CN220012861U - Electroplating sub-tank with adjustable liquid level - Google Patents
Electroplating sub-tank with adjustable liquid level Download PDFInfo
- Publication number
- CN220012861U CN220012861U CN202321046041.5U CN202321046041U CN220012861U CN 220012861 U CN220012861 U CN 220012861U CN 202321046041 U CN202321046041 U CN 202321046041U CN 220012861 U CN220012861 U CN 220012861U
- Authority
- CN
- China
- Prior art keywords
- liquid
- liquid level
- return pipe
- tank body
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 108
- 238000009713 electroplating Methods 0.000 title claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 238000005507 spraying Methods 0.000 claims abstract description 17
- 239000007921 spray Substances 0.000 claims abstract description 10
- 238000003780 insertion Methods 0.000 claims abstract description 3
- 230000037431 insertion Effects 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims description 22
- 210000005056 cell body Anatomy 0.000 claims description 9
- 238000002474 experimental method Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to the technical field of electroplating, in particular to a liquid level adjustable electroplating sub-tank, which comprises a tank body, wherein a liquid discharge hole is formed in the bottom of the tank body, a return pipe and an anode water spray box are arranged in the tank body, the return pipe is vertically arranged in the tank body and is in plug-in connection with the liquid discharge hole, and the insertion depth of the return pipe is adjustable so as to control the liquid level in the tank body; the positive plate of the positive plate water spraying box is provided with a plurality of liquid outlets corresponding to each liquid zone, and each liquid zone is internally provided with a liquid inlet pipe with independent control flow so as to control the corresponding liquid zone to discharge water according to the liquid level height and make the water discharge amount consistent. The electroplating sub-tank realizes liquid level control through the return pipe, and ensures that the electroplating liquid flow rate is uniform under the condition of high liquid level by matching with the anode water spraying box, thereby ensuring the electroplating quality.
Description
Technical Field
The utility model relates to the technical field of electroplating, in particular to a liquid level adjustable electroplating sub-tank.
Background
Electroplating is a traditional and mature surface processing technology, and is widely used in integrated circuit technology, namely, a process of plating a thin layer of other metals or alloys on the surface of certain metals by utilizing the electrolysis principle is a process of adhering a metal film on the surface of the metal or other material parts by utilizing the electrolysis action, thereby playing roles of preventing metal oxidation, improving wear resistance, conductivity, reflectivity, corrosion resistance, improving attractiveness and the like.
The plating sub-tank is a common component in the plating process and faces to the plating bath or horizontal plating and the like for providing the plating solution with the required liquid level, but the plating bath with the high liquid level is required to be prepared during the plating experiment; in the horizontal plating experiment, low-level electroplating liquid is required to be prepared, and even no liquid level exists.
The existing subslot has single function, does not have liquid level adjusting capability, and is difficult to meet various electroplating requirements. In addition, the liquid inlet pipe of the common sub-tank is arranged at a certain position, and aiming at liquid areas with different heights, the situation that the water outlet flow rates of all areas are different easily occurs, so that the plating layer is uneven. Therefore, further optimization is required.
Disclosure of Invention
Based on the above problems, the utility model aims to provide a plating sub-tank with adjustable liquid level, which is endowed with liquid level adjustment capability to form multiple liquid areas, controls the water outlet flow rate of each liquid area to be consistent and ensures the plating quality.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a liquid level adjustable electroplating sub-tank, it includes the cell body, and the flowing back hole has been seted up to the bottom of cell body, and the inside of cell body is provided with back flow and positive pole water spray box, and the back flow erects in the cell body and with flowing back hole grafting intercommunication, and the degree of depth of inserting of back flow is adjustable to the liquid level height in the control cell body; the positive plate of the positive plate water spraying box is provided with a plurality of liquid outlets corresponding to each liquid zone, and each liquid zone is internally provided with a liquid inlet pipe with independent control flow so as to control the corresponding liquid zone to discharge water according to the liquid level height and make the water discharge amount consistent.
Alternatively, the return pipe need not be installed when no liquid level is required for the tank.
Optionally, the return pipe is in threaded engagement with the drain hole.
Optionally, the length of the return pipe is telescopically adjustable.
Optionally, each liquid inlet pipe extends into from the top of the anode water spraying box and passes through the plurality of diaphragm plates to reach the corresponding liquid area.
Optionally, drain holes are reserved on the side panel, the bottom plate and the middle diaphragm plate of the anode water spraying box.
In summary, compare with prior art, the height-adjustable's back flow in the liquid level adjustable electroplating sub tank passes through the cell body has realized the control to the liquid level, has satisfied multiple electroplating experiment requirement, and the cooperation positive pole water spray box divides into a plurality of liquid district with the inslot space in addition to adjust each liquid district water yield unanimously, thereby guaranteed that the electroplating liquid flow rate is even under the high liquid level condition, guaranteed electroplating quality.
Drawings
FIG. 1 is a schematic view of a liquid level adjustable plating sub-tank according to an embodiment of the present utility model;
FIG. 2 is a front view of an anode water spray cartridge in a level adjustable plating sub-tank provided by an embodiment of the utility model.
In the figure:
1. a tank body; 2. a liquid discharge hole; 3. a return pipe; 4. an anode water spraying box; 5. a diaphragm; 6. a liquid feeding area; 7. a medium liquid zone; 8. a liquid discharging area; 9. a liquid outlet; 10. a liquid inlet pipe.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar parts throughout, or parts having like or similar functions. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, mechanically connected, electrically connected, indirectly connected through an intermediary, or may be in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present utility model, unless explicitly stated and limited otherwise, a first feature "above" or "below" a second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature not being in direct contact but being in contact by another feature therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature. The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
Referring to fig. 1 and 2, the preferred embodiment provides a plating sub-tank with adjustable liquid level, which comprises a tank body 1, wherein a liquid discharge hole 2 is formed in the bottom of the tank body 1, and a return pipe 3 and an anode water spraying box 4 are arranged in the tank body 1.
Wherein, the return pipe 3 is erected in the tank body 1 and is spliced and communicated with the liquid discharge hole 2, and the insertion depth of the return pipe 3 is adjustable so as to control the liquid level height in the tank body 1. The return pipe 3 is preferably screwed with the drain hole 2 for height adjustment, further the length of the return pipe 3 is telescopically adjustable, adjustment is more convenient, and the return pipe 3 does not need to be installed when no liquid level is required for the tank 1.
When the extension size of the return pipe 3 is large, the interior of the tank body 1 is at a high liquid level, so that the requirements of a plating experiment can be met; when the extension size of the return pipe 3 is small, the interior of the tank body 1 is at a high liquid level, and when the return pipe 3 is not adopted, the interior of the tank body 1 is at a non-liquid level, so that the requirements of horizontal plating experiments can be met.
On the basis, especially under the condition of high liquid level, the arrangement mode of the traditional liquid inlet pipe easily causes different water outlet flow rates in different areas, influences electroplating uniformity, and also needs to optimize the water outlet of each area.
In this regard, the anode water spraying box 4 is erected in the tank body 1, and the back plate of the anode water spraying box 4 is abutted against the inner side wall of the tank body 1, a plurality of transverse baffles 5 are arranged in the anode water spraying box 4, the inner cavity of the anode water spraying box 4 is divided into an upper liquid area and a lower liquid area, in this embodiment, three liquid areas of the upper liquid area 6, the middle liquid area 7 and the lower liquid area 8 are exemplified, and a plurality of liquid outlets 9 are formed on the front plate of the anode water spraying box 4 corresponding to the three liquid areas.
Particularly, each liquid zone is provided with a liquid inlet pipe 10 with independent flow control, so that the water outlet of the corresponding liquid zone is controlled according to the liquid level height and the water outlet amount is consistent, thereby ensuring that the upper liquid zone 6, the middle liquid zone 7 and the lower liquid zone 8 are uniformly plated, and ensuring the quality of a plating layer.
Specifically, each liquid inlet pipe 10 extends from the top of the anode water spraying box 4, one liquid inlet pipe 10 directly reaches the upper liquid area 6, one liquid inlet pipe 10 passes through one diaphragm 5 and then reaches the middle liquid area 7, and the other liquid inlet pipe 10 passes through two diaphragms 5 and then reaches the lower liquid area 8.
In addition, drain holes are reserved on the side plates, the bottom plate and the middle diaphragm plate 5 of the anode water spraying box 4, so that the electroplating liquid can be conveniently emptied during maintenance.
In summary, the above-mentioned adjustable electroplating sub tank of liquid level has realized the control to the liquid level through highly adjustable back flow in the cell body, has satisfied multiple electroplating experiment requirement, can be used for the rack plating experiment when high liquid level, can be used for the level to plate the experiment when low liquid level, no liquid level, and the cooperation positive pole water spray box divides into a plurality of liquid regions with the inslot space in addition to adjust each liquid region water yield unanimity, thereby guaranteed that the electroplating liquid flow rate is even under the high liquid level condition, guaranteed electroplating quality.
The above embodiments merely illustrate the basic principles and features of the present utility model, and the present utility model is not limited to the above embodiments, but can be variously changed and modified without departing from the spirit and scope of the present utility model, which is within the scope of the present utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The liquid level adjustable electroplating sub-tank is characterized by comprising a tank body (1), wherein a liquid discharge hole (2) is formed in the bottom of the tank body (1), a return pipe (3) and an anode water spraying box (4) are arranged in the tank body (1),
the return pipe (3) is vertically arranged in the tank body (1) and is in plug-in connection with the liquid discharge hole (2), and the insertion depth of the return pipe (3) is adjustable so as to control the liquid level height in the tank body (1);
the positive pole water spray box (4) erect in cell body (1), and the back panel of positive pole water spray box (4) with the inside wall of cell body (1) is leaned on, be provided with a plurality of diaphragm (5) in positive pole water spray box (4), cut apart into a plurality of liquid district from top to bottom with the inner chamber of positive pole water spray box (4), and a plurality of liquid outlet (9) have been seted up to each liquid district on the positive panel of positive pole water spray box (4), every all let in liquid district have inlet tube (10) of independent control flow, in order according to liquid level height control corresponds liquid district water yield and makes the water yield unanimous.
2. The level adjustable plating sub tank according to claim 1, characterized in that the return pipe (3) does not need to be installed when no level is required for the tank body (1).
3. The liquid level adjustable plating sub tank according to claim 1, wherein the return pipe (3) is screw-fitted with the drain hole (2).
4. The level-adjustable plating sub tank according to claim 1, characterized in that the length of the return pipe (3) is telescopically adjustable.
5. The liquid level adjustable electroplating sub tank according to claim 1, wherein each liquid inlet pipe (10) extends into the top of the anode water spraying box (4) and passes through a plurality of transverse baffles (5) to reach the corresponding liquid area.
6. The liquid level adjustable electroplating sub-tank according to claim 1, wherein drain holes are reserved on the side panel, the bottom plate and the middle diaphragm plate (5) of the anode water spraying box (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321046041.5U CN220012861U (en) | 2023-05-04 | 2023-05-04 | Electroplating sub-tank with adjustable liquid level |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321046041.5U CN220012861U (en) | 2023-05-04 | 2023-05-04 | Electroplating sub-tank with adjustable liquid level |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220012861U true CN220012861U (en) | 2023-11-14 |
Family
ID=88673728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321046041.5U Active CN220012861U (en) | 2023-05-04 | 2023-05-04 | Electroplating sub-tank with adjustable liquid level |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220012861U (en) |
-
2023
- 2023-05-04 CN CN202321046041.5U patent/CN220012861U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111910242B (en) | Electroplating method and device for printed circuit board | |
| CN220012861U (en) | Electroplating sub-tank with adjustable liquid level | |
| CN202786471U (en) | Child-mother plating tank for plating push-type slender shaft | |
| CN2853815Y (en) | Bottom spray system of aluminium foil corrosion production line | |
| CN208379036U (en) | Vacuum interrupter external screw thread dynamic plating automatic doubler surface glouer | |
| CN217378065U (en) | Jet flow anode device for horizontal electroplating equipment | |
| CN217378068U (en) | Electroplating equipment | |
| CN214782251U (en) | Continuous electroplating gilding general type base device | |
| CN210765576U (en) | Horizontal spraying structure and electrolytic etching device | |
| CN211079375U (en) | Infusion device of crude foil machine | |
| CN214271077U (en) | Novel electroplating pool with uniform electroplating | |
| CN201485525U (en) | Novel electroplating device | |
| CN210128481U (en) | Humidifier atomization cabin | |
| CN212503918U (en) | Liquid tank structure of liquid filling machine | |
| CN204825097U (en) | Electroplate cistern device | |
| CN208055484U (en) | A kind of electroplating bath | |
| CN110592653A (en) | Horizontal spraying structure and electrolytic etching device applied by same | |
| CN210491357U (en) | Black hole liquid medicine anti-foaming box structure | |
| CN215976092U (en) | Electroplating unit convenient to adjust liquid level of electroplating water tank | |
| CN219470226U (en) | High-efficiency electrolytic cell | |
| CN218710954U (en) | Electroplating device | |
| CN220265893U (en) | Be used for dull and stereotyped electroplating experiment device | |
| CN217479571U (en) | PCB electroplating device | |
| CN214218885U (en) | Device for local tinning by liquid flow method | |
| CN211284564U (en) | Novel chemical nickel waste liquid electrolysis equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |