CN117631160A

CN117631160A - Optical module

Info

Publication number: CN117631160A
Application number: CN202210967208.5A
Authority: CN
Inventors: 迟亚勋; 潘红超; 王力; 司宝峰
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-08-12
Filing date: 2022-08-12
Publication date: 2024-03-01

Abstract

The application discloses optical module, including circuit board and mount. The first circuit board includes a first positioning hole. The second circuit board is electrically connected with the first circuit board through the flexible circuit board and comprises a second positioning hole which is correspondingly arranged with the first positioning hole. The mount includes base, reference column and support column. The positioning column is correspondingly arranged with the second positioning hole, is clamped at the first positioning hole and the second positioning hole, is provided with a limiting protrusion and comprises a first sub-positioning column, a second sub-positioning column, a third sub-positioning column and a fourth sub-positioning column. The support column is connected with the lower surface of the first circuit board. The limit bulge is connected with the upper surface of the second circuit board. The vertical distance between the first sub-positioning column and the optical transceiver is smaller than that between the third sub-positioning column and the optical transceiver, and the vertical distance between the second sub-positioning column and the optical transceiver is smaller than that between the fourth sub-positioning column and the optical transceiver. In this application, the mount becomes a whole with first circuit board and second circuit board, and the optical module equipment of being convenient for.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

In general, to increase the transmission rate of an optical module, it is possible to use an increase in transmission channels in the optical module, such as improving a conventional optical module including one set of light emitting devices and one set of light receiving devices to an optical module including two sets of light emitting devices and two sets of light receiving devices. Thus, the space reserved for the circuit board by the optical module is smaller and smaller. Therefore, the problem that the space left for the circuit board by the optical module is small can be solved by adding a new circuit board above or below the original circuit board.

In the traditional optical module, a new circuit board is connected with an original circuit board through a flexible circuit board, and gaskets are used for extrusion and fixation between the new circuit board and the original circuit board. However, the new circuit board and the original circuit board are fixed by using the gasket in a pressing manner, so that the new circuit board and the original circuit cannot be effectively fixed into a whole, and the optical module is inconvenient to assemble.

Disclosure of Invention

The application provides an optical module, optical module equipment of being convenient for.

An optical module, comprising:

the circuit board comprises a first circuit board and a second circuit board;

the fixing frame is used for fixing the first circuit board and the second circuit board;

the first circuit board comprises a first positioning hole;

the second circuit board is electrically connected with the first circuit board through the flexible circuit board and comprises a second positioning hole which is arranged corresponding to the first positioning hole;

the fixing frame comprises a base, a positioning column and a supporting column;

the base comprises a first fixing plate and a third fixing plate which are oppositely arranged;

the positioning column is arranged corresponding to the second positioning hole and is clamped at the first positioning hole and the second positioning hole, and a limiting protrusion is arranged at one end far away from the first circuit board and comprises a first sub-positioning column, a second sub-positioning column, a third sub-positioning column and a fourth sub-positioning column;

The support column is connected with the lower surface of the first circuit board and is used for supporting the first circuit board;

the first fixing plate is provided with a first sub-positioning column and a second sub-positioning column;

the third fixing plate is provided with a third sub-positioning column and a fourth sub-positioning column;

the limiting bulge is connected with the upper surface of the second circuit board and used for limiting the position of the second circuit board;

the vertical distance between the first sub-positioning column and the optical transceiver is smaller than that between the third sub-positioning column and the optical transceiver, and the vertical distance between the second sub-positioning column and the optical transceiver is smaller than that between the fourth sub-positioning column and the optical transceiver.

The beneficial effects are that: the application provides an optical module, which comprises a circuit board and a fixing frame. The circuit board comprises a first circuit board and a second circuit board. The fixing frame is used for fixing the first circuit board and the second circuit board. The first circuit board includes a first positioning hole. The second circuit board is electrically connected with the first circuit board through the flexible circuit board and comprises a second positioning hole. The second positioning hole is arranged corresponding to the first positioning hole. In the traditional optical module, a first circuit board and a second circuit board are electrically connected through a flexible circuit board, and gaskets are used for extrusion and fixation between the first circuit board and the second circuit board. However, the first circuit board and the second circuit board are fixed by using the gasket in a pressing manner, so that the first circuit board and the second circuit board cannot be effectively fixed into a whole, and the assembly of the optical module is inconvenient. Therefore, it is necessary to design a fixing frame so that the first circuit board and the second circuit board are integrated. The mount includes base, reference column and support column. The base includes first fixed plate and the third fixed plate of relative setting. The positioning column is correspondingly arranged with the second positioning hole, is clamped at the first positioning hole and the second positioning hole, is provided with a limiting protrusion at one end far away from the first circuit board, and comprises a first sub positioning column, a second sub positioning column, a fourth sub positioning column and a fourth sub positioning column. And the support column is connected with the lower surface of the first circuit board and used for supporting the first circuit board. The first fixing plate is provided with a first sub-positioning column and a second sub-positioning column. The third fixing plate is provided with a third sub-positioning column and a fourth sub-positioning column. And the limiting protrusion is connected with the upper surface of the second circuit board and used for limiting the position of the second circuit board. The locating column joint is in first locating hole and second locating hole department, and the support column is connected with the lower surface of first circuit board, and spacing arch is connected with the upper surface of second circuit board for first circuit board and second circuit board become a whole. The vertical distance between the first sub-positioning column and the optical transceiver component is smaller than that between the third sub-positioning column and the optical transceiver component, and the vertical distance between the second sub-positioning column and the optical transceiver component is smaller than that between the fourth sub-positioning column and the optical transceiver component, which means that the first sub-positioning column and the second sub-positioning column on the first fixing plate are asymmetrically arranged with the third sub-positioning column and the fourth sub-positioning column on the third fixing plate. The first sub-positioning columns and the second sub-positioning columns on the first fixing plate and the third sub-positioning columns and the fourth sub-positioning columns on the third fixing plate are asymmetrically arranged, so that the fixing frame fixes the first circuit board and the second circuit board into a whole without changing the position of the main chip on the first circuit board. In this application, the reference column joint of mount is in first locating hole and second locating hole department, and the support column is connected with the lower surface of first circuit board, and spacing arch is connected with the upper surface of second circuit board, and first sub-reference column is less than the perpendicular distance of third sub-reference column and light transceiver module with light transceiver module's perpendicular distance, and the perpendicular distance of second sub-reference column and light transceiver module is less than the perpendicular distance of fourth sub-reference column and light transceiver module for first circuit board and second circuit board become a whole, the optical module equipment of being convenient for.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a diagram of the connection relationship of an optical communication system;

fig. 2 is a block diagram of an optical network terminal;

FIG. 3 is a block diagram of an optical module according to some embodiments;

fig. 4 is another block diagram of an optical module according to some embodiments;

fig. 5 is an exploded structural view of an optical module according to some embodiments;

fig. 6 is another exploded structural view of an optical module according to some embodiments;

FIG. 7 is a block diagram of an optical transceiver assembly, a circuit board and a mount according to some embodiments;

FIG. 8 is another block diagram of an optical transceiver assembly, a circuit board and a mount according to some embodiments;

FIG. 9 is an exploded view of an optical transceiver assembly, a circuit board, and a mount according to some embodiments;

FIG. 10 is a block diagram of a second flexible circuit board according to some embodiments;

FIG. 11 is a block diagram of a third flexible circuit board according to some embodiments;

FIG. 12 is a block diagram of a circuit board and a fixture according to some embodiments;

FIG. 13 is another block diagram of a circuit board and a mount according to some embodiments;

FIG. 14 is a block diagram of a mount and a first circuit board according to some embodiments;

FIG. 15 is an exploded view of a circuit board and a mount according to some embodiments;

FIG. 16 is an exploded view of a circuit board according to some embodiments;

FIG. 17 is a block diagram of a first circuit board according to some embodiments;

FIG. 18 is a block diagram of a second circuit board according to some embodiments;

FIG. 19 is a block diagram of a mount according to some embodiments;

FIG. 20 is a block diagram of an upper housing, an optical transceiver assembly, a circuit board, and a mount according to some embodiments;

FIG. 21 is another block diagram of an upper housing, an optical transceiver assembly, a circuit board, and a mount according to some embodiments;

FIG. 22 is a block diagram of the upper housing and the first circuit board according to some embodiments;

FIG. 23 is another block diagram of the upper housing and the first circuit board according to some embodiments;

Fig. 24 is a block diagram of the upper housing, the first circuit board, and the mount according to some embodiments;

FIG. 25 is a block diagram of an upper housing and unlocking components according to some embodiments;

FIG. 26 is a block diagram of an upper housing according to some embodiments;

FIG. 27 is another block diagram of an upper housing according to some embodiments;

FIG. 28 is a block diagram of a lower housing according to some embodiments;

fig. 29 is a cross-sectional view of an optical module according to some embodiments;

FIG. 30 is another cross-sectional view of an optical module according to some embodiments;

FIG. 31 is a block diagram of an unlocking component according to some embodiments;

FIG. 32 is another block diagram of an unlocking component according to some embodiments;

FIG. 33 is a block diagram of an unlock according to some embodiments;

FIG. 34 is another block diagram of an unlock according to some embodiments;

fig. 35 is a block diagram of an unlocking handle according to some embodiments.

