CN220526046U - Optical module - Google Patents

Abstract

The application provides an optical module, wherein, the circuit board is equipped with first mouthful of dodging, and light emitting part is located first mouthful of dodging. The light emitting component and the light receiving component are both positioned on the upper surface of the circuit board. The optical module also has a pad on which the light emitting component is located, and a narrow plate region of the pad is located below the circuit board to which the light receiving component corresponds. One end of the light emitting component is provided with an electric connector, a second bonding pad area of the electric connector protrudes out of the emitting shell, and the second bonding pad area is connected with a signal pin area of the circuit board in a wire bonding mode, so that impedance is reduced, and signal transmission quality is improved. The backing plate includes first supporting part, second supporting part and third supporting part, and the bottom opening of first supporting part shutoff emitter housing, second supporting part are located the below in signal pin region, and third supporting part is located the below in narrow plate region, provides the support for narrow plate region.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

In a novel service mode and an application mode of cloud computing, mobile internet, video and the like, an optical communication technology can be used. In optical communication, an optical module is a tool for realizing mutual conversion of optical and electrical signals, and is one of key devices in optical communication equipment. With the rapid development of 5G networks, optical modules at the core position of optical communications have been developed.

The optical module is internally provided with a light emitting component for converting an electric signal into an optical signal. The connection quality of the light emitting component and the circuit board affects the signal transmission quality.

Disclosure of Invention

The application provides an optical module to improve high-frequency transmission performance of the optical module.

In order to solve the technical problems, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, including:

the circuit board is provided with a first avoidance port and a narrow plate area, and the first avoidance port and the narrow plate area are arranged in parallel in the width direction of the circuit board; the circuit board is provided with a signal pin area;

the light emitting shell is positioned at the first avoidance port, one end of the light emitting shell is provided with an electric connector, and a second bonding pad area of the electric connector is positioned outside the light emitting component; the second bonding pad area is connected with the signal pin area through a metal bond;

a light receiving member located in the narrow plate region;

a backing plate, comprising: a first support portion, a second support portion, and a third support portion, wherein upper surfaces of the second support portion and the third support portion are higher than upper surfaces of the first support portion;

the light emitting housing has a bottom opening, the first support portion closing the bottom opening; the side wall of the electric connector is abutted against the side wall of the circuit board, and the second supporting part supports the signal pin area so that the signal pin area is level with the second pad area; the third support portion supports the narrow plate region.

Compared with the prior art, the beneficial effect of this application:

the application provides an optical module, wherein, the circuit board is equipped with first mouthful of dodging, and light emitting part is located first mouthful of dodging. The light emitting housing and the light receiving part are both positioned on the upper surface of the circuit board. The optical module also has a pad on which the light emitting component is located, and a narrow plate region of the pad is located below the circuit board to which the light receiving component corresponds. One end of the light emitting shell is provided with an electric connector, a second bonding pad area of the electric connector protrudes out of the light emitting shell, and the second bonding pad area is connected with a signal pin area of the circuit board in a wire bonding mode, so that impedance is reduced, and signal transmission quality is improved. The thickness of electric connector is less than the thickness of circuit board, for the difference in height of reduction signal pin region and second pad region, and the backing plate includes first supporting part, second supporting part and third supporting part, and the bottom opening of first supporting part shutoff emission casing, second supporting part are located the below of signal pin region, and the height of second supporting part lifting signal pin region for signal pin region and the high as far as possible of second pad region are unanimous. The third supporting part is positioned below the narrow plate area and provides support for the narrow plate area, so that the bending resistance of the narrow plate area is improved, and the narrow plate area is prevented from being broken due to stress.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

FIG. 1 is a partial architectural diagram of an optical communication system according to some embodiments;

FIG. 2 is a partial block diagram of a host computer according to some embodiments;

FIG. 3 is a block diagram of an optical module according to some embodiments;

fig. 4 is an exploded view of a light module according to some embodiments;

FIG. 5 is an exploded schematic view of a light emitting component, a light receiving component and a circuit board according to some embodiments of the present disclosure;

fig. 6 is an exploded schematic view of a light emitting component, a light receiving component, a circuit board provided in accordance with some embodiments of the present disclosure;

FIG. 7 is an exploded schematic view of a light emitting component provided in accordance with some embodiments of the present disclosure;

FIG. 8 is a schematic structural view of a launch housing provided according to some embodiments of the present disclosure;

fig. 9 is a schematic structural view of an electrical connector provided according to some embodiments of the present disclosure;

FIG. 10 is a schematic structural view of a shim plate provided according to some embodiments of the present disclosure;

FIG. 11 is a schematic illustration of a cross-section of a light emitting device and a circuit board according to some embodiments of the present disclosure;

FIG. 12 is a schematic illustration of a cross-section of a light emitting device and a circuit board according to some embodiments of the present disclosure;

FIG. 13 is an exploded schematic view of another light emitting component provided in accordance with some embodiments of the present disclosure;

FIG. 14 is a schematic structural view of another launch housing provided in accordance with some embodiments of the present disclosure;

FIG. 15 is a schematic, partial cross-sectional view of a light emitting component and a circuit board provided in accordance with some embodiments of the present disclosure;

fig. 16 is a schematic partial cross-sectional view of a light emitting device and a circuit board according to some embodiments of the present disclosure.

Detailed Description

The optical communication technology establishes information transfer between information processing apparatuses, and the optical communication technology loads information onto light, and uses propagation of light to realize information transfer, and the light loaded with information is an optical signal. The optical signal propagates in the information transmission device, so that the loss of optical power can be reduced, and the high-speed, long-distance and low-cost information transmission can be realized. Information that can be processed by the information processing device exists in the form of an electrical signal, and an optical network terminal/gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer and a television are common information processing devices, and an optical fiber and an optical waveguide are common information transmission devices.

The mutual conversion of optical signals and electric signals between the information processing equipment and the information transmission equipment is realized through an optical module. For example, an optical fiber is connected to an optical signal input end and/or an optical signal output end of the optical module, and an optical network terminal is connected to an electrical signal input end and/or an electrical signal output end of the optical module; the optical module converts the first optical signal into a first electric signal, and the optical module transmits the first electric signal into an optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Because the information processing devices can be connected with each other through an electrical signal network, at least one type of information processing device is required to be directly connected with the optical module, and not all types of information processing devices are required to be directly connected with the optical module, and the information processing device directly connected with the optical module is called an upper computer of the optical module.

Fig. 1 is a partial architectural diagram of an optical communication system according to some embodiments. As shown in fig. 1, a part of the optical communication system is represented as a remote information processing apparatus 1000, a local information processing apparatus 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 extends toward the remote information processing apparatus 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, the propagation of the optical signal in the total reflection direction can almost maintain the original optical power, the optical signal can be totally reflected in the optical fiber 101 for a plurality of times, the optical signal from the direction of the far-end information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated towards the direction of the far-end information processing device 1000, so that the information transmission with long distance and low power consumption is realized.

The number of the optical fibers 101 may be one or plural (two or more); the optical fiber 101 and the optical module 200 are movably connected in a pluggable mode, and can also be fixedly connected.

The upper computer 100 is provided with an optical module interface 102, and the optical module interface 102 is configured to be connected with the optical module 200, so that the upper computer 100 and the optical module 200 are connected by unidirectional/bidirectional electric signals; the upper computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working state of the optical module 200.

The upper computer 100 has an external electrical interface, such as a universal serial bus interface (Universal Serial Bus, USB), a network cable interface 104, and the external electrical interface can access an electrical signal network. Illustratively, the network cable interface 104 is configured to access the network cable 103, thereby enabling the host computer 100 to establish a unidirectional/bidirectional electrical signal connection with the network cable 103.

Optical network terminals (ONU, optical Network Unit), optical line terminals (OLT, optical Line Terminal), optical network devices (ONT, optical Network Terminal), and data center servers are common upper computers.

One end of the network cable 103 is connected to the local information processing device 2000, the other end is connected to the host computer 100, and the network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

Illustratively, the third electrical signal sent by the local information processing apparatus 2000 is transmitted to the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal based on the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, the optical module 200 transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing apparatus 1000 in the optical fiber 101.

Illustratively, the first optical signal from the direction of the remote information processing apparatus 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal into the local information processing apparatus 2000.

The optical module is a tool for realizing the mutual conversion of the optical signal and the electric signal, and the information is not changed in the conversion process of the optical signal and the electric signal, and the encoding and decoding modes of the information can be changed.

Fig. 2 is a partial block diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, fig. 2 only shows the structure of the host computer 100 and the optical module 200. As shown in fig. 2, the upper computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector (not shown in the drawing) disposed inside the cage 106, wherein the heat sink 107 has a convex structure for increasing a heat dissipation area, and the fin-like structure is a common convex structure.

