing plate is connected with the other end of the supporting column; the light source emitter is arranged between the base and the pressing plate. This application is fixed light source emitter at last shells inner wall through the mount, and the heat that light source emitter produced directly conducts supreme casing through the base, then transmits to the cage and dispels the heat, improves the radiating effect.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

Along with the miniaturization of devices, all photoelectric devices in the optical module are distributed more closely and occupy small space, and the heat emitted by the optical module is more, especially in the coherent optical module, the light source continuously emits light, and the emitted heat is more. The heat dissipation efficiency of the optical module is improved, and the communication stability of the optical module is improved.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to realize the fixed of light source.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, includes:

an upper housing;

the lower shell is covered with the upper shell to form a wrapping cavity;

the light source emitter is arranged in the packaging cavity and emits signal light;

the sub circuit board is arranged on one side of the light source emitter and is connected with the light source emitter;

the base is fixedly connected with the upper shell, and the other side of the base is connected with the sub circuit board and the light source emitter;

the supporting column is arranged below the base, and one end of the supporting column is connected with the base;

one end of the pressing plate is connected with the other end of the supporting column; the light source emitter is arranged between the base and the pressing plate.

Compared with the prior art, the application has the beneficial effects that:

the application discloses optical module includes: the upper shell and the lower shell cover a packaging cavity formed by closing; the light source emitter is arranged in the packaging cavity; the sub circuit board is arranged on one side of the light source emitter, is connected with the light source emitter and provides an electric signal for the light source emitter; base, support column and clamp plate. One side of the base is fixedly connected with the upper shell, and the other side of the base is connected with the sub circuit board and the light source emitter; the support column is arranged below the base, and one end of the support column is connected with the base. One end of the pressing plate is connected with the other end of the supporting column; the light source emitter is arranged between the base and the pressing plate. This application is fixed light source emitter at last shells inner wall through the mount, and the heat that light source emitter produced directly conducts supreme casing through the base, then transmits to the cage and dispels the heat, improves the radiating effect.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is an exploded view of a light source emitter and a circuit board according to an embodiment of the present disclosure;

fig. 6 is a partial cross-sectional view of an optical module according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of an upper housing and a light emitting component according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of an upper housing according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a light source emitter according to an embodiment of the present disclosure;

FIG. 10 is a schematic view of another angular structure of a light source emitter according to an embodiment of the present disclosure;

fig. 11 is an exploded view of a light source emitter according to an embodiment of the present disclosure;

fig. 12 is an exploded schematic view of a sub-circuit board and a light source according to an embodiment of the present disclosure;

fig. 13 is an exploded schematic view of a fixing frame according to an embodiment of the present disclosure;

fig. 14 is an exploded view from another perspective of a fixing frame according to an embodiment of the present disclosure;

FIG. 15 is a schematic view of another angle structure of the upper housing according to the embodiment of the present application;

FIG. 16 is an exploded view of the upper housing and the fixing frame;

FIG. 17 is a schematic structural view of an upper housing, a light source emitter, and a fiber optic adapter provided in an embodiment of the present application;

fig. 18 is a schematic structural diagram of a circuit board and a lower housing according to an embodiment of the present disclosure;

fig. 19 is an exploded view of a circuit board and a lower housing according to an embodiment of the present disclosure;

fig. 20 is a schematic structural diagram of a fixing frame, an optical fiber bracket and a circuit board according to an embodiment of the present disclosure;

fig. 21 is a schematic view of a disassembled structure of an optical fiber holder and a circuit board according to an embodiment of the present disclosure;

FIG. 22 is a schematic view of another angular configuration of a fiber optic support according to an embodiment of the present disclosure;

fig. 23 is a second schematic view of a partial structure of an optical module according to an embodiment of the present application;

fig. 24 is a schematic cross-sectional view of a partial structure of an optical module according to an embodiment of the present application.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C", both including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically realized. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical module 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, the optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver;

the shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two

openings

204 and 205; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates located at two sides of the bottom plate and disposed perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end (left end in fig. 3) of the optical module 200, and the opening 205 is also located at an end (right end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to receive the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 300 and the optical transceiver can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when the devices such as the circuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 203 located on an outer wall of a housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking members 203 are located on the outer walls of the two lower side plates of the lower housing 202, and include snap-fit members that mate with a cage of an upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. The electronic components may include, for example, capacitors, resistors, transistors, Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip may include, for example, a Micro Controller Unit (MCU), a limiting amplifier (limiting amplifier), a Clock and Data Recovery (CDR) chip, a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The gold fingers may be disposed on only one side of the circuit board 300 (e.g., the upper surface shown in fig. 4), or may be disposed on both upper and lower sides of the circuit board 300, so as to adapt to the situation where the requirement of the number of pins is large. The golden finger is configured to establish an electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

The optical transceiver comprises an optical transmitter subassembly and an optical receiver subassembly.

Fig. 5 is an exploded view of a light source emitter and a circuit board according to an embodiment of the present disclosure. Fig. 6 is a partial cross-sectional view of an optical module according to an embodiment of the present application. As shown in fig. 5 and 6, the optical module is provided with a light source emitter 410, which is disposed above the circuit board 300 and is used for emitting light, and one end of the light source emitter is connected to the outgoing optical fiber. The sub circuit board 420 is disposed above the circuit board 300 and electrically connected to the circuit board 300 through the flexible circuit board 440. The light source emitter 410 is electrically connected to a daughter circuit board 420, and the daughter circuit board 420 drives the optoelectronic devices within the light source emitter 410. The fixing frame 430 is disposed above the circuit board 300 and used for fixing the light source emitter 410. The light source emitter 410 is fixed on the fixing frame 430, and a plurality of pins are disposed on one side of the light source emitter and connected to the sub-circuit board 420. The fixing frame 430 is further connected with the upper housing, the light source emitter 410 is fixed on the upper housing through the fixing frame 430, and heat emitted by the light source emitter can be directly transmitted to the upper housing through the fixing frame, so that the heat dissipation function of the optical module is improved.

In this embodiment, the light source emitter may be a light source, and emits light without a signal, and the silicon optical chip receives a light loading signal emitted by the light source to form signal light.

In an embodiment of the present application, the light source emitter is disposed above the circuit board for emitting light. The sub circuit board 420 is disposed above the circuit board 300 and electrically connected to the circuit board 300 through a flexible circuit board. The light source is electrically connected to the sub circuit board 420, and the sub circuit board 420 drives the light source. The fixing frame 430 is disposed above the circuit board and used for fixing the light source. The fixing frame 430 is further connected with the upper housing 201, the light source emitter 410 is fixed on the upper housing 201 through the fixing frame 430, and heat emitted by the light source emitter can be directly transmitted to the upper housing through the fixing frame, so that the heat dissipation function of the optical module is improved.

Fig. 7 is a schematic structural diagram of an upper housing and a light emitting component according to an embodiment of the present disclosure, fig. 8 is a schematic structural diagram of an upper housing according to an embodiment of the present disclosure, and fig. 9 is a schematic structural diagram of a light source emitter according to an embodiment of the present disclosure, and as shown in fig. 7, fig. 8, and fig. 9, an upper housing 201 includes: a cover 2011, and two first upper side plates 2012 and second upper side plates 2013 which are positioned on two sides of the cover 2011 and are perpendicular to the cover. The cover plate 2011 is provided with a bracket mounting groove 2014, recessed with respect to the lower surface of the cover plate 2011. The bracket mounting groove 2014 is matched with the upper surface of the fixing frame, and the fixing frame 430 is mounted inside the bracket mounting groove 2014. A first fixing hole 2015 is arranged on the support mounting groove 2014, is positioned at one corner of the support mounting groove 2014 and corresponds to the first connecting through hole 4311 on the fixing frame 430 in position; the bracket mounting groove 2014 is also provided with a second fixing hole 2016, which is positioned at the other corner of the bracket mounting groove 2014 and corresponds to the second connecting through hole 4312 on the base.

For making things convenient for being connected and fixed of mount 430 and last casing 201, improve connection stability, the diagonal position that is located the support mounting groove of first fixed orifices 2015 and second fixed orifices 2016, be convenient for installation and stability.

The fixing frame 430 includes: a base and a bracket. The base is of a rectangular plate structure, one side surface of the base is of a plane structure, and the base is connected with the upper shell and used for fixing; the other side surface is provided with a plurality of avoiding grooves for fixedly mounting the light source and the sub circuit board 420. The support includes: the support column is arranged below the base, one end of the support column is connected with the base, and the other end of the support column is connected with the pressing plate. One side of the pressing plate is connected with the light source, and the light source is fixed between the pressing plate and the base.

In the embodiment of the present application, the light source emitter 410 may be a common housing with a rectangular parallelepiped structure, in which the light source emitter is disposed, and an exit fiber is connected to one end of the housing. The upper surface of the light source emitter 410 is attached to the lower surface of the base, and the lower surface is attached to the upper surface of the platen. The light source emitter 410 is provided with a plurality of metal pins on a surface of one side thereof, and the metal pins are connected to the sub circuit board 420 to fix and electrically connect the light source to the sub circuit board 420, and the metal pins are disposed toward one side of the sub circuit board 420 to reduce a distance between the pins and the sub circuit board 420 and increase connection stability.

Fig. 10 is a schematic view of another angle structure of a light source emitter according to an embodiment of the present disclosure, and fig. 11 is an exploded schematic view of the light source emitter according to the embodiment of the present disclosure. With reference to fig. 10 and 11, in the embodiment of the present application, the fixing frame 430 includes: a base 431 and a stand 432. The base 431 is of a rectangular plate-shaped structure, one side surface of the base is of a plane structure, and the base is connected with the upper shell and used for fixing; the other side is used for the fixed mounting of the light source emitter 410 and the daughter circuit board 420. The stand 432 includes: a supporting column 4321 and a pressing plate 4322, wherein the supporting column 4321 is arranged below the base 431, one end of the supporting column 4321 is connected with the base 431, and the other end of the supporting column 4321 is connected with the pressing plate 4322. One side of the pressure plate 4322 is connected to a light source, which is fixed between the pressure plate 4322 and the base 431.

To facilitate the position limitation of the light source on the base 431, one side of the lower surface of the base 431 includes a light source mounting part 4313, which is mounted in a matching manner with the light source. The base 431 includes a fixing portion 4314 fixedly connected to the sub circuit board 420. The fixing portion 4314 is disposed at one side of the light source mounting portion 4313.

The upper surface of the base 431 is connected to the upper housing 201, and the lower surface is provided with the light source emitter 410 and the sub circuit board 420, wherein the light source emitter 410 is disposed between the pressing plate 4322 and the base 431, and the sub circuit board 420 is disposed on one side of the light source emitter 410 and connected to the sub circuit board 420 through pins. The heat generated by the light source emitter 410 is conducted directly to the upper housing 201 through the base 431 and then transferred to the cage for heat dissipation.

In order to fixedly connect the base 431 and the upper case 201, the base 431 is provided with a plurality of connecting through holes, and is connected with the upper case 201 through screws. The relative position of the upper shell 201 is provided with a fixing hole corresponding to the position of the connecting through hole, and when the upper shell is connected, the fixing hole is penetrated through a screw to be connected with the connecting through hole. The connection through hole may be a threaded hole having a thread, and a screw is connected to the connection through hole.

The optical module is provided with a plurality of photoelectric devices, and a plurality of optical fibers are arranged for realizing the transmission of light among the photoelectric devices. In order to facilitate the installation of the optical fiber and reduce the optical loss, the length of the optical fiber is far greater than the distance between the photoelectric components. In order to improve the stability of the optical fiber, an optical fiber bracket is further arranged in the optical module and arranged above the circuit board, an optical fiber groove is formed above the optical fiber bracket, and the optical fiber is fixed in the optical fiber groove.

The upper surface and the lower surface of the sub circuit board 420 are both provided with a plurality of electronic components, and the sizes, heights and the like of the electronic components are not completely consistent, so that the setting of the angle of the emergent optical fiber of the light source emitter 410 is facilitated, the fixing part 4314 is provided with a plurality of avoiding recesses 43141 for avoiding installation of the electronic components, and the sub circuit board 420 and the circuit board 300 are kept parallel or substantially parallel after installation.

For the fixation between the base 431 and the sub circuit board 420, the base 431 is provided with a third connection through hole 4315 at one side of the fixing portion 4314 for the fixation with the sub circuit board 420. The base 431 is further provided with a fourth connection through hole 4316 at the other side of the fixing portion 4314 for fixing with the sub circuit board 420. The sub circuit board 420 is provided with a third fixing hole 421 matching with the third connecting through hole 4315. The third fixing hole 421 is connected to the third connection through hole 4315 by a screw. The sub circuit board 420 is provided with a fourth fixing hole 422 matched with the fourth connecting through hole 4316. The fourth fixing hole 422 is screwed to the fourth coupling through hole 4316.

Specifically, the third fixing hole 421 and the fourth fixing hole 422 are disposed at diagonal positions of the circuit board, so as to realize positioning between the sub-circuit board 420 and the base 431 in a direction parallel to the plane of the circuit board. The third fixing hole 421 is disposed adjacent to the support 432, and may be a circular through hole or a relief hole.

Fig. 12 is an exploded schematic view of a sub-circuit board and a light source according to an embodiment of the present disclosure. As shown in fig. 11 and 12, the sub circuit board 420 is provided with a mounting avoidance portion 424, and the light source emitter 410 is disposed at the mounting avoidance portion 424. The upper surface of the light source emitter 410 contacts the base, one end of the light source emitter 410 near the light port contacts the bracket 432, and the other end is connected with the corner position of the mounting escape part 424. One side of the light source emitter 410 is connected to the daughter circuit board 420 through a plurality of pins 411. Specifically, one side of the light source emitter 410 is connected to the upper surface of the sub circuit board 420 through pins.

Fig. 13 is an exploded schematic view of a fixing frame according to an embodiment of the present disclosure. Fig. 14 is an exploded view from another perspective of a fixing frame according to an embodiment of the present disclosure. As shown in fig. 12 and 13, in some embodiments of the present application, the base 431 and the bracket 432 may be integrally formed, and the upper surface of the pressing plate 4322 is connected to the lower surface of the light source emitter 410. Optionally, the base 431 and the stand 432 are separate structures, as shown. The support 432 includes a support column 4321 and a pressing plate 4322, wherein the support column 4321 is disposed under the base 431, one end of the support column 4321 is connected to the base 431, and the other end of the support column 43is connected to the pressing plate 4322. The upper surface of the pressure plate 4322 is connected with the light source emitter 410, and the light source emitter 410 is fixed between the pressure plate 4322 and the base 431. The supporting column 4321 is provided with a fixing threaded hole 43211, and a connecting hole 4317 is arranged at a corresponding position of the base 431.

During installation, the third connection through hole 4315 and the third fixing hole 421, and the third connection through hole 4315 and the third fixing hole 421 are connected by screws, so as to fix the sub circuit board 420 and the base 431. Then, the light source emitter 410 is installed between the pressing plate 4322 and the light source emitter 410 installation groove of the base 431, the supporting column 4321 is connected with the base 431 by using a screw, and the light source emitter 410 is fixed on the base 431 by using the pressing plate 4322. The base 431 is placed in the mounting groove of the support 432, and the first connecting through hole and the first fixing hole, and the second connecting through hole and the second fixing hole are connected by using screws, so that the connection between the fixing frame 430 of the light source emitter 410 and the upper shell 201 is realized. Finally, the light source emitter 410 is fixed on the light source emitter 410 fixing frame 430, and then the light source emitter 410 fixing frame 430 is fixed on the lower surface of the upper shell 201, so that the light source emitter 410 is fixedly installed inside the optical module, the light source emitter 410 is connected with the upper shell 201 through the base 431, heat emitted by the light source emitter 410 is transmitted to the upper shell 201 through the base 431, and the heat dissipation effect is improved.

To facilitate heat conduction, the base 431 may be made of materials including, but not limited to, tungsten copper, raft alloy, SPCC (Steel Plate Cold rolled Commercial), copper, etc., to facilitate heat transfer from the photovoltaic device to the base 431. In the present application, the light source emitter 410 is disposed on the base 431, and the base 431 and the upper housing 201 facilitate direct conduction of heat generated by the light source emitter 410 to the upper housing 201 through the base 431. The upper housing 201 is externally connected with the cage, has a heat dissipation channel, and increases heat conduction efficiency.

In some embodiments of the present application, a spacer 4323 is provided between the pressure plate 4322 and the light source emitter 410 to facilitate maintenance. The upper surface of the pressing plate 4322 is provided with a pressure-bearing portion 43221 and a receiving portion 43222, and the receiving portion 43222 is arranged between the pressure-bearing portion 43221 and the supporting column 4321, so that the pressure-bearing portion 43221 is connected with the supporting column 4321. The upper surface of the pressure part 43221 is connected to the lower surface of the pad 4323, and the lower surface of the pad 4323 is connected to the light source emitter 410. The upper surface of the pressure-bearing portion 43221 is lower than the upper surface of the socket portion 43222, so that a step surface exists between the pressure-bearing portion 43221 and the socket portion 43222, and one end of the gasket 4323 contacts with the step surface, so that the gasket 4323 is positioned.

Optionally, the height of the upper surface of the pad 4323 is not lower than the height of the upper surface of the receiving portion 43222. In order to facilitate maintenance and disassembly, the height of the upper surface of the gasket 4323 is higher than that of the receiving portion 43222, so that the light source emitter 410 is connected with the upper surface of the gasket 4323, and a certain gap exists between the light source emitter 410 and the receiving portion 43222, thereby preventing the screw between the support column 4321 and the base 431 from being stressed too much during installation, preventing the pressure of the pressure plate 4322 on the light source emitter 410 from being too great, and preventing the pressure plate 4322 from being broken.

During installation, the third connection through hole 4315 and the third fixing hole 421, and the third connection through hole 4315 and the third fixing hole 421 are connected by screws, so as to fix the sub circuit board 420 and the base 431. The light source emitter 410 is installed between the pressing plate 4322 and the light source emitter 410 installation groove of the base 431, the gasket 4323 is installed between the pressing plate 4322 and the light source emitter 410, the supporting column 4321 is connected with the base 431 by using a screw, and the light source emitter 410 is fixed on the base 431 by using the pressing plate 4322. The base 431 is placed in the mounting groove of the support 432, and the first connecting through hole and the first fixing hole, and the second connecting through hole and the second fixing hole are connected by using screws, so that the connection between the fixing frame 430 of the light source emitter 410 and the upper shell 201 is realized. Finally, the light source emitter 410 is fixed on the light source emitter 410 fixing frame 430, and then the light source emitter 410 fixing frame 430 is fixed on the lower surface of the upper shell 201, so that the light source emitter 410 is fixedly installed inside the optical module, the light source emitter 410 is connected with the upper shell 201 through the base 431, heat emitted by the light source emitter 410 is transmitted to the upper shell 201 through the base 431, and the heat dissipation effect is improved. When the light source emitter is detached, the gasket 4323 can be taken out only by unscrewing the screw connecting the support column 4321 and the base 431 for several turns and loosening the gasket 4323 between the pressing plate 4322 and the light source emitter 410, so that the connection between the light source emitter 410 and the base 431 can be released. Therefore, when the light source emitter 410 is repaired or replaced, the screw connecting the support column 4321 and the base 431 is loosened to take out the light source emitter 410, which is convenient and fast.

To electrically connect the sub circuit board 420 and the circuit board 300, a first connector is disposed on the sub circuit board 420 and is located on a lower surface of the sub circuit board 420, and the opening faces a side away from the light source emitter 410. The circuit board 300 is provided with the second connector with an opening orientation coinciding with that of the first connector. The first connector and the second connector are connected by adopting a flexible circuit board. One end of the circuit board 300 is provided with a gold finger, which is connected with an upper computer through the gold finger, receives an electrical signal of the upper computer, transmits the electrical signal to the sub-circuit board 420 through the flexible circuit board, and is connected with an external pin of the light source emitter 410 through an electrical pin on the sub-circuit board 420, so that signal transmission is realized.

The heat generated by the light source emitter 410 is transferred to the upper casing 201 through the base 431, and then is connected with the upper casing 201 through the base 431, and the heat emitted by the light source emitter 410 is transferred to the upper casing 201 through the base 431, so that the heat dissipation effect is improved. To achieve heat dissipation of the light source emitter 410, the material of the housing of the light source emitter 410 includes, but is not limited to, tungsten copper, raft alloy, SPCC (Steel Plate Cold rolled Commercial, Cold rolled carbon Steel), copper, etc., to facilitate heat transfer generated by the optoelectronic device to the base 431.

Fig. 15 is a schematic view of another angle structure of the upper housing according to the embodiment of the present disclosure, fig. 16 is an exploded structure schematic view of the upper housing and the fixing frame, and fig. 17 is a schematic view of the upper housing, the light source emitter, and the optical fiber adapter according to the embodiment of the present disclosure. As shown in fig. 15, 16 and 17, in order to facilitate the connection and fixation of the holder 430 with the upper case 201 and improve the connection stability, the holder 430 is installed inside the bracket installation groove 2014, and the upper surface of the base contacts the lower surface of the bracket installation groove 2014. The diagonal position that is located the support mounting groove of first fixed orifices 2015 and second fixed orifices 2016 is convenient for install and stable. First fixed orifices 2015 and second fixed orifices 2016 are the counter bore setting at apron 2011 upper surface, make things convenient for the screw head to sink into, do not bulge in apron 2011 surface for the optical module outward appearance is cleaner and tidier, the convenient structure with the host computer of being connected. The cover plate 2011 is further provided with a third fixing hole, which penetrates through the upper surface and the lower surface of the cover plate 2011, and is used for fixing the upper casing 201 and the lower casing 202. In this application, a countersunk screw is screwed into the optical module from the lower surface of the upper housing 201, and the fixing frame 430 is mounted on the lower surface of the upper housing 201.

When the optical transceiver module is mounted, the sub circuit board 420 and the base 431 are fixed by screws between the third fixing hole 421 and the third connecting through hole 4315, and between the fourth fixing hole 422 and the fourth connecting through hole 4316, the light source emitter 410 is fixed between the pressing plate 4322 and the base 431, and the supporting column 4321 is connected to the base 431 by screws. The light source emitter 410 and the daughter circuit board 420 are fixed on the fixing frame 430. Then, screws are screwed into the optical module from the lower surface of the upper case 201, and the first fixing holes 2015 are connected to the first connection holes 4311, and similarly, the second connection holes 4312 are connected to the bases of the second fixing holes 2016, so that the holder 430 on which the light source emitter 410 and the sub circuit board 420 are mounted is connected to the upper case 201.

The fifth fixing hole 2017 is disposed at one side of the bracket mounting groove 2014, near the light opening. In order to realize uniform stress between the upper shell and the lower shell, the distance from the fifth fixing hole to the first upper side plate 2012 is consistent with the distance from the fifth fixing hole to the second upper side plate 2013.

In order to realize the transmission of light, the first fiber adapter 206 and the second fiber adapter 207 are disposed in the optical module and disposed at the optical port 205, the first fiber adapter 206 is disposed near the light source emitter 410, and for facilitating the installation of the first fiber adapter 206, the supporting column 4321 is disposed with an adaptive avoiding groove 4324, and the first fiber adapter 206 and the second fiber adapter 207 are disposed between the fixing frame and the circuit board 300. The edge of the first fiber optic adapter 206 contacts the adapter avoidance groove 4324, so that the first fiber optic adapter 206 can be installed in an avoidance manner, and the first fiber optic adapter 206 can be positioned, thereby being beneficial to the stability of the first fiber optic adapter. The first optical fiber adapter 206 is connected to the silicon optical chip through an optical fiber, and is configured to transmit an optical signal to the outside of the optical module.

Fig. 18 is a schematic structural view of a circuit board and a lower housing provided in the embodiment of the present application, and fig. 19 is an exploded schematic structural view of the circuit board and the lower housing provided in the embodiment of the present application. As shown in fig. 18 and 19, the lower housing 202 includes a bottom plate 2021, and two lower side plates, a first lower side plate 2022 and a second lower side plate 2023, which are located on two sides of the bottom plate and are perpendicular to the bottom plate. The two side walls are combined with the two side plates to realize that the upper shell 201 is covered on the lower shell 202. In order to position the circuit board in the lower housing, the lower housing 202 is provided with a plurality of fixed tables 2024, and the fixed tables 2024 have the same top height and are used for supporting the circuit board. The top supporting surface of the fixing base 2024 is used for contacting the lower surface of the circuit board 300, so as to support the circuit board 300 and position the optical module in the height direction. In the embodiment of the present application, the fixing table may be a structure protruding from an inner sidewall of the lower housing 202 and having a supporting top surface. The shape of each fixing table may be the same or different.

Further, in order to ensure the accuracy of the installation of the circuit board 300, a first position-limiting post 2025 and a second position-limiting post 2026 are further disposed on the sidewall of the lower housing 202. The first limiting column 2025 and the second limiting column 2026 can realize the mounting and positioning of the circuit board 300, and can also realize the fixation of the circuit board 300 in the length direction of the optical module. The positions of the first stopper 2025 and the second stopper 2026 in the length direction of the optical module may be different or may be the same.

The side of the circuit board 300 is provided with a first limit port 301, the first limit port 301 is connected with a first limit post 2025 in a clamping manner, the second side of the circuit board 300 is provided with a second limit port 302, and the second limit port 302 is connected with a second limit post 2026 in a clamping manner. In the embodiment of the present application, the first stopper post 2025 and the second stopper post 2026 correspond to the first stopper opening 301 and the second stopper opening 302.

