CN210676293U - Water tank of quartz wafer cleaning machine - Google Patents
Water tank of quartz wafer cleaning machine Download PDFInfo
- Publication number
- CN210676293U CN210676293U CN201921687539.3U CN201921687539U CN210676293U CN 210676293 U CN210676293 U CN 210676293U CN 201921687539 U CN201921687539 U CN 201921687539U CN 210676293 U CN210676293 U CN 210676293U
- Authority
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- China
- Prior art keywords
- tank
- cleaning
- rinsing
- guide pipe
- quartz wafer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 106
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 239000010453 quartz Substances 0.000 title claims abstract description 41
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 238000005192 partition Methods 0.000 claims abstract description 19
- 239000008237 rinsing water Substances 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 30
- 230000000694 effects Effects 0.000 description 9
- 238000005406 washing Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a quartz wafer cleaning machine basin, concretely relates to quartz wafer cleaning machine technical field. The utility model discloses a cleaning machine water tank, which consists of a cleaning tank and a rinsing tank, wherein a clapboard is arranged between the cleaning tank and the rinsing tank, and the edge of the clapboard is connected with the side wall and the bottom surface of the cleaning machine water tank; the partition board is provided with a through hole; the bottom of the cleaning tank and the bottom of the rinsing tank are respectively provided with a plurality of cleaning water inlets and a plurality of rinsing water inlets; the upper ends of the cleaning water inlet hole and the rinsing water inlet hole are respectively provided with a high-pressure guide pipe, the bottom end of the high-pressure guide pipe is connected with the bottom of the water tank of the cleaning machine, and the radius of a circle at the bottom end of the high-pressure guide pipe is larger than that of a circle at the upper end; the upper part of the side wall of the cleaning tank is provided with a water outlet hole. The utility model provides a pair of quartz wafer cleaning machine basin can play good cleaning performance to the quartz wafer that is attached to together to improve quartz wafer's production quality.
Description
Technical Field
The utility model belongs to the technical field of the quartz wafer cleaning machine, concretely relates to quartz wafer cleaning machine basin.
Background
Along with the rapid development of national economy, quartz wafer wide application in electronic components technical field, quartz wafer is in the in-process of production and processing, and quartz wafer surface can receive the pollution, consequently needs to carry out cleaning to quartz wafer surface, and cleaning process divide into corrosive liquid and wash and water washing, makes quartz wafer surface have the adhesion after the corrosive liquid washs, and two wafers easily adhere together, causes the water washing process ubiquitous insufficient cleaning phenomenon.
An etching solution cleaning machine (No. CN201521078644.9) discloses an etching solution cleaning machine, which comprises a frame, a cleaning tank and a control box. The device provides a simple structure, cleaning performance is good, the cleaning efficiency is high, can effectively guarantee product quality's corrosive liquid cleaning machine simultaneously, but the device realizes that quartz wafer's cleaning performance is not good through the up-and-down motion of wash rack, can't make the quartz wafer that adheres to together separate, leads to the adhesion surface to obtain effectual washing.
In view of the above circumstances, there is a need for a water tank of a quartz wafer cleaning machine, which can achieve a good cleaning effect on quartz wafers attached together, thereby improving the production quality of the quartz wafers.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a quartz wafer cleaning machine basin can play good cleaning performance to the quartz wafer that adheres to together to improve quartz wafer's production quality.
The utility model provides a following technical scheme:
a quartz wafer cleaning machine water tank comprises a cleaning machine water tank, wherein the cleaning machine water tank consists of a cleaning tank and a rinsing tank, a partition plate is arranged between the cleaning tank and the rinsing tank, and the edge of the partition plate is connected with the side wall and the bottom surface of the cleaning machine water tank; the partition plate is provided with a through hole; the bottom of the cleaning tank and the bottom of the rinsing tank are respectively provided with a plurality of cleaning water inlets and a plurality of rinsing water inlets; the upper ends of the cleaning water inlet hole and the rinsing water inlet hole are respectively provided with a high-pressure guide pipe, the bottom end of the high-pressure guide pipe is connected with the bottom of the water tank of the cleaning machine, and the radius of a circle at the bottom end of the high-pressure guide pipe is larger than that of a circle at the upper end; and a water outlet hole is formed in the upper part of the side wall of the cleaning tank.
Preferably, the side wall of the upper end circle and the side wall of the lower end circle of the high-pressure guide pipe are arranged on the same vertical plane, the upper end directions of the high-pressure guide pipes in the cleaning tank are arranged clockwise, and the upper end directions of the high-pressure guide pipes in the rinsing tank are arranged anticlockwise.
Preferably, the outer side wall of the lower end of the high-pressure guide pipe is provided with threads.
Preferably, the inner side walls of the cleaning water inlet hole and the rinsing water inlet hole are provided with threads matched with the outer side wall of the lower end of the high-pressure guide pipe, and the outer side wall of the lower end of the high-pressure guide pipe is connected with the inner side wall of the cleaning water inlet hole and the inner side wall of the rinsing water inlet hole.
Preferably, a guide pipe is arranged in the cleaning tank, the end part of the guide pipe is connected with the through hole, and the guide pipe and the partition board form an inclined angle of 60 degrees.
Preferably, the inner side wall of the cleaning machine water tank is provided with a groove matched with the edge of the partition plate, and the bottom of the groove is connected with the partition plate.
The utility model discloses a profitable effect:
the utility model discloses a cleaning machine water tank, which consists of a cleaning tank and a rinsing tank, wherein a clapboard is arranged between the cleaning tank and the rinsing tank, a through hole is arranged on the clapboard, and the bottom of the cleaning tank and the bottom of the rinsing tank are respectively provided with a plurality of cleaning water inlets and a plurality of rinsing water inlets; the upper ends of the cleaning water inlet hole and the rinsing water inlet hole are provided with high-pressure guide pipes, and the radius of a circle at the bottom end of each high-pressure guide pipe is larger than that of a circle at the upper end; a water outlet is formed in the upper part of the side wall of the cleaning tank; the high pressure stand pipe can make quartz wafer roll in aqueous always, makes adnexed quartz wafer separate, and the cleaning performance is better, flows out from the washing tank apopore because of water, and the water in the rinsing groove is comparatively clean, puts into rinsing groove rinsing after quartz wafer has cleaned in the rinsing groove, makes surface impurity get rid of completely, has improved quartz wafer's production quality.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
In the drawings:
fig. 1 is a top view of the present invention;
fig. 2 is a cross-sectional view of the present invention;
fig. 3 is a schematic structural view of the high-pressure guide tube of the present invention.
Description of reference numerals:
1. a washer water tank; 11. a cleaning tank; 12. a rinsing tank; 2. a partition plate; 3. a guide tube; 4. a groove; 5. a high pressure guide tube; 6. a water outlet hole; 7. a through hole; 8. cleaning the water inlet hole; 9. rinsing the water inlet hole; 10. and (4) a water inlet pipe.
Detailed Description
As shown in fig. 1, 2 and 3, the water tank of the quartz wafer cleaning machine comprises a water tank 1 of the cleaning machine, wherein the water tank 1 of the cleaning machine consists of a cleaning tank 11 and a rinsing tank 12, and the quartz wafer is rinsed after being cleaned, so that the cleaning effect is better; a clapboard 2 is arranged between the cleaning tank 11 and the rinsing tank 12, and the cleaning tank 11 and the rinsing tank 12 can be separated by the clapboard 2; the inner side wall of the cleaning machine water tank 1 is provided with a groove 4 matched with the edge of the partition plate 2, the edge of the partition plate 2 is inserted into the groove 4, the groove 4 is convenient for the installation and the disassembly of the partition plate 2, and the inner wall of the groove 4 is provided with a rubber pad which enables the partition plate 2 to be more tightly connected with the cleaning machine water tank 1; three through holes 7 are arranged in parallel at the upper part of the clapboard 2, and water in the rinsing tank 12 can flow into the cleaning tank 11 through the through holes 7; three guide pipes 3 with the same diameter as the through hole 7 are arranged in the cleaning tank 11, the guide pipes 3 and the end face of the partition plate 2 form an inclined angle of 60 degrees, the end part of each guide pipe 7 is welded with the end part of the through hole 7, and water flowing out of the guide pipes 3 promotes water in the cleaning tank 11 to flow clockwise, so that the cleaning effect of the quartz wafer is better; the bottom of the cleaning tank 11 and the bottom of the rinsing tank 12 are respectively provided with four cleaning water inlet holes 8 and four rinsing water inlet holes 9, a water inlet pipe 10 is used for respectively injecting water into the cleaning tank 11 and the rinsing tank 12 through the cleaning water inlet holes 8 and the rinsing water inlet holes 9, the water injection temperature is 50 ℃, and the cleaning effect of water at the temperature on the quartz wafer is better; the upper ends of the cleaning water inlet hole 8 and the rinsing water inlet hole 9 are provided with high-pressure guide pipes 5 which are arranged in a quadrilateral way, the radius of the bottom circle of each high-pressure guide pipe 5 is larger than that of the upper end circle, the high-pressure guide pipes 5 can pressurize water flow, the cleaning effect is better, the side wall of the upper end circle of each high-pressure guide pipe 5 and the side wall of the lower end circle of each high-pressure guide pipe 5 are arranged on the same vertical plane, the upper end direction of each high-pressure guide pipe 5 in the cleaning tank 11 is clockwise arranged, the water flow in the cleaning tank 11 is clockwise spun, the cleaning effect is further enhanced, the upper end direction of each high-pressure guide pipe 5 in the rinsing tank 12 is anticlockwise arranged, the water flow in the rinsing tank 12 is anticlockwise spun, the rinsing effect is further enhanced, the outer side wall of the lower end of each high-pressure guide pipe 5 is provided with threads, the inner side walls of the cleaning water inlet hole 8 and the rinsing water inlet hole 9, the threads facilitate the installation and the disassembly of the high-pressure guide pipe 5 and the cleaning water inlet hole 8 and the rinsing water inlet hole 9; the lateral wall upper portion of washing tank 11 is equipped with apopore 6, and the water in the washing tank 11 accessible apopore 6 flows.
The utility model discloses a working method: the quartz wafer is firstly placed in the cleaning tank 11, 50 ℃ water is injected into the cleaning water inlet hole 8, the water temperature is favorable for cleaning, the water flow in the cleaning tank 11 is clockwise spun by the high-pressure guide pipe 5, and the quartz wafer is ceaselessly rotated, rolled and washed in the cleaning tank 11, so that the cleaning effect is enhanced; after the cleaning, the quartz wafer is placed in the rinsing tank 12, 50 ℃ water is injected into the rinsing water inlet 9, the water flow in the rinsing tank 12 is rotated anticlockwise through the high-pressure guide pipe 5, the quartz wafer is rotated and rolled for rinsing in the rinsing tank 12 ceaselessly, impurities which are not cleaned in the cleaning tank 11 are further cleaned, the water flow entering the cleaning tank 11 is promoted by the guide pipe 3 to be rotated clockwise, and finally the water in the water tank 1 of the cleaning machine flows out through the water outlet 6.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a quartz wafer cleaning machine basin, includes the cleaning machine basin, its characterized in that: the cleaning machine water tank consists of a cleaning tank and a rinsing tank, a partition plate is arranged between the cleaning tank and the rinsing tank, and the edge of the partition plate is connected with the side wall and the bottom surface of the cleaning machine water tank; the partition plate is provided with a through hole; the bottom of the cleaning tank and the bottom of the rinsing tank are respectively provided with a plurality of cleaning water inlets and a plurality of rinsing water inlets; the upper ends of the cleaning water inlet hole and the rinsing water inlet hole are respectively provided with a high-pressure guide pipe, the bottom end of the high-pressure guide pipe is connected with the bottom of the water tank of the cleaning machine, and the radius of a circle at the bottom end of the high-pressure guide pipe is larger than that of a circle at the upper end; and a water outlet hole is formed in the upper part of the side wall of the cleaning tank.
2. The quartz wafer washer tank of claim 1, wherein: the side wall of the upper end circle and the side wall of the lower end circle of the high-pressure guide pipe are arranged on the same vertical plane, the upper end direction of the high-pressure guide pipe in the cleaning tank is arranged clockwise, and the upper end direction of the high-pressure guide pipe in the rinsing tank is arranged anticlockwise.
3. The quartz wafer washer tank of claim 2, wherein: and the outer side wall of the lower end of the high-pressure guide pipe is provided with threads.
4. The quartz wafer washer tank of claim 3, wherein: the inside wall of wasing the inlet opening with the rinsing inlet opening be equipped with high pressure stand pipe lower extreme lateral wall assorted screw thread, the lower extreme lateral wall of high pressure stand pipe with the inside wall that washs the inlet opening with the inside wall of rinsing inlet opening meets.
5. The quartz wafer washer tank of claim 1, wherein: the cleaning tank is internally provided with a guide pipe, the end part of the guide pipe is connected with the through hole, and the guide pipe and the partition board form an inclined angle of 60 degrees.
6. The quartz wafer washer tank of claim 1, wherein: the inner side wall of the cleaning machine water tank is provided with a groove matched with the edge of the partition board, and the bottom of the groove is connected with the partition board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921687539.3U CN210676293U (en) | 2019-10-10 | 2019-10-10 | Water tank of quartz wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921687539.3U CN210676293U (en) | 2019-10-10 | 2019-10-10 | Water tank of quartz wafer cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210676293U true CN210676293U (en) | 2020-06-05 |
Family
ID=70891534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921687539.3U Expired - Fee Related CN210676293U (en) | 2019-10-10 | 2019-10-10 | Water tank of quartz wafer cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210676293U (en) |
-
2019
- 2019-10-10 CN CN201921687539.3U patent/CN210676293U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200605 |