Detailed Description

In an optical communication system, an optical signal is used to carry information to be transmitted, and the optical signal carrying the information is transmitted to an information processing device such as a computer through an information transmission device such as an optical fiber or an optical waveguide, so as to complete the transmission of the information. Since light has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost, low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and the electric connection is mainly used for power supply, I2C signal transmission, data information transmission, grounding and the like; the optical network terminal transmits the electric signal to information processing equipment such as a computer through a network cable or wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system. As shown in fig. 1, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-range signal transmission, such as several kilometers (6 kilometers to 8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to achieve unlimited distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing apparatus 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port configured to access the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that an information connection is established between the optical fiber 101 and the optical network terminal 100. Illustratively, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101. Since the optical module 200 is a tool for implementing the mutual conversion between the optical signal and the electrical signal, it has no function of processing data, and the information is not changed during the above-mentioned photoelectric conversion process.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. Illustratively, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits an electrical signal from the network cable 103 to the optical module 200, so that the optical network terminal 100, as a host computer of the optical module 200, can monitor the operation of the optical module 200. The upper computer of the optical module 200 may include an optical line terminal (Optical Line Terminal, OLT) or the like in addition to the optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal, and fig. 2 shows only the configuration of the optical network terminal 100 related to the optical module 200 in order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 and the optical network terminal 100 propose a bi-directional electrical signal connection. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101.

Fig. 3 is a first angle block diagram of an optical module according to some embodiments. Fig. 4 is a second angular block diagram of an optical module according to some embodiments. Fig. 5 is an exploded structural view of an optical module according to some embodiments. Fig. 6 is another exploded structural view of an optical module according to some embodiments. As shown in fig. 3-6, the optical module 200 includes a housing (shell), a circuit board 300 disposed within the housing, a first optical transceiver assembly 401, and a second optical transceiver assembly 402.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being covered on the lower housing 202 to form the above-mentioned housing having two openings; the outer contour of the housing generally presents a square shape.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed at both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011 and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction in which the two openings 204 and 205 are connected may be the same as the longitudinal direction of the optical module 200 or may be different from the longitudinal direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical port, and the golden finger of the circuit board 300 extends out from the electrical port 204 and is inserted into an upper computer (for example, the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101 such that the external optical fiber 101 connects to the optical transceiver assembly 400 inside the optical module 200.

The circuit board 300, the first optical transceiver module 401, the second optical transceiver module 402 and other devices are conveniently installed in the shell by adopting an assembly mode that the upper shell 201 and the lower shell 202 are combined, and the upper shell 201 and the lower shell 202 form packaging protection for the devices. In addition, when the circuit board 300, the first optical transceiver module 401, the second optical transceiver module 402 and other devices are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are convenient to deploy, and the automatic production implementation is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member located outside of the housing thereof, the unlocking member being configured to enable or disable the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking component 203 is located on the bottom plate 2011 of the upper housing 201, with a snap fit that mates with an upper computer cage (e.g., cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping piece of the unlocking component; when the unlocking component is pulled, the clamping piece of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping piece and the upper computer is changed, the clamping relation between the optical module 200 and the upper computer is relieved, and the optical module 200 can be pulled out of the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components and chips, which are connected together by the circuit traces according to a circuit design to realize functions such as power supply, electrical signal transmission, and grounding. The electronic components include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driving chip, a limiting amplifier (limiting amplifier), a clock data recovery (Clock and Data Recovery, CDR) chip, a power management chip, a digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; when the optical transceiver component is positioned on the circuit board, the hard circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electrical connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is conductively connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 or on the surfaces of the upper side and the lower side of the circuit board 300 so as to adapt to the occasion with large pin number requirement. The golden finger is configured to establish electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like.

Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board. For example, a flexible circuit board may be used to connect the hard circuit board and the optical transceiver.

The optical transceiver module 400 includes a light emitting device configured to implement emission of an optical signal and a light receiving device configured to implement reception of the optical signal. Illustratively, the light emitting device and the light receiving device are combined together to form an integral light transceiving component.

After the traditional optical module comprising a group of light emitting devices and a group of light receiving devices is improved into the optical module comprising two groups of light emitting devices and two groups of light receiving devices, the space reserved for the circuit board by the optical module is smaller and smaller, so that a new circuit board connected with the original circuit board is needed to be added above or below the original circuit board to solve the problem of small space of the circuit board in the optical module.

In the traditional optical module, a first circuit board and a second circuit board are electrically connected through a flexible circuit board, and gaskets are used for extrusion and fixation between the first circuit board and the second circuit board. However, the first circuit board and the second circuit board are fixed by using the gasket in a pressing manner, so that the first circuit board and the second circuit board cannot be effectively fixed into a whole, and the assembly of the optical module is inconvenient. Therefore, it is necessary to design a fixing frame so that the first circuit board and the second circuit board are integrated.

Fig. 7 is a block diagram of an optical transceiver assembly, a circuit board and a holder according to some embodiments. Fig. 8 is another block diagram of an optical transceiver assembly, a circuit board and a holder according to some embodiments. Fig. 9 is an exploded view of an optical transceiver assembly, a circuit board, and a mount according to some embodiments. As can be seen in fig. 7-9, in some embodiments, the circuit board 300 includes a first circuit board 301 and a second circuit board 302, the first circuit board 301 and the second circuit board 302 are electrically connected by a first flexible circuit board 303, and the fixing frame 500 is used to fix the first circuit board 301 and the second circuit board 302. The fixing frame 500 fixes the first circuit board 301 and the second circuit board 302 as a unit.

The first circuit board 301 is provided with a gold finger on an end surface thereof. The second circuit board 302 is located between the first circuit board 301 and the upper case 201, the upper surface is provided with a chip connected to the first heat conductive pad 600, and the lower surface is provided with the second heat conductive pad 700. Wherein, the first circuit board 301 and the second circuit board 302 are both hard circuit boards.

The first heat conductive pad 600 has an upper surface connected to the inner surface of the upper case 201 and a lower surface connected to the chip on the second circuit board 302, and is used for absorbing part of heat generated from the chip on the second circuit board 302 and also for transferring the heat generated from the chip on the second circuit board 302 to the upper case 201 to reduce the temperature of the chip.

And the second heat-conducting gasket 700, the upper surface of which is connected with the lower surface of the second circuit board 302, and the lower surface of which is not connected with the upper surface of the first circuit board 302, is used for absorbing heat generated by the second circuit board 302 so as to reduce the temperature of the second circuit board 302.

Fig. 10 is a block diagram of a second flexible circuit board according to some embodiments. Fig. 11 is a block diagram of a third flexible circuit board according to some embodiments. As can be seen in fig. 7-11, in some embodiments, the first optical transceiver 401 is connected to the first circuit board 301 through the second flexible circuit board 304, so as to implement transmission and reception of optical signals. The second optical transceiver module 402 is disposed in parallel with the first optical transceiver module 401, and is connected to the first circuit board 301 through the third flexible circuit board 305, so as to implement transmission and reception of optical signals. The second flex circuit 304 and the third flex circuit 305 each include a connecting flex circuit and two sub-flex circuit. The first ends of the connecting flexible circuit boards are respectively connected with the two sub flexible circuit boards, and the second ends of the connecting flexible circuit boards are connected with the surface of the first circuit board. And a sub flexible circuit board, the first end of which is connected with the light emitting device of the first light receiving and transmitting assembly 401 or the second light receiving and transmitting assembly 402, and the second end of which is connected with the first end of the connecting flexible circuit board. The other sub-flexible circuit board has a first end connected to the light receiving device of the first light receiving and transmitting assembly 401 or the second light receiving and transmitting assembly 402 and a second end connected to the first end of the connection flexible circuit board.

The first ends of the connecting flexible circuit boards are respectively connected with the two sub flexible circuit boards, and the connecting flexible circuit boards are used for connecting one sub flexible circuit board and the other sub flexible circuit board into a whole. Because the connecting flexible circuit board connects one sub flexible circuit board and the other sub flexible circuit board into a whole, and the second end of the connecting flexible circuit board is connected with the surface of the first circuit board, when the connecting flexible circuit board is welded on the surface of the first circuit board, the connecting flexible circuit board is directly welded on the surface of the first circuit board without considering leaving enough safety distance, and the connection of the optical transceiver component and the circuit board is realized.

In particular, the method comprises the steps of,

the first optical transceiver module 401 includes a first round square tube 4011, a first light emitting device 4012, a first light receiving device 4013, a first optical module, and a first optical fiber adapter 4014. The first round square tube 4011 is provided with a first tube orifice, a second tube orifice and a third tube orifice. The first light emitting device 4012 is embedded in the first pipe orifice, the first light receiving device 4013 is embedded in the second pipe orifice, the first optical component is arranged in the inner cavity of the first round square pipe body 4011, the first optical fiber adapter 4014 is embedded in the third pipe orifice, and the first light emitting device 4012 and the first light receiving device 4013 are respectively connected with the first optical fiber adapter 4014 in an optical mode to achieve a single-fiber bidirectional optical transmission mode.

The second flexible circuit board 304 includes a first connection flexible circuit board 3041, a first sub flexible circuit board 3042, and a second sub flexible circuit board 3043. The first connection flexible circuit board 3041 has a first end connected to the second ends of the first and second sub-flexible circuit boards 3042 and 3043, respectively, and a second end connected to the lower surface of the first circuit board 301. A first sub-flexible circuit board 3042, the first end of which is connected to the light emitting device of the first light transceiving component 401. The second sub-flexible circuit board 3043 has a first end connected to the light receiving device of the first optical transceiver module 401, is disconnected from the first sub-flexible circuit board 3042, and is positioned between the first sub-flexible circuit board 3042 and the third flexible circuit board 305.

Since the vertical distance between the first round square tube 4011 and the first circuit board 301 is greater than the vertical distance between the first orifice of the first round square tube 4011 and the first circuit board 301, the length dimension of the second sub-flexible circuit board 3043 connecting the first light receiving device 4013 on the second orifice of the first round square tube 4011 and the first circuit board 301 is greater than the length dimension of the first sub-flexible circuit board 3042 connecting the first light emitting device 4012 on the first orifice of the first round square tube 4011 and the first circuit board 301.

The first light emitting device 4012 is connected to the lower surface of the first circuit board 301 through the first sub flexible circuit board 3042 and the first connection flexible circuit board 3041 for emitting data light. The first light receiving device 4013 is connected to the lower surface of the first circuit board 301 through the second sub flexible circuit board 3043 and the first connection flexible circuit board 3041 for receiving the data light. The first optical component is disposed in the inner cavity of the first round square tube 4011, and is used for adjusting the data light emitted by the first light emitting device 4012 and the data light incident on the first light receiving device 4013. A first fiber optic adapter 4014 for connecting optical fibers. Wherein the other side of the first connection flexible circuit board 3041 is connected to the lower surface of the first circuit board 301.

If the second flexible circuit board 304 includes only the first sub-flexible circuit board and the second sub-flexible circuit board that are not connected, the first sub-flexible circuit board must be provided with a sufficient safety distance between the soldering point of the first circuit board 301 and the soldering point of the second sub-flexible circuit board 301 when the first sub-flexible circuit board and the second sub-flexible circuit board that are not connected are soldered to the lower surface of the first circuit board 301, so that signal crosstalk caused by overlapping of the soldering point of the first sub-flexible circuit board at the first circuit board 301 and the soldering point of the second sub-flexible circuit board at the first circuit board 301 is avoided.

Because the first connection flexible circuit board 3041 connects the first sub-flexible circuit board 3042 and the second sub-flexible circuit board 3043 as a whole, and the other side of the connection flexible circuit board is connected to the lower surface of the first circuit board 301, when the first connection flexible circuit board 3041 is welded to the lower surface of the first circuit board 301, the first connection flexible circuit board 3041 is directly welded to the lower surface of the first circuit board 301 without considering a sufficient safety distance, and the connection between the first optical transceiver component and the first circuit board is realized.

The second sub flexible circuit board 3043 includes a first connection portion 30431 and a second connection portion 30434, a first end of the first connection portion 30431 is electrically connected to the first light receiving device 30431, a second end of the first connection portion 30431 is connected to a first end of the second connection portion 3032, and a second end of the second connection portion 30434 is connected to the first connection flexible circuit board 3041.

The first end of the first connection portion 30431 is electrically connected to the first light receiving device 30431. Specifically, the first connection portion 30431 is provided with a first soldering hole 304311, and a pin of the first receiving device 4013 is inserted into the first soldering hole 304311 and soldered at the first soldering hole 304311 to electrically connect the first light receiving device 4013 with the second sub flexible circuit board 3043.

Since the signal line laid on the first connection portion 30431 needs to avoid the first soldering hole 304311, and the signal line laid on the second connection portion 30434 cannot avoid other devices, the width of the first connection portion 30431 is greater than the width of the second connection portion 30434.

The second optical transceiver module 402 includes a second round square tube body 4021, a second light emitting device 4022, a second light receiving device 4023, a second optical module, and a second optical fiber adapter 4024. The second round square tube 4021 is also provided with a first tube orifice, a second tube orifice and a third tube orifice. The second light emitting device 4022 is embedded in the first pipe orifice, the second light receiving device 4023 is embedded in the second pipe orifice, the second optical component is arranged in the inner cavity of the second round square pipe body 4021, the second optical fiber adapter 4024 is embedded in the third pipe orifice, and the second light emitting device and the second light receiving device 4023 are respectively connected with the second optical fiber adapter 4024 in an optical mode so as to realize a single-fiber bidirectional optical transmission mode.

The third flexible circuit board 305 includes a second connection flexible circuit board 3051, a third sub flexible circuit board 3052, and a fourth sub flexible circuit board 3053. The second connection flexible circuit board 3051 has a first end connected to the second ends of the third and fourth sub flexible circuit boards 3052 and 3053, respectively, and a second end connected to the upper surface of the first circuit board 301. The third sub-flexible circuit board 3052 has a first end connected to the light emitting device of the second optical transceiver module 402. The fourth sub-flexible circuit board 3053 has a first end connected to the light receiving device of the second optical transceiver module 402, is not connected to the third sub-flexible circuit board 3052, and is located between the third sub-flexible circuit board 3052 and the second flexible circuit board 304.

Since the vertical distance between the second round square tube body 4021 and the first circuit board 301 is greater than the vertical distance between the first tube orifice of the second round square tube body 4021 and the first circuit board 301, the length of the fourth sub-flexible circuit board 3053 connecting the second light receiving device 4023 on the second tube orifice of the second round square tube body 4021 and the first circuit board 301 is greater than the length of the third sub-flexible circuit board 3052 connecting the second light emitting device 4022 on the first tube orifice of the second round square tube body 4021 and the first circuit board 301.

The second light emitting device 4022 is connected to the upper surface of the first circuit board 301 through the third sub flexible circuit board 3052 and the second connection flexible circuit board 3051 for emitting data light. The second light receiving device 4023 is connected to the upper surface of the first circuit board 301 through the fourth sub flexible circuit board 3053 and the second connection flexible circuit board 3051 for receiving the data light. The second optical component is disposed in the inner cavity of the second round square tube 4021, and is used for adjusting the data light emitted by the second light emitting device 4022 and adjusting the data light incident to the second light receiving device 4023. A second fiber optic adapter 4024 for connecting optical fibers. Wherein the second connection flexible circuit board 3051 is connected with the upper surface of the first circuit board 301.

If the third flexible circuit board 305 includes only the third sub-flexible circuit board and the fourth sub-flexible circuit board that are not connected, the third sub-flexible circuit board must be kept with a sufficient safety distance between the soldering point of the first circuit board 301 and the soldering point of the fourth sub-flexible circuit board at the first circuit board 301 when the third sub-flexible circuit board and the fourth sub-flexible circuit board that are not connected are soldered to the upper surface of the first circuit board 301, so that signal crosstalk caused by overlapping of the soldering point of the third sub-flexible circuit board at the first circuit board 301 and the soldering point of the fourth sub-flexible circuit board at the first circuit board 301 is avoided.

Because the second connection flexible circuit board 3051 connects the third sub flexible circuit board 3052 and the fourth sub flexible circuit board 3053 as a whole, and the other side of the second connection flexible circuit board 3051 is connected with the lower surface of the first circuit board 301, when the second connection flexible circuit board 3051 is welded on the upper surface of the first circuit board 301, a sufficient safety distance is not required to be left, the second connection flexible circuit board 3051 is directly welded on the upper surface of the first circuit board 301, and connection between the second optical transceiver component and the first circuit board is realized.

The fourth sub flexible circuit board 3053 includes a third connection part 30531 and a fourth connection part 30532, a first end of the third connection part 30531 is electrically connected to the fourth connection part 30532, a second end of the third connection part 30531 is connected to the first end of the fourth connection part 30532, and a second end of the fourth connection part 30532 is connected to the second connection flexible circuit board 3051.

The first end of the third connection portion 30531 is electrically connected to the second light receiver 30531. Specifically, the third connection portion 30531 is provided with a second soldering hole 305311, and a pin of the second receiving device 4023 is inserted into the second soldering hole 305311 and soldered at the second soldering hole 305311 to electrically connect the second receiving device 4023 with the fourth sub flexible circuit board 3053.

Since the signal line laid on the third connection portion 30531 needs to avoid the second soldering hole 305311, and the signal line laid on the fourth connection portion 30532 cannot avoid other devices, the width of the third connection portion 30531 is greater than that of the fourth connection portion 30532.

In this application, second flexible circuit board and third flexible circuit board all include one connect flexible circuit board and two sub-flexible circuit boards, connect flexible circuit board first end and be connected with two sub-flexible circuit boards respectively, connect flexible circuit board second end and first circuit board's surface connection, when will connect flexible circuit board welding in first circuit board's surface, directly will connect flexible circuit board welding in first circuit board's surface can, realized the connection of light transceiver module and circuit board.

Fig. 12 is a block diagram of a circuit board and a holder according to some embodiments. Fig. 13 is another block diagram of a circuit board and a holder according to some embodiments. Fig. 14 is a block diagram of a mount and a first circuit board according to some embodiments. Fig. 15 is an exploded view of a circuit board and a mount according to some embodiments. Fig. 16 is an exploded view of a circuit board according to some embodiments. Fig. 17 is a block diagram of a first circuit board according to some embodiments. Fig. 18 is a block diagram of a second circuit board according to some embodiments. Fig. 19 is a block diagram of a mount according to some embodiments. As can be seen in fig. 7-19, in some embodiments, the first circuit board 301 includes a first locating hole 3011, a first card interface 3012, a second card interface 3013, a first notch area 3014, and a second notch area 3015. In particular, the method comprises the steps of,

The first positioning hole 3011 is formed by a sidewall of the first circuit board 301 being recessed inward. The first positioning hole 3011 includes a first sub-positioning hole 30111, a second sub-positioning hole 30112, a third sub-positioning hole 30113, and a fourth sub-positioning hole 30114. The first and second sub-positioning holes 30111 and 30112 are each formed by inward depression of a first side wall of the first circuit board 301, and the third and fourth sub-positioning holes 30113 and 30114 are each formed by inward depression of a second side wall of the first circuit board 301. The first sub-positioning hole 30111 and the third sub-positioning hole 30113 are close to one end of the optical transceiver module 400, the second sub-positioning hole 30112 and the fourth sub-positioning hole 30114 are far away from one end of the optical transceiver module 400, the vertical distance between the first sub-positioning hole 30111 and the optical transceiver module 400 is smaller than the vertical distance between the third sub-positioning hole 30113 and the optical transceiver module 400, and the vertical distance between the second sub-positioning hole 30112 and the optical transceiver module 400 is smaller than the vertical distance between the fourth sub-positioning hole 30114 and the optical transceiver module 400.

The first card interface 3012 includes a first sub-card interface 30121 and a second sub-card interface 30122. The first sub-card interface 30121 is formed by inwardly recessing both the first end of the first circuit board 301 and the first side wall of the first circuit board 301, and the second sub-card interface 30122 is formed by inwardly recessing the second side wall of the first circuit board 301. The vertical distance between the first sub-card interface 30121 and the optical transceiver module 400 is smaller than the vertical distance between the second sub-card interface 30122 and the optical transceiver module 400.

The second card interface 3013 includes a third sub-card interface 30131 and a fourth sub-card interface 30132. The third sub-card interface 30131 is formed by inwardly recessing both the second end of the first circuit board 301 and the first side wall of the first circuit board 301, and the third sub-card interface 30132 is formed by inwardly recessing the second side wall of the first circuit board 301. The vertical distance between the third sub-card interface 30131 and the optical transceiver module 400 is greater than the vertical distance between the fourth sub-card interface 30132 and the end of the first circuit board 301 near the optical transceiver module 400.

The first notched area 3014 is formed by the first end of the first circuit board 301 and the first side wall of the first circuit board 301 both being recessed inward. The first notched area 3014 is more recessed relative to the recess of the first side wall of the first circuit board 301 for the first daughter card interface 30121.

Since the first end of the second flexible circuit board 304 is fixed on the first optical transceiver assembly 401, the second end of the second flexible circuit board 304 is fixed on the lower surface of the first circuit board 301, and the connection of the bending region of the second flexible circuit board 304 with the first end of the first circuit board 301 is easy to damage the second flexible circuit board 304. To avoid the connection of the bending region of the second flexible circuit board 304 with the first end of the first circuit board 301, in some embodiments, the first circuit board 301 is provided with a first notched region 3014. The presence of the first notch area 3014, such that the bending area of the first flexible circuit board 304 is not connected to the first end of the first circuit board 301, avoids the situation that the first flexible circuit board 304 is damaged due to the connection of the bending area of the first flexible circuit board 304 to the first end of the first circuit board 301.

The second notched area 3015 is recessed inward from the first side wall of the first circuit board 301. The second notched area 3015 is provided with a first sub-positioning hole 30111 and a second sub-positioning hole 30112.

Since the side view of the third flexible circuit board 303 is arc-shaped and both side walls of the circuit board 300 are close to the inner wall of the lower housing 202, if the side wall of the first circuit board 301 connected to the third flexible circuit board 303 is not provided with a notch area, the third flexible circuit board 303 is easily directly connected to the inner wall of the lower housing 202 and is easily damaged, and thus, in some embodiments, the first circuit board 301 is provided with the second notch area 3015. The presence of the second notch area 3015 allows the third flexible circuit board 303 to be disconnected from the inner wall of the lower housing 202, avoiding damage to the third flexible circuit board 303 due to the disconnection of the third flexible circuit board 303 from the inner wall of the lower housing 202.

Since the first sub-positioning hole 30111 is not connected to the first sub-card interface 30121, the area between the first sub-positioning hole 30111 and the first sub-card interface 30121 is the first connection area 3016. Since the second sub-positioning hole 30112 is not connected to the third sub-card interface 30131, the area between the second sub-positioning hole 30112 and the third sub-card interface 30131 is the second connection area 3017. Since the third sub-positioning hole 30113 is not connected to the second sub-card interface 30122, the area between the third sub-positioning hole 30113 and the second sub-card interface 30122 is the third connection area 3018. Since the fourth sub-positioning hole 30114 is connected to the fourth sub-card interface 30132, there is no connection area between the fourth sub-positioning hole 30114 and the fourth sub-card interface 30132.

As can be seen in fig. 7-19, in some embodiments, the second circuit board 302 includes a second locating hole 3021. The second positioning hole 3021 is provided corresponding to the first positioning hole 3011. The second positioning hole 3021 includes a fifth sub positioning hole 30211, a sixth sub positioning hole 30212, a seventh sub positioning hole 30213, and an eighth sub positioning hole 30214. The fifth sub-positioning hole 30211 and the sixth sub-positioning hole 30212 are each formed by inwardly recessing the first side wall of the second circuit board 302, the seventh sub-positioning hole 30213 is formed by inwardly recessing the second side wall of the second circuit board 302, and the eighth sub-positioning hole 30214 is formed by inwardly recessing the second side wall of the second circuit board 302 and the second end of the second circuit board 302. The fifth sub-positioning hole 30211 is provided corresponding to the first sub-positioning hole 30111, the sixth sub-positioning hole 30212 is provided corresponding to the second sub-positioning hole 30112, the seventh sub-positioning hole 30213 is provided corresponding to the third sub-positioning hole 30113, and the eighth sub-positioning hole 30214 is provided corresponding to the fourth sub-positioning hole 30114. The vertical distance between the fifth sub-positioning hole 30211 and the optical transceiver module 400 is smaller than the vertical distance between the sixth sub-positioning hole 30212 and the optical transceiver module 400, and the vertical distance between the seventh sub-positioning hole 30213 and the optical transceiver module 400 is smaller than the vertical distance between the eighth sub-positioning hole 30214 and the optical transceiver module 400.

As can be seen in fig. 7-19, in some embodiments, the mount 500 includes a base 501. The base 501 is provided with a positioning column 502 and a support column 503. In particular, the method comprises the steps of,

the base 501 is located between the lower housing 202 and the first circuit board 301. The support columns 503 provided on the base 501 are connected to the first circuit board 301 such that the fixing frame 500 is integral with the first circuit board 301. The positioning posts 502 are disposed corresponding to the first positioning holes 3011 of the first circuit board 301 and the second positioning holes 3021 of the second circuit board 302. The positioning post 502 is clamped in the first positioning hole 3011 and the second positioning hole 3021, so that the first circuit board 301 and the second circuit board 302 are integrated.

The chassis 501 includes a first fixing plate 5011, a second fixing plate 5012, a third fixing plate 5013, and a fourth fixing plate 5014. The second end of the first fixing plate 5011 is connected with the first end of the second fixing plate 5012, the second end of the second fixing plate 5012 is connected with the first end of the third fixing plate 5013, the second end of the third fixing plate 5013 is connected with the first end of the fourth fixing plate 5014, and the second end of the fourth fixing plate 5014 is connected with the first end of the first fixing plate 5011.

The base is also provided with a third card interface 5015 and a fourth card interface 5016. In particular, the method comprises the steps of,

The third card interface 5015 is provided corresponding to the first card interface 3012. The third card interface 5015 includes a fifth sub card interface 50151 and a sixth sub card interface 50152. Fifth sub-card interface 50151 is provided corresponding to first sub-card interface 30121, and sixth sub-card interface 50152 is provided corresponding to second sub-card interface 30122. The fifth sub card interface 50151 is formed by the inward depression of the side wall of the first fixing board 5011, and the sixth sub card interface 50152 is formed by the inward depression of the side wall of the third fixing board 5013.

The fourth card interface 5016 is provided corresponding to the second card interface 3013. Fourth card interface 5016 includes seventh sub-card interface 50161 and eighth sub-card interface 50162. The seventh sub card interface 50161 is provided corresponding to the third sub card interface 30131, and the eighth sub card interface 50162 is provided corresponding to the fourth sub card interface 30132. The seventh sub card interface 50161 is formed by inwardly recessed side walls of the first fixing plate 5011 and side walls of the second fixing plate 5012, and the eighth sub card interface 50162 is formed by inwardly recessed side walls of the third fixing plate 5013.

The positioning column 502 includes a first sub-positioning column 5021, a second sub-positioning column 5022, a third sub-positioning column 5023 and a fourth sub-positioning column 5024. The first sub-positioning column 5021 and the second sub-positioning column 5022 are all arranged on the first fixing plate 5011, and the third sub-positioning column 5023 and the fourth sub-positioning column 5024 are all arranged on the third fixing plate 5013. The fourth sub-mount 5024 is at an end of the first end of the third fixing plate 5013.

The positioning posts 502 are disposed corresponding to the second positioning holes 3021. Specifically, the first sub-positioning column 5021 is disposed corresponding to the first sub-positioning hole 30111 and the fifth sub-positioning hole 30211, the second sub-positioning column 5022 is disposed corresponding to the second sub-positioning hole 30112 and the sixth sub-positioning hole 30212, the third sub-positioning column 5023 is disposed corresponding to the third sub-positioning hole 30113 and the seventh sub-positioning hole 30213, and the fourth sub-positioning column 5024 is disposed corresponding to the fourth sub-positioning hole 30114 and the eighth sub-positioning hole 30214.

Because the vertical distance between the first sub-positioning hole 30111 and the optical transceiver module 400 is smaller than the vertical distance between the third sub-positioning hole 30113 and the optical transceiver module 400, the vertical distance between the second sub-positioning hole 30112 and the optical transceiver module 400 is smaller than the vertical distance between the fourth sub-positioning hole 30114 and the optical transceiver module 400, the vertical distance between the first sub-positioning column 5021 and the optical transceiver module 400 is smaller than the vertical distance between the third sub-positioning column 5023 and the optical transceiver module 400, and the vertical distance between the second sub-positioning column 5022 and the optical transceiver module 400 is smaller than the vertical distance between the fourth sub-positioning column 5024 and the optical transceiver module 400. The vertical distance between the first sub-positioning column 5021 and the optical transceiver component 400 is smaller than the vertical distance between the third sub-positioning column 5023 and the optical transceiver component 400, the vertical distance between the second sub-positioning column 5022 and the optical transceiver component 400 is smaller than the vertical distance between the fourth sub-positioning column 5024 and the optical transceiver component 400, which means that the first sub-positioning column 5021 and the second sub-positioning column 5022 on the first fixing plate 5011 are asymmetrically arranged with the third sub-positioning column 5023 and the fourth sub-positioning column 5024 on the third fixing plate 5013.

The first circuit board 301 is provided with a main chip, and the position of the main chip is set according to the signal lines laid on the first circuit board 301, so the position of the main chip is fixed. If the first circuit board 301 and the second circuit board 302 are to be fixed as a whole by the fixing frame 500 without changing the position of the main chip, the first sub-positioning columns 5021 and the second sub-positioning columns 5022 on the first fixing board 5011 and the third sub-positioning columns 5023 and the fourth sub-positioning columns 5024 on the third fixing board 5013 need to be asymmetrically arranged.

The first and second sub-positioning columns 5021 and 5022 on the first fixing board 5011 are asymmetrically arranged with the third and fourth sub-positioning columns 5023 and 5024 on the third fixing board 5013, so that the fixing frame 500 fixes the first and second circuit boards 301 and 302 as a whole without changing the position of the main chip on the first circuit board.

The one end that the reference column 502 kept away from the base 501 all is provided with support breach and spacing arch, and the support breach is connected with the lower surface of the upper side board of last casing 201, and spacing bellied lower surface is connected with the upper surface of second circuit board 302, and spacing protruding and the difference in height of base are greater than the difference in height of support breach and base. For example, the first sub-positioning column 5021 includes a first support notch 50211 and a first limit projection 50212. The first supporting notch 50211 is connected with the lower surface of the upper side plate of the upper housing 201, and the lower surface of the first limiting protrusion 50212 is connected with the upper surface of the second circuit board 302.

The limit protrusion is used to define the position of the second circuit board 302, so that the second circuit board 302, the first circuit board 301 and the fixing frame 500 are further integrated.

The lower surface of the support column 503 is connected to the upper surface of the base 501, and the upper surface of the support column 503 is connected to the lower surface of the first circuit board 301, so that the first circuit board 301 is integrated with the fixing frame 500.

The support columns 503 include a first sub-support column 5031, a second sub-support column 5032, a third sub-support column 5033, and a fourth sub-support column 5034. The first sub-supporting column 5031 and the second sub-supporting column 5032 are disposed on the first fixing board 5011, the first sub-supporting column 5031 is connected with the first sub-positioning column 5021, the second sub-supporting column 5032 is connected with the second sub-positioning column 5022, the first sub-supporting column 5031 is disposed corresponding to the first connection region 3016, and the second sub-supporting column 5032 is disposed corresponding to the second connection region 3017. The first sub-support columns 5031 are connected to the lower surface of the first connection region 3016, and the second sub-support columns 5032 are connected to the lower surface of the second connection region 3016. The third sub-supporting column 5033 and the fourth sub-supporting column 5034 are disposed on the third fixing board 5013, the third sub-supporting column 5033 is connected to the third sub-positioning column 5023, the third sub-supporting column 5033 is disposed corresponding to the third connection area 3018, and the fourth sub-supporting column 5034 is not connected to the fourth sub-positioning column 5024. The third sub-support column 5033 is connected to the lower surface of the third connection region 3018, and the fourth sub-support column 5034 is connected to the lower surface of the region between the third sub-positioning hole 30113 and the fourth sub-card interface 30132 in the first circuit board 301.

In some embodiments, the positioning column is clamped at the first positioning hole and the second positioning hole, the supporting column is connected with the lower surface of the first circuit board, and the limit protrusion is connected with the upper surface of the second circuit board, so that the first circuit board and the second circuit board are integrated. The vertical distance between the first sub-positioning column and the optical transceiver component is smaller than that between the third sub-positioning column and the optical transceiver component, and the vertical distance between the second sub-positioning column and the optical transceiver component is smaller than that between the fourth sub-positioning column and the optical transceiver component, which means that the first sub-positioning column and the second sub-positioning column on the first fixing plate are asymmetrically arranged with the third sub-positioning column and the fourth sub-positioning column on the third fixing plate. The first sub-positioning columns and the second sub-positioning columns on the first fixing plate and the third sub-positioning columns and the fourth sub-positioning columns on the third fixing plate are asymmetrically arranged, so that the fixing frame fixes the first circuit board and the second circuit board into a whole without changing the position of the main chip on the first circuit board.

Fig. 20 is a block diagram of the upper housing, the optical transceiver, the circuit board and the fixing frame according to some embodiments. Fig. 21 is another block diagram of the upper housing, the optical transceiver, the circuit board and the holder according to some embodiments. Fig. 22 is a block diagram of the upper housing and the first circuit board according to some embodiments. Fig. 23 is another block diagram of the upper housing and the first circuit board according to some embodiments. Fig. 24 is a block diagram of the upper housing, the first circuit board, and the mount according to some embodiments. Fig. 25 is a block diagram of the upper housing and unlocking components according to some embodiments. Fig. 26 is a block diagram of the upper housing according to some embodiments. Fig. 27 is another block diagram of an upper housing according to some embodiments. As can be seen in fig. 3-27, in some embodiments, the upper housing 201 includes a cover 2011 and two upper side plates 2012 disposed at two sides of the cover 2011 and perpendicular to the cover 2011. The upper side plate 2012 is provided with a third notch region 20121, a fourth notch region 20122, a positioning plate 20123, and a fixing boss 20124. In particular, the method comprises the steps of,

The third notch area 20121 is formed by recessing the lower surface of the upper plate 2012 toward the cover 2011, near the light port.

The third notch region 20121 is provided with a first sub-notch region 201211 and a second sub-notch region 201212 according to the degree of dishing. The first sub-notch area 201211 is more recessed relative to the second sub-notch area 201212. The second sub-notch area 201212 is not connected to the mount 500.

The fourth notch area 20122, which is adjacent to the electric port, is formed by recessing the lower surface of the upper plate 2012 toward the cover 2011, and is not connected to the third notch area 20121.

The fourth notch region 20122 is provided with a third sub-notch region 201221, a fourth sub-notch region 201222, and a fifth sub-notch region 201223 depending on the degree of dishing. The third sub-notch region 201221 is located between the fourth sub-notch region 201222 and the fifth sub-notch region 201223, and the third sub-notch region 201221 is more recessed relative to the fourth sub-notch region 201222 and the fifth sub-notch region 201223. The third sub-notch area 201221 is connected to a support notch (e.g., the first support notch 50111) of the mount 500, the fourth sub-notch area 201222 is connected to the first connection area 3016 of the first circuit board 301, and the fifth sub-notch area 201223 is connected to the second connection area 3017 of the first circuit board 301.

The positioning plate 20123 is located between the third notch area 20121 and the fourth notch area 20122, and is clamped at the first card interface 3012 and the second card interface 5015.

Fig. 28 is a block diagram of a lower housing according to some embodiments. Fig. 29 is a cross-sectional view of an optical module according to some embodiments. Fig. 30 is another cross-sectional view of an optical module according to some embodiments. As can be seen in fig. 3-30, in some embodiments, the lower side plate 2022 of the lower housing 202 is provided with fixing holes 20221, and the fixing holes 20221 are disposed corresponding to the fixing protrusions 20124. The fixing protrusion 20124 is engaged in the fixing hole 20221, so that the upper case 201 and the lower case 202 are fixed.

In this application, the reference column joint of mount is in first locating hole and second locating hole department, and the support column is connected with the lower surface of first circuit board, and spacing arch is connected with the upper surface of second circuit board, and first sub-reference column is less than the perpendicular distance of third sub-reference column and light transceiver module with light transceiver module's perpendicular distance, and the perpendicular distance of second sub-reference column and light transceiver module is less than the perpendicular distance of fourth sub-reference column and light transceiver module for first circuit board and second circuit board become a whole, the optical module equipment of being convenient for.

Fig. 31 is a block diagram of an unlocking component according to some embodiments. Fig. 32 is another block diagram of an unlocking component according to some embodiments. Fig. 33 is a block diagram of an unlock device according to some embodiments. Fig. 34 is another block diagram of an unlocking device according to some embodiments. Fig. 35 is a block diagram of an unlocking handle according to some embodiments. As can be seen in fig. 25 and 31-35, in some embodiments, the unlocking member 203 includes an unlocking handle 2031, an unlocking device 2032, and an elastic member 2033.

The unlocking handle 2031 is provided with a first protrusion 20315 protruding toward the light port direction, an inner surface of a first end (near the light port end) of the unlocking device 2032 is connected with the unlocking handle 2031, an outer surface of a second end (near the electric port end) of the unlocking device 2032 is provided with a snap member 203221, and an inner surface of the second end of the unlocking device 2032 is provided with a fixing column 203222.

When the optical module is inserted into the host computer, the engaging member 203221 is engaged with the bayonet of the cage of the host computer, thereby realizing the engagement relationship between the optical module 200 and the host computer. When the unlocking member is pulled, that is, the unlocking handle 2031 is turned, the first end of the connector 20321 of the unlocking device 2032 is lifted up, the unlocking device body 20322 of the unlocking device 2032 is sunk down, and the engaging member 203221 on the unlocking device body 20322 is also sunk down until the engaging member 203221 is separated from the bayonet of the cage of the upper computer, so as to release the engaging relationship between the optical module 200 and the upper computer.

When the unlocking handle 2031 is not rotated, the angle between the first projection 20315 and the inner surface of the upper housing is approximately 0 °; when the unlocking lever 2031 starts to rotate, the angle between the first projection 20315 and the inner surface of the upper housing is gradually increased from approximately 0 °; when the unlocking handle 2031 cannot be rotated further, the angle of the first projection 20315 to the inner surface of the upper case is approximately 90 °.

Since the angle between the first protrusion 20315 and the inner surface of the upper case is gradually increased from approximately 0 ° when the unlocking handle 2031 is rotated, the distance between the first end of the unlocking device 2032 connected to the first protrusion 20315 and the inner surface of the upper case is gradually increased, i.e., the first end of the unlocking device 2031 is lifted upward.

When the unlocking lever 2031 is rotated, the first protrusion 20315 is gradually turned from the approximately horizontal direction to the approximately vertical direction, and the inner surface of the first end of the unlocking lever 2032 is lifted upward. Since the unlocking device 2032 is connected to the upper case 201 through the connection shaft 2034, the second end of the unlocking device 2032 is sunk downward, i.e., the engaging piece 203221 and the fixing column 203222 are sunk downward according to the principle of leverage. Since the second end of the unlocking device 2032 is sunk downward, the engaging member 203221 on the outer surface of the second end of the unlocking device 2032 is correspondingly sunk until the optical module is separated from the cage of the upper computer. Because one end of the elastic member 2033 is fixed to the fixing column 203222, the elastic member 2033 is compressed downward when the fixing column 203222 is sunk downward.

However, in order to allow the second end of the unlocking means 2032 to sink as the first end of the unlocking means 2032 is lifted, the upper case 201 is spaced apart from the second end of the unlocking means 2032 by a certain distance, that is, the inner surface of the upper case 201 is provided with a stopper plate when the unlocking handle 2031 is not rotated. And a limiting plate located at an intermediate position of the inner surface of the cover 2011 of the upper case 201, the first end being more recessed with respect to the storage groove, and the second end being more recessed with respect to the first end, such that a distance between the second end of the unlocking device 2032 and the upper case 201 is not equal to zero (when the unlocking handle 2031 is not rotated). The presence of the stop plate allows a distance between the upper housing 201 and the second end of the opener 2032, so that the second end of the opener 2032 is allowed to sink as the first end of the opener 2032 is lifted.

The limiting plate encloses two second accommodating cavities 2019 with the upper side plate of the upper shell 201, and the two accommodating cavities 2019 are respectively used for accommodating the first optical fiber adapter 4014 or the second optical fiber adapter 4024.

The limit plates include a first limit plate 2017 and a second limit plate 2018. The first and second stopper plates 2017 and 2018 are each formed by being recessed inward from the inner surface of the bottom plate 2011 of the upper case 201. The second end (near the electrical port end) of the first limiting plate 2017 is more recessed relative to the first end (near the optical port end) of the first limiting plate 2017. The second stop plate 2018 is more recessed relative to the second end of the first stop plate 2017.

When the second end of the second limiting plate 2018 is recessed to the same extent as the second end of the first limiting plate 2017, or the second end of the first limiting plate 2017 is recessed to a lesser extent with respect to the second limiting plate 2018, the unlocking device body 20322 is lowered to a lesser extent, and the locking member 203221 on the unlocking device body 20322 is lowered to a lesser extent, so that the locking member 203221 cannot be separated from the bayonet of the cage of the host computer.

The presence of the first and second stopper plates 2017 and 2018 allows a distance between the second end of the delatch 2032 and the inner surface of the upper housing 201 before the delatch handle 2031 is not rotated, so that the second end of the delatch 2032 is conveniently sunk as the first end of the delatch 2032 is lifted.

The unlocking handle 2031 includes, in addition to a first protrusion 20315 protruding toward the light port direction, a first side 20311, a second side 20312, a third side 20313, a fourth side 20314, and a fifth side 20316, and the first side 20311, the second side 20312, the third side 20313, the fourth side 20314, the first protrusion 20315, the fifth side 20316, and the first side 20311 are connected in order.

The fourth edge 20314, the fifth edge 20316 and the first protrusion 20315 form a first end of the unlocking handle 2031, the second edge 20312 is used as a second end of the unlocking handle 2031, the first edge 20311 and the third edge 20313 are used as middle parts of the unlocking handle 2031, and the middle parts of the unlocking handle 2031 are respectively connected with the first end of the unlocking handle 2031 and the second end of the unlocking handle 2031.

The first protrusion 20315 is located at the same level as the fourth side 20314 and the fifth side 20316, and protrudes toward the light entrance direction with respect to the fourth side 20314 and the fifth side 20316.

The unlocking handle 2031 is fixed in the storage groove 2015 of the upper case 201. Specifically, the inner surface of the upper casing 201 is provided with a storage groove 2015, the storage groove 2015 is surrounded by a first limit part 20151 and a second limit part 20152, the first limit part 20151 comprises a connecting plate 201510 and two fixing plates 201512, the two fixing plates 201512 are respectively connected with two ends of the connecting plate 201510, the connecting plate 201510 and the second limit part 20152 surround a storage cavity, the storage cavity is more sunken relative to the second limit part 20152, the fixing plates 201512 are provided with limit holes, the limit holes are formed by the fixing plates 201512 in a manner of being sunken towards the direction of an optical port, a fourth edge 20314 and a fifth edge 20316 of the unlocking handle 2031 are respectively placed in the limit holes, and the first protrusion 20315 is located in the storage cavity.

To define the position of the first protrusion 20315, in some embodiments, the delatch 2032 is provided with a stopper 203214. The stopper 203214 is projected outward from the unlocking device 2032. The stopper 203214 serves to define the position of the first protrusion 20315 of the unlocking handle 2031, preventing the first protrusion 20315 from exceeding the position of the stopper 203214 so that the angle between the first protrusion 20315 and the inner surface of the upper housing is 90 ° when the first protrusion 20315 is connected to the stopper 20314.

The second stopper 20152 is provided with a fifth notch area 2015121, and the fifth notch area 2015121 is formed by the second stopper 20152 being recessed toward the electrical outlet. The stopper 203214 is provided corresponding to the fifth notch region 2015121, and the stopper 203214 is located in the fifth notch region 2015121.

The unlocking device 2032 is connected to the upper case 201 via a connection shaft 2034. Specifically, the two side plates of the upper housing 201 are provided with first connection holes 2016, the position of the unlocking device 2032 corresponding to the first connection holes 2016 is provided with second connection holes 203215, the second connection holes 203215 extend from one side of the unlocking device 2032 to the other side, and the connection column 2031 sequentially passes through one first connection hole 2016, the second connection hole 203215 and the other first connection hole 2016, so that the unlocking device 2032 and the upper housing 201 are connected through the connection shaft 2034.

The unlocking device 2032 includes a connecting body 20321 and an unlocking device body 20322, the unlocking device body 20322 is formed by an outer surface of a second end (near an electric opening end) of the connecting body 20321 and both side walls of the connecting body 20321 being recessed inward, an inner surface of a first end (near an optical opening end) of the connecting body 20321 is connected with a first end of the unlocking handle 2031, and the second end of the connecting body 20321 is connected with the unlocking device body 20322.

The connector 20321 includes a first sub-connector 203211, a second sub-connector 203212, and a third sub-connector 203213, the first sub-connector 203211 being proximate the electrical port end, the second sub-connector 203212 being positioned between the first sub-connector 203211 and the third sub-connector 203213, the third sub-connector 203213 being proximate the electrical port end. The first sub-connector 203211 is disposed corresponding to the unlocking lever 2031, the second sub-connector 203212 is disposed corresponding to the second stopper 20152, and the third sub-connector 203213 is disposed corresponding to the first stopper 2017 of the upper case 201. The inner surface of the first sub-connector 203211 is connected to the first end of the unlocking handle 2031, a stopper 203214 is provided on the first sub-connector 203211, and a second connection hole 203215 is provided on the third sub-connector 203213.

The difference in height between the inner surface of the first sub-connector 203211 and the outer surface of the first sub-connector 203211 < the difference in height between the inner surface of the second sub-connector 203212 and the outer surface of the second sub-connector 203212 < the difference in height between the inner surface of the third sub-connector 203213 and the outer surface of the third sub-connector 203213.

The height difference between the inner surface of the first sub-connector 203211 and the outer surface of the first sub-connector 203211 may be equal to the height difference between the inner surface of the second sub-connector 203212 and the outer surface of the second sub-connector 203212, regardless of the strength of the delatcher 2032. When considering the strength of the delatcher 2032, i.e., increasing the strength of the delatcher 2032, the difference in height between the inner surface of the first sub-connector 203211 and the outer surface of the first sub-connector 203211 < the difference in height between the inner surface of the second sub-connector 203212 and the outer surface of the second sub-connector 203212.

Before the unlocking handle is not rotated, the inner surface of the first sub-connector 203211 is connected with the unlocking handle 2031, the inner surface of the third sub-connector 203213 is connected with the first end of the first limiting plate 2017, and the first end of the first limiting plate 2017 is more recessed relative to the storage cavity where the unlocking handle 2031 is located. In order to make the outer surface of the first sub-connector 203211 and the outer surface of the third sub-connector 203213 at the same level or at a similar level, the height difference between the inner surface of the first sub-connector 203211 and the outer surface of the first sub-connector 203211 is < the height difference between the inner surface of the third sub-connector 203213 and the outer surface of the third sub-connector 203213.

Before the unlocking handle is not rotated, the inner surface of the second sub-connector 203212 is not connected with the second limiting member 20152, the inner surface of the third sub-connector 203213 is connected with the first end of the first limiting plate 2017, and the first end of the first limiting plate 2017 is more recessed relative to the second limiting member 20152. In order to make the outer surface of the second sub-connector 203212 and the outer surface of the third sub-connector 203213 at the same level or at a similar level, the height difference between the inner surface of the second sub-connector 203212 and the outer surface of the second sub-connector 203212 is < the height difference between the inner surface of the third sub-connector 203213 and the outer surface of the third sub-connector 203213.

Since the second end (near the electrical port end) of the first limiting plate 2017 is more recessed relative to the first end (near the optical port end) of the first limiting plate 2017, there is a certain distance difference between the second end (near the electrical port end) of the third sub-connector 203213 disposed corresponding to the first limiting plate 2017 and the second end of the first limiting plate 2017. When the unlocking handle 2031 is rotated to jack up the first sub-connector 203211, the third sub-connector 203213 can be sunk downward.

The unlocking device body 20322 is provided with a clamping piece 203221 on the outer surface and a fixing column 203222 on the inner surface. Specifically, a first end (near the optical port end) of the unlocking device body 20322 is connected to a second end of the connecting body 20321, an outer surface of the second end (near the electrical port end) of the unlocking device body 20322 is provided with a locking member 203221, and an inner surface of the second end (near the electrical port end) of the unlocking device body 20322 is provided with a fixing column 203222.

The elastic member 2033 includes a movable end and a fixed end, the fixed end of the elastic member 2033 is fixed on the fixed column 203222, and the movable end of the elastic member 2033 is disposed in the limit cavity 20181 of the second limit plate 2018 of the upper housing 201. When the second end of the delatcher body 20322 is submerged downward, the resilient member 2033 compresses within the retention cavity 20181; when the second end of the delatcher body 20322 is no longer depressed, the resilient member 2033 returns from the compressed state to the uncompressed state within the retention cavity 20181.

In some embodiments, when the optical module is inserted into the host computer, the locking member is locked at a bayonet of the cage of the host computer, so as to realize a locking relationship between the optical module and the host computer. When the unlocking handle is not rotated, the clamping piece is matched with the bayonet of the upper computer, so that the clamping relationship between the optical module and the upper computer is realized. When the unlocking handle rotates, the first end of the unlocking device is lifted upwards, the second end of the unlocking device is sunk downwards, the clamping piece is sunk downwards until the clamping piece is separated from the bayonet, and the clamping relation between the optical module and the upper computer is relieved. In this application, towards the protruding first arch of light mouthful direction, first arch is connected with the internal surface of the first end of unblock ware, and the unblock ware passes through the connecting axle with last casing and is connected for when unblock handle rotated, the first end of unblock ware upwards lifts up under first bellied effect, and the second end of unblock ware sinks downwards, until the bayonet socket that the fastener breaks away from the host computer, releases the block relation of optical module and host computer.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. An optical module, comprising:

the circuit board comprises a first circuit board and a second circuit board;

the first circuit board comprises a first positioning hole;

the second circuit board is electrically connected with the first circuit board through a flexible circuit board and comprises a second positioning hole which is arranged corresponding to the first positioning hole;

the positioning column is arranged corresponding to the second positioning hole, is clamped at the first positioning hole and the second positioning hole, is provided with a limiting protrusion at one end far away from the first circuit board, and comprises a first sub-positioning column, a second sub-positioning column, a third sub-positioning column and a fourth sub-positioning column;

the support column is connected with the lower surface of the first circuit board and used for supporting the first circuit board;

the first fixing plate is provided with the first sub-positioning column and the second sub-positioning column;

the third fixing plate is provided with the third sub-positioning column and the fourth sub-positioning column;

The limiting protrusion is connected with the upper surface of the second circuit board and used for limiting the position of the second circuit board;

the vertical distance between the first sub-positioning column and the optical transceiver component is smaller than that between the third sub-positioning column and the optical transceiver component, and the vertical distance between the second sub-positioning column and the optical transceiver component is smaller than that between the fourth sub-positioning column and the optical transceiver component.

2. The light module of claim 1 wherein the first positioning hole comprises a first sub-positioning hole, a second sub-positioning hole, a third sub-positioning hole, and a fourth sub-positioning hole, the second positioning hole comprising a fifth sub-positioning hole, a sixth positioning hole, a seventh sub-positioning hole, and an eighth sub-positioning hole;

the first sub-positioning holes are arranged corresponding to the fifth sub-positioning holes and are connected with the first sub-positioning columns;

the second sub-positioning hole is arranged corresponding to the sixth sub-positioning hole and is connected with the second sub-positioning column;

the third sub-positioning hole is arranged corresponding to the seventh sub-positioning hole and is connected with the third sub-positioning column;

the fourth sub-positioning hole is arranged corresponding to the eighth sub-positioning hole and is connected with the fourth sub-positioning column;

The vertical distance between the first sub-positioning hole and the optical transceiver component is smaller than that between the third sub-positioning hole and the optical transceiver component, and the vertical distance between the second sub-positioning hole and the optical transceiver component is smaller than that between the fourth sub-positioning hole and the optical transceiver component.

3. The optical module of claim 2, wherein the first circuit board further comprises a first card interface and a second card interface;

the first card interface comprises a first sub-card interface and a second sub-card interface;

the first sub-card interface is formed by inward recessing of the first end of the first circuit board and the first side wall of the first circuit board, and is not communicated with the first sub-positioning hole;

the second sub-card interface is formed by inward recessing of the second end of the first circuit board and the second side wall of the first circuit board, and is not communicated with the second sub-positioning hole;

the second card interface comprises a third sub-card interface and a fourth sub-card interface;

the third sub-card interface is formed by inward recessing of the second end of the first circuit board and the first side wall of the first circuit board, and is not communicated with the third sub-positioning hole;

the fourth sub-card interface is formed by inward recessing of the second end of the first circuit board and the second side wall of the first circuit board and is communicated with the fourth sub-positioning hole.

4. The optical module of claim 3 wherein the first circuit board further comprises a first notched area;

the first notch area is formed by inward recessing of the first end of the first circuit board and the first side wall of the first circuit board and is communicated with the first sub-card interface.

5. A light module as recited in claim 3, wherein the base comprises a third card interface and a fourth card interface;

the third card interface is arranged corresponding to the first card interface and comprises a fifth sub-card interface and a sixth sub-card interface;

the fifth sub-card interface is arranged corresponding to the first sub-card interface and is formed by inwards sinking the side wall of the first fixing plate;

the sixth sub-card interface is arranged corresponding to the second sub-card interface and is formed by inwards sinking the side wall of the third fixing plate;

the fourth card interface is arranged corresponding to the second card interface and comprises a seventh sub-card interface and an eighth sub-card interface;

the seventh sub-card interface is arranged corresponding to the third sub-card interface and is formed by inwards sinking the side wall of the first fixed plate and the side wall of the second fixed plate;

the eighth sub-card interface is arranged corresponding to the fourth sub-card interface and is formed by inwards sinking both the side wall of the second fixing plate and the side wall of the third fixing plate.

6. The light module of claim 2 wherein the support columns comprise a first sub-support column, a second sub-support column, a third sub-support column, and a fourth sub-support column;

the first sub-supporting columns are connected with the first sub-positioning columns;

the second sub-supporting columns and the first sub-supporting columns are arranged on the first fixing plate and are connected with the second sub-positioning columns;

the third sub-supporting column is connected with the third sub-positioning column;

the fourth sub-supporting columns and the third sub-supporting columns are arranged on the third fixing plate and are not connected with the fourth sub-positioning columns.

7. The optical module of claim 2, wherein the first circuit board further comprises a second notched area;

the second notch area is formed by inwards sinking the first side wall of the first circuit board and is provided with the first sub-positioning hole and the second sub-positioning hole.

8. The light module of claim 1 wherein the positioning posts are further provided with support indentations;

the supporting notch and the limiting protrusion are respectively positioned on different surfaces of the positioning column.

9. The light module of claim 8 further comprising an upper housing;

The upper shell is provided with a third notch area, a fourth notch area and a positioning plate;

the third notch area is not connected with the fourth notch area;

the fourth notch region comprises a third sub-notch region, a fourth sub-notch region and a fifth sub-notch region;

the third sub-notch area is connected with the support notch;

the fourth sub-notch region and the fifth sub-notch region are more recessed relative to the third sub-notch region;

the positioning plate is positioned between the third notch area and the fourth notch area and is clamped at the first clamping interface and the second clamping interface.

10. The light module of claim 8 wherein the spacing protrusion has a greater height than the base than the support notch.