In order to fix the circuit board 300 to the lower case, a fifth mounting through hole 20211 is formed in the middle of the bottom plate 2021, and a seventh fixing hole 310 is formed in the circuit board 300. The fifth mounting through-hole 20211 is connected with a screw from the upper surface of the circuit board 300 through the seventh fixing hole 310. Because the lower surface of the circuit board 300 is also provided with a plurality of electronic components, in order to support the circuit board, the middle of the bottom plate 2021 is provided with a through hole table 20212, and the fifth installation through hole 20211 is located on the through hole table 20212. The lower surface of the circuit board 300 is in contact connection with the through hole table 20212, so that the circuit board 300 is supported and positioned. The through-hole mesa 20212 protrudes with respect to the inner sidewall of the bottom plate 2021 and has a supporting top surface.

Further, to facilitate the installation of the circuit board 300 and achieve uniform stress on the circuit board 300, the through hole table 20212 is disposed in the middle of the bottom plate 2021, and the distance from the through hole table 20212 to the first lower side plate 2022 is the same as the distance from the through hole table 20212 to the second lower side plate 2023. The distance from the end surface of the via land 20212 to the lower surface of the bottom plate 2021 is greater than the distance from the upper surface to the lower surface of the bottom plate 2021, i.e., the thickness of the via land 20212 is greater than the thickness of the bottom plate 2021. A screw penetrates through the seventh fixing hole 310 on the circuit board 300 and is connected with the fifth mounting through hole 20211, but does not protrude out of the lower end face of the fifth mounting through hole 20211, so that the integrity of the lower surface of the bottom plate 2021 is maintained, and the optical module is conveniently connected with an upper computer.

The optical module is provided with a plurality of photoelectric devices, and a plurality of optical fibers are arranged for realizing the transmission of light among the photoelectric devices. In order to facilitate the installation of the optical fiber and reduce the optical loss, the length of the optical fiber is far greater than the distance between the photoelectric components. In order to improve the stability of the optical fiber, the optical module is further provided with an optical fiber bracket 500 arranged above the circuit board 300, an optical fiber groove is arranged above the optical fiber bracket, and the optical fiber is fixed in the optical fiber groove.

Fig. 20 is a schematic structural view of a fixing frame, an optical fiber bracket and a circuit board according to an embodiment of the present disclosure, and fig. 21 is a schematic structural view of a detachment of the optical fiber bracket and the circuit board according to an embodiment of the present disclosure. FIG. 22 is a schematic view of another angle structure of a fiber optic stand according to an embodiment of the present disclosure. As shown in fig. 20, 21 and 22, in order to realize the positioning and installation of the optical fiber bracket 500 and the circuit board 300, a first limiting portion 501 and a second limiting portion 502 are disposed at one end of the bottom surface of the optical fiber bracket 500. The circuit board 300 is provided with a third limiting opening 303, and the first limiting portion 501 is clamped and connected with the third limiting opening 303. The circuit board 300 is provided with a fourth position-limiting opening 304, and the second position-limiting portion 502 is connected to the fourth position-limiting opening 304 in a clamping manner. The first limiting portion 501 and the second limiting portion 502 can not only realize the installation and positioning of the optical fiber bracket 500 on the circuit board 300, but also realize the fixation of the optical fiber bracket 500 in the height direction of the optical module.

Further, the first limiting portion 501 is provided with a first clamping portion 5011, is embedded into the third limiting port 303, and is clamped with the circuit board 300, so that the optical fiber support 500 is fixed in the length direction of the optical module. The first locking portion 5011 protrudes downward relative to the first supporting surface 5012, and the first supporting surface 5012 contacts with the upper surface of the circuit board 300, so that the optical fiber holder 500 is mounted and positioned on the circuit board 300, and the optical fiber holder 500 is fixed in the height direction of the optical module. The first clamping portion 5011 is inserted into the third limiting opening 303 to fix the optical fiber holder 500 in the length direction of the optical module.

The second limit portion 502 is provided with a second clamping portion 5021, is embedded into the fourth limit port 304, and is clamped with the circuit board 300, so that the optical fiber support 500 is fixed in the length direction of the optical module. The second hooking portion 5021 protrudes downward relative to the second supporting surface 5022, and the second supporting surface 5022 contacts with the upper surface of the circuit board 300, so that the fiber holder 500 is mounted and positioned on the circuit board 300, and the fiber holder 500 is fixed in the height direction of the optical module. The second clamping part 5021 is embedded into the fourth limiting opening 304, so that the optical fiber bracket 500 is fixed in the length direction of the optical module.

Further, in order to improve the stability of the optical fiber holder 500 on the circuit board 300, the lower surface of the optical fiber holder 500 is further provided with a first supporting portion 503 and a second supporting portion 504, which are in contact connection with the upper surface of the circuit board 300, so that the optical fiber holder 500 is fixed in the height direction of the optical module. The first supporting portion 503 and the second supporting portion 504 have a structure for supporting the top surface to be flat for surface contact connection with the circuit board 300. In the embodiment of the present application, in order to facilitate the mounting of the optoelectronic device on the circuit board, the heights of the ends of the first supporting portion 503 and the second supporting portion 504 are the same. And the end portions of the first and

second support portions

503 and 504 are at the same level as the first and second support faces 5012 and 5022.

