CN220063004U - Hall sensor of secondary injection molding - Google Patents
Hall sensor of secondary injection molding Download PDFInfo
- Publication number
- CN220063004U CN220063004U CN202321415921.5U CN202321415921U CN220063004U CN 220063004 U CN220063004 U CN 220063004U CN 202321415921 U CN202321415921 U CN 202321415921U CN 220063004 U CN220063004 U CN 220063004U
- Authority
- CN
- China
- Prior art keywords
- hall
- circuit board
- framework
- cavity
- contact pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001746 injection moulding Methods 0.000 title claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 238000003466 welding Methods 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 8
- 238000012797 qualification Methods 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000004519 grease Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Measuring Magnetic Variables (AREA)
Abstract
The utility model relates to a secondary injection molding Hall sensor which comprises a Hall framework, a circuit board, pins, a Hall chip and an outer plastic shell, wherein the pins are fixedly connected with the Hall framework, the pins are connected with the Hall framework through the circuit board, the outer plastic shell is formed by secondary injection molding of the Hall framework, a resin layer is arranged between the Hall framework and the outer plastic shell, and the resin layer is wrapped on the outer surface of the circuit board. The utility model aims to wrap and protect the circuit board through the resin layer, prevent the soldering tin from falling off due to high temperature and high pressure impact, maintain the stability of the circuit, improve the qualification rate of the product and reduce the loss.
Description
Technical Field
The utility model relates to the technical field of Hall sensors, in particular to a secondary injection molding Hall sensor.
Background
In order to improve the overall waterproof performance, the conventional Hall sensor wraps the circuit component in a secondary injection molding mode, so that the anti-interference performance of the Hall sensor is improved, the Hall sensor can be continuously used in a severe environment, as the secondary injection molding environment is in a high-temperature and high-pressure state, welding spots of the circuit component are impacted and damaged during secondary injection molding, the circuit component is also tested to be qualified before injection molding, the sensor is tested to be unqualified after injection molding, unqualified waste products can only be scrapped, and the production loss is increased.
Disclosure of Invention
In order to overcome the defects of the background technology, the utility model adopts the following technical scheme: the utility model provides a hall sensor of secondary injection molding, includes hall skeleton, circuit board, contact pin, hall chip and outer shell of moulding, hall skeleton fixedly connected with contact pin, the contact pin passes through the circuit board and is connected with the hall skeleton, hall skeleton secondary injection molding has outer shell of moulding, be equipped with the resin layer between hall skeleton and the outer shell of moulding, the resin layer parcel is at the surface of circuit board.
Further, the Hall framework is provided with a sealed cavity, the circuit board is positioned in the cavity, and the resin is filled in the cavity.
Further, welding spots connected with the contact pins and the Hall chips are arranged at two ends of the circuit board, and resin is wrapped on the surfaces of the welding spots.
Further, contact pin injection moulding is in hall skeleton, the one end of contact pin extends to in the die cavity, hall chip is equipped with the pin that is connected with the circuit board, and the pin extends to in the die cavity.
Further, the contact pin extends to the outer side of the Hall framework, and the contact pin and the outer plastic shell form a plug.
Further, the Hall framework is provided with a fixing block and a fixing column which face the cavity in a mutually perpendicular mode, the fixing block is arranged on two sides of the cavity, and the fixing block and the fixing column extend to the outer surface of the outer plastic shell.
Further, the bottom of the outer plastic shell, which is positioned at the cavity, is provided with a groove, and the bottom surface of the Hall framework is exposed through the groove.
Compared with the prior art, the utility model has the beneficial effects that:
the circuit board is wrapped and protected by the resin layer, so that the solder is prevented from falling off due to high-temperature and high-pressure impact, the stability of the circuit is maintained, the product qualification rate is improved, and the loss is reduced.
Embodiments of the present utility model are further described below with reference to the accompanying drawings.
Drawings
FIG. 1 is a top view of the present utility model;
FIG. 2 is a cross-sectional view of the view A of FIG. 1 in accordance with the present utility model;
FIG. 3 is a perspective view of the Hall skeleton of the present utility model before grease injection;
FIG. 4 is a perspective view of the Hall skeleton of the present utility model after being injected with grease;
wherein: 1-Hall framework, 2-circuit board, 3-contact pin, 4-Hall chip, 5-outer plastic shell, 6-resin layer, 7-cavity, 8-welding spot, 9-pin, 10-plug, 11-fixed block, 12-fixed column and 13-groove;
Detailed Description
As shown in fig. 1 and 2, this embodiment provides a hall sensor of secondary injection molding, including hall skeleton 1, circuit board 2, contact pin 3, hall chip 4 and outer shell 5 of moulding, hall skeleton 1 fixedly connected with contact pin 3, contact pin 3 is connected with hall skeleton 1 through circuit board 2, hall skeleton 1 secondary injection molding has outer shell 5 of moulding, is equipped with resin layer 6 between hall skeleton 1 and the outer shell 5 of moulding, and resin layer 6 parcel is at the surface of circuit board 2.
In the utility model, the circuit board 2 is wrapped and protected by the resin layer 6, and the resin layer 6 protects the soldering tin position of the electronic device on the circuit board 2 from falling off due to high-temperature and high-pressure impact during secondary injection molding of the Hall framework 1, so that the stability of a circuit is maintained, and the qualification rate of products is improved.
As shown in fig. 3 and 4, in this embodiment, the hall frame 1 is provided with a sealed cavity 7, the circuit board 2 is located in the cavity 7, and the cavity 7 is filled with resin. Specifically, two ends of the circuit board 2 are provided with welding spots 8 connected with the contact pins 3 and the Hall chips 4, and the surfaces of the welding spots 8 are wrapped with the resin layer 6. Specifically, the contact pin 3 is injection molded on the hall skeleton 1, one end of the contact pin 3 extends into the cavity 7, the hall chip 4 is provided with a pin 9 connected with the circuit board 2, and the pin 9 extends into the cavity 7.
Before secondary injection molding, resin needs to be injected into the cavity 7, the resin layer 6 is formed after cooling, and welding spots 8 at two ends of the circuit board 2 are wrapped by the resin layer 6, and the injected resin cannot leak outside because the cavity 7 is a sealed cavity, so that materials are saved, the resin injection process is simple and quick to operate, and the process can realize automatic operation.
Referring to fig. 2 and 3, in this embodiment, the pin 3 extends to the outside of the hall frame 1, and the pin 3 and the outer plastic shell 5 form a plug 10.
In the utility model, the outer plastic shell 5 and the contact pin 3 form a standard plug 10, so that the electric connection requirement of the Hall sensor is met.
In this embodiment, the hall skeleton 1 is provided with a fixing block 11 and a fixing column 12 which are oriented to be perpendicular to each other, and the fixing block 11 is arranged at two sides of the cavity 7, and the fixing block 11 and the fixing column 12 extend to the outer surface of the outer plastic shell 5. Specifically, the bottom of the outer plastic shell 5, which is positioned at the cavity 7, is provided with a groove 13, and the bottom surface of the Hall framework 1 is exposed through the groove 13.
In the utility model, before secondary injection, the Hall framework 1 is clamped in the mould up and down by the limit of the fixing column 12 and the groove 13, and is clamped in the mould left and right by the fixing block 11, so that the Hall framework 1 is completely fixed in the injection mould, thereby achieving the requirement of secondary injection.
The above embodiments are not intended to limit the scope of the present utility model, so: all equivalent changes in structure, shape and principle of the utility model should be covered in the scope of protection of the utility model.
Claims (7)
1. The utility model provides a hall sensor of secondary injection molding, includes hall skeleton (1), circuit board (2), contact pin (3), hall chip (4) and outer shell (5) of moulding, hall skeleton (1) fixedly connected with contact pin (3), contact pin (3) are connected with hall skeleton (1) through circuit board (2), hall skeleton (1) secondary injection molding has outer shell (5), a serial communication port, be equipped with resin layer (6) between hall skeleton (1) and the outer shell (5) of moulding, resin layer (6) parcel is at the surface of circuit board (2).
2. The over-molded hall sensor of claim 1, wherein: the Hall framework (1) is provided with a sealed cavity (7), the circuit board (2) is positioned in the cavity (7), and the cavity (7) is filled with resin.
3. The over-molded hall sensor of claim 2, wherein: welding spots (8) connected with the contact pins (3) and the Hall chips (4) are arranged at two ends of the circuit board (2), and a resin layer (6) is wrapped on the surface of each welding spot (8).
4. The over-molded hall sensor of claim 2, wherein: the Hall module comprises a Hall framework (1), wherein the Hall framework is formed by injection molding of a contact pin (3), one end of the contact pin (3) extends into a cavity (7), a pin (9) connected with a circuit board (2) is arranged on a Hall chip (4), and the pin (9) extends into the cavity (7).
5. The over-molded hall sensor of claim 4 wherein: the contact pin (3) extends to the outer side of the Hall framework (1), and the contact pin (3) and the outer plastic shell (5) form a plug (10).
6. The over-molded hall sensor of claim 2, wherein: the Hall framework (1) is provided with fixing blocks (11) and fixing columns (12) which face the Hall framework and are perpendicular to each other, the fixing blocks (11) are arranged on two sides of the cavity (7), and the fixing blocks (11) and the fixing columns (12) extend to the outer surface of the outer plastic shell (5).
7. The over-molded hall sensor of claim 6 wherein: the bottom of the outer plastic shell (5) positioned at the die cavity (7) is provided with a groove (13), and the bottom surface of the Hall framework (1) is exposed through the groove (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321415921.5U CN220063004U (en) | 2023-06-05 | 2023-06-05 | Hall sensor of secondary injection molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321415921.5U CN220063004U (en) | 2023-06-05 | 2023-06-05 | Hall sensor of secondary injection molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220063004U true CN220063004U (en) | 2023-11-21 |
Family
ID=88787579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321415921.5U Active CN220063004U (en) | 2023-06-05 | 2023-06-05 | Hall sensor of secondary injection molding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220063004U (en) |
-
2023
- 2023-06-05 CN CN202321415921.5U patent/CN220063004U/en active Active
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