CN220526045U - Optical module - Google Patents

Abstract

The application discloses optical module includes: the circuit board, light emission part, one end is connected with the circuit board electricity, and the other end is equipped with the optic fibre adapter. The light emitting member includes a component mounting portion and an adapter base. The glue overflow groove is positioned between the assembly installation part and the adaptive base, so that the benefit of redundant glue is facilitated, and the coupling precision is improved. The adapter base is provided with a limiting part, the optical fiber adapter is positioned above the adapter base, and the side wall of the optical fiber adapter is connected with the limiting part. The limiting part limits the position of the optical fiber adapter in the direction perpendicular to the optical axis and parallel to the surface of the adapter base. The end face of the optical fiber adapter is connected against the side wall of the assembly installation part, and the side wall of the assembly installation part limits the optical fiber adapter along the optical axis direction. The optical fiber adapter adopts square structure, and the shaping is simple, and the inside of optical fiber adapter non-insertion lateral wall, and the installation is simple and convenient with reprocessing.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

In a novel service mode and an application mode of cloud computing, mobile internet, video and the like, an optical communication technology can be used. In optical communication, an optical module is a tool for realizing mutual conversion of optical and electrical signals, and is one of key devices in optical communication equipment. With the rapid development of 5G networks, optical modules at the core position of optical communications have been developed.

Disclosure of Invention

The application provides an optical module to improve optical module coupling accuracy.

In order to solve the technical problems, the embodiment of the application discloses the following technical scheme:

in one aspect, an embodiment of the present application discloses an optical module, including:

the electrical circuit board is provided with a plurality of circuit boards,

a light emitting component, one end of which is electrically connected with the circuit board, and the other end of which is provided with an optical fiber adapter;

the light emitting member includes:

the upper surface of the component mounting part is provided with an emission structure body which is used for emitting signal light;

the adapter base protrudes out of the upper surface of the bottom plate, and the optical fiber adapter is positioned above the adapter base; and

the glue overflow groove is positioned between the component mounting part and the adaptive base;

the adaptive base is also provided with a limiting part, and the limiting part protrudes out of the upper surface of the adaptive base;

the side wall of the optical fiber adapter is connected with the limiting part, and the end face of the optical fiber adapter abuts against the side wall of the component mounting part;

the optical fiber adapter is square in appearance.

On the other hand, the embodiment of the application discloses an optical module, which comprises: the electrical circuit board is provided with a plurality of circuit boards,

a light emitting component, one end of which is electrically connected with the circuit board, and the other end of which is provided with a first optical fiber adapter and a second optical fiber adapter;

The light emitting member includes:

the upper surface of the component mounting part is provided with an emission structure body which is used for emitting signal light;

the adapter base protrudes out of the upper surface of the bottom plate, and the optical fiber adapter is positioned above the adapter base; and

the glue overflow groove is positioned between the component mounting part and the adaptive base;

the adaptive base is also provided with a first limiting part and a second limiting part, and the first limiting part and the second limiting part protrude out of the upper surface of the adaptive base;

the side wall of the first optical fiber adapter is connected with the first limiting part, and the end face of the first optical fiber adapter is abutted against the side wall of the component mounting part;

the side wall of the second optical fiber adapter is connected with the second limiting part, and the end face of the second optical fiber adapter is abutted against the side wall of the component mounting part;

the first fiber optic adapter and the second fiber optic adapter are square in shape.

Compared with the prior art, the beneficial effect of this application:

the application discloses optical module includes: the circuit board, light emission part, one end is connected with the circuit board electricity, and the other end is equipped with the optic fibre adapter. The light emitting member includes a component mounting portion and an adapter base. The glue overflow groove is positioned between the assembly installation part and the adaptive base, so that the benefit of redundant glue is facilitated, and the coupling precision is improved. The adapter base is provided with a limiting part, the optical fiber adapter is positioned above the adapter base, and the side wall of the optical fiber adapter is connected with the limiting part. The limiting part limits the position of the optical fiber adapter in the direction perpendicular to the optical axis and parallel to the surface of the adapter base. The end face of the optical fiber adapter is connected against the side wall of the assembly installation part, and the side wall of the assembly installation part limits the optical fiber adapter along the optical axis direction. The optical fiber adapter adopts square structure, and the shaping is simple, and the inside of optical fiber adapter non-insertion lateral wall, and the installation is simple and convenient with reprocessing.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

fig. 2 is a partial block diagram of a host computer according to some embodiments of the present disclosure;

FIG. 3 is a block diagram of an optical module provided in accordance with some embodiments of the present disclosure;

FIG. 4 is an exploded view of an optical module provided in accordance with some embodiments of the present disclosure;

fig. 5 is a schematic diagram of an exploded structure of a light emitting device and a circuit board according to some embodiments of the present disclosure;

fig. 6 is a schematic diagram illustrating an exploded structure of a light emitting device and a circuit board according to some embodiments of the present disclosure;

Fig. 7 is a schematic diagram of a light emitting component and a sub-circuit board according to some embodiments of the present disclosure;

FIG. 8 is a second exploded view of a light emitting component and a sub-circuit board according to some embodiments of the present disclosure;

fig. 9 is a schematic structural view of a light emitting component provided according to some embodiments of the present disclosure;

FIG. 10 is an exploded schematic view of a light emitting component provided in accordance with some embodiments of the present disclosure;

FIG. 11 is an exploded view of a light emitting component and a sub-circuit board according to some embodiments of the present disclosure;

FIG. 12 is a schematic cross-sectional view of a light emitting component provided in accordance with some embodiments of the present disclosure;

FIG. 13 is a first angular schematic view of a housing provided in accordance with some embodiments of the present disclosure;

FIG. 14 is a second angular schematic view of a housing provided in accordance with some embodiments of the present disclosure;

fig. 15 is a schematic diagram of a sub-circuit board according to some embodiments of the present disclosure;

fig. 16 is a second schematic structural view of a sub-circuit board according to some embodiments of the present disclosure;

fig. 17 is an exploded schematic illustration one of a sub-circuit board provided in accordance with some embodiments of the present disclosure;

Fig. 18 is an exploded schematic diagram ii of a sub-circuit board provided in accordance with some embodiments of the present disclosure;

FIG. 19 is a schematic diagram of a COC assembly provided in accordance with some embodiments of the present disclosure;

fig. 20 is an exploded view of a COC assembly provided in accordance with some embodiments of the present disclosure.

Detailed Description

The optical communication technology establishes information transfer between information processing apparatuses, and the optical communication technology loads information onto light, and uses propagation of light to realize information transfer, and the light loaded with information is an optical signal. The optical signal propagates in the information transmission device, so that the loss of optical power can be reduced, and the high-speed, long-distance and low-cost information transmission can be realized. Information that can be processed by the information processing device exists in the form of an electrical signal, and an optical network terminal/gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer and a television are common information processing devices, and an optical fiber and an optical waveguide are common information transmission devices.

The mutual conversion of optical signals and electric signals between the information processing equipment and the information transmission equipment is realized through an optical module. For example, an optical fiber is connected to an optical signal input end and/or an optical signal output end of the optical module, and an optical network terminal is connected to an electrical signal input end and/or an electrical signal output end of the optical module; the optical module converts the first optical signal into a first electric signal, and the optical module transmits the first electric signal into an optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Because the information processing devices can be connected with each other through an electrical signal network, at least one type of information processing device is required to be directly connected with the optical module, and not all types of information processing devices are required to be directly connected with the optical module, and the information processing device directly connected with the optical module is called an upper computer of the optical module.

Fig. 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure. As shown in fig. 1, a part of the optical communication system is represented as a remote information processing apparatus 1000, a local information processing apparatus 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 extends toward the remote information processing apparatus 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, the propagation of the optical signal in the total reflection direction can almost maintain the original optical power, the optical signal can be totally reflected in the optical fiber 101 for a plurality of times, the optical signal from the direction of the far-end information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated towards the direction of the far-end information processing device 1000, so that the information transmission with long distance and low power consumption is realized.

The number of the optical fibers 101 may be one or plural (two or more); the optical fiber 101 and the optical module 200 are movably connected in a pluggable mode, and can also be fixedly connected.

The upper computer 100 is provided with an optical module interface 102, and the optical module interface 102 is configured to be connected with the optical module 200, so that the upper computer 100 and the optical module 200 are connected by unidirectional/bidirectional electric signals; the upper computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working state of the optical module 200.

The upper computer 100 has an external electrical interface, such as a universal serial bus interface (Universal Serial Bus, USB), a network cable interface 104, and the external electrical interface can access an electrical signal network. Illustratively, the network cable interface 104 is configured to access the network cable 103, thereby enabling the host computer 100 to establish a unidirectional/bidirectional electrical signal connection with the network cable 103.

Optical network terminals (ONU, optical Network Unit), optical line terminals (OLT, optical Line Terminal), optical network devices (ONT, optical Network Terminal), and data center servers are common upper computers.

One end of the network cable 103 is connected to the local information processing device 2000, the other end is connected to the host computer 100, and the network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

Illustratively, the third electrical signal sent by the local information processing apparatus 2000 is transmitted to the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal based on the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, the optical module 200 transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing apparatus 1000 in the optical fiber 101.

Illustratively, the first optical signal from the direction of the remote information processing apparatus 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal into the local information processing apparatus 2000.

The optical module is a tool for realizing the mutual conversion of the optical signal and the electric signal, and the information is not changed in the conversion process of the optical signal and the electric signal, and the encoding and decoding modes of the information can be changed.

Fig. 2 is a partial block diagram of a host computer according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, fig. 2 only shows the structure of the host computer 100 and the optical module 200. As shown in fig. 2, the upper computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector (not shown in the drawing) disposed inside the cage 106, wherein the heat sink 107 has a convex structure for increasing a heat dissipation area, and the fin-like structure is a common convex structure.

The optical module 200 is inserted into the cage 106 of the host computer 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected with an electrical connector inside the cage 106.

Fig. 3 is a block diagram of an optical module provided according to some embodiments of the present disclosure, and fig. 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed within the housing, a light emitting part 400, and a light receiving part 500. The present disclosure is not limited thereto and in some embodiments, the optical module 200 includes one of the light emitting part 400 and the light receiving part 500.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical interface, and the golden finger of the circuit board 300 extends out of the electrical interface and is inserted into an electrical connector of the upper computer; the opening 205 is an optical port configured to access the optical fiber 101 such that the optical fiber 101 connects to the light emitting component 400 and/or the light receiving component 500 in the optical module 200.

The assembly mode of combining the upper shell 201 and the lower shell 202 is adopted, so that the circuit board 300, the light emitting component 400, the light receiving component 500 and other components can be conveniently installed in the shells, and the shapes of the components can be packaged and protected by the upper shell 201 and the lower shell 202. In addition, when the circuit board 300, the light emitting part 400, the light receiving part 500, and the like are assembled, the positioning part, the heat dissipating part, and the electromagnetic shielding part of these devices are easily disposed, which is advantageous for automating the production.

In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the light module 200 further includes an unlocking member 600 located outside its housing. The unlocking part 600 is configured to achieve a fixed connection between the optical module 200 and the upper computer, or to release the fixed connection between the optical module 200 and the upper computer.

For example, the unlocking member 600 is located outside of the two lower side plates 2022 of the lower housing 202, and includes an engaging member that mates with the cage 106 of the upper computer. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging member of the unlocking member 600; when the unlocking member 600 is pulled, the engaging member of the unlocking member 600 moves along with the unlocking member, so that the connection relationship between the engaging member and the host computer is changed, and the engagement and fixed connection between the optical module 200 and the host computer is released, so that the optical module 200 can be pulled out from the cage 106.

The circuit board 300 includes circuit traces, electronic components, chips, etc., and the electronic components and the chips are connected together according to a circuit design through the circuit traces to realize functions of power supply, electric signal transmission, grounding, etc. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (limiting amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; the hard circuit board is also convenient to insert into an electric connector in the host computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of independent leads. The circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connectors within the cage 106 by the gold fingers. The gold fingers may be disposed on only one surface (e.g., the upper surface shown in fig. 4) of the circuit board 300, or may be disposed on both upper and lower surfaces of the circuit board 300, so as to provide more pins. The golden finger is configured to establish electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like.

Of course, a flexible circuit board is also used in some optical modules, and the flexible circuit board is generally used in cooperation with a hard circuit board to supplement the hard circuit board.

The light emitting part 400 and/or the light receiving part 500 are located at a side of the circuit board 300 away from the gold finger; in some embodiments, the light emitting part 400 and the light receiving part 500 are physically separated from the circuit board 300, respectively, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors, respectively; in some embodiments, the light emitting and/or light receiving components may be disposed directly on the circuit board 300, may be disposed on a surface of the circuit board, or may be disposed on a side of the circuit board.

Fig. 5 is a schematic diagram of an exploded structure of a light emitting device and a circuit board according to some embodiments of the present disclosure; fig. 6 is a schematic diagram illustrating an exploded structure of a light emitting device and a circuit board according to some embodiments of the present disclosure; the overall structure of the light emitting portion of the optical module of the present application will be described below with reference to fig. 5 and 6. As shown in fig. 5 and 6, the light emitting member 400 includes an emission cover 401 and a housing 402, and the emission cover 401 and the housing 402 are connected by being covered. The transmitting cover plate 401 covers the housing 402 from above, one side wall of the housing 402 has an opening 404 for insertion of the sub-circuit board 301, and the other side wall of the housing 402 has a first through hole 405 for insertion of the fiber optic adapter 700.

One side of the housing 402 has a cover opening, and the transmitting cover covers over the housing 402 to form a transmitting cavity.

Specifically, the sub-circuit board 300 extends into the housing 402 through the opening 404, and the sub-circuit board 300 is fixed to the lower case 202; the sub-circuit board 300 is plated with metal traces, and the optical devices may be electrically connected to the corresponding metal traces by wire bonding to electrically connect the optical devices within the housing 402 to the sub-circuit board 300.

The second side wall of the housing 402 has an opening 404 for insertion of the daughter circuit board 300 and the first side wall of the housing 402 has a through hole for insertion of the fiber optic adapter 700.

The optical device in the housing 402 may optionally be connected to the sub-circuit board 300 through pins, where one end of the pin is inserted into the lower housing and is plated with a metal wire, the optical device may be electrically connected to the corresponding metal wire by wire bonding, and the pin is disposed at one end of the housing 402 and is provided with a plurality of pins electrically connected to the metal wire, and the pins are inserted into the sub-circuit board 300 and soldered together, so that the optical device in the housing 402 and the sub-circuit board 300 may be electrically connected, or of course, the pins on the pins may be directly soldered together with the sub-circuit board 300, so that the optical device in the housing 402 and the sub-circuit board 300 may be electrically connected.

In the signal transmitting process, the light emitting device in the housing 402 will convert the electrical signal into an optical signal after receiving the electrical signal transmitted by the circuit board 300, and then the optical signal enters the optical fiber adapter 700 and is transmitted to the outside of the optical module.

The light emitting component has a package structure for packaging laser chips and the like, and the existing package structure comprises a coaxial package TO-CAN, a silicon light package, a chip-on-board LENS assembly package COB-LENS and a micro-optical XMD package. The package is also divided into airtight package and non-airtight package, wherein the package provides stable and reliable working environment for the laser chip on one hand, and forms external electric connection and light output on the other hand.

The signal light emitted by the light emitting device is injected into the first through hole 405, the optical fiber adapter 700 stretches into the first through hole 405 to couple and receive the signal light, the optical fiber adapter 700 can move back and forth in the first through hole 405 through the design of the assembling structure, the required size of the optical fiber between the light emitting component and the optical fiber plug can be adjusted, and when the optical fiber is short, the optical fiber adapter can move backwards (towards the outer direction of the cavity) in the first through hole so as to meet the requirement of the connection size; when the optical fiber is long, the optical fiber adapter can be moved forward (toward the inside of the cavity) in the through hole to straighten the optical fiber and avoid bending the optical fiber. The optical fiber adapter 700 is inserted into the first through hole to achieve fixation with the light emitting part 400; during assembly, the fiber optic adapter 700 may be moved within the first through-hole to select a securing position. When the first through hole is a round hole, the optical fiber adapter 700 adopts a cylindrical structure, and the adapter is fixedly connected with the tube shell in an adhesive manner, so that the installation process and the repair are difficult. In order to ensure the processing of the round hole of the optical fiber adapter, the design cost of the tube shell is high.

In some embodiments, the light emitting component 400 may be inserted into the circuit board 300 itself, or may be electrically connected to a sub-circuit board.

Fig. 7 is a schematic diagram of a light emitting device and a sub-circuit board according to some embodiments of the present disclosure. Fig. 8 is a second exploded view of a light emitting device and a sub-circuit board according to some embodiments of the present disclosure. As shown in connection with fig. 7 and 8, the housing 402 includes a bottom plate and a first sidewall where the first through hole 405 is located. Light from the laser is transmitted to the fiber optic adapter 700 via the first through-hole 405. The optical window is located at the first through hole 405, the first side wall extends outwards to form the adapting base 410, the optical fiber adapter 700 is in limit connection with the adapting base 410, and the optical fiber adapter 700 is not embedded into the first through hole 405.

The adapter shoe 410 may also be formed by a bottom plate extending outwardly of the first sidewall.

In some embodiments of the present disclosure, the fiber optic adapter 700 has a square shape. The shape of the fiber optic adapter 700 may be square or rectangular.

A limiting part 411 is arranged above the adaptive base 410, and the limiting part 411 protrudes out of the adaptive base 410. The fiber optic adapter 700 is connected to a surface of the adapter mount 410, and the adapter mount 410 limits the fiber optic adapter 700. The side surface of the optical fiber adapter 700 is connected with the limiting part 411, and the limiting part 411 limits the position of the optical fiber adapter 700 in the direction parallel to the surface of the adapter base and perpendicular to the optical axis. The other side surface of the optical fiber adapter 700 is connected to the outer surface of the first sidewall 4021 of the housing 402, and the first sidewall 4021 limits the optical fiber adapter 700 in the optical axis direction.

The optical fiber adapter 700 adopts a square structure, the optical fiber adapter 700 is fixedly connected with the adapter base 410 in an adhesive mode, the optical fiber adapter 700 is coupled with the shell 402, the optical fiber adapter 700 is not embedded into the shell 402, and the installation process and the repair are simple.

In some embodiments of the present disclosure, the fiber optic adapter 700 and the adapter mount 410 may be connected by welding.

Fig. 9 is a schematic structural view of a light emitting component provided according to some embodiments of the present disclosure. Fig. 10 is an exploded schematic view of a light emitting component provided according to some embodiments of the present disclosure. As shown in fig. 9 and 10, the fiber optic adapter 700 includes a first fiber optic adapter 701 and a second fiber optic adapter 702. The adaptor base 410 is provided with a first limiting portion 4111 and a second limiting portion 4112. The upper surface of the adapter base 410 protrudes from the bottom plate 4023 of the housing 402. The base plate 4023 of the housing 402 is further provided with a component mounting part 4024, and an upper surface of the component mounting part 4024 protrudes from the base plate 4023. The focusing lens and the laser are provided on the upper surface of the component mounting portion 4024.

The first fiber optic adapter 701 is coupled to a surface of the adapter mount 410, and the adapter mount 410 positions the first fiber optic adapter 701. The side surface of the first optical fiber adapter 701 is connected to the first limiting portion 4111, and the first limiting portion 4111 limits the position of the first optical fiber adapter 701 in the direction perpendicular to the optical axis and parallel to the surface of the adapter base. The other side surface of the first optical fiber adapter 701 is connected to a side wall of the component mounting portion 4024, and the side wall of the component mounting portion 4024 limits the first optical fiber adapter 701 in the optical axis direction.

Likewise, the second fiber optic adapter 702 is coupled to a surface of the adapter mount 410, and the adapter mount 410 positions the second fiber optic adapter 702. The side surface of the second fiber optic adapter 702 is connected to the second limiting portion 4112, and the second limiting portion 4112 limits the position of the second fiber optic adapter 702 parallel to the surface of the adapter base and perpendicular to the optical axis direction. The other side surface of the second optical fiber adapter 702 is connected to a side wall of the component mounting portion 4024, and the side wall of the component mounting portion 4024 limits the second optical fiber adapter 701 in the optical axis direction.

The first optical fiber adapter and the second optical fiber adapter are positioned between the first limiting part and the second limiting part.

A glue overflow groove 4025 is arranged between the component mounting part 4024 and the adapting base 410, the upper surface of the glue overflow groove 4025 is lower than the adapting base 410, and the upper surface of the glue overflow groove 4025 is lower than the upper surface of the component mounting part 4024. The optical fiber adapter is connected with the adapting base through colloid or welding flux in the installation process, and redundant welding flux or colloid can be distributed along the glue overflow grooves 4025, so that the coupling precision of the optical fiber adapter is improved.

Fig. 11 is an exploded view of a light emitting device and a sub-circuit board according to some embodiments of the present disclosure. As shown in fig. 11, an emission structure 420 is provided inside the case 402, and the emission structure 420 includes: a semiconductor refrigerator 421, a first substrate 422, a second substrate 423, a laser 424, and a focusing lens 425. The semiconductor refrigerator 421 is located at the bottom of the housing 402, the first substrate 422 is located at the semiconductor refrigerator 421 and the second substrate 423, the laser 424 is located above the second substrate 423, the focusing lens 425 is located above the first substrate 422, and the focusing lens 425 is located on the light-emitting path of the laser 424. The upper surface of the circuit board is parallel to the upper surface of the second substrate to reduce the length of the wire bond between the sub-circuit board 301 and the second substrate. The second substrate 423 and the laser 424 form a COC assembly.

Fig. 12 is a schematic cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure. Fig. 13 is a first angular schematic view of a housing provided in accordance with some embodiments of the present disclosure. Fig. 14 is a second angular schematic view of a housing provided in accordance with some embodiments of the present disclosure. As shown in fig. 12, 13 and 14, the inner wall of the first sidewall 4021 is recessed to form a dodging groove 4022, and the first through hole 405 is located in the dodging groove 4022. The optical window 430 is located in the avoidance groove 4022, one side of the optical window 430 abuts against the first sidewall 4021, and light emitted by the laser is conducted into the optical fiber adapter through the optical window 430 after passing through the converging lens.

The cross-sectional area of the optical window 430 is larger than the area of the first through hole 405, and the first sidewall 4021 forms a limit for the optical window 430. The light emitting member is further provided with an optical window connection portion 431, and the optical window connection portion 431 is filled between the optical window 430 and the escape groove 4022. The light window connection limits the light window 430.

To avoid the light window 430 from returning to the laser chip from the reflected light path, the light window 430 is not perpendicular to the optical axis of the laser.

In some embodiments of the present disclosure, one end of the relief groove 4022 communicates with the cover plate opening, facilitating installation of the light window 430. The relief groove 4022 may be a U-shaped structure with an open end in open communication with the cover plate as shown in FIG. 12. The recess 4022 may have other shapes, such as square or circular, and the open end of the recess 4022 is communicated with the opening of the cover plate.

The inner surface of the avoiding groove 4022 is obliquely arranged with the side wall of the shell, the avoiding groove 4022 is a U-shaped groove, and the tube body of the optical window 430 is omitted, so that the shell can be integrally formed.

The conventional housing is provided with a light window 430 tube in the first through hole, and the light window 430 tube is separated from the first through hole 405. The present disclosure designs the U-shaped relief groove 4022 at the light window 430, which not only can use annular solder, effectively inhibits solder overflow and reduces the housing length. Meanwhile, the insert pin formed by one-time drawing can be used, the bottom surface is smooth, the processing technology is simple, and meanwhile, the low cost and the feasibility of optical mounting are realized.

The opening 404 is provided with a first groove 4041 and a second groove 4042, and the first groove 4041 and the second groove 4042 are respectively positioned at two sides of the opening 404. The first connection portion 441 is located between the first groove 4041 and the sub-circuit board 301; the second connection portion 442 is located between the second groove 4042 and the sub-circuit board 301, which increases the tightness of the connection between the sub-circuit board 301 and the housing 402, and prevents moisture from entering the interior along the gap between the opening 404 and the sub-circuit board 301.

One side of the first groove 4041 communicates with the outside of the housing, facilitating the installation of the first connection portion 441. One side of the second groove 4042 communicates with the outside of the housing to facilitate the installation of the second connection portion 442.

Fig. 15 is a schematic diagram of a sub-circuit board according to some embodiments of the present disclosure; fig. 16 is a schematic diagram of a second sub-circuit board according to some embodiments of the present disclosure. Fig. 15 and 16 are schematic views of sub-circuit boards at different angles. As shown in fig. 13 and 14, the upper surface of the sub-circuit board 301 is provided with an insulating region 311, the insulating region 311 traversing the sub-circuit board. The first lead area 312 and the second lead area 313 are respectively located at two sides of the insulation area, and the insulation area 311 and the second lead area 313 are located outside the opening 404. The second lead area 313 has a plurality of leads therein, the leads of the second lead area 313 are electrically connected to the circuit board 300, and the leads of the first lead area 312 are connected to the emission structure.

The first and second connection portions 441 and 442 may be glue cured. The first connection portion 441 connects the first lead area and the first groove 4041, and prevents moisture from entering the housing through gaps between the first connection portion 441 and the sub-circuit board 301, and between the first connection portion 441 and the housing 402. The second connection portion 442 connects the first lead area and the second groove 4042, and prevents moisture from entering the housing through gaps between the second connection portion 442 and the sub-circuit board 301, and between the second connection portion 442 and the housing 402. The first and second connection parts 441 and 442 may be low water absorption glue to enhance the airtight effect.

Fig. 17 is an exploded schematic illustration one of a sub-circuit board provided in accordance with some embodiments of the present disclosure; fig. 18 is an exploded view of a secondary circuit board provided according to some embodiments of the present disclosure. As shown in fig. 17 and 18, the upper surface of the sub-circuit board 301 is provided with an insulating region 311, a first lead region 3312, and a second lead region 313. The insulating region 211 is provided with a first insulating layer 3111, and the first insulating layer 3111 isolates the first lead region 312 from the second lead region 313. The first lead area 312 is provided with a first conductive sheet 3121, the first conductive sheet 3121 is provided with a first notch 3122, a first lead set 3123 is provided within the first notch 3122, and the first lead set 3123 is electrically connected to the radiating structure. The second lead area 313 is provided with a second lead group 3131, and the second lead group 3131 is electrically connected to the circuit board.

In some embodiments of the present disclosure, the first insulating layer 3111 may be a solder resist layer, enhancing the hermetic effect, blocking solder spreading onto the pads.

The first notch 3122 is further provided with a second insulating layer 3112, the second insulating layer 3112 is provided with a plurality of avoidance holes, and the first pin set 3123 is exposed in the avoidance holes. The second insulating layer 3112 may be a solder resist layer. The second insulating layer 3112 covers the portion without metal cover in the first lead area 3312, and plugs the air holes on the surface of the sub-circuit board, increasing the air tightness of the light emitting member.

In some embodiments of the present disclosure, the interlayer tightness of the sub-circuit board is greater than the interlayer tightness of the circuit board, preventing moisture from entering the housing along the interlayer gap of the sub-circuit board.

The first side 3011 of the sub-circuit board 301 is provided with a second conductive sheet 30111, and the second conductive sheet 30111 is connected to the first conductive sheet 3121. The projection of the first conductive sheet 3121 on the upper surface covers the first lead area 312. The projection of the upper surface of the first conductive sheet 3121 is located within the insulating region 211.

The second side 3012 of the sub-circuit board 301 is provided with a third conductive pad 30121, and the third conductive pad 30121 is connected to the first conductive pad 3121. The third conductive sheet 30121 covers the second side 3012 of the sub-circuit board 301 and prevents moisture from entering the interior of the housing through the gaps between the layers of the interior of the sub-circuit board.

The third side 3013 of the sub-circuit board 301 is provided with a fourth conductive pad 30131, and one side of the fourth conductive pad 30131 is connected to the first conductive pad 3121. The other side of the fourth conductive sheet 30131 is connected to the third conductive sheet 30121. The projection of the fourth conductive sheet 30131 on the upper surface covers the first lead area 312. The projection of the fourth conductive sheet 30131 on the upper surface is located within the insulating region 211.

The bottom surface of the sub-circuit board 301 is provided with a fifth conductive sheet 321, and the fifth conductive sheet 321 covers the bottom surface of the sub-circuit board 301. The fifth conductive sheet 321 is provided with a third insulating layer 3211, and a projection of the second lead group 3131 on the bottom surface of the sub-circuit board falls within a range of the third insulating layer 3211. The fifth conductive sheet 321 is connected to the second conductive sheet 30111, the third conductive sheet 30121, and the fourth conductive sheet 30131 to form a ground circuit, and forms a return path for the signals of the first pin group, thereby reducing the return path.

The third insulating layer 3211 covers the surface of the fifth conductive sheet 321, thereby preventing the fifth conductive sheet from being connected to an external circuit. The fifth conductive sheet 321 and the third insulating layer 3211 are located on the surface of the sub-circuit board, so as to seal pores on the surface of the sub-circuit board, and prevent water vapor from entering the interior of the housing through gaps between layers in the sub-circuit board.

For convenience in preparation, the fifth conductive sheet 321, the second conductive sheet 30111, the third conductive sheet 30121, and the fourth conductive sheet 30131 are integrally formed.

The first connection portion 441 is connected to a first conductive sheet, which is a metal structure. The surface of the first conducting strip is smooth, the first conducting strip and the first connecting part have good connectivity, bubbles are not easy to generate, and the airtight effect is improved. The second connection portion 442 is connected to the fifth conductive sheet 321, and the fifth conductive sheet 321 has a metal structure. The surface of the fifth conductive sheet 321 is flat, and the fifth conductive sheet 321 and the second connection portion have good connectivity, so that bubbles are not easy to generate, and the airtight effect is improved. Similarly, the first conductive sheet is positioned on the surface of the sub-circuit board to block the air holes on the surface of the sub-circuit board, so that water vapor can be prevented from entering the shell from gaps among layers in the sub-circuit board.

The second conductive sheet 30111 is located on a surface of the sub-circuit board, and the second conductive sheet 30111 is located inside the housing 402. The second conductive sheet 30111 has a metal structure, and is used for blocking air holes on the surface of the sub-circuit board, so that water vapor can be prevented from entering the interior of the shell through gaps between layers in the sub-circuit board.

The second pin group 3131 includes a first high-speed pin 3132, and the first high-speed pin 3132 is connected to a high-speed signal line on the circuit board. The second pin set 3131 further includes a first ground pin 3133 and a second ground pin 3134, with the first high speed pin 3132 being located between the first ground pin 3133 and the second ground pin 3134. One end of the first ground pin 3133 is connected to the third ground pin 3135, and one end of the second ground pin 3134 is connected to the third ground pin 3135.

In some examples of the present disclosure, the first ground pin 3133, the second ground pin 3134, and the third ground pin 3135 form a semi-enclosed structure within which the first high speed pin 3132 is located. The first ground pin 3133, the second ground pin 3134, and the third ground pin 3135 provide a return ground for signals in the first high speed pin 3132, reducing signal return paths, and facilitating reduced losses. The third ground pin 3135 is adjacent to the insulating region 211, and the opening of the semi-surrounding structure is located to facilitate the wire bonding connection between the first high-speed pin 3132 and the circuit board 301, so as to avoid short circuit caused by too low wire bonding.

The first conductive sheet 3121 also has a lead relief opening such that the edge of the first conductive sheet 3121 is in line with the gap of the second pin set.

The first insulating layer 3111 is located between the first conductive sheet 3121 and the second pin set, isolates the first conductive sheet 3121 from the second pin set, prevents the first conductive sheet from being connected with the second pin set, and ensures electrical connection stability.

The third conductive sheet 30121 increases the electromagnetic loss of the sub-circuit board, and in order to reduce the loss and improve the bandwidth of the optical module, the surface of the second substrate 423 is provided with a seventh conductive sheet 4231, and the seventh conductive sheet 4231 is adjacent to the sub-circuit board 301. The seventh conductive pad 4231 forms a capacitive coupling channel with the third conductive pad 30121 of the sub-circuit board, which enables ground return of the signal line to pass through the coupling channel, guaranteeing the integrity of the ground return signal.

Fig. 19 is a schematic view of a COC component according to some embodiments of the present disclosure, and fig. 20 is an exploded schematic view of a COC component according to some embodiments of the present disclosure. As shown in fig. 19 and 20, the COC module includes a second substrate 423 and a laser 424, and the laser 424 is located on a surface of the second substrate 423. The second substrate 423 has a sixth conductive pad 4232 disposed on an upper surface thereof, and the sixth conductive pad 4232 covers the upper surface of the second substrate 423. The sixth conductive plate 4232 has a third notch 42322, and a modulation signal line 4233 is disposed in the third notch 42322. The modulated signal line 4233 is wired to the sub-circuit board, and the modulated signal line 4233 is also wired to the laser 424.

The sixth conductive plate 4232 is further provided with a fourth notch, and a power supply signal line is arranged in the fourth notch.

The bottom surface of the laser 424 is connected with the sixth conductive plate 4232, and the upper surface of the laser 424 is provided with a signal panel, and the signal panel is wire-bonded with the modulation signal line 4233.

The second substrate 423 has a sixth conductive pad 4232 disposed on an upper surface thereof, and the sixth conductive pad 4232 covers the upper surface of the second substrate 423. The sixth conductive plate 4232 has a third notch 42321, and a modulation signal line 4233 is disposed in the third notch 42321.

The sixth conductive sheet has a grounding region 42321 to which the lower surface grounding region 42321 of the laser is connected. The sixth conductive sheet is connected to the ground signal line.

The side wall of the second substrate 423 is provided with a seventh conductive sheet 4231, and the seventh conductive sheet 4231 is adjacent to the sub-circuit board 301. The side wall of the second substrate 423 is provided with a seventh conductive sheet 4231, and the seventh conductive sheet 4231 and the third conductive sheet 30121 of the sub-circuit board form a capacitive coupling channel, so that ground reflux of the signal line can be transmitted from the coupling channel, and the integrity of the ground reflux signal is ensured.

The seventh conductive sheet 4231 may further extend to the bottom of the second substrate, that is, the seventh conductive sheet 4231 may further cover the bottom of the second substrate, thereby alleviating antenna effect and reducing electromagnetic radiation.

The disclosed embodiments provide a light emitting part including: the transmitting cover plate 401 and the shell 402 are in cover connection. A side wall of the housing 402 has an opening 404, and one end of the sub-circuit board 301 is inserted into the housing 402 through the opening 404. The opening 404 is provided with a first groove 4041 and a second groove 4042 on both sides, respectively. The first connection portion 441 is located between the first groove 4041 and the sub-circuit board 301; the second connection portion 442 is located between the second groove 4042 and the sub-circuit board 301, which increases the tightness of the connection between the sub-circuit board 301 and the housing 402, and prevents moisture from entering the interior along the gap between the opening 404 and the sub-circuit board 301. One side of the first groove 4041 communicates with the outside of the housing, facilitating the installation of the first connection portion 441. One side of the second groove 4042 communicates with the outside of the housing to facilitate the installation of the second connection portion 442.

The inner wall of the first sidewall 4021 is recessed to form an avoidance groove 4022, and the first through hole 405 is located in the avoidance groove 4022. The optical window 430 is located in the avoidance groove 4022, one side of the optical window 430 abuts against the first sidewall 4021, and light emitted by the laser is conducted into the optical fiber adapter through the optical window 430 after passing through the converging lens.

The upper surface of the sub-circuit board 301 is provided with an insulating region 311, the insulating region 311 traversing the sub-circuit board. The first lead area 312 and the second lead area 313 are respectively located at two sides of the insulation area, and the insulation area 311 and the second lead area 313 are located outside the opening 404. The second lead area 313 has a plurality of leads therein, the leads of the second lead area 313 are electrically connected to the circuit board 300, and the leads of the first lead area 312 are connected to the emission structure. The first and second connection portions 441 and 442 may be glue cured. The first connection portion 441 connects the first lead area and the first groove 4041, and prevents moisture from entering the housing through gaps between the first connection portion 441 and the sub-circuit board 301, and between the first connection portion 441 and the housing 402. The second connection portion 442 connects the first lead area and the second groove 4042, and prevents moisture from entering the housing through gaps between the second connection portion 442 and the sub-circuit board 301, and between the second connection portion 442 and the housing 402. The first and second connection parts 441 and 442 may be low water absorption glue to enhance the airtight effect.

The surface of the sub-circuit board is provided with a plurality of conductive areas, the conductive areas wrap the part of the sub-circuit board positioned in the shell 402, air holes on the surface of the sub-circuit board are blocked, and the air tightness of the light emitting component is improved.

The housing is internally provided with a COC component comprising a second substrate 423 and a laser 424. The side wall of the second substrate 423 is provided with a seventh conductive sheet 4231, and the seventh conductive sheet 4231 is adjacent to the sub-circuit board 301. The seventh conductive pad 4231 forms a capacitive coupling channel with the third conductive pad 30121 of the sub-circuit board, which enables ground return of the signal line to pass through the coupling channel, guaranteeing the integrity of the ground return signal.

Since the foregoing embodiments are all described in other modes by reference to the above, the same parts are provided between different embodiments, and the same and similar parts are provided between the embodiments in the present specification. And will not be described in detail herein.

It should be noted that in this specification, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the statement "comprises" or "comprising" a … … "does not exclude that an additional identical element is present in a circuit structure, article or apparatus that comprises the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application are not intended to limit the scope of the present application.

Claims (9)

1. An optical module, comprising:

the electrical circuit board is provided with a plurality of circuit boards,

a light emitting component, one end of which is electrically connected with the circuit board, and the other end of which is provided with an optical fiber adapter;

the light emitting member includes:

the bottom plate is provided with a bottom plate,

the upper surface of the component mounting part protrudes out of the bottom plate, and is provided with an emission structure body which is used for emitting signal light;

the adapter base protrudes out of the upper surface of the bottom plate, and the optical fiber adapter is positioned above the adapter base; and

the glue overflow groove is positioned between the component mounting part and the adaptive base;

The adaptive base is provided with a limiting part, and the limiting part protrudes out of the upper surface of the adaptive base;

the side wall of the optical fiber adapter is connected with the limiting part, and the end face of the optical fiber adapter abuts against the side wall of the component mounting part;

the optical fiber adapter is square in appearance.

2. The light module of claim 1 wherein an upper surface of the glue overflow recess is lower than the adapter base; the upper surface of the glue overflow groove is lower than the component mounting part.

3. The light module of claim 1 wherein the light emitting component further comprises: a transmitting cover plate;

the shell is connected with the transmitting cover plate in a covering way;

the first side wall of the housing has an opening through which the circuit board enters the housing;

the second side wall of the shell is also provided with a first through hole, and the inner surface of the second side wall is provided with an avoidance groove;

the first through hole is communicated with the avoidance groove;

a light window is arranged in the avoidance groove and is propped against the first through hole;

the dodging groove is internally provided with an optical window connecting part, and the optical window connecting part is positioned between the optical window and the dodging groove.

4. A light module as recited in claim 3, wherein the housing is provided with a cover opening, the emitter cover being located over the cover opening;

the open end of the avoidance groove is communicated with the opening of the cover plate.

5. The light module of claim 3 or 4, wherein an area of the light window is larger than an area of the first through hole; the side wall of the avoidance groove is not perpendicular to the axis of the optical fiber adapter.

6. A light module as recited in claim 3, wherein the relief groove is a U-shaped groove and the light window is filled between the light window and the relief groove.

7. An optical module, comprising:

the electrical circuit board is provided with a plurality of circuit boards,

a light emitting component, one end of which is electrically connected with the circuit board, and the other end of which is provided with a first optical fiber adapter and a second optical fiber adapter;

the light emitting member includes:

a bottom plate, a component mounting part, a light emitting structure body and a light emitting module, wherein the upper surface of the component mounting part protrudes out of the bottom plate, and the upper surface of the component mounting part is provided with the light emitting structure body which is used for emitting signal light;

the adapter base protrudes out of the upper surface of the bottom plate, and the optical fiber adapter is positioned above the adapter base; and

the glue overflow groove is positioned between the component mounting part and the adaptive base;

The adaptive base is also provided with a first limiting part and a second limiting part, and the first limiting part and the second limiting part protrude out of the upper surface of the adaptive base;

the side wall of the first optical fiber adapter is connected with the first limiting part, and the end face of the first optical fiber adapter is abutted against the side wall of the component mounting part;

the side wall of the second optical fiber adapter is connected with the second limiting part, and the end face of the second optical fiber adapter is abutted against the side wall of the component mounting part;

the first fiber optic adapter and the second fiber optic adapter are square in shape.

8. The light module of claim 7 wherein the light emitting component further comprises: a transmitting cover plate;

the shell is connected with the transmitting cover plate in a covering way;

the first side wall of the housing has an opening through which the circuit board enters the housing;

the second side wall of the shell is also provided with a first through hole, and the inner surface of the second side wall is provided with an avoidance groove;

the first through hole is communicated with the avoidance groove;

a light window is arranged in the avoidance groove and is propped against the first through hole;

the dodging groove is internally provided with an optical window connecting part, and the optical window connecting part is positioned between the optical window and the dodging groove.

9. The light module of claim 8 wherein the relief groove is a U-shaped groove.