In the present application, the first supporting portion 503 and the second supporting portion 504 are in contact with the upper surface of the circuit board 300, so that the optical fiber holder 500 is fixed in the height direction of the optical module. The first limiting portion 501 and the second limiting portion 502 are connected with the third limiting port 303 and the fourth limiting port 304 in a clamping manner, so that the optical fiber support 500 is fixedly connected with the circuit board 300.

When the circuit board 300 is installed, the first supporting portion 503 and the second supporting portion 504 are in contact connection with the upper surface of the circuit board 300, and the first clamping connection portion 5011 is embedded into the third limiting opening 303 and clamped with the circuit board 300; the second clamping connection portion 5021 is embedded into the fourth limiting port 304 and clamped with the circuit board 300, so that the optical fiber bracket 500 is fixed in the height direction of the optical module. A first supporting portion 503 and a second supporting portion 504 which are in contact connection with the upper surface of the circuit board 300; the first supporting portion 503 and the second supporting portion 504 are in contact with the upper surface of the circuit board 300, and the optical fiber holder 500 is fixed in the height direction of the optical module. The fiber holder 500 is fixed to the circuit board 300.

One end of the side of the optical fiber bracket 500 is provided with a first mounting slot 505 corresponding to the position of the first position-limiting opening 301 on the circuit board 300, and connected with the first position-limiting post 2025 in a clamping manner. A second mounting slot 506 is disposed at one end of the other side of the optical fiber bracket 500, corresponding to the position of the second position-limiting opening 302 on the circuit board 300, and connected to the second position-limiting post 2026 in a clamping manner. The first and second mounting

slots

505 and 506 are configured to achieve the positioning of the fiber holder 500 in the longitudinal direction of the lower housing 202.

Further, be equipped with a plurality of photoelectricity chips such as DSP on the circuit board 300, for making things convenient for fiber support 500's fixed mounting, reduce the space and occupy, fiber support 500's lower surface sets up photoelectricity and dodges the groove, and chips such as DSP set up in photoelectricity and dodge the inslot. The optical fiber support 500 covers the DSP, the distance between the optical fiber support 500 and the circuit board 300 is small, the space is reduced, and the optical module is miniaturized.

The lower surface of the fiber holder 500 is provided with a fiber groove for fixing the outgoing fiber of the light source emitter 410. The optical fiber support 500 and the fixing frame 430 are both disposed above the circuit board 300, and the optical fiber support 500 is located at one side of the fixing frame 430, and the projection of the optical fiber support 500 on the circuit board 300 is not overlapped with the projection of the fixing frame 430 and the circuit board 300. In the present application, the fixing frame 430 is close to the side of the light port 205, and the fiber support 500 is close to the side of the light port 205.

To facilitate the installation of the circuit board 300 on the lower housing, the seventh fixing hole 310 and the fifth mounting through hole 20211 are located outside the projection of the fiber holder 500 on the circuit board 300, near the light port 205 side.

Fig. 23 is a second schematic view of a partial structure of an optical module according to an embodiment of the present application; fig. 24 is a schematic cross-sectional view of a partial structure of an optical module according to an embodiment of the present application. As shown in fig. 23 and 24, in order to realize the electrical connection between the sub circuit board 420 and the circuit board 300, a first connector 423 is provided on the sub circuit board 420 at a lower surface of the sub circuit board 420, which is opened to a side of the light source emitter 410. The circuit board 300 is provided with a second connector 305 having an opening orientation coincident with that of the first connector. The first connector 423 and the second connector 305 are connected by a flexible circuit board 440. One end of the circuit board 300 is provided with a gold finger, which is connected with an upper computer through the gold finger, receives an electrical signal of the upper computer, transmits the electrical signal to the sub-circuit board 420 through the flexible circuit board 440, and is connected with an external pin of the light source emitter 410 through an electrical pin on the sub-circuit board 420, so as to realize signal transmission.

Further, for the convenience of installation, the first connector 423 is located outside the fixing frame, and the projection of the first connector 423 on the circuit board 300 is consistent with the projection of the second connector 305 on the circuit board 300 in the longitudinal direction of the optical module.

The lower surface of the sub-circuit board 420 is close to the upper surface of the circuit board 300, and the gap between the lower surface of the sub-circuit board 420 and the upper surface of the circuit board 300 is small after installation, which is not favorable for the arrangement of the electrical connector. Therefore, in the present application, the second connector 305 is disposed on the lower surface of the circuit board 300, the first connector 423 is disposed on the upper surface of the sub-circuit board 420, and the flexible circuit board 440 is wrapped outside the light source emitter 410. Specifically, the flexible circuit board 440 covers the outside of the optical fiber connector of the light source emitter 410. The flexible circuit board 440 has better flexibility and is convenient to install.

When the circuit board assembly is mounted, the sub circuit board 420 and the base 431 are fixed by screws passing through the third fixing hole 421 and the third connection through hole 4315, and the fourth fixing hole 422 and the fourth connection through hole 4316, the light source emitter 410 is fixed between the pressing plate 4322 and the base 431, and the supporting column 4321 is connected to the base 431 by screws. The light source emitter 410 and the daughter circuit board 420 are fixed on the fixing frame 430. Then, screws are screwed into the optical module from the lower surface of the upper case 201, and the first fixing holes 2015 are connected to the first connection holes 4311, and similarly, the second connection holes 4312 are connected to the bases of the second fixing holes 2016, so that the holder 430 on which the light source emitter 410 and the sub circuit board 420 are mounted is connected to the upper case 201. The first supporting part 503 and the second supporting part 504 are in contact connection with the upper surface of the circuit board 300, and the first clamping connection part 5011 is embedded into the third limiting opening 303 and clamped with the circuit board 300; the second clamping connection portion 5021 is embedded into the fourth limiting port 304 and clamped with the circuit board 300, so that the optical fiber bracket 500 is fixed in the height direction of the optical module. A first supporting portion 503 and a second supporting portion 504 which are in contact connection with the upper surface of the circuit board 300; the first supporting portion 503 and the second supporting portion 504 are in contact with the upper surface of the circuit board 300, and the optical fiber holder 500 is fixed in the height direction of the optical module. The fiber holder 500 is fixed to the circuit board 300. A screw is inserted from above the seventh fixing hole 310 of the circuit board 300 and connected to the fifth mounting through hole 20211, thereby fixing the circuit board 300 inside the lower case. One end of the flexible circuit board 440 is connected to the second connector on the lower surface of the circuit board 300, and the other end bypasses the light source emitter 410 and is connected to the first connector on the upper surface of the sub circuit board 420, so that the circuit board 300 and the sub circuit board 420 are electrically connected. The upper housing is then joined to the lower housing.

The application discloses optical module includes: and a light source emitter 410 disposed above the circuit board for emitting light. The sub circuit board 420 is disposed above the circuit board 300 and electrically connected to the circuit board 300 through a flexible circuit board. The light source emitter 410 is electrically connected to the sub circuit board 420, and the sub circuit board 420 drives the light source emitter 410. The light source emitter 410 fixing frame 430 is disposed above the circuit board and is used for fixing the light source emitter 410. The light source emitter 410 is fixed on the light source emitter 410 fixing frame 430, and one side of the light source emitter is provided with a plurality of pins connected with the sub circuit board 420. The light source emitter 410 fixing frame 430 is further connected with the upper shell 201, the light source emitter 410 is fixed on the upper shell 201 through the light source emitter 410 fixing frame 430, and heat emitted by the light source emitter 410 can be directly transmitted to the upper shell 201 through the light source emitter 410 fixing frame 430, so that the heat dissipation function of the optical module is improved. The stand 432 includes: a supporting column 4321 and a pressing plate 4322, wherein the supporting column 4321 is arranged below the base 431, one end of the supporting column 4321 is connected with the base 431, and the other end of the supporting column 4321 is connected with the pressing plate 4322. The upper surface of the pressing plate 4322 is connected with the light source emitter 410, and the light source emitter 410 is fixed between the pressing plate 4322 and the base 431, so that the light source emitter 410 is fixed. The heat generated by the light source emitter 410 is conducted directly to the upper housing 201 through the base 431 and then transferred to the cage for heat dissipation.

Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.

It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims

1. A light module, comprising: an upper housing;

the lower shell is covered with the upper shell to form a wrapping cavity;

the circuit board is arranged in the wrapping cavity;

the light source emitter is arranged in the packaging cavity;

the sub circuit board is arranged on one side of the light source emitter and is electrically connected with the light source emitter;

2. The light module of claim 1, wherein the pressure plate comprises:

one end of the bearing part is connected with the other end of the supporting column;

one end of the bearing part is connected with the other end of the bearing part; the light source emitter is arranged between the bearing part and the base; the upper surface of the bearing part is lower than that of the bearing part;

the gasket is arranged between the light source emitter and the bearing part, and the upper surface of the bearing part is lower than that of the gasket.

3. The light module of claim 2, wherein an upper surface of the light source emitter is connected to a lower surface of the base;

the lower surface of the light source emitter is connected with the upper surface of the bearing part.

4. The optical module according to claim 1, wherein an installation avoiding part is arranged at the edge of the sub circuit board and used for positioning and installing the light source emitter.

5. The optical module of claim 1, wherein an upper surface of the sub-circuit board is provided with a first connector; a second connector is arranged on the lower surface of the circuit board; the first connector and the second connector are connected through a flexible circuit board.

6. The optical module of claim 1, wherein the circuit board is provided with a silicon optical chip, and is connected with the light source emitter through an optical fiber.

7. The light module of claim 6, further comprising: the optical fiber adapter is connected with the silicon optical chip;

the support column is provided with an adaptive avoiding groove and is matched with the outer wall of the optical fiber adapter.

8. The optical module of claim 7, wherein the base is provided with a plurality of avoidance recesses for avoiding the electronic components on the sub circuit board.

9. The optical module according to claim 1, wherein a bracket mounting groove is formed in an inner wall of the upper housing, and is used for avoiding and positioning the base; the base is provided with a connecting through hole, the upper shell is provided with a fixing hole, and the connecting through hole is connected with the fixing hole through a screw.