CN217504971U

CN217504971U - Sensor module

Info

Publication number: CN217504971U
Application number: CN202221307621.0U
Authority: CN
Inventors: 不公告发明人
Original assignee: Beijing Taifang Technology Co ltd
Current assignee: Beijing Taifang Technology Co ltd
Priority date: 2022-05-25
Filing date: 2022-05-25
Publication date: 2022-09-27
Anticipated expiration: 2032-05-25

Abstract

A sensor module is disclosed herein. The sensor module comprises a shell, a connector and a sensing assembly, wherein the shell is a low-pressure injection molding shell, the sensing assembly and the first end of the connector are embedded and injection molded in the shell, and the connector is electrically connected with the sensing assembly. The sensor module has simple structure, low manufacturing cost and reliable operation.

Description

Sensor module

Technical Field

The application relates to but is not limited to a sensor packaging technology, in particular to a sensor module.

Background

In the prior art, a piezoelectric sensor is mainly used as a sensor for detecting elastic waves, and at present, three packaging methods of the piezoelectric sensor are mainly used: firstly, low-pressure injection molding, namely directly using a low-pressure injection molding material for the piezoelectric sensitive element, adopting a low-pressure injection molding process for injection molding and wrapping, leading out signals through a wiring harness which is injected together, and connecting the other end of the wiring harness with a connector. However, this packaging method is costly, and the external wiring harness and the connector both add to the cost of the entire sensor module. And secondly, high-pressure injection molding, wherein the shell for bearing the piezoelectric sensitive element and the connector are integrally molded through high-pressure injection molding. However, since the connectors have industrial requirements such as drawing force and firmness, the injection-molded materials are all made of materials which have high hardness and meet the industrial standards, such as nylon materials, PBT (polybutylene terephthalate), and the like, and the hardness of the materials has a great influence on the signal transmission of elastic waves, so that the sensitivity of the sensor module in the packaging manner to low-frequency signals is greatly reduced, and the normal use of the sensor module is influenced. And thirdly, the piezoelectric sensing element is exposed for use, generally, the piezoelectric sensing element is welded on a circuit board or the piezoelectric sensing element is directly used, a lead wire welded on the circuit board is led out from the circuit board, and a lead wire directly used by the piezoelectric sensing element is led out from the piezoelectric sensing element. In the packaging mode, the piezoelectric sensing element is directly exposed, is easy to damage and has poor interference resistance.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a sensor module, simple structure, low in manufacturing cost and reliable operation.

The embodiment of the application provides a sensor module, sensor module includes shell, connector and sensing component, the shell is the low pressure casing of moulding plastics, sensing component with the first end of connector is inlayed and is moulded plastics in the shell, just the connector with sensing component electricity is connected.

Furthermore, the connector comprises a high-pressure injection molding shell and a contact pin embedded in the high-pressure injection molding shell, and the contact pin is electrically connected with the sensing assembly.

Furthermore, the sensing assembly comprises a carrier and a sensor installed on the carrier, and one end of the contact pin extends out of the high-pressure injection molding shell and is fixedly welded with the carrier.

Further, the shell includes that casing portion and protruding locate the connecting portion of casing portion one side, sensing component encapsulates in the casing portion, the first end encapsulation of connector is in the connecting portion.

Further, the connecting portion is formed with an opening through which the connector passes;

a limiting convex rib for preventing the first end of the connector from being separated from the opening is formed on the outer side wall surface of the first end of the connector, and a limiting groove matched with the limiting convex rib is formed on the inner wall surface of the connecting part.

Furthermore, the sensing assembly comprises a carrier and a sensor installed on the carrier, a first positioning column is arranged on the end face of the first end of the connector, and a first positioning hole matched with the positioning column in an inserting mode is formed in the carrier.

Further, the first positioning hole is positioned on a first side of the carrier, a second positioning hole is arranged on a second side of the carrier opposite to the first side, and the second positioning hole is arranged to be matched with a positioning piece of the low-pressure injection mold in a positioning mode;

the shell is provided with a avoiding hole for avoiding the positioning piece of the low-pressure injection mold.

Furthermore, a plugging piece is arranged at the position of the avoiding hole.

Furthermore, the shell is provided with a back adhesive, and the back adhesive and the connectors are respectively positioned on two opposite sides of the shell.

Further, the carrier is a circuit board, a metal plate or a non-metal plate, and the sensor is a pressure-sensitive sensor.

Compared with some technologies, the method has the following beneficial effects:

the sensor module that this application embodiment provided, shell low pressure injection moulding and inlay the first end of sensing subassembly and connector and mould plastics in the shell, the low pressure is moulded plastics and can not be influenced the signal transmission of elastic wave, guarantee the sensitivity of sensor module to low frequency signal, and, inlay through the first end with sensing subassembly and connector and mould plastics in the shell, make sensing subassembly and connector form the whole that is inseparable relatively, need not additionally to draw forth the pencil and be used for linking to each other with the connector, packaging cost has been reduced. The sensor module has reliable work, difficult damage and strong anti-interference performance.

Other features and advantages of the present application will be set forth in the description that follows.

Drawings

The accompanying drawings are included to provide a further understanding of the claimed subject matter and are incorporated in and constitute a part of this specification, illustrate embodiments of the subject matter and together with the description serve to explain the principles of the subject matter and not to limit the subject matter.

Fig. 1 is a first schematic structural diagram of a sensor module according to an embodiment of the present disclosure;

fig. 2 is a second schematic structural diagram of a sensor module according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a sensor module according to an embodiment of the present application.

Illustration of the drawings:

1-shell, 11-shell, 111-avoidance hole, 12-connecting part, 2-connector, 21-high-pressure injection molding shell, 211-connecting section, 212-extending section, 213-limiting convex rib, 214-first positioning column, 22-contact pin, 3-sensing component, 31-carrier, 311-first positioning hole, 312-second positioning hole, 32-sensor and 4-back glue.

Detailed Description

To make the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.

Low pressure injection molding is a new injection molding process between potting and high pressure injection molding. The main difference between low-pressure injection molding and high-pressure injection molding is the injection pressure difference. The injection pressure range of the high-pressure injection molding is generally 350-1300Bar, and the injection pressure range of the low-pressure injection molding is generally 1.5-40 Bar. The low-pressure low-temperature injection molding of the low-pressure injection molding is very suitable for packaging electronic components.

The embodiment of the application provides a sensor module, as shown in fig. 1 to 3, the sensor module includes shell 1, connector 2 and sensing component 3, and shell 1 is the casing of moulding plastics of low pressure, and the first end of sensing component 3 and connector 2 is inlayed and is moulded plastics in shell 1, and connector 2 is connected with sensing component 3 electricity.

Casing 1 is the low pressure casing of moulding plastics, inlay the first end of moulding plastics with sensing subassembly 3 and connector 2 in the lump in casing 1 at the in-process of moulding plastics, in other words, sensing subassembly 3 moulds plastics through the low pressure and encapsulates and directly cooperate at the low pressure internal with the first end of connector 2, the sensing subassembly 3 of the encapsulation of moulding plastics of low pressure need not to draw forth the pencil alone again, manufacturing cost has been reduced on the basis of moulding plastics of low pressure, the performance of sensor module has also been guaranteed.

The sensor module that this application embodiment provided, 1 low pressure injection moulding of shell inlays the first end of sensing subassembly 3 and connector 2 and moulds plastics in shell 1, the low pressure is moulded plastics and is not influenced the signal transmission of elastic wave, guarantee the sensitivity of sensor module to low frequency signal, and, inlay the first end through with sensing subassembly 3 and connector 2 and mould plastics in shell 1, make sensing subassembly 3 and connector 2 form the whole that is inseparable relatively, need not additionally to draw forth the pencil and be used for linking to each other with connector 2, the encapsulation cost has been reduced. The sensor module has reliable work, difficult damage and strong anti-interference performance.

In an exemplary embodiment, as shown in fig. 2 and 3, the connector 2 includes an over-molded housing 21 and PINs 22 (also called PIN PINs) insert-molded in the over-molded housing 21, and the PINs 22 are electrically connected to the sensing component 3.

The connector 2 comprises a high-pressure injection molded housing and insert molded pins 22, in other words, encapsulated at the connector 2 by high-pressure injection molding. The sensor module is integrally packaged in a mode of combining low-pressure injection molding and high-pressure injection molding, so that the working reliability of the sensor module is guaranteed, and the packaging cost is reduced.

Wherein, the one end of contact pin 22 is fixed in shell 1 and is connected with sensing component 3 electricity with the first end of connector 2 jointly, and the other end is fixed in connector 2 through high pressure injection moulding, need not additionally to set up the lead wire, has reduced the manufacturing cost of sensor module.

The pins 22 may be L-shaped and may be 2 in number.

In an exemplary embodiment, as shown in fig. 2, the sensing assembly 3 includes a carrier 31 and a sensor 32 mounted on the carrier 31, and one end of the pin 22 extends out of the high pressure injection molded housing 21 and is fixed to the carrier 31 by welding.

The carrier 31 is used for mounting and fixing the sensor 32, and the sensor 32 can also be electrically connected with an external structure through the carrier 31. One end of the contact pin 22 extends into the shell 1 to be welded and fixed with the carrier 31, the fixation is reliable, the circuit conduction is realized while the connection is welded, and the process is simplified.

The sensor 32 may be a piezoelectric sensor.

In an exemplary embodiment, as shown in fig. 2, the housing 1 includes a housing portion 11 and a connecting portion 12 protruding from one side of the housing portion 11, the sensing assembly 3 is enclosed in the housing portion 11, and the first end of the connector 2 is enclosed in the connecting portion 12.

The housing 1 is a low-pressure injection molded integral housing, and in terms of specific structure, the housing 1 may include a housing portion 11 and a connecting portion 12, the housing portion 11 is used for encapsulating the sensing component 3, and the connecting portion 12 is used for encapsulating the first end of the connector 2.

The connecting portion 12 is located on the upper end surface of the housing portion 11 and close to the side surface, so that the connector 2 can be connected to a subsequent structure, and the length of the connector 2 is reduced.

In an exemplary embodiment, as shown in fig. 2, the connecting portion 12 is formed with an opening through which a first end of the connector 2 passes; a limiting convex rib 213 for preventing the first end of the connector 2 from separating from the opening is formed on the outer side wall surface of the first end of the connector 2, and a limiting groove matched with the limiting convex rib 213 is formed on the inner wall surface of the connecting part 12.

The first end of the connector 2 passes through the opening of the connecting portion 12 and is fixed in the connecting portion 12. The outer side wall surface of the connecting part 12 is provided with a limiting convex rib 213, the inner wall surface of the connecting part 12 is provided with a limiting groove, and the limiting convex rib 213 is clamped in the limiting groove to prevent the first end of the connector 2 from being separated from the connecting part 12.

Specifically, the first end of the connector 2 may be of an approximately cylindrical structure, the limiting rib 213 may be an annular rib disposed on the outer circumferential surface of the connector 2, and the annular rib may be axially disposed for a plurality of turns to improve the clamping anti-disengaging effect. The limiting grooves are annular grooves, and the number of the limiting grooves can be correspondingly arranged with the annular convex ribs.

In an exemplary embodiment, as shown in fig. 2, the sensing assembly 3 includes a carrier 31 and a sensor 32 mounted on the carrier 31, a first positioning post 214 is disposed on an end surface of the first end of the connector 2, and the carrier 31 is provided with a first positioning hole 311 for mating with the positioning post.

The first positioning column 214 on the connector 2 is inserted into the first positioning hole 311 on the carrier 31, so that the sensing component 3 and the connector 2 are fixed in position, a good positioning effect is achieved, and the subsequent contact pin 22 is conveniently welded on the carrier 31. Further, the first positioning posts 214 are inserted into the first positioning holes 311, which also improves the fixing reliability of the sensor unit 3.

In a specific operation, the first end of the connector 2 may be enclosed in the connecting portion 12 of the housing 1, and the first positioning post 214 extends into the housing portion 11 of the housing 1, so that the first positioning post 214 on the end surface of the first end of the connector 2 is inserted into the first positioning hole 311 of the carrier 31.

The first end of the connector 2 comprises a connecting section 211 and an extending section 212, wherein the extending section 212 is arranged at the tail end of the connecting section 211 and is perpendicular to the length direction of the connecting section 211; the extension 212 is fitted into the housing 1 to be connected with the sensing assembly 3. The limit rib 213 may be provided on the connection section 211, and the first positioning post 214 may be provided on an end surface of the extension section 212.

In an exemplary embodiment, as shown in fig. 2, the first positioning hole 311 is located on a first side of the carrier 31, a second side of the carrier 31 opposite to the first side is provided with a second positioning hole 312, and the second positioning hole 312 is configured to be positioned and matched with a positioning component of a low-pressure injection mold; the housing 1 is formed with a relief hole 111 for relieving a positioning member of the low pressure injection mold. And a plugging piece is arranged at the avoidance hole 111.

The second positioning hole 312 is matched with a positioning member of the low pressure injection mold for positioning so as to fix the sensing assembly 3. A relief hole 111 for relieving the retainer is formed in the housing 1.

The avoiding hole 111 may be located on the housing 11.

In practical applications, the positioning element is inserted into the second positioning hole 312 of the carrier 31 to fix and position the sensing assembly 3. Then, the housing 1 is formed by pressing and injection molding, the sensing component 3 and the first end of the connector 2 are encapsulated in the housing 1, and an avoiding hole 111 for avoiding the positioning piece is formed in the housing 1.

The formed shell 1 is provided with a avoiding hole 111, and a plugging piece can be arranged at the avoiding hole 111 to improve the sealing performance of the sensor module and ensure the working reliability of the sensor module. Of course, the blocking piece is not required to be arranged here, and the sensor module can be used normally.

In an exemplary embodiment, as shown in fig. 1 to 3, the housing 1 is provided with a back adhesive 4, and the back adhesive 4 and the connector 2 are respectively located at opposite sides of the housing 1.

The back adhesive 4 is used as a connecting piece for fixing the shell 1 at a required position by means of adhesion, such as: and is adhered and fixed on the bumper of the vehicle.

In an exemplary embodiment, the carrier 31 is a circuit board, metal plate or non-metal plate and the sensor 32 is a pressure sensitive sensor 32.

The carrier 31 is a circuit board, which may be a printed circuit board PCB, for example. The sensor 32 may be soldered to a PCB to form a printed circuit board assembly PCBA.

Of course, the carrier 31 may not be provided with a circuit, for example, the carrier 31 may be a common metal plate or a non-metal plate, such as: glass plates, plastic plates, wood plates, or plates of other materials.

In actual production, the specific packaging process may be:

the pins 22 are first produced and then insert molded into the connector 2 to form the high pressure injection molded connector 2. The sensor 32 is soldered to the carrier 31 to constitute the sensing component 3(PCBA assembly). The pins 22 are soldered to the sensing assembly 3. And (3) performing low-pressure injection molding on the sensing assembly 3 and the first end of the connector 2 to form an integral sensor module.

The sensor module that this application embodiment provided has overcome the shortcoming of the various encapsulation mode of current elastic wave sensor module, has creatively provided the mode that high-low pressure was moulded plastics and has combined, and at the in-process that the low pressure was moulded plastics, the connector 2 first end parcel that moulds plastics with the high pressure forms a whole, and is complete in structure, need not to draw forth the pencil again. The wire harness and the rear-end complete connector 2 are reduced, and the cost of the whole module is greatly reduced; the connector 2 part formed by high-pressure injection molding ensures the reliability of the connector 2, so that the connector can meet the industrial standard; the sensor 32 is injected into the main body part at low pressure, so that the integrity of an elastic wave signal is ensured; the mode of injection molding and packaging plays a good role in protecting the piezoelectric sensitive element.

The sensor module that this application embodiment provided can reach insulating, temperature resistant, shock resistance, shock attenuation, dampproofing, waterproof, dustproof, efficiency such as corrosion-resistant.

In the description of the present application, it should be noted that the directions or positional relationships indicated by "upper", "one end", "one side", and the like are based on the directions or positional relationships shown in the drawings, and are only for convenience of describing the present application and simplifying the description, and do not indicate or imply that the structures referred to have a specific direction, are configured and operated in a specific direction, and thus, cannot be construed as limiting the present application.

In the description of the embodiments of the present application, unless otherwise expressly specified or limited, the terms "connected" and "mounted" are to be construed broadly, e.g., the terms "connected" and "connected" may be either fixedly or detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The embodiments described herein are exemplary rather than limiting and it will be apparent to those of ordinary skill in the art that many more embodiments and implementations are possible within the scope of the embodiments described herein. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are possible. Any feature or element of any embodiment may be used in combination with or instead of any other feature or element in any other embodiment, unless expressly limited otherwise.

The present application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements that have been disclosed in this application may also be combined with any conventional features or elements to form unique aspects as defined by the claims. Any feature or element of any embodiment may also be combined with features or elements from other aspects to form another unique aspect as defined by the claims. Thus, it should be understood that any of the features shown and/or discussed in this application may be implemented alone or in any suitable combination. Accordingly, the embodiments are not limited except as by the appended claims and their equivalents. Further, various modifications and changes may be made within the scope of the appended claims.

Claims

1. The utility model provides a sensor module, its characterized in that includes shell, connector and sensing component, the shell is the low pressure casing of moulding plastics, sensing component with the first end of connector is inlayed and is moulded plastics in the shell, just the connector with sensing component electricity is connected.

2. The sensor module of claim 1, wherein the connector comprises a high-pressure injection molded housing and a pin insert molded on the high-pressure injection molded housing, and the pin is electrically connected with the sensing component.

3. The sensor module as claimed in claim 2, wherein the sensing assembly comprises a carrier and a sensor mounted on the carrier, and one end of the pin extends out of the high pressure injection molding housing and is welded and fixed with the carrier.

4. The sensor module of claim 1, wherein the housing includes a housing portion and a connecting portion protruding from one side of the housing portion, the sensing assembly is encapsulated in the housing portion, and the first end of the connector is encapsulated in the connecting portion.

5. The sensor module according to claim 4, wherein the connecting portion is formed with an opening through which the connector passes;

the outer side wall surface of the first end of the connector is provided with a limiting convex rib for preventing the first end of the connector from being separated from the opening, and the inner wall surface of the connecting part is provided with a limiting groove matched with the limiting convex rib.

6. The sensor module as claimed in claim 1, wherein the sensor assembly includes a carrier and a sensor mounted on the carrier, a first positioning post is disposed on an end surface of the first end of the connector, and the carrier has a first positioning hole engaged with the positioning post.

7. The sensor module of claim 6, wherein the first positioning hole is located on a first side of the carrier, and a second positioning hole is located on a second side of the carrier opposite to the first side, the second positioning hole being configured to be in positioning engagement with a positioning element of a low pressure injection mold;

and a avoiding hole for avoiding the positioning piece of the low-pressure injection mold is formed in the shell.

8. The sensor module of claim 7, wherein a closure member is provided at the exit aperture.

9. The sensor module of any one of claims 1 to 8, wherein a back adhesive is provided on the housing, and the back adhesive and the connector are respectively located on opposite sides of the housing.

10. The sensor module according to any one of claims 3, 6-8, wherein the carrier is a circuit board, a metal plate or a non-metal plate, and the sensor is a pressure sensitive sensor.