CN220753308U

CN220753308U - Proximity switch for food processor

Info

Publication number: CN220753308U
Application number: CN202321506116.3U
Authority: CN
Inventors: 杨金水
Original assignee: Individual
Current assignee: Zhongshan Ruijie Electronics Co ltd
Priority date: 2023-06-13
Filing date: 2023-06-13
Publication date: 2024-04-09
Anticipated expiration: 2033-06-13

Abstract

According to the proximity switch for the food processor, the Hall element arranged on the circuit board is used as the magnetic force sensing element of the proximity switch, pin secondary trimming is not needed for the Hall element, so that the stability of the performance of the Hall element is ensured, the Hall element has higher precision and sensitivity, and the magnetic field detection and sensing aspects are more advanced and efficient than a reed switch, so that the sensing distance of the proximity switch is ensured; and in the assembly process, the circuit board provided with the Hall element is assembled in the positioning cavity in a positioning way through the positioning structure so as to determine the position of the Hall element in the positioning cavity and determine the induction position of the proximity switch, thereby accurately determining the induction distance of the proximity switch, ensuring that the food processor can work normally and improving the user experience.

Description

Proximity switch for food processor

Technical Field

The utility model relates to the technical field of circuit switches, in particular to a proximity switch for a food processor.

Background

Patent CN201922133786.5 discloses a reed switch magnetic proximity switch, which comprises a positioning seat with an opening at the top, a packaging shell arranged in the opening of the positioning seat and extending along the length direction of the positioning seat, a reed pipe arranged in the packaging shell, and connecting lugs symmetrically arranged at two sides of the positioning seat, wherein leads are respectively arranged on pins at two ends of the reed pipe; the packaging shell is integrally formed with the positioning seat, a plurality of clamping plates for fixing the packaging shell are further arranged in the opening, a positioning groove and positioning notches are formed in the two ends of the positioning groove at the bottom of the positioning seat, and the reed switch is packaged in the packaging shell through sealing resin.

According to the technical scheme, most of magnetic proximity switches in the prior art adopt reed pipes as magnetic induction elements and are packaged in a packaging shell;

however, in order to achieve a perfect combination of it and the package housing of the proximity switch, the length or pitch of the reed switch pins needs to be tailored to the appropriate dimensions to meet the size and shape requirements of the package housing;

however, the length and spacing of the reed switch pins are important factors that directly affect the switch sensitivity and sensing distance, and therefore trimming of the pins may affect the performance of the switch;

if the length of the pin is too short, the magnetic field strength is weakened, and the distance between the magnetic field strength and the induction distance is affected, in this case, the induction distance of the reed pipe is correspondingly reduced, even if a metal object close to the reed pipe cannot be induced, the induction range of the conventional reed pipe is approximately 5mm to 15mm, the distance between the proximity switch in the food processor and the metal object on the cover body is approximately 14-16mm, if the pin is trimmed, the magnetic field strength of the reed pipe is weakened (the induction range is reduced to approximately 12 mm), the proximity switch cannot induce the metal object, the proximity switch rapidly loses the sensitivity, and even the food processor cannot work normally;

conversely, if the length of the pin is too long, the induction distance is increased, but the possibility of misjudgment is increased, so that when the cover body is not assembled on the food processor, the proximity switch senses a metal object, and the proximity switch is electrified to work, thereby easily causing safety accidents and reducing user experience;

and can make the tongue tube unable assembly to the encapsulation casing in, need prune for the second time, when influencing proximity switch sensitivity, still increased proximity switch manufacturing cost.

The utility model is researched and proposed for overcoming the defects of the prior art.

Disclosure of Invention

Aiming at the technical problems that the reed switch pin needs to be trimmed and the induction distance of the proximity switch cannot be accurately ensured in the proximity switch adopting the reed switch as the magnetic induction element in the prior art.

The technical scheme adopted for solving the technical problems is as follows:

the utility model provides a proximity switch for cooking machine, includes encapsulation casing, be equipped with the location chamber that has the opening in the encapsulation casing, the opening is located the one end of encapsulation casing, be equipped with a magnetic force induction action device in the location chamber, magnetic force induction action device includes the circuit board and locates the hall element on the circuit board, be equipped with location structure in the location chamber, location structure is used for making circuit board location assembly in the location intracavity.

The proximity switch for the food processor is characterized in that the Hall element is connected with the circuit board by adopting a patch package.

The proximity switch for the food processor is characterized in that the length direction of the Hall element is the same as the length direction of the circuit board.

In the proximity switch for the food processor, the width dimension of the Hall element is similar to or equal to the width dimension of the circuit board.

According to the proximity switch for the food processor, a certain interval exists between the top end of the circuit board and the top end of the packaging shell.

The proximity switch for the food processor is characterized in that the positioning structure is an inner side wall of the packaging shell and comprises a first side wall part and a second side wall part which are connected with each other, the positioning cavity is formed by the first side wall part and the second side wall part in a surrounding mode, the second side wall part is used for carrying out directional assembly on the circuit board, and the first side wall part can be matched with the second side wall part to limit the circuit board to circumferentially rotate relative to the packaging shell.

The proximity switch for the food processor is characterized in that the second side wall part comprises a vertical plane side wall propped against one side surface of the circuit board.

The proximity switch for the food processor is characterized in that the first side wall part comprises an arc-shaped side wall, and two ends of the arc-shaped side wall are respectively connected with two ends of the vertical plane side wall.

The proximity switch for the food processor is characterized in that the positioning mark corresponding to the positioning structure is arranged on the outer side wall of the packaging shell, and the positioning mark can guide the direction of the sensing surface on the Hall element.

The proximity switch for the food processor is characterized in that the positioning mark is a mark outer side surface parallel to the sensing surface on the Hall element.

The beneficial effects of the utility model are as follows:

1. according to the proximity switch for the food processor, the Hall element arranged on the circuit board is used as the magnetic force sensing element of the proximity switch, pin secondary trimming is not needed for the Hall element, so that the stability of the performance of the Hall element is ensured, the Hall element has higher precision and sensitivity, and the magnetic field detection and sensing aspects are more advanced and efficient than a reed switch, so that the sensing distance of the proximity switch is ensured; and in the assembly process, the circuit board provided with the Hall element is assembled in the positioning cavity in a positioning way through the positioning structure so as to determine the position of the Hall element in the positioning cavity and determine the induction position of the proximity switch, thereby accurately determining the induction distance of the proximity switch, ensuring that the food processor can work normally and improving the user experience.

2. Specifically, the induction range of the hall switch is approximately 5mm to 20mm, and through integrating the hall switch onto the circuit board, the production cost and the manufacturing difficulty can be greatly reduced, the production efficiency and the quality are improved, the industrial production and the mass manufacturing are convenient, and the induction distance of the proximity switch in the embodiment can be maintained to be more than 15 mm.

3. The Hall element and the circuit board are connected by adopting the patch package, so that the Hall element and the circuit board have the advantages of high operation efficiency, stable process, capability of reducing the size of the proximity switch, improvement of the reliability of the proximity switch and the like; adopt the paster encapsulation, through the production of machine paster, the production efficiency who makes hall element and circuit board improves greatly, and the production efficiency of proximity switch in this embodiment is compared the design that adopts the tongue tube in the past, can be fast more than one time, and hall element is more stable, is difficult fragile.

4. In the production process of this embodiment, can carry out the encapsulating process or the embedment process of moulding plastics in the location intracavity to make magnetic force response action device be fixed in on the encapsulation casing completely, improve proximity switch's waterproof function, avoid cooking in the steam entering encapsulation casing in the cup, influence hall element's normal work.

The utility model will be further described with reference to the drawings and detailed description.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is an exploded view of the present utility model;

FIG. 3 is a schematic top view of the present utility model;

FIG. 4 is a schematic cross-sectional view taken along line A-A of FIG. 3;

FIG. 5 is a schematic view of a package housing according to the present utility model;

fig. 6 is a schematic top view of the package housing of the present utility model.

Detailed Description

Embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1 to 6, the proximity switch for a food processor of the present embodiment includes a package housing 1, a positioning cavity 11 having an opening is provided in the package housing 1, the opening is located at one end of the package housing 1, a magnetic force induction action device is provided in the positioning cavity 11, the magnetic force induction action device includes a circuit board 2 and a hall element 3 provided on the circuit board 2, and a positioning structure 4 is provided in the positioning cavity 11;

specifically, the hall element 3 arranged on the circuit board 2 is used as a magnetic force sensing element of the proximity switch, pin secondary trimming is not needed for the hall element 3, so that the stability of the performance of the hall element 3 is ensured, the hall element 3 has higher precision and sensitivity, and the magnetic field sensing and sensing aspects are more advanced and efficient than a reed switch, so that the sensing distance of the proximity switch is ensured; and in the assembly process, the circuit board 2 provided with the Hall element 3 is positioned and assembled in the positioning cavity 11 through the positioning structure 4 so as to determine the position of the Hall element 3 in the positioning cavity 11 and determine the induction position of the proximity switch, thereby accurately determining the induction distance of the proximity switch, ensuring that the food processor can work normally and improving the user experience.

In particular, the hall switch has the following advantages: compared with a reed pipe, the Hall switch can more accurately detect a magnetic field and react, so that the response speed and accuracy of the proximity switch are effectively improved;

specifically, the induction range of the hall switch is approximately 5mm to 20mm, and through integrating the hall switch onto the circuit board, the production cost and the manufacturing difficulty can be greatly reduced, the production efficiency and the quality are improved, the industrial production and the mass manufacturing are convenient, and the induction distance of the proximity switch in the embodiment can be maintained to be more than 15 mm.

And the Hall switch is less influenced by an external magnetic field, has stronger anti-interference performance compared with a reed pipe, can be better suitable for different working environments and conditions in specific applications, is integrated with other circuits on a circuit board, can furthest reduce mismatch or interference between the circuits, effectively improves the precision and stability of the proximity switch, reduces errors and uncertainties, and realizes conductive detection more stably and reliably.

And (III) the service life of the Hall switch is longer, and the Hall switch has no mechanical moving parts and is more durable and reliable compared with a mechanical switch such as a reed switch.

The Hall switch has smaller volume and weight, the Hall switch circuit is arranged on the circuit board, can be packaged in the smaller circuit board, is beneficial to optimizing the volume and weight of the proximity switch, has more advantages in size and weight due to the fact that the more compact proximity switch structure can be designed by adopting the Hall switch, is particularly suitable for application scenes with limited space and limited weight,

and fifthly, the Hall switch does not need pin trimming, and compared with a reed switch, the Hall switch does not need pin trimming, so that the process difficulty and the production cost in the manufacturing process are reduced.

The Hall switch has better reliability and stability, is not easily influenced by factors such as mechanical impact, vibration, moisture, corrosion and the like, and can ensure the long-term stable operation of the proximity switch.

And the Hall switch is connected to the circuit board through pin connection or SMT mounting and the like, the manufacturing process is simpler and more convenient, the manufacturing cost and the labor cost are reduced, the Hall switch is connected with other circuit components more tightly, stably and reliably, and the Hall switch is not interfered by external factors, so that the probability of faults in the system is reduced.

Preferably, the hall element 3 and the circuit board 2 in the embodiment are connected by adopting a patch package, so that the method has the advantages of high operation efficiency, stable process, capability of reducing the size of the proximity switch and improving the reliability of the proximity switch;

the production efficiency of the Hall element 3 and the circuit board 2 is greatly improved by adopting the chip packaging and the chip mounting production of a machine, and compared with the traditional design adopting a reed switch, the production efficiency of the proximity switch in the embodiment can be more than doubled, and the Hall element 3 is more stable and is not fragile;

and the size of the Hall element 3 is small, so that the resolution of the sensor is effectively improved.

Preferably, in other embodiments, the following different connection methods may be used between the hall element 3 and the circuit board 2:

and (one) plug-in packaging: the pins of the Hall element 3 are required to be inserted into holes on the circuit board, and then the pins of the Hall element 3 are connected with the bonding pads of the circuit board by using manual or welding equipment;

(II) Surface Mount (SMD) packaging: the pins of the Hall element 3 are directly welded on the surface of the circuit board through packaging equipment;

(III) insert welding: the Hall switch is inserted into the slot of the circuit board, and then the Hall switch is connected with the circuit board by welding and the like.

(IV): welding connecting wires: the hall switch is connected to the circuit board by using a wire, and a single-wire, a multi-wire or a flat wire can be selected.

The connection method of the hall element 3 and the wiring board 2 is not limited to the above-described embodiment.

As shown in fig. 1 to 6, the hall element 3 of the present embodiment has the same length direction as the wiring board 2;

preferably, the width dimension of the hall element 3 of the present embodiment is similar to or equal to the width dimension of the wiring board 2; by adopting the design, the width dimension of the circuit board 2 is reduced, and the structure of the proximity switch is further compact.

As shown in fig. 1 to 6, a certain interval exists between the top end of the circuit board 2 and the top end of the package housing 1 in this embodiment, and the following advantages are provided by adopting such a design:

(one) preventing thermal runaway; the Hall switch may generate heat during working, and if the Hall switch is attached to the packaging shell, the temperature is possibly too high, and the working stability and the service life of the Hall switch are affected; and a certain interval exists between the heat dissipation device and the packaging shell, so that the heat dissipation efficiency can be improved, and the thermal runaway can be effectively avoided.

(II) preventing magnetic field interference; the Hall switch is a magnetic sensor, and can be interfered by an external magnetic field to influence the working accuracy and stability of the Hall switch; and the Hall switch is attached to the packaging shell, the magnetic field interference around the Hall switch can be larger, and a certain interval is reserved to reduce the influence of the magnetic field interference.

(III) preventing mechanical damage; the Hall switch is an electronic component, has relatively fragile shape, is easily mechanically damaged when being attached to the packaging shell, and affects the service life and stability of the Hall switch; and a certain interval exists between the Hall switch and the packaging shell, so that the mechanical damage to the Hall switch can be reduced, and the reliability of the Hall switch is improved.

Fourthly, the maintenance is convenient; the design with a certain interval is reserved, so that adhesion between the Hall switch and the packaging shell can be avoided, disassembly and maintenance are convenient, and working time and cost are saved.

As shown in fig. 1 to 6, three bonding pads 21 are disposed on the circuit board 2 in this embodiment, the three bonding pads 21 are respectively connected with three wires, the three wires respectively correspond to the positive electrode, the negative electrode and the output pins of the hall element, preferably, two bonding pads 21 electrically connected with the positive electrode and the negative electrode of the hall element are disposed on one side surface of the circuit board 2, one bonding pad 21 electrically connected with the output pins of the hall element is disposed on the other side of the circuit board 2, and by adopting such a design, the problem that the width dimension of the circuit board 2 is oversized due to the fact that the three bonding pads 21 are disposed on the same side of the circuit board 2 is avoided, so that the structure of the circuit board 2 is more compact.

As shown in fig. 1 to 6, the positioning structure 4 of the present embodiment is an inner sidewall of the package housing 1, and includes a first sidewall portion and a second sidewall portion that are connected to each other, the positioning cavity 11 is formed by the first sidewall portion and the second sidewall portion being enclosed together, the second sidewall portion is used for performing directional assembly on the circuit board 2, and the first sidewall portion can be matched with the second sidewall portion to limit the circuit board 2 from rotating circumferentially relative to the package housing 1;

during assembly, the side wall of the circuit board 2 can be matched with the second side wall part, so that the circuit board 2 is assembled in the positioning cavity 11 in an oriented manner, when the circuit board 2 in the positioning cavity 11 rotates in the circumferential direction, one side of the circuit board 2 abuts against the first side wall part, and the other side abuts against the second side wall part, so that the circuit board 2 is limited to rotate in the circumferential direction relative to the packaging shell 1, the circuit board 2 cannot turn over, and the circuit board 2 is assembled in the positioning cavity 11 in a positioning manner, so that the sensing surface on the Hall element 3 is arranged in the positioning cavity 11 in an oriented manner;

preferably, in the production process of the embodiment, a glue filling process can be performed in the positioning cavity 11, so that the magnetic force induction action device is completely fixed on the packaging shell 1, the waterproof function of the proximity switch is improved, and water vapor in the cooking cup is prevented from entering the packaging shell 1 to influence the normal work of the Hall element 3;

the sizing material in the positioning cavity 11 presses the circuit board 2 to the second side wall part so as to further orient and assemble the circuit board 2 and the second side wall part;

preferably, in other embodiments, the packaging shell 1 provided with the circuit board 2 is placed in a mold of an injection molding machine, and the material injected by the injection molding machine is encapsulated into the positioning cavity 11 through a low-pressure injection molding encapsulation procedure, so that the magnetic force induction action device is completely fixed on the packaging shell 1;

the low-pressure injection molding encapsulation has the following advantages:

the environmental protection performance is excellent: low pressure injection molding potting techniques typically use environmentally friendly materials that can be cured quickly and allow for repeated processing and recycling, particularly in applications where environmental performance is a requirement.

(II) high hardness is adjustable: different types of plastic materials can be used in the low-pressure injection molding encapsulation technology, and different application requirements can be met by adjusting the hardness of the materials; when packaging some relatively sensitive components, a material with low hardness can be selected to better protect the components.

And (III) the precision is high: the low pressure injection molding potting technique can compress the material in the mold during the onset of hardening and fill the material into a smaller, more complex space; the encapsulation technology can improve the integration level and the production efficiency of parts and components, and ensures that the sizes of the parts and components are more stable and consistent.

(IV) cost control: compared with other packaging technologies, the low-pressure injection molding encapsulation technology can reduce the production cost; the packaging device can be used for simultaneously encapsulating various components in the production process, so that the packaging efficiency can be improved, the production cost can be reduced, and the packaging device is more obvious in a large-scale production environment.

Convenience (five): parts produced by the low-pressure injection molding encapsulation technology are small and exquisite, and can be conveniently integrated and installed; meanwhile, the encapsulation technology can increase the stability and safety of parts and is beneficial to maintenance and subsequent repair.

Preferably, the circuit board 2 may be sealed and assembled in the package housing 1 by other injection molding processes, not limited to the low-pressure injection molding and encapsulating process (such as the high-pressure injection molding and encapsulating process or the cold molding and injection molding process).

Specifically, the cold molding injection molding process is to rapidly cool the plastic through a cooling system inside the mold after the material injected by the injection molding machine is encapsulated into the positioning cavity 11, so as to ensure the dimensional accuracy, the surface flatness and the appearance quality of the injection molding finished product, take the finished product out of the mold after the cooling time is over, remove burrs, and perform subsequent processing or provide customers for direct use.

Has the following advantages:

and (one) high precision: during cooling, the shrinkage of the material is small and precise dimensions can be obtained.

(II) short period: because the heating time required by the materials in the production process is shorter, the production period is shorter than that of the traditional injection molding process.

And (III) the cost is lower: compared with the traditional injection molding process, the cold molding injection molding process has lower equipment cost and lower requirements on the processing process, the calculation machinery and the like of the finished product after being matched with a special process.

Preferably, in other embodiments, in the production process, the end part of the packaging shell 1 with the opening can be provided with a sealing cover, and the sealing cover and the packaging shell 1 can be connected in a threaded or clamping way, so that the magnetic force induction actuating device is completely fixed on the packaging shell 1.

As shown in fig. 1 to 6, the second side wall portion of the present embodiment includes a vertical planar side wall 41 that abuts against one side face of the wiring board 2; during assembly, one side surface of the circuit board 2 can be abutted against the vertical plane side wall 41, so that the magnetic force induction action device is directionally assembled into the positioning cavity, and the sizing material can press the circuit board 2 to the vertical plane side wall 41 during material injection, so that the circuit board 2 and the vertical plane side wall 41 are kept in a mutually abutted state, and the orientation of the induction surface of the Hall element 3 on the packaging shell is locked;

specifically, the plane of the sensing surface of the hall element 3 in the present embodiment is parallel to the second side wall portion, and the surface of the circuit board 2 that abuts against the vertical plane side wall 41 is the bottom surface of the circuit board 2.

As shown in fig. 1 to 6, the first side wall portion of the present embodiment includes an arc-shaped side wall 422, both ends of the arc-shaped side wall 422 being connected to both ends of the vertical plane side wall 41, respectively;

thereby enclosing and forming a positioning cavity 11, when the circuit board 2 in the positioning cavity 11 rotates circumferentially during assembly, one side of the circuit board 2 is propped against the arc-shaped side wall 42, the other side of the circuit board 2 is propped against the vertical plane side wall 41 to prevent the circuit board 2 from overturning in the positioning cavity 11, and the circuit board 2 is locked in the positioning cavity 11 through the cooperation of the arc-shaped side wall 42 and the vertical plane side wall 41;

by adopting the design, the circuit board 2 is similar to the arc-shaped side wall 42, a certain space exists between the arc-shaped side wall 42 and the magnetic force induction action device, and when enough insertion space is provided for the magnetic force induction action device, the situation that the magnetic force induction action device collides with the arc-shaped side wall 42 to be damaged is avoided when the magnetic force induction action device is inserted into the positioning cavity;

and provide sufficient notes material space for magnetic force induction action device, can pour into more sizing material into to the location intracavity, and make sizing material can wrap up magnetic force induction action device completely, ensure the steadiness of being connected between magnetic force induction action device and the location chamber, and there is certain distance between arc lateral wall 42 and the magnetic force induction action device, can avoid injecting glue pressure too big and cause the circumstances emergence that magnetic force induction action device damaged in the injecting glue in-process.

As shown in fig. 1 to 6, preferably, the cross-sectional shape of the structure formed by connecting the arc-shaped side wall 42 and the vertical plane side wall 41 of the present embodiment is in a large cut circle shape, that is, the cross-sectional shape of the arc-shaped side wall 42 is in a major arc shape; ensuring that the positioning cavity 11 has a certain volume, and a certain glue injecting space is formed after the magnetic force induction action device is inserted into the positioning cavity 11, ensuring the glue injecting space and facilitating the insertion of the magnetic force induction action device into the positioning cavity 11 for positioning and assembly.

As shown in fig. 1 to 6, the distance dimension at both ends of the vertical plane side wall 41 of the present embodiment is R, where R satisfies: r is similar to the width dimension of the circuit board 2, so that the bottom surface of the circuit board 2 can be propped against the vertical plane side wall 41, and when the circuit board 2 circumferentially rotates in the positioning cavity 11, one side of the circuit board 2 is propped against the joint of the vertical plane side wall 41 and the arc-shaped side wall 42, and the other side of the circuit board 2 is propped against the middle section part of the arc-shaped side wall 42, so that a magnetic force induction action device is locked in the positioning cavity 11, and the limiting mode is reliable.

As shown in fig. 1 to 6, the maximum distance between the arc-shaped side wall 42 and the vertical plane side wall 41 of the present embodiment is D, where D satisfies: d is smaller than the width of the circuit board 2, preferably, the width of the circuit board 2 is similar to R, i.e. D is smaller than R;

by adopting the design, the circuit board 2 can only be inserted into the positioning cavity through the angle of the bottom surface parallel to the vertical plane side wall 41, and cannot be inserted into the positioning cavity through the angle of the bottom surface perpendicular to the vertical plane side wall 41, so that the effect of directional assembly is achieved.

As shown in fig. 1 to 6, the vertical plane side wall 41 of the present embodiment is provided with a material injection groove 43 recessed toward a direction away from the positioning cavity 11, and the material injection groove 43 is used to perform a glue injection process at a position where the bottom surface of the circuit board 2 abuts against the vertical plane side wall 41, so that the glue material is further coated on the magnetic force induction actuating device, and the stability of the assembly of the magnetic force induction actuating device in the positioning cavity 11 is further improved.

As shown in fig. 1 to 6, the maximum distance between the first side wall portion and the filling slot 43 in the present embodiment is T, where T satisfies: t is smaller than the width dimension of the circuit board 2, preferably, the width dimension of the circuit board 2 is similar to R, i.e., T is smaller than R;

by adopting the design, even if a part of the circuit board 2 is erroneously inserted into the injection groove 43, the circuit board cannot be continuously inserted into the positioning cavity 11, so that the positioning and orientation effects of the positioning cavity 11 on the magnetic force induction action device are ensured.

Specifically, one surface of the circuit board 2 provided with the hall element 3 is a top surface of the circuit board, a surface of the circuit board opposite to the top surface is a bottom surface, the bottom surface of the circuit board is propped against the vertical plane side wall 41, the top surface of the circuit board faces the arc-shaped side wall 42, the hall element 3 on the circuit board is similar to the arc-shaped side wall 42, a certain space exists between the arc-shaped side wall 42 and the hall element 3, and when enough insertion space is provided for the circuit board, the situation that the hall element 3 collides with the arc-shaped side wall 42 to be damaged when being inserted into the positioning cavity is avoided;

and provide sufficient notes material space for the circuit board, can pour into more sizing materials into the location intracavity, and make sizing material can cladding circuit board completely, ensure the steadiness of being connected between circuit board and the location chamber.

As shown in fig. 1 to 6, a positioning mark 5 corresponding to the positioning structure 4 is provided on the outer side wall of the package housing 1 in the present embodiment, and the positioning mark 5 can guide the orientation of the sensing surface on the hall element 3;

specifically, the orientation of the sensing surface can be confirmed by the positioning mark 5 corresponding to the second side wall part on the outer side wall of the packaging shell 1, so that the sensing surface of the magnetic proximity switch assembled on the product is opposite to the magnet, the sensing distance between the magnetic proximity switch and the magnet is ensured, the condition of poor sensing of the magnetic proximity switch is avoided, and the normal operation of the magnetic proximity switch is ensured

As shown in fig. 1 to 6, the positioning mark 5 of the present embodiment is a mark outer side surface parallel to the vertical plane side wall 41, and is designed such that the plane of the sensing surface of the hall element 3 is parallel to the mark outer side surface, so that the sensing surface orientation of the hall element 3 can be determined from the outside, when the magnetic proximity switch is assembled on a product, the sensing surface orientation can be determined by the mark outer side surface, and when the sensing surface faces the magnet during assembly, so as to ensure mutual correspondence and sensing distance between the two; or the outer side surface of the mark can be used as a mounting surface to be assembled on a product so as to determine the position and the orientation of the sensing surface on the product, and the device has the advantages of simple structure and convenient operation.

The foregoing examples are provided to further illustrate the technical contents of the present utility model for the convenience of the reader, but are not intended to limit the embodiments of the present utility model thereto, and any technical extension or re-creation according to the present utility model is protected by the present utility model. The protection scope of the utility model is subject to the claims.

Claims

1. A proximity switch for cooking machine, including encapsulation casing (1), its characterized in that: the novel packaging structure is characterized in that a positioning cavity (11) with an opening is arranged in the packaging shell (1), the opening is located at one end of the packaging shell (1), a magnetic force induction action device is arranged in the positioning cavity (11), the magnetic force induction action device comprises a circuit board (2) and a Hall element (3) arranged on the circuit board (2), a positioning structure (4) is arranged in the positioning cavity (11), and the positioning structure (4) is used for enabling the circuit board (2) to be assembled in the positioning cavity (11) in a positioning mode.

2. The proximity switch for a food processor according to claim 1, wherein: the Hall element (3) is connected with the circuit board (2) by adopting a patch package.

3. The proximity switch for a food processor according to claim 1, wherein: the length direction of the Hall element (3) is the same as the length direction of the circuit board (2).

4. A proximity switch for a food processor according to claim 3, wherein: the width dimension of the Hall element (3) is similar to or equal to the width dimension of the circuit board (2).

5. The proximity switch for a food processor according to claim 1, wherein: a certain interval exists between the top end of the circuit board (2) and the top end of the packaging shell (1).

6. The proximity switch for a food processor according to claim 1, wherein: the positioning structure (4) is an inner side wall of the packaging shell (1), and comprises a first side wall part and a second side wall part which are connected with each other, the positioning cavity (11) is formed by the first side wall part and the second side wall part in a surrounding mode, the second side wall part is used for carrying out directional assembly on the circuit board (2), and the first side wall part can be matched with the second side wall part to limit the circuit board (2) to circumferentially rotate relative to the packaging shell (1).

7. The proximity switch for a food processor of claim 6, wherein: the second side wall portion includes a vertical planar side wall (41) that abuts against one side face of the wiring board (2).

8. The proximity switch for a food processor of claim 7, wherein: the first side wall part comprises an arc-shaped side wall (42), and two ends of the arc-shaped side wall (42) are respectively connected with two ends of the vertical plane side wall (41).

9. The proximity switch for a food processor according to claim 1, wherein: the outer side wall of the packaging shell (1) is provided with a positioning mark (5) corresponding to the positioning structure (4), and the positioning mark (5) can guide the orientation of the sensing surface on the Hall element (3).

10. The proximity switch for a food processor of claim 9, wherein: the positioning mark (5) is a mark outer side surface parallel to the sensing surface on the Hall element (3).