CN106273170A - A kind of mould structure of integrated circuit plastic packaging shell - Google Patents

A kind of mould structure of integrated circuit plastic packaging shell Download PDF

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Publication number
CN106273170A
CN106273170A CN201610703250.0A CN201610703250A CN106273170A CN 106273170 A CN106273170 A CN 106273170A CN 201610703250 A CN201610703250 A CN 201610703250A CN 106273170 A CN106273170 A CN 106273170A
Authority
CN
China
Prior art keywords
face
upper bolster
die
fixedly mounted
bracer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610703250.0A
Other languages
Chinese (zh)
Inventor
何振威
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taicang Winstart Electronics Co Ltd
Original Assignee
Taicang Winstart Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taicang Winstart Electronics Co Ltd filed Critical Taicang Winstart Electronics Co Ltd
Priority to CN201610703250.0A priority Critical patent/CN106273170A/en
Publication of CN106273170A publication Critical patent/CN106273170A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B29C2043/182—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated completely
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B29C2043/503—Removing moulded articles using ejector pins, rods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

nullThe invention discloses the mould structure of a kind of integrated circuit plastic packaging shell，It is characterized in that: described pressing plate is fixedly mounted on the end face of upper bolster，Punch is fixedly mounted on the bottom surface of upper bolster，Adapter sleeve is fixedly mounted in the centre bore of upper bolster，Kicker ram is fixedly mounted in the installing hole of adapter sleeve，Prop up bracer to be arranged on the end face of die shoe，Die template is arranged on the end face of a bracer by screw，Guide pillar is fixedly mounted on the end face of a bracer，Guide pin bushing is inlayed in the installing hole being arranged on die template，Guide pillar top is arranged in the cylindrical hole of upper bolster，Upper bolster is arranged on the end face of die template，Plastic shell goods are positioned in the gap of die template die cavity and punch formation，Push rod afterbody is arranged in the cylindrical hole of die template，Push rod head is arranged on installing plate，Ejector rod base is arranged on the bottom surface of installing plate by bolt.Present configuration is simple, low cost, be adapted for slimming and mass automatic production.

Description

A kind of mould structure of integrated circuit plastic packaging shell
Technical field
The invention belongs to integrated antenna package technical field, be specifically related to the mould knot of a kind of integrated circuit plastic packaging shell Structure.
Background technology
Electronic Packaging belongs to the Technology of electronic product back segment, is in order to a set of organizational structure of IC chip, It is made to play the specific function of chip.Can be divided into according to the difference of package main body material, semi-conductor discrete device and integrated circuit The encapsulation of Metal Packaging, ceramic package, ceramic metal and Plastic Package.Statistics shows, Plastic Package (abbreviation plastic packaging) accounts for generation More than the 95% of integrated antenna package market, boundary, for the main flow of various encapsulation.Domestic existing a considerable amount of plastic packaged integrated circuits It is applied to national defence.The difference of parameter according to plastic packaged integrated circuit, credit rating etc., the difference of its price is very big, Buying often runs into illegal businessman and for economic benefit renovation or changes target plastic packaged integrated circuit.
Summary of the invention
The technical problem to be solved is to provide a kind of integrated circuit plastic packaging for above-mentioned the deficiencies in the prior art The mould structure of shell, its structural manufacturing process is simple, low cost, be adapted for slimming and mass automatic production.
For realizing above-mentioned technical purpose, the technical scheme that the present invention takes is:
The mould structure of a kind of integrated circuit plastic packaging shell, including upper bolster, die template, push rod, ejector rod base, spiral shell Nail, installing plate, die shoe, a bracer, plastic shell goods, guide pin bushing, guide pillar, punch, kicker ram, adapter sleeve and pressing plate, institute The pressing plate stated is fixedly mounted on the end face of upper bolster, and described punch is fixedly mounted on the bottom surface of upper bolster, described company Female connector is fixedly mounted in the centre bore of upper bolster, and described kicker ram is fixedly mounted in the installing hole of adapter sleeve, described Bracer be arranged on the end face of die shoe, described die template is arranged on by screw on the end face propping up bracer, described Guide pillar be fixedly mounted on the end face of bracer, described guide pin bushing is inlayed in the installing hole being arranged on die template, described Guide pillar top is arranged in the cylindrical hole of upper bolster, and described upper bolster is arranged on the end face of die template, described plastic packaging Casing products is positioned in the gap of die template die cavity and punch formation, and described push rod afterbody is arranged on the cylinder of die template Kong Li, described push rod head is arranged on installing plate, and described ejector rod base is arranged on the bottom surface of installing plate by bolt.
For optimizing technique scheme, the concrete measure taked also includes:
The above-mentioned rectangular configuration that plastic shell article shape is uncovered.
An above-mentioned bracer is sector structure, and die shoe end face has been distributed uniformly and circumferentially four bracers.
The external cylindrical surface of above-mentioned adapter sleeve is provided with annular boss.
Cope match-plate pattern drives punch, kicker ram, adapter sleeve and pressing plate to move downwardly together, by guide pillar, the guiding of guide pin bushing Effect, is pressed into die template accurately by punch, keeps certain time, treats that punch and die template form in gap melted former Material molding cooling, cope match-plate pattern drives punch, kicker ram, adapter sleeve and pressing plate to move upwardly together, again by guide pillar, guide pin bushing Guide effect, punch separates with die template, and ejector rod base drives installing plate and push rod head to move upwardly together, push rod tail Portion will be left in die template plastic shell goods and ejects.
Present configuration is simple, low cost, be adapted for slimming and mass automatic production, can be used for various integrated The machine-shaping of circuit plastic shell.
Accompanying drawing explanation
Fig. 1 is the topology view of the present invention.
Reference therein is: upper bolster 1, die template 2, push rod 3, ejector rod base 4, screw 5, installing plate 6, lower mold Seat 7, bracer 8, plastic shell goods 9, guide pin bushing 10, guide pillar 11, punch 12, kicker ram 13, adapter sleeve 14, pressing plate 15.
Detailed description of the invention
Below in conjunction with the accompanying drawings the detailed description of the invention of the present invention is further illustrated:
A kind of mould structure of integrated circuit plastic packaging shell, wherein: include upper bolster 1, die template 2, push rod 3, push rod Base 4, screw 5, installing plate 6, die shoe 7, bracer 8, plastic shell goods 9, guide pin bushing 10, guide pillar 11, punch 12, reinforcing post Plug 13, adapter sleeve 14 and pressing plate 15, described pressing plate 15 is fixedly mounted on the end face of upper bolster 1, and described punch 12 is fixed Being arranged on the bottom surface of upper bolster 1, described adapter sleeve 14 is fixedly mounted in the centre bore of upper bolster 1, described reinforcing post Plug 13 is fixedly mounted in the installing hole of adapter sleeve 14, and a described bracer 8 is arranged on the end face of die shoe 7, and described is recessed Mould plate 2 is arranged on the end face of a bracer 8 by screw 5, and described guide pillar 11 is fixedly mounted on the end face of a bracer 8, Described guide pin bushing 10 is inlayed in the installing hole being arranged on die template 2, and described guide pillar 11 top is arranged on the cylinder of upper bolster 1 Kong Li, described upper bolster 1 is arranged on the end face of die template 2, and described plastic shell goods 9 are positioned at die template 2 type In the gap that chamber and punch 12 are formed, described push rod 3 afterbody is arranged in the cylindrical hole of die template 2, described push rod 3 Portion is arranged on installing plate 6, and described ejector rod base 4 is arranged on the bottom surface of installing plate 6 by bolt.
In embodiment, plastic shell goods 9 are shaped as the rectangular configuration of uncovered.
In embodiment, a bracer 8 is sector structure, and die shoe 7 end face has been distributed uniformly and circumferentially four supports Block 8.
In embodiment, the external cylindrical surface of adapter sleeve 14 is provided with annular boss.
Punch and the size of die template, shape can be set according to the practical situation of plastic shell, the quantity of push rod Change also dependent on situation with position.
Below being only the preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-described embodiment, All technical schemes belonged under thinking of the present invention belong to protection scope of the present invention.It should be pointed out that, for the art For those of ordinary skill, some improvements and modifications without departing from the principles of the present invention, should be regarded as the protection of the present invention Scope.

Claims (4)

1. the mould structure of an integrated circuit plastic packaging shell, it is characterised in that: include upper bolster (1), die template (2), top Bar (3), ejector rod base (4), screw (5), installing plate (6), die shoe (7), bracer (8), plastic shell goods (9), guide pin bushing (10), guide pillar (11), punch (12), kicker ram (13), adapter sleeve (14) and pressing plate (15), the fixing peace of described pressing plate (15) Being contained on the end face of upper bolster (1), described punch (12) is fixedly mounted on the bottom surface of upper bolster (1), described adapter sleeve (14) being fixedly mounted in the centre bore of upper bolster (1), described kicker ram (13) is fixedly mounted on the peace of adapter sleeve (14) In dress hole, a described bracer (8) is arranged on the end face of die shoe (7), and described die template (2) is pacified by screw (5) Being contained on the end face of a bracer (8), described guide pillar (11) is fixedly mounted on the end face of a bracer (8), described guide pin bushing (10) inlaying in the installing hole being arranged on die template (2), described guide pillar (11) top is arranged on the cylindrical hole of upper bolster (1) In, described upper bolster (1) is arranged on the end face of die template (2), and described plastic shell goods (9) are positioned at die template (2), in the gap that die cavity and punch (12) are formed, described push rod (3) afterbody is arranged in the cylindrical hole of die template (2), institute Push rod (3) head stated is arranged on installing plate (6), and described ejector rod base (4) is arranged on the end of installing plate (6) by bolt On face.
The mould structure of a kind of integrated circuit plastic packaging shell the most according to claim 1, it is characterised in that: described plastic packaging Casing products (9) is shaped as the rectangular configuration of uncovered.
The mould structure of a kind of integrated circuit plastic packaging shell the most according to claim 1, it is characterised in that: described support Block (8) is sector structure, and die shoe (7) end face has been distributed uniformly and circumferentially four bracers (8).
The mould structure of a kind of integrated circuit plastic packaging shell the most according to claim 1, it is characterised in that: described connection The external cylindrical surface of set (14) is provided with annular boss.
CN201610703250.0A 2016-08-23 2016-08-23 A kind of mould structure of integrated circuit plastic packaging shell Pending CN106273170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610703250.0A CN106273170A (en) 2016-08-23 2016-08-23 A kind of mould structure of integrated circuit plastic packaging shell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610703250.0A CN106273170A (en) 2016-08-23 2016-08-23 A kind of mould structure of integrated circuit plastic packaging shell

Publications (1)

Publication Number Publication Date
CN106273170A true CN106273170A (en) 2017-01-04

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610703250.0A Pending CN106273170A (en) 2016-08-23 2016-08-23 A kind of mould structure of integrated circuit plastic packaging shell

Country Status (1)

Country Link
CN (1) CN106273170A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108878301A (en) * 2018-06-15 2018-11-23 南通尚明精密模具有限公司 A kind of plastic package die

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201105458Y (en) * 2007-10-23 2008-08-27 上海理工大学 Special die carrier for punching flexible printed circuit board
CN102380931A (en) * 2011-12-06 2012-03-21 爱普科斯科技（无锡）有限公司 Mould for injection packaging process
CN102738020A (en) * 2012-06-26 2012-10-17 铜陵三佳山田科技有限公司 Integrated circuit plastic packaging mold for preventing horizontal overflowed material at cored hole
CN202633243U (en) * 2012-02-09 2012-12-26 大连泰一精密模具有限公司 Packaging die for precise minisize face-down bonding chip integrated circuit
CN203792581U (en) * 2014-04-29 2014-08-27 成都中科精密模具有限公司 Novel plastic package mold with micro matrix lead frame attached to surface
CN104139109A (en) * 2014-07-23 2014-11-12 成都市龙泉驿区齐盛机械厂 Necking die of lampshade
CN204320981U (en) * 2014-12-16 2015-05-13 郭逸锋 A kind of ultrashort type punching die structure
CN206106198U (en) * 2016-08-23 2017-04-19 太仓市威士达电子有限公司 Mould structure of integrated circuit plastic envelope shell

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201105458Y (en) * 2007-10-23 2008-08-27 上海理工大学 Special die carrier for punching flexible printed circuit board
CN102380931A (en) * 2011-12-06 2012-03-21 爱普科斯科技（无锡）有限公司 Mould for injection packaging process
CN202633243U (en) * 2012-02-09 2012-12-26 大连泰一精密模具有限公司 Packaging die for precise minisize face-down bonding chip integrated circuit
CN102738020A (en) * 2012-06-26 2012-10-17 铜陵三佳山田科技有限公司 Integrated circuit plastic packaging mold for preventing horizontal overflowed material at cored hole
CN203792581U (en) * 2014-04-29 2014-08-27 成都中科精密模具有限公司 Novel plastic package mold with micro matrix lead frame attached to surface
CN104139109A (en) * 2014-07-23 2014-11-12 成都市龙泉驿区齐盛机械厂 Necking die of lampshade
CN204320981U (en) * 2014-12-16 2015-05-13 郭逸锋 A kind of ultrashort type punching die structure
CN206106198U (en) * 2016-08-23 2017-04-19 太仓市威士达电子有限公司 Mould structure of integrated circuit plastic envelope shell

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108878301A (en) * 2018-06-15 2018-11-23 南通尚明精密模具有限公司 A kind of plastic package die

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
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Application publication date: 20170104