CN108878301A - A kind of plastic package die - Google Patents
A kind of plastic package die Download PDFInfo
- Publication number
- CN108878301A CN108878301A CN201810623055.6A CN201810623055A CN108878301A CN 108878301 A CN108878301 A CN 108878301A CN 201810623055 A CN201810623055 A CN 201810623055A CN 108878301 A CN108878301 A CN 108878301A
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- plastic packaging
- plastic
- plastic package
- mold
- packaging
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 235
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000009434 installation Methods 0.000 claims abstract description 22
- 230000005540 biological transmission Effects 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000011324 bead Substances 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000009510 drug design Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of plastic package die and its plastic package methods,Including Plastic packaging apparatus ontology,Plastic package mechanism,Plastic package mechanism upper plate is equipped on Plastic packaging apparatus ontology,Drive shaft connector,Transmission mechanism fixed plate,Drive shaft,Plastic package mechanism,Plastic package mechanism upper cover plate,Plastic package mechanism pedestal,Plastic package die installation pedestal,Vertical columns,Mold under plastic packaging,Plastic packaging upper mold,It is drivingly connected column,Plastic packaging head mounting base,Plastic packaging head,Plastic package die top cover,Motor,Mold fixing bolt,Plastic packaging slot,Plastic packaging attachment mounting plates,Mold mounting groove,Parting bead,Vertical columns mounting groove,It is drivingly connected column mounting groove,Plastic packaging slot side fixed block,Plastic packaging pawl,The present invention has rational design,Using Mechanical Driven,Automatically automatic packaging is carried out to chip,To which chip be effectively protected,And cost can be effectively reduced using plastic packaging,And plastic packaging speed is fast,Difficulty of processing is low.
Description
Technical field
The present invention relates to chip flip-clip field, specially a kind of plastic package die and its plastic package method.
Background technique
Plastic packaging refers to using particular manufacturing craft, with plastic packaging resin semi-finished product after bonding under the conditions of certain pressure and temperature
The process that packaging protection gets up, in technical field of semiconductors, common chip bonding is to PCB plate surface, wherein more often
There is the mode of wire bonding.
The currently used device that plastic packaging is carried out to chip, it is bad due to positioning, it is easy to cause plastic packaging appearance position deviation
The phenomenon that, greatly reduce the yield of product.
Summary of the invention
Mechanical Driven is used the purpose of the present invention is to provide a kind of, automatic packaging is carried out to chip automatically, thus to core
Piece is effectively protected, and cost can be effectively reduced using plastic packaging, and plastic packaging speed is fast, the low one kind of difficulty of processing
Plastic package die and its plastic package method, to solve the problems mentioned in the above background technology.
To achieve the above object, the present invention provides the following technical solutions：A kind of plastic package die, including Plastic packaging apparatus ontology,
Plastic package mechanism, the bottom of the Plastic packaging apparatus ontology are equipped with plastic package mechanism pedestal, and the top of the plastic package mechanism pedestal is equipped with modeling
Sealing mechanism, the bottom of plastic package mechanism are equipped with plastic package die installation pedestal, are equipped with above the both ends of the plastic package die installation pedestal
Vertical columns, the top of the vertical columns are equipped with mold under plastic packaging, and the top of mold is equipped with plastic packaging upper mold under the plastic packaging,
The top of the plastic package mechanism is equipped with plastic package die top cover, and the top of the plastic package mechanism is equipped with plastic package mechanism upper cover plate, plastic packaging
Left side between mechanism upper cover plate and plastic package mechanism pedestal is equipped with connection jack-post, and the right side of the plastic package mechanism upper cover plate is equipped with solid
Determine block, connector is equipped between fixed block, the top of the plastic package mechanism upper cover plate is equipped with transmission mechanism fixed plate, the transmission
The top of mechanism fixed plate is equipped with fixed plate, and the top of the Plastic packaging apparatus ontology is equipped with plastic package mechanism upper plate, plastic package mechanism
The lower section of upper plate is equipped with mechanism's installing plate, and the lower section of the plastic package mechanism upper plate is equipped with connection bearing, and connection bearing passes through
Mechanism's installing plate is connect with fixed plate, and the right side of the connection bearing is equipped with motor mounting rack, and motor mounting rack is equipped with
Motor, the lower section of the motor are equipped with drive shaft connector, and the lower end of the drive shaft connector is equipped with drive shaft, mechanism installation
The left end of plate is equipped with fixedly connected part, and fixedly connected part is connected by the left end of connection bolt and mechanism's installing plate.
Preferably, the centre under the plastic packaging between mold and plastic packaging upper mold, which is equipped with, is drivingly connected column, is drivingly connected column
Two sides be symmetrically arranged with plastic packaging slot, the top of the plastic packaging upper mold is equipped with plastic packaging attachment mounting plates, plastic packaging attachment mounting plates
Centre, which is equipped with, is drivingly connected column mounting hole, and the top of the plastic packaging attachment mounting plates is equipped with plastic packaging head mounting base, the installation of plastic packaging head
The centre of seat, which is equipped with, is drivingly connected column mounting hole, is drivingly connected axis and passes through among plastic packaging attachment mounting plates and plastic packaging head mounting base
It is drivingly connected column mounting hole, the top for being drivingly connected column is connect with the bottom center of plastic package die top cover, the plastic sealed mould
The lower section both ends of tool top cover are connect by being fixedly connected with column with the top both ends of plastic packaging upper mold.
Preferably, the both ends of mold and plastic packaging upper mold are equipped with mold fixing bolt under the plastic packaging.
Preferably, it is drivingly connected column two sides of mounting hole in the plastic packaging head mounting base and is equipped with plastic packaging head, the plastic packaging head
Bottom end is connect with the chip inside plastic packaging slot, and the inside of plastic packaging slot is equipped with the chip for needing plastic packaging, the bottom two of the plastic packaging head
Side is symmetrically arranged with auxiliary plastic packaging head, and the bottom end of the plastic packaging slot is equipped with supporting pad.
Preferably, one row of centre of the plastic packaging upper mold is equipped with plastic packaging pawl, and the centre of plastic packaging pawl is equipped with circular hole, the modeling
The two sides for sealing pawl are equipped with plastic packaging slot, and the both ends middle position of the plastic packaging upper mold is equipped with fixing bolt, the two sides of fixing bolt
It is symmetrically arranged with connecting hole.
Preferably, the centre of mold is equipped with a row and is drivingly connected column mounting groove, the drive connection column peace under the plastic packaging
The two sides of tankage are symmetrically arranged with plastic packaging slot, and the both ends of mold are symmetrically arranged with plastic packaging slot side fixed block, plastic packaging slot under the plastic packaging
Plastic packaging slot side fixed block is fixed on the both ends of mold under plastic packaging, plastic packaging slot side by fixing bolt by side fixed block
Fixed block is equipped with connected circular hole.
Preferably, plastic package die installation pedestal is equipped with mold mounting groove, is equipped with parting bead, institute between the mold mounting groove
It states plastic package die installation pedestal and is equipped with vertical columns mounting groove at four angles.
Preferably, a kind of plastic package die, plastic package method include the following steps：
A, the chip that will need to carry out plastic packaging first, in the plastic packaging slot under putting to plastic packaging in mold；
B, mold is fixed in plastic package die installation pedestal under plastic packaging, is drivingly connected column for plastic packaging upper mold and plastic packaging lower die
Tool is fastened；
C, plastic packaging head and the auxiliary plastic packaging head of plastic packaging both sides of head be by chip fixed column, plastic packaging pawl by chip connection welding with
Routing connects between feeler, carries out plastic packaging to the upper surface of chip after routing；
D, after the completion of molding powder, plastic packaging upper mold moves up under the driving for being drivingly connected column, plastic packaging upper mold is opened, by plastic packaging
Good chip removes.
Compared with prior art, the beneficial effects of the invention are as follows：
The present invention has rational design, using Mechanical Driven, automatic packaging is carried out to chip automatically, to effectively be protected to chip
Shield, and cost can be effectively reduced using plastic packaging, and plastic packaging speed is fast, difficulty of processing is low.
Detailed description of the invention
Fig. 1 is cutting machine body construction schematic diagram of the present invention；
Fig. 2 is plastic package mechanism structural schematic diagram of the present invention；
Fig. 3 is plastic package die installation pedestal structural schematic diagram of the present invention；
Fig. 4 is mold schematic diagram under plastic packaging of the present invention；
Fig. 5 is plastic packaging upper mold schematic diagram of the present invention.
In figure：1, Plastic packaging apparatus ontology；2, plastic package mechanism upper plate；3, motor；4, fixedly connected part；5, bearing is connected；
6, fixed plate；7, drive shaft connector；8, transmission mechanism fixed plate；9, drive shaft；10, plastic package mechanism；11, plastic package mechanism upper cover
Plate；12, plastic package mechanism pedestal；13, plastic package die installation pedestal；14, vertical columns；15, mold under plastic packaging；16, plastic packaging upper mold
Tool；17, it is drivingly connected column；18, plastic packaging head mounting base；19, plastic packaging head；20, plastic package die top cover；21, motor；22, mold is solid
Determine bolt；23, plastic packaging slot；24, plastic packaging attachment mounting plates；25, mold mounting groove；26, parting bead；27, vertical columns mounting groove；
28, it is drivingly connected column mounting groove；29, plastic packaging slot side fixed block；30, plastic packaging pawl.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1, Fig. 2, Fig. 3, Fig. 4 or Fig. 5 are please referred to, the present invention provides a kind of technical solution：A kind of plastic package die, including modeling
The bottom of seal apparatus ontology 1, plastic package mechanism 10, Plastic packaging apparatus ontology 1 is equipped with plastic package mechanism pedestal 12, plastic package mechanism pedestal 12
Top is equipped with plastic package mechanism 10, and the bottom of plastic package mechanism 10 is equipped with plastic package die installation pedestal 13, plastic package die installation pedestal 13
It is equipped with mold mounting groove 25, parting bead 26 is equipped between mold mounting groove 25, uses parting bead between adjacent mold mounting groove 25
26 are fixed, and plastic package die is enable to fix, and are equipped with vertical columns at four angles in plastic package die installation pedestal 13 and pacify
Tankage 27, the both ends top of plastic package die installation pedestal 13 are equipped with vertical columns 14, and the top of vertical columns 14 is equipped under plastic packaging
Mold 15, the top of mold 15 is equipped with plastic packaging upper mold 16 under plastic packaging, and the top of plastic package mechanism 10 is equipped with plastic package die top cover 20,
The top of plastic package mechanism 10 is equipped with plastic package mechanism upper cover plate 11, the left side between plastic package mechanism upper cover plate 11 and plastic package mechanism pedestal 12
Side is equipped with connection jack-post, and the right side of plastic package mechanism upper cover plate 11 is equipped with fixed block, is equipped with connector, plastic package mechanism between fixed block
The top of upper cover plate 11 is equipped with transmission mechanism fixed plate 8, and the top of transmission mechanism fixed plate 8 is equipped with fixed plate, Plastic packaging apparatus sheet
The top of body 1 is equipped with plastic package mechanism upper plate 2, and the lower section of plastic package mechanism upper plate 2 is equipped with mechanism's installing plate, bottom in plastic package mechanism
The lower section of plate 2 is equipped with connection bearing 5, and connection bearing 5 passes through mechanism's installing plate and connect with fixed plate 6, and the right side of connection bearing 5 is set
There is motor mounting rack, motor mounting rack is equipped with motor 21, and the lower section of motor 21 is equipped with drive shaft connector 7, drive shaft
The lower end of connector 7 is equipped with drive shaft 9, and the left end of mechanism's installing plate is equipped with fixedly connected part, and fixedly connected part passes through connection spiral shell
The connection of the left end of bolt and mechanism's installing plate.
Centre under plastic packaging between mold 15 and plastic packaging upper mold 16, which is equipped with, is drivingly connected column 17, is drivingly connected the two of column 17
Side is symmetrically arranged with plastic packaging slot 23, and the top of plastic packaging upper mold 15 is equipped with plastic packaging attachment mounting plates 24, plastic packaging attachment mounting plates 24
Centre, which is equipped with, is drivingly connected column mounting hole, and the top of plastic packaging attachment mounting plates 24 is equipped with plastic packaging head mounting base 18, the installation of plastic packaging head
The centre of seat 18, which is equipped with, is drivingly connected column mounting hole, is drivingly connected axis and passes through plastic packaging attachment mounting plates 24 and plastic packaging head mounting base 18
Intermediate drive connection column mounting hole, the top for being drivingly connected column 17 are connect with the bottom center of plastic package die top cover 20, plastic packaging
The lower section both ends of mold top cover 20 are connect by being fixedly connected with column with the top both ends of plastic packaging upper mold 16, under plastic packaging mold 15 with
The both ends of plastic packaging upper mold 16 are equipped with mold fixing bolt, by mold fixing bolt by mold 15 under plastic packaging and plastic packaging upper mold
16 are tightly secured in together, avoid offset deviation occur during plastic packaging.
It is drivingly connected column two sides of mounting hole in plastic packaging head mounting base 18 and is equipped with plastic packaging head 19, the bottom end of plastic packaging head 19 and plastic packaging
Chip connection inside slot 23, the inside of plastic packaging slot 23 are equipped with the chip for needing plastic packaging, and the two sides of the bottom of plastic packaging head 19 are symmetrically set
There is auxiliary plastic packaging head, assists plastic packaging head not only can carry out plastic packaging to chip during plastic packaging, while can also be by chip
It is fixed, avoids chip appearance position when plastic packaging from moving, the bottom end of plastic packaging slot 23 is equipped with supporting pad.
One row of centre of plastic packaging upper mold 16 is equipped with plastic packaging pawl 30, and plastic packaging pawl 30 is by the company on the conducting wire and chip on chip
Contact angle carries out playing gold thread use, is equipped with circular hole in the centre of plastic packaging pawl 30, the two sides of plastic packaging pawl 30 are equipped with plastic packaging slot 23, plastic packaging
The both ends middle position of upper mold 16 is equipped with fixing bolt, and the two sides of fixing bolt are symmetrically arranged with connecting hole.
The centre of mold 15 is equipped with a row and is drivingly connected column mounting groove 28 under plastic packaging, is drivingly connected the two sides of column mounting groove 28
It is symmetrically arranged with plastic packaging slot 23, the both ends of mold 15 are symmetrically arranged with plastic packaging slot side fixed block 29 under plastic packaging, and plastic packaging slot side is fixed
Plastic packaging slot side fixed block 29 is fixed on the both ends of mold 15 under plastic packaging, plastic packaging slot side fixed block by fixing bolt by block 29
29 are equipped with connected circular hole.
When carrying out plastic packaging using Plastic packaging apparatus ontology 1, it will need to carry out the chip of plastic packaging first, put to plastic packaging lower die
In plastic packaging slot 23 in tool 15, mold 15 is fixed in plastic package die installation pedestal 13 under plastic packaging, and being drivingly connected column will mould
It seals up mold 16 to be fastened with mold 15 under plastic packaging, the auxiliary plastic packaging head of 19 two sides of plastic packaging head 19 and plastic packaging head consolidates chip
Fixed column, by the connection welding on chip and between feeler, routing connects plastic packaging pawl 30, after routing to the upper surface of chip into
Row plastic packaging, after the completion of molding powder, plastic packaging upper mold 16 moves up under the driving for being drivingly connected column 17, opens plastic packaging upper mold
16, the good chip of plastic packaging is removed.
The present invention has rational design, using Mechanical Driven, carries out automatic packaging to chip automatically, to carry out to chip effective
Protection, and cost can be effectively reduced using plastic packaging, and plastic packaging speed is fast, difficulty of processing is low.
A kind of plastic package die, plastic package method include the following steps：
A, the chip that will need to carry out plastic packaging first, in the plastic packaging slot 23 under putting to plastic packaging in mold 15；
B, mold 15 is fixed in plastic package die installation pedestal 13 under plastic packaging, is drivingly connected column for plastic packaging upper mold 16 and modeling
Lower mold 15 is sealed to be fastened；
C, the auxiliary plastic packaging head of 19 two sides of plastic packaging head 19 and plastic packaging head is by chip fixed column, and plastic packaging pawl 30 is by the connection on chip
Routing connects between solder joint and feeler, carries out plastic packaging to the upper surface of chip after routing；
D, after the completion of molding powder, plastic packaging upper mold 16 moves up under the driving for being drivingly connected column 17, opens plastic packaging upper mold 16,
The good chip of plastic packaging is removed.
The beneficial effects of the invention are as follows：
The present invention has rational design, using Mechanical Driven, automatic packaging is carried out to chip automatically, to effectively be protected to chip
Shield, and cost can be effectively reduced using plastic packaging, and plastic packaging speed is fast, difficulty of processing is low.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (8)
1. a kind of plastic package die, including Plastic packaging apparatus ontology（1）, plastic package mechanism（10）, it is characterised in that：The Plastic packaging apparatus sheet
Body（1）Bottom be equipped with plastic package mechanism pedestal（12）, the plastic package mechanism pedestal（12）Top be equipped with plastic package mechanism（10）, modeling
Sealing mechanism（10）Bottom be equipped with plastic package die installation pedestal（13）, the plastic package die installation pedestal（13）Both ends above set
There are vertical columns（14）, the vertical columns（14）Top be equipped with plastic packaging under mold（15）, mold under the plastic packaging（15）'s
Top is equipped with plastic packaging upper mold（16）, the plastic package mechanism（10）Top be equipped with plastic package die top cover（20）, the plastic packaging machine
Structure（10）Top be equipped with plastic package mechanism upper cover plate（11）, plastic package mechanism upper cover plate（11）With plastic package mechanism pedestal（12）Between
Left side is equipped with connection jack-post, the plastic package mechanism upper cover plate（11）Right side be equipped with fixed block, connector is equipped between fixed block,
The plastic package mechanism upper cover plate（11）Top be equipped with transmission mechanism fixed plate（8）, the transmission mechanism fixed plate（8）Top
Equipped with fixed plate, the Plastic packaging apparatus ontology（1）Top be equipped with plastic package mechanism upper plate（2）, plastic package mechanism upper plate（2）'s
Lower section is equipped with mechanism's installing plate, the plastic package mechanism upper plate（2）Lower section be equipped with connection bearing（5）, connect bearing（5）It passes through
Mechanism's installing plate and fixed plate（6）Connection, the connection bearing（5）Right side be equipped with motor mounting rack, motor mounting rack
It is equipped with motor（21）, the motor（21）Lower section be equipped with drive shaft connector（7）, the drive shaft connector（7）Under
End is equipped with drive shaft（9）, equipped with fixedly connected part, fixedly connected part is pacified by connection bolt and mechanism for the left end of mechanism's installing plate
The left end of loading board connects.
2. a kind of plastic package die according to claim 1, it is characterised in that：Mold under the plastic packaging（15）With plastic packaging upper mold
Tool（16）Between centre be equipped be drivingly connected column（17）, it is drivingly connected column（17）Two sides be symmetrically arranged with plastic packaging slot（23）, institute
State plastic packaging upper mold（15）Top be equipped with plastic packaging attachment mounting plates（24）, plastic packaging attachment mounting plates（24）Centre be equipped with driving
Connecting column mounting hole, the plastic packaging attachment mounting plates（24）Top be equipped with plastic packaging head mounting base（18）, plastic packaging head mounting base
（18）Centre be equipped be drivingly connected column mounting hole, be drivingly connected axis pass through plastic packaging attachment mounting plates（24）With plastic packaging head mounting base
（18）Intermediate drive connection column mounting hole, the drive connection column（17）Top and plastic package die top cover（20）Lower section in
Centre connection, the plastic package die top cover（20）Lower section both ends by being fixedly connected with column and plastic packaging upper mold（16）Top both ends
Connection.
3. a kind of plastic package die according to claim 1, it is characterised in that：Mold under the plastic packaging（15）With plastic packaging upper mold
Tool（16）Both ends be equipped with mold fixing bolt.
4. a kind of plastic package die according to claim 1, it is characterised in that：The plastic packaging head mounting base（18）Upper driving connects
Column two sides of mounting hole is connect equipped with plastic packaging head（19）, the plastic packaging head（19）Bottom end and plastic packaging slot（23）Internal chip connection,
Plastic packaging slot（23）Inside be equipped with and need the chip of plastic packaging, the plastic packaging head（19）Two sides of the bottom be symmetrically arranged with auxiliary plastic packaging
Head, the plastic packaging slot（23）Bottom end be equipped with supporting pad.
5. a kind of plastic package die according to claim 1, it is characterised in that：The plastic packaging upper mold（16）One row of centre
Equipped with plastic packaging pawl（30）, plastic packaging pawl（30）Centre be equipped with circular hole, the plastic packaging pawl（30）Two sides be equipped with plastic packaging slot（23）, institute
State plastic packaging upper mold（16）Both ends middle position be equipped with fixing bolt, the two sides of fixing bolt are symmetrically arranged with connecting hole.
6. a kind of plastic package die according to claim 1, it is characterised in that：Mold under the plastic packaging（15）Centre be equipped with
One row is drivingly connected column mounting groove（28）, the drive connection column mounting groove（28）Two sides be symmetrically arranged with plastic packaging slot（23）, institute
State mold under plastic packaging（15）Both ends be symmetrically arranged with plastic packaging slot side fixed block（29）, plastic packaging slot side fixed block（29）By solid
Bolt is determined by plastic packaging slot side fixed block（29）It is fixed on mold under plastic packaging（15）Both ends, plastic packaging slot side fixed block
（29）It is equipped with connected circular hole.
7. a kind of plastic package die according to claim 1, it is characterised in that：The plastic package die installation pedestal（13）On set
There is mold mounting groove（25）, parting bead is equipped between the mold mounting groove（26）, the plastic package die installation pedestal（13）It is close
Vertical columns mounting groove is equipped at four angles（27）.
8. realizing a kind of plastic package die described in claim 1, plastic package method includes the following steps：
A, the chip that will need to carry out plastic packaging first, mold under putting to plastic packaging（15）Interior plastic packaging slot（23）In；
B, mold under plastic packaging（15）It is fixed on plastic package die installation pedestal（13）On, column is drivingly connected by plastic packaging upper mold
（16）With mold under plastic packaging（15）It is fastened；
C, plastic packaging head（19）And plastic packaging head（19）The auxiliary plastic packaging head of two sides is by chip fixed column, plastic packaging pawl（30）It will be on chip
Connection welding and feeler between routing connect, plastic packaging is carried out to the upper surface of chip after routing；
D, after the completion of molding powder, plastic packaging upper mold（16）It is being drivingly connected column（17）Driving under move up, open plastic packaging upper mold
Tool（16）, the good chip of plastic packaging is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810623055.6A CN108878301A (en) | 2018-06-15 | 2018-06-15 | A kind of plastic package die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810623055.6A CN108878301A (en) | 2018-06-15 | 2018-06-15 | A kind of plastic package die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108878301A true CN108878301A (en) | 2018-11-23 |
Family
ID=64339379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810623055.6A Pending CN108878301A (en) | 2018-06-15 | 2018-06-15 | A kind of plastic package die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108878301A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109834910A (en) * | 2019-04-02 | 2019-06-04 | 嘉兴喜格丽服装有限公司 | A kind of injection molding packaging equipment |
| CN110696275A (en) * | 2019-10-31 | 2020-01-17 | 奇点新源国际技术开发(北京)有限公司 | Plastic package method for cable node |
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| CN108058335A (en) * | 2017-12-28 | 2018-05-22 | 大连泰半导体设备有限公司 | A kind of flat transistor semiconductor multiple spot material feeding form encapsulating mould of middle power |
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|---|---|---|---|---|
| CN106273170A (en) * | 2016-08-23 | 2017-01-04 | 太仓市威士达电子有限公司 | A kind of mould structure of integrated circuit plastic packaging shell |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109834910A (en) * | 2019-04-02 | 2019-06-04 | 嘉兴喜格丽服装有限公司 | A kind of injection molding packaging equipment |
| CN109834910B (en) * | 2019-04-02 | 2020-12-08 | 江西瑞溢新材料科技有限公司 | Injection molding packaging equipment |
| CN110696275A (en) * | 2019-10-31 | 2020-01-17 | 奇点新源国际技术开发(北京)有限公司 | Plastic package method for cable node |
| CN110696275B (en) * | 2019-10-31 | 2022-06-21 | 奇点新源国际技术开发(北京)有限公司 | Plastic package method for cable node |
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Application publication date: 20181123 |