CN213041400U - High-sensitivity ceramic substrate type temperature sensor - Google Patents
High-sensitivity ceramic substrate type temperature sensor Download PDFInfo
- Publication number
- CN213041400U CN213041400U CN202021565465.9U CN202021565465U CN213041400U CN 213041400 U CN213041400 U CN 213041400U CN 202021565465 U CN202021565465 U CN 202021565465U CN 213041400 U CN213041400 U CN 213041400U
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- chip
- plastic shell
- temperature sensor
- sensitivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to a sensor field indicates a high sensitivity ceramic substrate type temperature sensor especially. Including ceramic substrate, chip protective housing, wire rod, plastic shell, the ceramic substrate surface is equipped with printed circuit and base plate scribing, the chip welding is on ceramic substrate's printed circuit to with base plate scribing electric connection, the chip protective housing covers the chip surface to with ceramic substrate surface mounting, the wire rod respectively with base plate scribing welded fastening, ceramic substrate and plastic shell joint to one side that is equipped with the chip is inside towards the plastic shell, fill epoxy between ceramic substrate and the plastic shell. The high-sensitivity ceramic substrate type temperature sensor is small in size, high in sensitivity, fast in response time, good in moisture resistance, free of influence on adhesive force caused by the change of the size of the plastic shell, convenient for various different mounting structures and high in production efficiency.
Description
Technical Field
The utility model relates to a sensor field indicates a high sensitivity ceramic substrate type temperature sensor especially.
Background
A temperature sensor is a sensor that senses temperature and converts it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument and has a plurality of varieties. The measurement method can be divided into a contact type and a non-contact type, and the measurement method can be divided into a thermal resistor and a thermocouple according to the characteristics of sensor materials and electronic elements.
Most are injection type structure behind present temperature sensor ceramic substrate welding SMD, the chip exposes direct injection moulding and need two 85 of dampproofing test simultaneously 1000H, can have following defect:
1) the thickness of the substrate is 0.635mm, so the height of the corresponding substrate fixing column is only 0.6 mm, the substrate fixing column cannot be well fixed during injection molding, and the substrate is easy to separate from the support after being assembled with the support, so that the substrate is crushed or a mold is damaged during injection molding;
2) burrs are easy to appear at the periphery of the chip protection bracket, the ceramic substrate and the joint of the wire rods during injection molding; wires at the die assembly position are easy to crush during injection molding;
3) the injection molding piece is made of PP + GF, but the characteristic use temperature of the PP is about 100 ℃, so that the high-temperature operation requirement cannot be met;
4) the mold can be directly contacted with the ceramic substrate during injection molding, the contact degree of the mold can influence whether the ceramic substrate is crushed, the requirement is difficult to control, and the injection molding is performed once in the expected time of more than 1 minute;
5) the plastic material has poor dimensional stability under the condition of long-term high temperature, and gaps exist between the plastic and other materials after high and low temperature impact; resulting in deterioration of moisture resistance.
Disclosure of Invention
In order to solve the above problem, the utility model provides a high sensitivity ceramic substrate type temperature sensor, the structural space utilizes than higher, the outward appearance is better, and the welding is the single face welding.
In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a high sensitivity ceramic substrate board type temperature sensor, includes ceramic substrate, chip protective housing, wire rod, plastic shell, the ceramic substrate surface is equipped with printed circuit and base plate scribing, the chip welding is on ceramic substrate's printed circuit to with base plate scribing electric connection, the chip protective housing covers the chip surface to with ceramic substrate surface stationary, the wire rod respectively with base plate scribing welded fastening, ceramic substrate and plastic shell joint to one side that is equipped with the chip is inside towards the plastic shell, fill epoxy between ceramic substrate and the plastic shell.
Further, the surface of the plastic shell is provided with a groove, the lower side of the plastic shell is provided with a wire hole, the wire penetrates through the wire hole, the epoxy resin is filled in the groove, and the chip is connected with the plastic shell in a curing mode through the epoxy resin.
The wire rod is arranged in the groove, and epoxy resin is filled in the groove.
The groove is further provided with a sunken position for accommodating the chip protection shell, the groove is further provided with a protruding portion, and the protruding portion is internally provided with a mounting hole.
Further, the chip protective shell is connected with the ceramic substrate through the silicon-fluorine rubber in a curing mode.
The beneficial effects of the utility model reside in that: the high-sensitivity ceramic substrate type temperature sensor has the advantages of small volume, high sensitivity, quick response time, good moisture resistance, no influence of the epoxy resin on the adhesive force due to the change of the size of the plastic shell, and convenience for various different mounting structures; the epoxy resin is filled between the plastic shell and the ceramic substrate, and the epoxy resin has good fluidity, is not influenced by the change of the size of the plastic shell, has the characteristics of high adhesive force, high temperature resistance, strong insulating and pressure-resistant capabilities and the like, and can well fill the gap between the plastic shell and the ceramic substrate; in addition, the epoxy resin has good moisture resistance, the adhesive force is not influenced by the change of the size of the plastic shell, and the production efficiency is high.
Drawings
Fig. 1 is a state diagram before epoxy resin is filled in the packaging of the present embodiment.
Fig. 2 is a state diagram after the epoxy resin is filled in the packaging of the present embodiment.
Fig. 3 is a schematic diagram of the packaged structure of the present embodiment.
Fig. 4 is a schematic structural view of the bonding of the ceramic substrate and the chip in the present embodiment.
Fig. 5 is a perspective view of the plastic case of the present embodiment.
Fig. 6 is another perspective view of the plastic case of the present embodiment.
The reference numbers illustrate: 1. a ceramic substrate; 11. scribing the substrate; 2. a chip; 3. a chip protection shell; 4. a wire rod; 5. a plastic shell; 51. a groove; 511. a clamping part; 512. a recessed position; 52. wire holes; 53. a slot position; mounting holes; 6. and (3) epoxy resin.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings. The present application may be embodied in many different forms and is not limited to the embodiments described in the present embodiment. The following detailed description is provided to facilitate a more thorough understanding of the present disclosure, and the words used to indicate orientation, top, bottom, left, right, etc. are used solely to describe the illustrated structure in connection with the accompanying figures.
Please refer to fig. 1-6, the utility model discloses a high sensitivity ceramic substrate board type temperature sensor, including ceramic substrate 1, chip 2, be used for dampproofing chip protection shell 3, wire rod 4, plastic shell 5, 1 surface of ceramic substrate is equipped with printed circuit and base plate scribing 11, chip 2 welds on ceramic substrate 1's printed circuit to 11 electric connection with the base plate scribing, chip protection shell 3 covers chip 2 surface to through silicon fluororubber and 1 fixed surface of ceramic substrate, wire rod 4 respectively with 11 welded fastening of base plate scribing, ceramic substrate 1 and plastic shell 5 joint to one side that is equipped with chip 2 is inside towards plastic shell 5, fill epoxy 6 between ceramic substrate 1 and the plastic shell 5.
In this embodiment, the surface of plastic shell 5 is equipped with recess 51, and the downside is equipped with wire rod hole 52, wire rod 4 runs through wire rod hole 52, epoxy 6 fills in recess 51, chip 2 is connected with plastic shell 5 solidification through epoxy 6. Wherein, recess 51 upper end still is equipped with the joint portion 511 corresponding with ceramic substrate 1 shape, ceramic substrate 1 and joint portion 511 joint, 5 downside of plastic casing still are equipped with the trench 53 that the degree of depth is less than recess 51, wire rod 4 is located trench 53 to trench 53 fills epoxy 6. In addition, a concave position 512 for accommodating the chip protection shell 3 is further arranged in the groove 51, and a convex part is further arranged on the slot 53, and a mounting hole 54 is formed in the convex part.
The space utilization ratio of the temperature sensor is higher, the appearance is better, the chip needs the SMT technology, the welding is single-side welding, the size is small, the sensitivity is high, the response time is fast, the moisture resistance is good, the epoxy resin 6 is not affected by the change of the size of the plastic shell 5, and the temperature sensor is convenient for various different installation structures.
The welding process of the SMD temperature sensor chip and the substrate in the embodiment is as follows:
1) firstly, a circuit printing ceramic substrate 1 is adopted, wherein the model specification of the ceramic substrate 1 is 127 × 0.635 mm;
2) welding the chip 2 by using an automatic chip mounter;
3) the chip 2 is protected by the point silicon fluorine rubber and is fixed on the chip protection shell 3, wherein the tin plating range is a rectangle with the range of 1.0 x 3.0mm, namely the bonding pad range is 0.08-0.15 mm.
Referring to fig. 1-3, the product is encapsulated by using epoxy resin encapsulation process according to the present embodiment, which includes the following steps:
1) the wire 4 passes through two holes of the plastic shell 5, and then the wire is bent at a position close to the ceramic substrate 1;
2) filling the prepared epoxy resin 6 in the groove 51 of the plastic shell 5;
3) after the epoxy resin 6 is dispensed, the ceramic substrate 1 is assembled to the position of the clamping part 511 of the groove 51;
4) the slot 53 and the gap of the plastic shell 5 are supplemented with epoxy resin 6.
After the technical scheme is adopted, the plastic shell 5 and the ceramic substrate 1 are filled with the epoxy resin, and the epoxy resin 6 has good fluidity, so that the high performances of adhesive force, high temperature resistance, strong insulating and pressure-resistant capability and the like are not influenced by the change of the size of the plastic shell 5, and the gap between the plastic shell 5 and the ceramic substrate 1 can be well filled; epoxy 6 is dampproofing good, and does not receive the change of 5 sizes of plastic shell and influence adhesive force, and production efficiency is high, can accomplish a point and glue through testing 10 seconds.
It is further understood that the terms "connected," "secured," "mounted," "disposed," and the like are to be construed broadly and their meanings in the context of the present application will be understood by those skilled in the art as appropriate and not by limitation, unless otherwise explicitly stated or limited.
The above embodiments are only for describing the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and improvements made by the technical solution of the present invention by those skilled in the art are all within the scope of the present invention as defined by the claims.
Claims (6)
1. A high-sensitivity ceramic substrate type temperature sensor characterized in that: including ceramic substrate, chip protective housing, wire rod, plastic shell, the ceramic substrate surface is equipped with printed circuit and base plate scribing, the chip welding is on ceramic substrate's printed circuit to with base plate scribing electric connection, the chip protective housing covers the chip surface to with ceramic substrate surface mounting, the wire rod respectively with base plate scribing welded fastening, ceramic substrate and plastic shell joint to one side that is equipped with the chip is inside towards the plastic shell, fill epoxy between ceramic substrate and the plastic shell.
2. The high-sensitivity ceramic substrate type temperature sensor according to claim 1, wherein: the surface of the plastic shell is provided with a groove, the lower side of the plastic shell is provided with a wire hole, the wire penetrates through the wire hole, the epoxy resin is filled in the groove, and the chip is connected with the plastic shell in a curing mode through the epoxy resin.
3. The high-sensitivity ceramic substrate type temperature sensor according to claim 2, wherein: the recess upper end still is equipped with the joint portion corresponding with ceramic substrate shape, ceramic substrate and joint portion joint, the plastic casing downside still is equipped with the trench that the degree of depth is less than the recess, the wire rod is located the trench to epoxy is filled to the trench.
4. A high-sensitivity ceramic substrate type temperature sensor according to claim 3, characterized in that: and a sunken position for accommodating the chip protective shell is further arranged in the groove.
5. A high-sensitivity ceramic substrate type temperature sensor according to claim 3, characterized in that: still be equipped with the bulge on the trench, be equipped with the mounting hole in the bulge.
6. The high-sensitivity ceramic substrate type temperature sensor according to claim 1, wherein: the chip protective shell is connected with the ceramic substrate through the silicon-fluorine rubber in a curing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021565465.9U CN213041400U (en) | 2020-07-31 | 2020-07-31 | High-sensitivity ceramic substrate type temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021565465.9U CN213041400U (en) | 2020-07-31 | 2020-07-31 | High-sensitivity ceramic substrate type temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213041400U true CN213041400U (en) | 2021-04-23 |
Family
ID=75529171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021565465.9U Active CN213041400U (en) | 2020-07-31 | 2020-07-31 | High-sensitivity ceramic substrate type temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213041400U (en) |
-
2020
- 2020-07-31 CN CN202021565465.9U patent/CN213041400U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5894108A (en) | Plastic package with exposed die | |
| US7408244B2 (en) | Semiconductor package and stack arrangement thereof | |
| CN106044697B (en) | Depression packaging part with composite substrate | |
| CN104517914A (en) | Pressure sensor package with integrated sealing | |
| EP1078559A1 (en) | Encapsulation package and method of packaging an electronic circuit module | |
| CN113053861A (en) | Packaging module, packaging process and electronic equipment | |
| CN213041400U (en) | High-sensitivity ceramic substrate type temperature sensor | |
| US8937380B1 (en) | Die edge protection for pressure sensor packages | |
| JP2003178732A (en) | Battery pack | |
| KR940027140A (en) | Plastic molded circuit package | |
| EP1396886A2 (en) | Semiconductor device having the inner end of connector leads placed onto the surface of semiconductor chip | |
| CN211088270U (en) | Chip packaging structure and optical sensor | |
| JP2011151225A (en) | Humidity sensor package and method of manufacturing the same | |
| CN100388574C (en) | Semiconductor laser | |
| CN213397425U (en) | Temperature sensor for injection molding micro charging column | |
| CN216696397U (en) | Testing device for various chip packaging forms | |
| CN107179099B (en) | Sensor structure and manufacturing method thereof | |
| US20020079438A1 (en) | Image sensor package and substrate thereof | |
| CN209471962U (en) | Integrated circuit package body and its injection molding jig | |
| CN208805832U (en) | A kind of high-reliability electronic label | |
| CN111879444A (en) | Small force sensor and manufacturing method thereof | |
| CN212844032U (en) | High-sensitivity high-pressure-resistant bracket type temperature sensor | |
| CN210400636U (en) | Wireless temperature sensor | |
| JP2555497B2 (en) | Hollow resin-sealed semiconductor pressure sensor | |
| CN211504447U (en) | Modular heat conduction temperature measurement sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |