CN215976092U - Electroplating unit convenient to adjust liquid level of electroplating water tank - Google Patents

Electroplating unit convenient to adjust liquid level of electroplating water tank Download PDF

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Publication number
CN215976092U
CN215976092U CN202120847732.XU CN202120847732U CN215976092U CN 215976092 U CN215976092 U CN 215976092U CN 202120847732 U CN202120847732 U CN 202120847732U CN 215976092 U CN215976092 U CN 215976092U
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CN
China
Prior art keywords
electroplating
liquid level
tank
aeration
bath
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Expired - Fee Related
Application number
CN202120847732.XU
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Chinese (zh)
Inventor
缪伟
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Suzhou Yongxiang Hardware Plastic Co ltd
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Suzhou Yongxiang Hardware Plastic Co ltd
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Priority to CN202120847732.XU priority Critical patent/CN215976092U/en
Application granted granted Critical
Publication of CN215976092U publication Critical patent/CN215976092U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses an electroplating unit convenient for adjusting the liquid level of an electroplating water tank, which comprises an electroplating tank and a circulating tank, wherein the electroplating tank is arranged in the circulating tank, the circulating tank is used for recycling electroplating solution in the electroplating tank, overflow pipes which are symmetrically distributed are arranged on two sides of the electroplating tank, a piston plate which can move up and down and is used for driving the liquid level of the electroplating solution to move up and down is arranged in the electroplating tank, and the height of the liquid level of the electroplating solution in the electroplating tank can be effectively controlled by utilizing the up-and-down movement of the piston plate, so that the adjustment of the liquid level of the electroplating solution in the electroplating tank is realized, different positions of the piston plate can be adjusted according to different requirements, the depth of the electroplating solution in the electroplating tank is controlled, the electroplating requirements are met, and the depth of the electroplating solution can be timely adjusted according to the requirements.

Description

Electroplating unit convenient to adjust liquid level of electroplating water tank
Technical Field
The utility model belongs to the technical field of electroplating, and particularly relates to an electroplating unit convenient for adjusting the liquid level of an electroplating water tank.
Background
Electroplating is widely applied to products of connecting terminals at present, and parts such as pins, pressing sheets, screws and the like can meet specific functions and service lives of the parts only through electroplating treatment; electroplating is a process of depositing metal or alloy on the surface of a workpiece by electrolysis under the action of direct current to form a uniform, dense and good-bonding-force metal surface.
The baffle at the both ends of electroplating water tank is provided with the overflow pipe, and the continuous in-process of pouring electrolyte in the electroplating water tank, the overflow pipe at both ends spills over from electrolyte, realizes that electrolyte is continuous to circulate, and the opening at electroplating water tank both ends is adjustable among the prior art, when needs increase or reduce the liquid level height in the electroplating water tank, adjusts the trouble very.
SUMMERY OF THE UTILITY MODEL
In view of the problems in the prior art, the utility model aims to provide an electroplating unit which is convenient for adjusting the liquid level of an electroplating water tank.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides an electroplate unit convenient to adjust electroplating water tank liquid level, includes plating bath and circulation groove, the plating bath sets up in the circulation groove, the circulation groove is used for the cyclic utilization of plating solution in the plating bath, the plating bath both sides are equipped with symmetric distribution's overflow pipe, and are equipped with the piston board that can up-and-down motion just is used for driving the plating solution liquid level up-and-down motion in the plating bath.
Preferably, a fixing rod fixedly connected with the outer side of the electroplating bath is arranged, the fixing rod is fixedly connected with the inner wall of the circulating groove, a filter screen plate for preliminary filtering is arranged in the circulating groove below the electroplating bath, and a depth filtering layer for depth filtering of the electroplating solution is arranged below the filter screen plate.
Furthermore, the depth filter layer comprises an activated carbon layer, an ion exchange resin layer and a super-permeable membrane from top to bottom.
Preferably, the bottom of the electroplating bath is provided with a plurality of fixedly connected hydraulic rods, and the upper ends of the hydraulic rods are fixedly connected with corresponding piston plates.
Furthermore, a plurality of aeration pipes are arranged at the bottom of the circulation tank below the depth filter layer, aeration holes for aeration are formed in the aeration pipes, an aeration fan is arranged on one side of the circulation tank, and the output end of the aeration fan is communicated with the aeration pipes through a guide pipe.
Preferably, circulation groove one side is equipped with the bin that is used for the plating solution to collect, circulation groove one side is equipped with the back flow that is used for the plating solution to flow back, back flow and bin upper end import department intercommunication, be equipped with the conveyer pipe that is used for the plating solution to carry on the bin, the conveyer pipe middle part is equipped with the delivery pump that is used for the plating solution to carry, and the conveyer pipe extension end is located plating bath import department.
Compared with the prior art, the utility model has the following technical effects:
utilize the up-and-down motion of piston plate, the height of plating solution liquid level in can effectual control plating bath to the realization can be according to the demand of difference to the regulation of plating solution liquid level in the plating bath, the position that the adjustment piston plate is different, the degree of depth of plating solution in the control plating bath satisfies the electroplating demand, but also can be timely according to the demand, adjusts the degree of depth of plating solution.
Additional features and advantages of the utility model will be set forth in the detailed description which follows.
Drawings
Fig. 1 is a schematic view of an overall structure provided in embodiment 1 of the present invention;
fig. 2 is a schematic view of the overall structure provided in embodiment 2 of the present invention;
the reference numbers in the figures illustrate: 1. an electroplating bath; 11. a hydraulic lever; 12. an overflow pipe; 13. a piston plate; 2. a circulation tank; 21. fixing the rod; 22. a flow guide pipe; 23. an aeration hole; 24. a depth filtration layer; 25. an aeration pipe; 26. an aeration fan; 27; a filter screen plate; 3. a storage tank; 31. a return pipe; 32. a delivery pipe; 33. a delivery pump.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further clarified by combining the concrete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Example 1
Referring to fig. 1, an electroplating unit convenient for adjusting the liquid level of an electroplating water tank includes an electroplating tank 1 and a circulation tank 2, wherein the electroplating tank 1 is disposed in the circulation tank 2, the circulation tank 2 is used for recycling the electroplating solution in the electroplating tank 1, overflow pipes 12 are symmetrically disposed on two sides of the electroplating tank 1, and a piston plate 13 capable of moving up and down and driving the liquid level of the electroplating solution to move up and down is disposed in the electroplating tank 1.
Further, the outer side of the electroplating bath 1 is provided with a fixed rod 21 fixedly connected, the fixed rod 21 is fixedly connected with the inner wall of the circulating groove 2, a filter screen plate for preliminary filtration is arranged in the circulating groove 2 below the electroplating bath 1, and a depth filtering layer 24 for depth filtration of electroplating solution is arranged below the filter screen plate.
The filter screen board can carry out primary filtration to the plating solution, and the degree of depth filter layer 24 can carry out the degree of depth filtration to the plating solution to make the plating solution can reach the standard of recycling.
Further, the depth filter layer 24 includes, from top to bottom, an activated carbon layer, an ion exchange resin layer, and a super-permeable membrane. The active carbon is mainly used for preliminary filtration, the ion exchange resin layer is mainly used for removing ions including metal cations or other anions, the super-permeable membrane is used for final filtration, the current membrane filtration is a relatively mature technology, and the membrane is used for filtration to ensure the filtration effect of the filter layer.
Furthermore, the bottom of the electroplating bath 1 is provided with a plurality of fixedly connected hydraulic rods 11, and the upper ends of the hydraulic rods 11 are fixedly connected with corresponding piston plates 13.
Further, a storage tank 27 for collecting the plating solution is arranged on one side of the circulation tank 2; a filter screen plate; 3, a return pipe 31 for returning the electroplating solution is arranged on one side of the circulating tank 2, and the return pipe 31 and the storage tank 27 are arranged; a filter screen plate; 3, the upper end inlet of the storage tank 27 is communicated with the upper end of the shell; a filter screen plate; a delivery pipe 32 for delivering the electroplating solution is arranged on the electroplating bath 3, a delivery pump 33 for delivering the electroplating solution is arranged in the middle of the delivery pipe 32, and the extending end of the delivery pipe 32 is positioned at the inlet of the electroplating bath 1.
A storage tank 27; a filter screen plate; the design of 3 can provide the electroplating solution for the electroplating bath 1, and the design of the return pipe 31 realizes the purpose that the electroplating solution is recycled after being filtered.
Example 2
The same points as those in example 1 are not repeated, and the difference from example 1 is that:
referring to fig. 2, a plurality of aeration pipes 25 are disposed at the bottom of the circulation tank 2 below the depth filter layer 24, aeration holes 23 for aeration are disposed on the aeration pipes 25, an aeration fan 26 is disposed at one side of the circulation tank 2, and an output end of the aeration fan 26 is communicated with the aeration pipes 25 through a guide pipe 22.
The design of aeration pipe 25 utilizes the aeration of aeration pipe 25, and through the air current of aeration, can effectually carry out the back flush to depth filter layer 24, and the effectual condition that prevents depth filter layer 24 jam guarantees depth filter layer 24's filterability.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the utility model. The utility model is not described in detail in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.

Claims (6)

1. The utility model provides an electroplate unit convenient to adjust electroplating water tank liquid level, includes plating bath and circulation groove, the plating bath sets up in the circulation groove, the circulation groove is used for the cyclic utilization of plating solution in the plating bath, its characterized in that: overflow pipes are symmetrically distributed on two sides of the electroplating bath, and piston plates which can move up and down and are used for driving the liquid level of the electroplating solution to move up and down are arranged in the electroplating bath.
2. An electroplating unit for facilitating adjustment of a liquid level of an electroplating bath according to claim 1, wherein: the electroplating bath is characterized in that a fixed rod is fixedly connected with the outer side of the electroplating bath, the fixed rod is fixedly connected with the inner wall of the circulating groove, a filter screen plate for primary filtration is arranged in the circulating groove below the electroplating bath, and a depth filtering layer for depth filtration of electroplating solution is arranged below the filter screen plate.
3. An electroplating unit for facilitating adjustment of a liquid level of an electroplating bath according to claim 2, wherein: the depth filter layer comprises an activated carbon layer, an ion exchange resin layer and a super-permeable membrane from top to bottom.
4. An electroplating unit for facilitating adjustment of a liquid level of an electroplating bath according to claim 1, wherein: the bottom of the electroplating bath is provided with a plurality of fixedly connected hydraulic rods, and the upper end parts of the hydraulic rods are fixedly connected with corresponding piston plates.
5. An electroplating unit for facilitating adjustment of a liquid level of an electroplating bath according to claim 2, wherein: the bottom of the circulation tank below the depth filter layer is provided with a plurality of aeration pipes, the aeration pipes are provided with aeration holes for aeration, one side of the circulation tank is provided with an aeration fan, and the output end of the aeration fan is communicated with the aeration pipes through a guide pipe.
6. An electroplating unit for facilitating adjustment of a liquid level of an electroplating bath according to claim 1, wherein: circulation groove one side is equipped with the bin that is used for the plating solution to collect, circulation groove one side is equipped with the back flow that is used for the plating solution to flow back, back flow and bin upper end import department intercommunication, be equipped with the conveyer pipe that is used for the plating solution to carry on the bin, the conveyer pipe middle part is equipped with the delivery pump that is used for the plating solution to carry, and the conveyer pipe extension end is located plating bath import department.
CN202120847732.XU 2021-04-23 2021-04-23 Electroplating unit convenient to adjust liquid level of electroplating water tank Expired - Fee Related CN215976092U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120847732.XU CN215976092U (en) 2021-04-23 2021-04-23 Electroplating unit convenient to adjust liquid level of electroplating water tank

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120847732.XU CN215976092U (en) 2021-04-23 2021-04-23 Electroplating unit convenient to adjust liquid level of electroplating water tank

Publications (1)

Publication Number Publication Date
CN215976092U true CN215976092U (en) 2022-03-08

Family

ID=80574106

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120847732.XU Expired - Fee Related CN215976092U (en) 2021-04-23 2021-04-23 Electroplating unit convenient to adjust liquid level of electroplating water tank

Country Status (1)

Country Link
CN (1) CN215976092U (en)

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Granted publication date: 20220308