CN203983327U - The material-strap structure of light-emitting diode - Google Patents

The material-strap structure of light-emitting diode Download PDF

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Publication number
CN203983327U
CN203983327U CN201420284370.8U CN201420284370U CN203983327U CN 203983327 U CN203983327 U CN 203983327U CN 201420284370 U CN201420284370 U CN 201420284370U CN 203983327 U CN203983327 U CN 203983327U
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CN
China
Prior art keywords
lead frame
emitting diode
light
injection molding
connecting pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420284370.8U
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Chinese (zh)
Inventor
曾绍诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
I-CHIUN PRECISION ELECTRIC INDUSTRY (CHINA) Co Ltd
Original Assignee
I-CHIUN PRECISION ELECTRIC INDUSTRY (CHINA) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN201420284370.8U priority Critical patent/CN203983327U/en
Application granted granted Critical
Publication of CN203983327U publication Critical patent/CN203983327U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of light-emitting diode material-strap structure, comprises material strip body, multiple lead frame and injection molding material body.Material strip body is provided with multiple hollow slots.The corresponding above-mentioned hollow slots setting respectively of each lead frame, and the first conductive connecting pin and the second conductive connecting pin that there is insulating base and extend from insulating base both sides.Injection molding material body connects the another both sides of each lead frame, and part mulch band body.Have whereby the plane of disruption of cutting shape smooth, dimensional accuracy is more stable, and then makes light-emitting diode technique Yield lmproved.

Description

The material-strap structure of light-emitting diode
Technical field
The utility model relates to a kind of material-strap structure, espespecially a kind of light-emitting diode material-strap structure.
Background technology
The lead frame of light-emitting diode (LED Lead Frame) is now to utilize metal material belt to fix and with one-body molded the making of mode of ejection formation mostly.This material strip is mostly copper alloy (Copper Alloy) material, by impact style, makes multiple lead frames that matrix is arranged that are on material strip.The ejection formation of lead frame is to take out LED rubber base after the liquid thermoplastic plastics of melting (PCT, the own diformazan alcohol ester of poly terephthalic acid) are filled in corresponding mould.LED rubber base supplies carrying LED chip, and is electrically conducted with wire support.
Because rubber base the latter half of metal material belt and LED lead frame links together completely, cut off or dial rubber base the latter half and metal material belt junction, the corner of rubber base the latter half be can be damaged to and burr or breakage produced.Moreover, in the time entering into vibrating disc packaging after these rubber base blankings, easily because the burr vibrations of rubber base periphery come off, and then be stained with on the packaging plastic or other position that bonds to other LED rubber base.
The problems referred to above probably affect each rubber base at the flaw that transmits electric current or signal and improve quality, and seriously can affect and penetrate the luminous mass of finished product and reduce and produce yield, therefore must give manual amendment, are not inconsistent economic benefit again.
Utility model content
One of the utility model object, is to provide that to have the plane of disruption of cutting shape smooth, and dimensional accuracy is more stable, and then makes the light-emitting diode material-strap structure of light-emitting diode technique Yield lmproved.
In order to reach above-mentioned purpose, the utility model provides a kind of light-emitting diode material-strap structure, comprises material strip body, multiple lead frame and injection molding material body.Material strip body is provided with multiple hollow slots.The corresponding above-mentioned hollow slots setting respectively of each lead frame, and the first conductive connecting pin and the second conductive connecting pin that there is insulating base and extend from insulating base both sides.Injection molding material body connects the another both sides of each lead frame, and part mulch band body.
Wherein, this first conductive connecting pin and this second conductive connecting pin respectively with each this hollow slots relative set, this injection molding material body more exposes this first conductive connecting pin and this second conductive connecting pin.
Wherein, this material strip body is more formed with multiple location holes, and each this location hole is positioned at each these lead frame both sides, and this injection molding material body separately has multiple fixed parts, and respectively this fixed part is combined with each this location hole, makes this lead frame firmly be connected in this material strip body.
Wherein, more comprise multiple location holes, be formed on this material strip body, wherein this lead frame of adjacent each comprises shared this location hole, this injection molding material body separately has multiple fixed parts, and respectively this fixed part is combined with each this location hole, makes this lead frame firmly be connected in this material strip body.
Wherein, this location hole or this fixed part shape comprise T shape, trapezoidal or arc.
Wherein, each this lead frame is not connected with this material strip body.
Wherein, this injection molding material body more comprises a cut-out point, be formed at each this insulating base side, and this cut-out point shape comprises rectangle, triangle or arc.
Wherein, this injection molding material body material comprises high heat-resisting thermoplastics, thermoset plastics or silica gel, that is, this injection molding material body is thermoplastic plastic injecting material body, thermoset plastics injection molding material body or silica gel injection molding material body.
Wherein, each this lead frame is more formed with a glue cup, and each this glue cup has functional areas and an echo area, and this echo area is for being arranged at obliquely this functional areas periphery.
Wherein, this first conductive connecting pin and this second conductive connecting pin are respectively to extending and separately have one first brace sections and one second brace sections in this lead frame, and this first brace sections and this second brace sections are isolated with an insulating segment.
The utility model also has following effect:
The first, each lead frame of the utility model is to be connected with injection molding material body with (metal) material-strap structure, and it is low that this injection molding material body is compared metal material hardness.Decline owing to connecting material hardness, it is laborsaving that material stripping becomes, the also decline thereupon of problem that therefore insulating base breakage, burr occurs or weighs wounded.
The second, in another embodiment of the utility model, each adjacent lead frame is shared same location hole, so as to the distance between each lead frame on shortening strip band structure, make lead frame on material-strap structure, arrange more intensively, and then the production quantity of raising lead frame, have the effect of saving process costs concurrently simultaneously.
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail, but not as to restriction of the present utility model.
Brief description of the drawings
Fig. 1 is the part top view that illustrates the utility model the first embodiment.
Fig. 2 is the A part enlarged diagram that illustrates Fig. 1.
Fig. 3 is the B-B generalized section that illustrates Fig. 2.
Fig. 4 is for illustrating another cut-out point generalized section of the utility model.
Fig. 5 is for illustrating another location hole generalized section of the utility model.
Fig. 6 is the part top view that illustrates the utility model the second embodiment.
Fig. 7 is the generalized section that illustrates Fig. 6.
Wherein, Reference numeral:
100 material-strap structures
110 material strip bodies
120 hollow slots
130 location holes
200 lead frames
210 first conductive connecting pins
212 first brace sections
216 insulating segments
220 second conductive connecting pins
222 second brace sections
230 insulating bases
240 functional areas
242 echo areas
250 glue cups
300 injection molding material bodies
310 cut-out points
320 fixed parts
Embodiment
Relevant detailed description of the present utility model and technology contents, coordinate graphic being described as follows, but appended graphic reference and the explanation use of only providing is not used for the utility model to be limited.
As shown in Figures 1 and 3, the utility model the first embodiment provides a kind of light-emitting diode material-strap structure 100, comprises material strip body 110, multiple lead frame 200 and injection molding material body 300.In the present embodiment, material strip body 110 is provided with multiple hollow slots 120.The corresponding above-mentioned hollow slots 120 of the better difference of each lead frame 200 arranges, and also can be described as and is erected between hollow slots 120.As shown in Figure 2, each lead frame 200 separately have insulating base 230 and from insulating base 230 both sides extend the first conductive connecting pin 210 and the second conductive connecting pin 220, wherein the first conductive connecting pin 210 and the second conductive connecting pin 220 respectively with each hollow slots 120 1 edge relative set.In other words, each lead frame 200 is not connected with material strip body 110 in fact.
Should be noted that at this, the material strip body 110 that the utility model is metal material is preferably after the techniques such as prior punching press and plating, then coordinates suitable jetting mold (not shown) to carry out the technique of injection molding material body 300 to Jet forming machine.After injection molding material body 300 coagulation formings, then cut out and there is as shown in Figure 1 the lead frame 200 that multiple hollow slots 120 and multiple arrangement form through Sheet Metal Forming Technology.
As shown in Figure 2, material strip body 110 is more formed with multiple location holes 130.Above-mentioned location hole 130 is preferably in the time that hollow slots 120 cuts shaping, and location hole 130 also punching press simultaneously completes.Each location hole 130 is positioned at each lead frame 200 both sides, and 300 of injection molding material bodies have multiple fixed parts 320.Each fixed part 320 is to impose respectively injection molding material body 300 to fill up rear combination with each location hole 130, and lead frame 200 is firmly connected on material strip body 110.As shown in Figure 3, the above-mentioned location hole better T of the comprising shape of 130 shape (being inverted T shape), and fixed part 320 also forms this shape equally.But in embodiment as shown in Figure 5, that location hole 130 or fixed part 320 shapes also can comprise is trapezoidal, arc (not shown) or other suitable shape.
Each lead frame 200 of the utility model is preferably with injection molding material body 300 and connects, and coordinates with location hole 130 by further firmly connection of lead frame 200, as shown in Figure 2.Injection molding material body 300 is preferably on the another both sides that are connected to relative the first conductive connecting pin 210 of lead frame 200 and the second conductive connecting pin 220.Injection molding material body 300 further part covers each lead frame 200, and exposes respectively the first conductive connecting pin 210 and the second conductive connecting pin 220.
As shown in Figures 2 and 3, injection molding material body 300 more comprises cut-out point 310, is convenient to after downstream manufacturers bends or cuts take off insulating base 230.This cut-out point 310 is better to be formed between each insulating base 230 side.In the time carrying out blanking processing (blanking), utilize cutter or mould that the cut-out point 310 that is formed at insulating base 230 both sides is broken.That is to say, design cut-out point 310 will more be conducive to take off insulating base 230, and be difficult for producing burr.
As shown in Figure 3, the better rectangle that comprises of cut-out point 310 shapes.But in embodiment as shown in Figure 4, cut-out point 310 also can comprise triangle, arc (not shown) or other applicable shape.
In the time that each insulating base 230 takes off from cut-out point 310 (being formed between each lead frame 200 and material strip body 110), because injection molding material body 300 hardness are lower, blanking material stripping becomes laborsaving.Comparatively speaking, each insulating base 230 to cut plane of disruption shape comparatively smooth, dimensional accuracy is also more stable.Therefore insulating base 230 generation breakages, burr or the situation weighing wounded also reduce, and then make the utility model integrated artistic Yield lmproved.
Comprise high heat-resisting thermoplastics, thermoset plastics, silica gel or other applicable material about injection molding material body 300 materials.Generally speaking injection molding material body 300 heat resisting temperatures need to exceed 250 degree Celsius.In addition, insulating base 230 dependency structures of summary the present embodiment, are more formed with glue cup 250.Each glue cup 250 has functional areas 240 and echo area 242, and wherein echo area 242 is for being arranged at obliquely functional areas 240 peripheries.The first conductive connecting pin 210 and the second conductive connecting pin 220 more respectively interior extension of guide coil holder 200 separately have the first brace sections 212 and the second brace sections 222.The first brace sections 212 and the second brace sections 222 are further isolated with insulating segment 216, that is can impose packaging operation in the first brace sections 212 and the second brace sections 222 in last part technology, do not repeat them here.
As shown in FIG. 6 and 7, be the light-emitting diode material-strap structure of the utility model the second embodiment.It is more tight that the present embodiment and previous embodiment Main Differences are that lead frame 200 is arranged on material-strap structure 100, that is location hole 130 designs are different.About each lead frame 200 dependency structures, assembly and annexation thereof, please refer to as described in the previous embodimently, do not repeat them here.As shown in FIG. 6 and 7, location hole 130 is preferably punch forming in the lump on material strip body 110 with hollow slots 120, and wherein each adjacent lead frame 200 comprises a shared single location hole 130.
Thus, the distance that each lead frame is 200 more shortens on material-strap structure 100, makes lead frame 200 on material strip body 110, arrange more intensively.Can improve whereby the production quantity of lead frame 200, have the effect of saving process costs simultaneously concurrently.
The packaging operation (not shown) of follow-up light-emitting diode is undertaken by downstream manufacturers, that is carry light-emitting diode via glutinous brilliant (die bond), be electrically connected respectively after light-emitting diode and lead electrode by wiring, be the transparent sealing resin of glue cup 250 recess filling bags containing fluorophor, then seal.
Certainly; the utility model also can have other various embodiments; in the situation that not deviating from the utility model spirit and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the utility model claim.

Claims (10)

1. a light-emitting diode material-strap structure, is characterized in that, comprising:
One material strip body, is provided with multiple hollow slots;
Multiple lead frames, respectively to should hollow slots setting, one first conductive connecting pin and one second conductive connecting pin that each this lead frame has an insulating base and extends from these insulating base both sides; And
One injection molding material body, connects each another both sides of this lead frame, and part covers this material strip body.
2. light-emitting diode material-strap structure according to claim 1, is characterized in that, this first conductive connecting pin and this second conductive connecting pin respectively with each this hollow slots relative set, this injection molding material body more exposes this first conductive connecting pin and this second conductive connecting pin.
3. light-emitting diode material-strap structure according to claim 1, it is characterized in that, this material strip body is more formed with multiple location holes, each this location hole is positioned at each these lead frame both sides, this injection molding material body separately has multiple fixed parts, respectively this fixed part is combined with each this location hole, makes this lead frame firmly be connected in this material strip body.
4. light-emitting diode material-strap structure according to claim 1, it is characterized in that, more comprise multiple location holes, be formed on this material strip body, wherein this lead frame of adjacent each comprises shared this location hole, this injection molding material body separately has multiple fixed parts, and respectively this fixed part is combined with each this location hole, makes this lead frame firmly be connected in this material strip body.
5. according to the light-emitting diode material-strap structure described in claim 3 or 4, it is characterized in that, this location hole or this fixed part shape comprise T shape, trapezoidal or arc.
6. light-emitting diode material-strap structure according to claim 1, is characterized in that, each this lead frame is not connected with this material strip body.
7. light-emitting diode material-strap structure according to claim 1, is characterized in that, this injection molding material body more comprises a cut-out point, be formed at each this insulating base side, and this cut-out point shape comprises rectangle, triangle or arc.
8. light-emitting diode material-strap structure according to claim 1, is characterized in that, this injection molding material body is thermoplastic plastic injecting material body, thermoset plastics injection molding material body or silica gel injection molding material body.
9. light-emitting diode material-strap structure according to claim 1, is characterized in that, each this lead frame is more formed with a glue cup, and each this glue cup has functional areas and an echo area, and this echo area is for being arranged at obliquely this functional areas periphery.
10. light-emitting diode material-strap structure according to claim 1, it is characterized in that, this first conductive connecting pin and this second conductive connecting pin are respectively to extending and separately have one first brace sections and one second brace sections in this lead frame, and this first brace sections and this second brace sections are isolated with an insulating segment.
CN201420284370.8U 2014-05-30 2014-05-30 The material-strap structure of light-emitting diode Expired - Fee Related CN203983327U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420284370.8U CN203983327U (en) 2014-05-30 2014-05-30 The material-strap structure of light-emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420284370.8U CN203983327U (en) 2014-05-30 2014-05-30 The material-strap structure of light-emitting diode

Publications (1)

Publication Number Publication Date
CN203983327U true CN203983327U (en) 2014-12-03

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Application Number Title Priority Date Filing Date
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111509109A (en) * 2020-04-27 2020-08-07 山东傲天环保科技有限公司 L ED packaging equipment and using method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111509109A (en) * 2020-04-27 2020-08-07 山东傲天环保科技有限公司 L ED packaging equipment and using method thereof
CN111509109B (en) * 2020-04-27 2021-03-12 江西省兆驰光电有限公司 LED packaging equipment and use method thereof

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141203

Termination date: 20170530