CN220021057U - Device for improving liquid level flow direction of water tank - Google Patents

Abstract

The utility model discloses a water tank liquid level flow direction improving device which comprises two first spraying assemblies symmetrically arranged at the bottom of a water tank and a second spraying assembly arranged above the water tank, wherein the second spraying heads are fixed above the water tank through a fixed bracket, each spraying assembly comprises a spraying pipe and a plurality of spraying heads which are arranged on the spraying pipe and are uniformly spaced, the spraying pipes of the first spraying assembly and the second spraying assembly are arranged along the axial direction of a wafer, the spraying heads of the two first spraying assemblies are arranged oppositely, and the spraying heads of the second spraying assembly are arranged to spray in the liquid level direction of the water tank so as to blow surface center liquid of the water tank to the edge of the surface of the water tank. The device forms liquid circulation flow in the water tank by arranging a plurality of spraying components to cooperate, and sprays the polluted liquid floating on the surface of the liquid to the edge of the water tank, so that the secondary pollution of the wafer is prevented.

Description

Device for improving liquid level flow direction of water tank

Technical Field

The utility model relates to the technical field of wafer cleaning equipment, in particular to a device for improving the flow direction of a liquid level of a water tank.

Background

With the increasing popularity and updating of electronic products, the manufacturing process of semiconductors has also been rapidly developed. In the manufacturing process of the semiconductor, the acid tank cleaning process plays a great role throughout the whole process.

At present, the wafer cleaning process after etching is all groove type cleaning equipment, wherein the acid groove is used for cleaning, then ultrapure water is used for cleaning, however, the wafer is taken out of the acid groove and put into the water groove, then acid liquor is easily brought into the water groove, or a large amount of acid liquor still remains in the water groove after cleaning and usually floats on the water surface, and the acid liquor adheres to the surface of the wafer when the wafer is grabbed out of the groove, so that the whole batch of cross contamination is caused. In the prior art, a power device is arranged in a water tank to improve water flow, but linear pollution is still easy to generate on the surface of a wafer in the actual process, and the quality of products is affected.

Thus, there remains a need in the art for a sump level flow direction improvement device.

Disclosure of Invention

Therefore, an object of the embodiments of the present utility model is to provide a device for improving the flow direction of a liquid level in a water tank, wherein a plurality of spray assemblies are arranged in the device to form a liquid circulation flow in the water tank, so that a contaminated liquid floating on the surface of the liquid is sprayed to the edge of the water tank, and the secondary pollution of a wafer is prevented.

Based on the above object, the embodiment of the utility model provides a water tank liquid level flow direction improving device, wherein a water tank is used for cleaning a wafer, the device comprises two first spraying components symmetrically arranged at the bottom of the water tank and a second spraying component arranged above the water tank, the second spraying components are fixed above the water tank through a fixed bracket, each spraying component comprises a spraying pipe and a plurality of uniformly-spaced spraying heads arranged on the spraying pipe, the spraying pipes of the first spraying component and the second spraying component are arranged along the axial direction of the wafer, the spraying heads of the two first spraying components are arranged oppositely, and the spraying heads of the second spraying component are arranged to spray in the liquid level direction of the water tank so as to blow the surface center liquid of the water tank to the edge of the surface of the water tank.

In some embodiments, the shower pipes of the two first shower assemblies are respectively abutted with two opposite water tank side walls.

In some embodiments, the spray heads of the two first spray assemblies have a spray direction at an angle of 0 to 25 ° to the horizontal.

In some embodiments, the second spray assembly is disposed above the center of the water tank with a spray head of the second spray assembly having a spray range of 0-120 °.

In some embodiments, the second spray assembly is arranged above any side wall of the water tank, and the spray direction of the spray header of the second spray assembly forms an included angle of 10-45 degrees with the horizontal plane.

In some embodiments, the second spray assembly is disposed 0-10 cm above the sink.

The utility model has at least the following beneficial technical effects:

the utility model provides a liquid level flow direction improving device of a water tank, which comprises three groups of spray assemblies, wherein each spray assembly is provided with a plurality of spray heads at intervals, two spray pipes are symmetrically arranged at the bottom of the water tank and close to the wall of the water tank, the spray heads of the two spray pipes are oppositely arranged, the other spray pipe is arranged above the water tank, the spray direction of the spray pipe is set to blow liquid on the surface of the water tank to any side from the center, and the spray assemblies of the device are matched to enable the water tank to form liquid circulation flow, so that polluted liquid floating on the surface of the liquid is blown to the edge of the water tank, and the secondary pollution of a wafer is prevented.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model and that other embodiments may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an embodiment of wafer surface contamination provided by the present utility model;

FIG. 2 is a front view of a first embodiment of the sink level flow direction improving apparatus provided by the present utility model;

FIG. 3 is a top view of a first embodiment of the sink level flow direction improving device provided by the present utility model;

fig. 4 is a schematic diagram of a second embodiment of the device for improving the flow direction of the liquid level in the water tank.

Reference numerals illustrate:

1. a water tank; 2. a first spray assembly; 3. a second spray assembly; 4. a shower pipe; 5. a spray header.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the following embodiments of the present utility model will be described in further detail with reference to the accompanying drawings.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs; the terms used in the specification are used herein for the purpose of describing particular embodiments only and are not intended to limit the present utility model, for example, the orientations or positions indicated by the terms "length", "width", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positions shown in the drawings, are merely for convenience of description, and are not to be construed as limiting the present utility model.

The terms "comprising" and "having" and any variations thereof in the description of the utility model and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion; the terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order. The meaning of "a plurality of" is two or more, unless specifically defined otherwise.

In the description of the utility model and the claims and the above figures, when an element is referred to as being "fixed" or "mounted" or "disposed" or "connected" to another element, it can be directly or indirectly on the other element. For example, when an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.

Furthermore, references herein to "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present utility model. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

At present, the wafer cleaning process after etching is all groove type cleaning equipment, and ultrapure water is used for cleaning after an acid groove is used for cleaning, however, the wafer is taken out of the acid groove and put into the water groove, and then acid liquor is easily brought into the water groove, because of the flowing direction of the liquid in the water groove, the acid liquor is generally accumulated on the center surface of the water groove, so that strip acid liquor pollutants are accumulated at the centremost part of the liquid surface in the water groove, and in the wafer taking-out process, strip pollution is easily formed on the surface of the wafer due to the action of the surface tension of the solution, the product quality is influenced, and the schematic diagram of the embodiment of the wafer surface pollution provided by the utility model is shown in fig. 1.

Accordingly, the present utility model provides a tank liquid level flow direction improving apparatus, as shown in fig. 2 to 4, wherein the tank is used for cleaning a wafer, and as shown in fig. 2, a front view of the apparatus is shown, and in an actual cleaning process, a wafer surface is placed in the tank along a plane of the front view, and the apparatus specifically comprises:

including two symmetry set up the first spraying subassembly 2 in basin 1 bottom and set up the second spraying subassembly 3 in the basin top, the second shower head 3 passes through the fixed bolster (not shown in the figure) to be fixed in basin 1 top, every spraying subassembly all includes shower and sets up a plurality of even shower heads 5 in interval on shower 4, the shower pipe 4 of first spraying subassembly and second spraying subassembly all sets up along the axial of wafer, the shower head 5 of two first spraying subassemblies 2 sets up relatively, the shower head 5 of second spraying subassembly 3 sets up to the liquid level direction jetting of basin in order to blow the surface center liquid of basin to basin surface edge.

Further, the second spraying component is arranged at a position 0-10 cm above the water tank.

If only two spray assemblies are arranged at the bottom of the water tank, in the spraying process, liquid in the water tank forms flow directions of which the bottom flows in opposite directions and the top flows in opposite directions, however, the arrangement causes strip acid liquid pollutant aggregation at the centremost part of the liquid surface in the water tank, and the strip acid liquid pollutant aggregation is easy to adhere to the surface of a wafer in the wafer taking-out process. Therefore, the device is also provided with a spraying component above the water tank, and the spraying direction of the spraying component is set to blow the liquid on the surface of the water tank from the center to any side, namely, the spraying component mainly acts to blow the central pollutant on the surface of the water tank to the edge position of the water tank so as to prevent secondary pollution to the wafer.

The following is a further explanation of specific embodiments according to the present utility model.

Example 1

Fig. 2 to 3 are front views and top views of a first embodiment of the liquid level flow direction improving device for a water tank, wherein two first spray assemblies 2 are symmetrically arranged at the bottom of the water tank 1, spray pipes 4 of the two first spray assemblies 2 are respectively abutted against two opposite side walls of the water tank 1, and an included angle between the spraying direction of spray heads of the two first spray assemblies and the horizontal plane is 0-25 degrees. The second spray assembly 3 is arranged above any one side wall of the water tank 1, and the spray assembly of the embodiment is arranged above the right side wall of the water tank, and is 10cm away from the water tank, and the spray direction of the spray header of the second spray assembly and the included angle of the horizontal plane are 10-45 degrees.

The spray assembly includes a shower pipe 4 and a shower head 5, as shown in fig. 3, 7 shower heads 5 are provided on the shower pipe 4 at even intervals in this embodiment.

Example 2

As shown in fig. 4, which is a front view of a second embodiment of the device for improving the flow direction of the liquid surface of a water tank, the difference between the embodiment and embodiment 1 is that the second spray assembly is disposed at a position above the center of the water tank, in this embodiment, the spray range of the spray header of the second spray assembly is 0-120 °, that is, the central pollutant on the surface of the water tank can be blown to the edge position of the water tank, so as to prevent secondary pollution to the wafer, and other settings are the same as those of embodiment 1, so that the description is omitted.

The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the disclosure as defined by the appended claims. Furthermore, although elements of the disclosed embodiments may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.

It should be understood that as used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.

The foregoing embodiment of the present utility model has been disclosed with reference to the number of embodiments for the purpose of description only, and does not represent the advantages or disadvantages of the embodiments.

Those of ordinary skill in the art will appreciate that: the above discussion of any embodiment is merely exemplary and is not intended to imply that the scope of the disclosure of embodiments of the utility model, including the claims, is limited to such examples; combinations of features of the above embodiments or in different embodiments are also possible within the idea of an embodiment of the utility model, and many other variations of the different aspects of the embodiments of the utility model as described above exist, which are not provided in detail for the sake of brevity. Therefore, any omission, modification, equivalent replacement, improvement, etc. of the embodiments should be included in the protection scope of the embodiments of the present utility model.

Claims (6)

1. The utility model provides a basin liquid level flow direction improves device, basin is used for the wafer cleaning, its characterized in that, is in including two symmetries setting is in first spray set spare and the setting of basin bottom is in the second spray set spare of basin top, the second spray set spare passes through the fixed bolster to be fixed the basin top, every spray set spare all includes the shower and sets up a plurality of even shower heads in interval on the shower, first spray set spare with the shower of second spray set spare all sets up along the axial of wafer, two first spray set spare the shower head sets up relatively, the shower head setting of second spray set spare is to the liquid level direction jetting of basin is in order to with the surface center liquid of basin blows to basin surface edge.

2. The sink level flow direction improving apparatus of claim 1, wherein the shower pipes of the two first shower assemblies are respectively abutted against two opposing sink side walls.

3. The sink liquid level flow direction improving apparatus according to claim 1, wherein the spray header of the two first spray assemblies has an angle of 0 to 25 ° with respect to the horizontal plane.

4. The sink liquid level flow direction improving apparatus according to claim 1, wherein the second shower assembly is disposed above the center of the sink, and the shower head of the second shower assembly has a shower range of 0 ° to 120 °.

5. The water tank liquid level flow direction improving device according to claim 1, wherein the second spray assembly is arranged above any side wall of the water tank, and the spray direction of the spray header of the second spray assembly forms an included angle of 10-45 degrees with the horizontal plane.

6. The sink liquid level flow direction improving apparatus according to claim 1, wherein the second spray assembly is disposed 0-10 cm above the sink.