The optical module 200 is inserted into the cage 106 of the host computer 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected with an electrical connector inside the cage 106.

Fig. 3 is a block diagram of an optical module according to some embodiments, and fig. 4 is an exploded view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed within the housing, a light emitting part 400, and a light receiving part 500. The present disclosure is not limited thereto and in some embodiments, the optical module 200 includes one of the light emitting part 400 and the light receiving part 500.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical interface, and the golden finger 301 of the circuit board 300 extends out of the electrical interface and is inserted into an electrical connector of the upper computer; the opening 205 is an optical port configured to access the optical fiber 101 such that the optical fiber 101 connects to the light emitting component 400 and/or the light receiving component 500 in the optical module 200.

By adopting the assembly mode of combining the upper shell 201 and the lower shell 202, the circuit board 300, the light emitting component 400, the light receiving component and other components are convenient to be installed in the shells, and the shapes of the components can be packaged and protected by the upper shell 201 and the lower shell 202. In addition, when the circuit board 300, the light emitting part 400, the light receiving part, and the like are assembled, the positioning part, the heat radiating part, and the electromagnetic shielding part of these devices are easily disposed, which is advantageous for automatized production.

In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the light module 200 further includes an unlocking member 600 located outside its housing. The unlocking part 600 is configured to achieve a fixed connection between the optical module 200 and the upper computer, or to release the fixed connection between the optical module 200 and the upper computer.

For example, the unlocking member 600 is located outside of the two lower side plates 2022 of the lower housing 202, and includes an engaging member that mates with the cage 106 of the upper computer. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging member of the unlocking member 600; when the unlocking member 600 is pulled, the engaging member of the unlocking member 600 moves along with the unlocking member, so that the connection relationship between the engaging member and the host computer is changed, and the engagement and fixed connection between the optical module 200 and the host computer is released, so that the optical module 200 can be pulled out from the cage 106.

The circuit board 300 includes circuit traces, electronic components, chips, etc., and the electronic components and the chips are connected together according to a circuit design through the circuit traces to realize functions of power supply, electric signal transmission, grounding, etc. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (limiting amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; the hard circuit board is also convenient to insert into an electric connector in the host computer cage.

The circuit board 300 further includes a gold finger 301 formed on an end surface thereof, the gold finger 301 being composed of a plurality of independent leads. The circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connector within the cage 106 by the gold finger 301. The gold finger 301 may be disposed on only one surface (such as the upper surface shown in fig. 4) of the circuit board 300, or may be disposed on both upper and lower surfaces of the circuit board 300, so as to provide more pins. The golden finger 301 is configured to establish electrical connection with an upper computer to achieve power supply, grounding, I2C signal transfer, data signal transfer, and the like.

Of course, a flexible circuit board is also used in some optical modules, and the flexible circuit board is generally used in cooperation with a hard circuit board to supplement the hard circuit board.

The light emitting part 400 and/or the light receiving part 500 are located at a side of the circuit board 300 away from the gold finger 301; in some embodiments, the light emitting part 400 and the light receiving part 500 are physically separated from the circuit board 300, respectively, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors, respectively; in some embodiments, the light emitting and/or light receiving components may be disposed directly on the circuit board 300, may be disposed on a surface of the circuit board, or may be disposed on a side of the circuit board.

In some embodiments, the light emitting component 400 includes a cartridge, and the electrical connection between the cartridge and the circuit board 300 is achieved by an electrical connector, a flexible circuit board, and illustratively one end of the electrical connector is electrically connected to the cartridge, the other end is electrically connected to one end of the flexible circuit board, and the other end of the flexible circuit board is point-connected to the circuit board 300, thereby achieving the electrical connection of the cartridge and the circuit board 300.

In the electrical connection mode of the electrical connector and the flexible circuit board, the flexible circuit board is illustratively connected with the electrical connector through soldering tin, in this mode, the uniformity of the thickness of the soldering tin material between the connection surface of the flexible circuit board and the electrical connector is difficult to control, the coating of the soldering tin material is uneven, the transmission quality of high-frequency signals is easy to be reduced when the thickness of the soldering tin material is uneven, for example, the transmission quality of the high-frequency signals is poor at the position where the thickness of the soldering tin material is large, the stability of the transmission quality of the high-frequency signals is affected by the non-uniformity of the thickness of the soldering tin material, and the transmission performance of the high-frequency signals is further affected.

In order to improve the transmission quality of the high-frequency signal and ensure the transmission performance of the high-frequency signal, in some embodiments, the impedance can be reduced by selecting a mode of connecting the electric connector and the circuit board through a metal key.

Fig. 5 is an exploded schematic view of a light emitting device, a light receiving device, and a circuit board according to some embodiments of the present disclosure. Fig. 6 is an exploded schematic view of a light emitting component, a light receiving component, and a circuit board provided according to some embodiments of the present disclosure. As shown in fig. 5 and 6, the circuit board 300 is provided with a first escape opening 310, and the light emitting member is positioned in the first escape opening 310. The light emitting component and the light receiving component are both positioned on the upper surface of the circuit board. The light module further has a pad 420, the light emitting part is located on the pad 420, and a portion of the pad 420 is located under the circuit board corresponding to the light receiving part.

In some embodiments, the first relief port 310 is located on one side of the circuit board, with its opening in communication with the outside. The circuit board is provided with a signal pin area 320, and the light emitting component is wire-bonded with the signal pin area 320. The narrow plate region 330 is located on the first escape opening 310 side, and the narrow plate region 330 is located in parallel with the first escape opening 310 in the width direction of the circuit board, and the light receiving member 500 is located in the narrow plate region 330. The width of the narrow plate region 330 is less than or equal to 1/3 of the width of the rest of the circuit board 300.

Fig. 7 is an exploded schematic view of a light emitting component provided according to some embodiments of the present disclosure. As shown in fig. 7, the light emitting part includes an emitting case 410a and an electrical connector 430. A first through hole 4103 is provided at one side wall of the emission case 410a, and an electrical connector 430 is provided at an opposite side wall of the first through hole 4103. A light emitting assembly is provided in the emission housing 410 a.

Illustratively, the emission housing 410a is an emission tube housing having a light emission assembly disposed therein, comprising: a laser array 411, a lens array 412, and an optical multiplexing component 413. The laser array 411 emits light of different wavelengths, each beam is sequentially processed by a converging lens in the lens array 412, converted from a divergent state to a convergent state, and then processed by a multiplexing process of the optical multiplexing component 413, so that light of different wavelengths is converted into parallel light after being collimated by a collimating lens in the optical fiber adapter 700, and is emitted from the emission housing 410a in a parallel light posture.

Fig. 8 is a schematic structural view of a launch housing provided according to some embodiments of the present disclosure. As shown in fig. 8, a first through hole 4103 is provided on the emission housing 410a, the first through hole 4103 communicates with an inner cavity of the emission housing 410a, and the first through hole 4103 is connected to the optical fiber adapter 700.

The emission housing 410a is provided with a first opening 4101, and the first through hole 4103 and the first opening 4101 are respectively located on opposite sides of the emission housing.

In some embodiments, the electrical connector 430 is located at the first opening 4101, one side of the electrical connector 430 is inserted into the emission housing 410a, and the other side is exposed outside the emission housing 410a, such that the emission housing 410a and the electrical connector are assembled to form a light emission cavity. One end of the electric connector 430 located in the emission shell is connected with the laser array 411 through a gold wire, one end of the electric connector 430 located outside the emission shell is connected with the circuit board through a gold wire, and electric signals, working signals and the like generated by the circuit board 300 are transferred to the laser array 411 to drive each laser to emit laser beams with different wavelengths.

In some embodiments, the housing bottom 4102 of the emitter housing 410a is connected with the electrical connector 430 to support the electrical connector 430. The lower surface of the electrical connector 430 is higher than the housing bottom 4102.

Fig. 9 is a schematic structural view of an electrical connector provided according to some embodiments of the present disclosure. As shown in fig. 9, a first pad area 431 is formed on the surface of the electrical connector 430 located inside the emission housing 410a, and a second pad area 432 is formed on the surface of the electrical connector 430 located outside the emission housing 410 a. The first pad region 431 is electrically connected to the second pad region 432, thereby enabling transmission of signals, including low frequency signals and high frequency signals, inside and outside the emission case 410 a. The second pad region 432 includes a low frequency signal line for transmission of a low frequency signal and a high frequency signal line for transmission of a high frequency signal.

The surface of the circuit board 300 is formed with a signal pin area 320, the signal pin area 320 includes a pad for transmitting low frequency signals and high frequency signals, and the signal pin area 320 is connected with the second pad area 432 by wire bonding, thereby realizing the transmission of the low frequency signals and the high frequency signals between the circuit board and the electrical connector 430. When the signal pin area 320 is flush with the surface of the second pad area 432, the wire bonding time between the signal pin area and the second pad area is shorter, and the transmission quality of the high-frequency signal is better.

In order to provide a certain supporting force to the metal key between the emission housing 410a and the electrical connector 430, the pad 420 has a first supporting portion 421, a second supporting portion 422, and a third supporting portion 423. The first supporting portion 421, the second supporting portion 422, and the third supporting portion 423 are illustrated as an integrated structure.

The thickness of the electrical connector 430 is greater than that of the circuit board 300, and in order to shorten the length of the metal wire between the electrical connector 430 and the signal pin area 320, a second support 422 is provided between the signal pin area 320 and the lower case. The second support 422 lifts the height of the signal pin area 320 so that the upper surface of the electrical connector 430 is flush with the upper surface of the signal pin area 320. In some embodiments, the upper surface of the electrical connector 430 is flush with the upper surface of the signal pin area 320 means that the difference in height between the upper surface of the electrical connector 430 and the upper surface of the signal pin area 320 is less than or equal to 0.2mm.

Fig. 10 is a schematic structural view of a mat provided according to some embodiments of the present disclosure. As shown in fig. 10, the upper surfaces of the second support portion 422 and the third support portion 423 are connected to the circuit board for supporting the circuit board. The upper surface of the second supporting portion 422 protrudes from the upper surface of the first supporting portion 421, and the second supporting portion 422 is located below the signal pin region 320. The second support 422 supports the circuit board such that the signal pin region 320 and the second pad region 432 are located in the same plane.

The second support part 422 is located at one side of the first support part 421, and the third support part 423 is located at one side adjacent to the second support part 422. The light receiving member 500 is located within the projection range of the third supporting portion 423. The narrow plate area 330 is narrower in width, resulting in a circuit board that is subject to stress and deformation. The third supporting portion 423 is located at one side of the first escape opening 310, and the third supporting portion 423 reinforces the narrow plate area 330 of the circuit board. Meanwhile, the light receiving part is connected with the circuit board, the upper surface of the third supporting part 423 is connected with the circuit board, and the lower surface of the pad 420 is connected with the lower case, increasing the heat dissipation effect of the light receiving part and the light emitting part.

The third supporting portion 423 has a relief groove 4231, and the relief groove 4231 accommodates an electric device on the circuit board, for example.

In some embodiments of the present application, the second supporting portion 422 is located below the signal pin region 320, and the hardness of the second supporting portion 422 is greater than that of the circuit board, so as to provide a hard support for the metal of the signal pin region 320 and the second pad region 432.

Fig. 11 is a schematic partial cross-sectional view of a light emitting device and a circuit board according to some embodiments of the present disclosure. Fig. 12 is a schematic cross-sectional view of a light emitting device and a circuit board according to some embodiments of the present disclosure. As shown in fig. 11 and 12, the upper surface of the second pad area 432 of the electrical connector 430 is higher than the upper surface of the second support 422 from a different angle so that the signal pin area 320 and the second pad area 432 are located in the same plane. The signal pin region 320 is connected to the second pad region 432 by wire bonding, which is advantageous in reducing impedance.

In some embodiments, the second support portion, the third support portion and the circuit board are adhesively fixed. The first support portion and the bottom 4102 may be glued or welded.

In some embodiments, to reduce the length of the gold wires between the electrical connector 430 and the circuit board 300, the sidewall of the electrical connector 430 abuts against the sidewall of the second support 422. The lower surface of the electrical connector 430 is higher than the bottom 4102, and the second pad area 432 of the electrical connector 430 is located outside the emission housing, a first gap 424 is formed between the bottom 4102 and the second support portion 422, and the first gap 424 receives the overflow welding or glue overflow when the emission housing is welded to the first support portion 421, so as to prevent the emission housing from being inclined due to excessive welding or glue, and facilitate improving the coupling efficiency. The second pad area 432 is located above the first gap 424, and the sidewall of the electrical connector 430 abuts against the sidewall of the second support 422. The sidewall of the emission case 410a is connected to the third supporting part 423.

The third supporting portion 423 is connected to a lower surface of the circuit board to provide support for the circuit board 300, and at the same time, the light receiving member is connected to the circuit board, and an upper surface of the third supporting portion 423 is connected to the circuit board. The lower surface of the pad 420 is connected with the lower housing, the pad 420 is in heat conduction connection with the light emitting component, the heat dissipation area is increased, and the heat dissipation effect of the light receiving component and the light emitting component is improved.

Accordingly, the present application provides an optical module, wherein a circuit board, circuit board 300 is provided with a first avoiding opening 310, and an optical emission component is located in the first avoiding opening. The light emitting component and the light receiving component are both positioned on the upper surface of the circuit board. The light module further has a pad 420, the light emitting part is located on the pad 420, and a portion of the pad 420 is located under the circuit board corresponding to the light receiving part. One end of the light emitting component is provided with an electric connector, a second bonding pad area 432 of the electric connector protrudes out of the emitting shell, and the second bonding pad area 432 is connected with a signal pin area of the circuit board in a wire bonding mode, so that impedance is reduced, and signal transmission quality is improved. The backing plate includes first supporting part, second supporting part and third supporting part, and the shell bottom and the first supporting part welding of emission casing, second supporting part are located the below in signal pin region, and third supporting part is located the below of the circuit board of light receiving element below. The upper surfaces of the second supporting part and the third supporting part are higher than the upper surface of the first supporting part. The shell bottom of the emission shell is positioned between the base plate and the electric connector, and the electric connector is in contact connection with one side of the second supporting part.

A first gap 424 exists between the bottom of the shell and the second support portion, and the first gap 424 receives the solder overflow when the firing housing is soldered to the first support portion 421. A second gap 425 exists between the bottom of the case and the third support portion 423, and the second gap 425 receives the overflow welding when the transmitting case is welded to the first support portion 421.

Fig. 13 is an exploded schematic view of another light emitting component provided in accordance with some embodiments of the present disclosure. As shown in fig. 13, the light emitting part includes an emitting case 410b and an electrical connector 430. A first through hole 4103 is provided at one side wall of the emission case 410b, and an electrical connector 430 is provided at an opposite side wall of the first through hole 4103. A light emitting assembly is provided in the emission housing 410 b.

Illustratively, the emission housing 410b is an emission tube housing having a light emission assembly disposed therein, comprising: a laser array 411, a lens array 412, and an optical multiplexing component 413. The laser array 411 emits light of different wavelengths, each beam is sequentially processed by a converging lens in the lens array 412, converted from a divergent state to a convergent state, and then processed by a multiplexing process of the optical multiplexing component 413, so that light of different wavelengths is converted into parallel light after being collimated by a collimating lens in the optical fiber adapter 700, and is emitted from the emission housing 410b in a parallel light posture.

In order to provide a certain supporting force for the wire bonding between the transmitting case 410b and the electrical connector 430, the pad 420 has a first supporting portion 421, a second supporting portion 422, and a third supporting portion 423. The first supporting portion 421, the second supporting portion 422, and the third supporting portion 423 are illustrated as an integrated structure.

The upper surfaces of the second support portion 422 and the third support portion 423 are connected to the circuit board for supporting the circuit board. The upper surface of the second supporting portion 422 protrudes from the upper surface of the first supporting portion 421, and the second supporting portion 422 is located below the signal pin region 320. The second support 422 supports the circuit board such that the signal pin region 320 and the second pad region 432 are located in the same plane.

The second support part 422 is located at one side of the first support part 421, and the third support part 423 is located at one side adjacent to the second support part 422. The light receiving member 500 is located within the projection range of the third supporting portion 423. The width of the circuit board 300 at the position where the first avoiding opening 310 is arranged is narrower, so that the circuit board is easy to deform under the stress. The third supporting portion 423 is located at one side of the first escape opening 310, and the third supporting portion 423 reinforces the narrow plate area 330 of the circuit board. Meanwhile, the light receiving part is connected with the circuit board, the upper surface of the third supporting part 423 is connected with the circuit board, and the lower surface of the third supporting part 423 is connected with the lower housing, thereby increasing the heat dissipation effect of the light receiving part.

For example, the pad 420 is provided with a groove 4221, and the groove 4221 is located at the connection between the second support portion and the third support portion. The grooves 4221 may be used for mounting positioning, or the grooves 4221 may be used to carry flash or solder overflow.

The grooves 4221 are arcuate, and the grooves 4221 are concave toward the second and third support portions. The grooves 4221 can be in other shapes, and the grooves 4221 are chamfer structures at the connecting positions of the second supporting parts and the third supporting parts, so that the preparation and the molding are convenient.

Fig. 14 is a schematic structural view of another launch housing provided in accordance with some embodiments of the present disclosure. As shown in fig. 14, a first through hole 4103 is provided on the emission housing 410b, the first through hole 4103 communicates with the inner cavity of the emission housing 410b, and the first through hole 4103 is connected to the optical fiber adapter 700.

The emitter housing 410b is provided with a first opening 4101, and the first through hole 4103 and the first opening 4101 are respectively located on opposite sides of the emitter housing.

In some embodiments, the bottom of the emitter housing 410b is an opening, referred to for convenience as bottom opening 4104, and the spacer 420 is located below the emitter housing 410 b. The bottom opening 4104 communicates with the first opening 4101.

The emission housing 410b includes a first sidewall 4107, a second sidewall 4105 and a third sidewall 4106 respectively located on both sides of the first sidewall. The first through hole 4103 is located on the first sidewall 4107, and the first opening 4101 is located on an opposite side of the first sidewall 4107.

In some embodiments, the electrical connector 430 is located at the first opening 4101, one side of the electrical connector 430 is inserted into the emission housing 410b, and the other side is exposed outside the emission housing 410b, such that the emission housing 410b and the electrical connector are assembled to form a light emission cavity. One end of the electrical connector 430 located in the emission housing 410b is connected with the laser array 411 through a gold wire, and one end of the electrical connector 430 located outside the emission housing is connected with the circuit board through a gold wire, so that an electrical signal, a working signal and the like generated by the circuit board 300 are transferred to the laser array 411 to drive each laser to emit laser beams with different wavelengths.

Illustratively, the light emitting assembly is located on the backing plate.

After the pad 420 is connected to the emission housing 410b, the first supporting portion 421 seals the bottom opening 4104. The electrical connector 430 is located at the first opening 4101. The sidewalls of the electrical connector 430 are connected to the second and third sidewalls 4105 and 4106 of the emission housing 410b, respectively, and the bottom of the electrical connector 430 is connected to the first support 421.

Fig. 15 is a schematic cross-sectional view of a light emitting device and a circuit board according to some embodiments of the present disclosure. Fig. 16 is a schematic partial cross-sectional view of a light emitting device and a circuit board according to some embodiments of the present disclosure. As shown in fig. 15 and 16, the upper surface of the second pad area 432 of the electrical connector 430 is higher than the upper surface of the second support 422 from a different angle so that the signal pin area 320 and the second pad area 432 are located in the same plane. The signal pin region 320 is connected to the second pad region 432 by wire bonding, which is advantageous in reducing impedance.

In some embodiments, to reduce the length of the gold wires between the electrical connector 430 and the circuit board 300, the sidewall of the electrical connector 430 is close to the sidewall of the second support 422. However, in order to prevent the excessive glue or solder from flowing out when the electrical connector is connected to the pad 420, a third gap is provided between the sidewall of the electrical connector 430 and the sidewall of the second supporting portion 422, and the third gap 426 receives the solder overflow when the electrical connector is welded to the first supporting portion 421, so as to prevent the solder from excessively causing the inclination of the transmitting housing, thereby contributing to improving the coupling efficiency. The signal pin area 320 of the circuit board is covered over the third gap 426, so that the electrical connector is close to the signal pin area 320, reducing the length of the wire bonding.

A second gap 425 exists between the third side wall 4106 and the third supporting portion 423, and the second gap 425 receives overflow welding or overflow glue when the emission casing is welded with the first supporting portion 421, so that the emission casing is prevented from tilting due to excessive solder, a platform is provided for the photoelectric device of the light emitting component, and the coupling efficiency is improved. The circuit board 300 abuts against the side wall 4106 of the emission housing 410b, and positioning of the emission housing 410b is achieved.

Illustratively, the lower surface of the backing plate is planar and the lower surface of the backing plate is connected to the lower housing.

The third supporting portion 423 is connected to a lower surface of the circuit board to provide support for the circuit board 300, and at the same time, the light receiving member is connected to the circuit board, and an upper surface of the third supporting portion 423 is connected to the circuit board. The lower surface of the pad 420 is connected with the lower housing, the pad 420 is in heat conduction connection with the light emitting component, the heat dissipation area is increased, and the heat dissipation effect of the light receiving component and the light emitting component is improved.

Accordingly, the present application provides an optical module, wherein a circuit board, circuit board 300 is provided with a first avoiding opening 310, and an optical emission component is located in the first avoiding opening. The light emitting component and the light receiving component are both positioned on the upper surface of the circuit board. The light module further has a pad 420, the light emitting part is located on the pad 420, and a portion of the pad 420 is located under the circuit board corresponding to the light receiving part. One end of the light emitting component is provided with an electric connector, a second bonding pad area 432 of the electric connector protrudes out of the emitting shell, and the second bonding pad area 432 is connected with a signal pin area of the circuit board in a wire bonding mode, so that impedance is reduced, and signal transmission quality is improved. The backing plate includes first supporting part, second supporting part and third supporting part, and the shell bottom and the first supporting part welding of emission casing, second supporting part are located the below in signal pin region, and third supporting part is located the below of the circuit board of light receiving element below. The upper surfaces of the second supporting part and the third supporting part are higher than the upper surface of the first supporting part. The bottom opening part of the emission shell is provided with a base plate, and one side of the electric connector and the second supporting part is provided with a third gap. A second gap 425 exists between the side wall of the emitter housing and the third support portion, and the second gap 425 receives the solder overflow when the emitter housing is soldered to the first support portion 421. A second gap 425 exists between the bottom of the case and the third support portion 423, and the second gap 425 receives the overflow welding when the transmitting case is welded to the first support portion 421.

Since the foregoing embodiments are all described in other modes by reference to the above, the same parts are provided between different embodiments, and the same and similar parts are provided between the embodiments in the present specification. And will not be described in detail herein.

It should be noted that in this specification, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the statement "comprises" or "comprising" a … … "does not exclude that an additional identical element is present in a circuit structure, article or apparatus that comprises the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application are not intended to limit the scope of the present application.

Claims (10)

1. An optical module, comprising: the circuit board is provided with a first avoidance port and a narrow plate area, and the first avoidance port and the narrow plate area are arranged in parallel in the width direction of the circuit board; the circuit board is provided with a signal pin area;

the light emitting shell is positioned at the first avoidance port, one end of the light emitting shell is provided with an electric connector, and a second bonding pad area of the electric connector is positioned outside the light emitting component; the second bonding pad area is connected with the signal pin area through a metal bond; the thickness of the electric connector is larger than that of the circuit board;

a light receiving member located in the narrow plate region;

a backing plate, comprising: a first support portion, a second support portion, and a third support portion, wherein upper surfaces of the second support portion and the third support portion are higher than upper surfaces of the first support portion;

the light emitting housing has a bottom opening, the first support portion closing the bottom opening; the second supporting part supports the signal pin area so that the signal pin area is level with the second pad area; the third support portion is located below the narrow plate region.

2. The optical module of claim 1 wherein the light emitting housing has a first through hole, the first through hole being opposite the electrical connector, the fiber optic adapter being located within the first through hole.

3. The optical module of claim 1 or 2, wherein a lower surface of the electrical connector is connected to the first support portion with a third gap between the second pad region and the second support portion; the signal pin area covers the third gap so that the signal pin area is connected with the second bonding pad area.

4. The light module of claim 1 wherein a second gap is provided between the light emitting housing and a sidewall of the third support portion.

5. The light module of claim 1, wherein the mat is provided with: a laser array, a lens array and an optical multiplexing component;

the lens array is positioned between the laser array and the light multiplexing component;

the laser array is electrically connected with the electrical connector.

6. The optical module of claim 5 wherein the electrical connector has a first pad region, the first pad region being electrically connected to the laser array; the second pad region includes a low-frequency signal line for transmission of a low-frequency signal and a high-frequency signal line for transmission of a high-frequency signal.

7. The light module of claim 1 wherein the light emitting housing is welded to the first support.

8. The light module of claim 1 wherein the backing plate is provided with a groove at the junction of the second support and the third support.

9. The optical module of claim 1, further comprising:

an upper housing;

a lower housing;

the circuit board is positioned between the upper shell and the lower shell;

the light receiving member is located between the narrow plate area and the upper case; the upper surface of the third supporting part is connected with the narrow plate area, and the lower surface of the backing plate is in heat conduction connection with the lower shell.

10. The optical module of claim 1, wherein the width of the narrow plate region is less than or equal to 1/3 of the width of the circuit board.