CN215404623U - Circuit board processing and electroplating device - Google Patents
Circuit board processing and electroplating device Download PDFInfo
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- CN215404623U CN215404623U CN202122039696.7U CN202122039696U CN215404623U CN 215404623 U CN215404623 U CN 215404623U CN 202122039696 U CN202122039696 U CN 202122039696U CN 215404623 U CN215404623 U CN 215404623U
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Abstract
According to the circuit board processing and electroplating device provided by the utility model, the circulating filter part is arranged on the electroplating liquid tank, so that when impurities in the anode part enter electroplating liquid, the impurities in the electroplating liquid are filtered and removed through the filtering action of the circulating filter part, and the electroplating process is prevented from being influenced by excessive impurities in the electroplating liquid. And the flow velocity of the electroplating solution in the electroplating bath tank is accelerated through the circulating filter part, so that the electroplating efficiency is improved.
Description
Technical Field
The utility model relates to the field of circuit board processing devices, in particular to a circuit board processing and electroplating device.
Background
When traditional circuit board was electroplated, because need electroplate the circuit board with anode material on, and there is certain impurity in the anode material, when the positive pole consumed, impurity in the anode material remained in the bottom of plating bath, formed the thick impurity layer of one deck after extrudeing for a long time, influenced the electroplating of circuit board, and the impurity clearance of plating bath bottom is inconvenient.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a circuit board processing and electroplating device, which is used for solving the technical problem that impurities are accumulated at the bottom of an electroplating bath in the electroplating process of the existing electroplating device to influence the electroplating of a circuit board.
In order to achieve the purpose, the utility model adopts the technical scheme that: the circuit board processing and electroplating device is provided and is used for electroplating the surface of a circuit board, and comprises:
the electroplating liquid tank is filled with electroplating liquid;
an anode section provided in the plating liquid tank;
the circuit board is arranged in the electroplating liquid tank;
the positive electrode and the negative electrode of the direct current power supply are respectively and electrically connected with the positive electrode part and the circuit board;
and the circulating filter part is arranged on the electroplating liquid tank and is used for removing settled impurities in the electroplating liquid tank and improving the flowing speed of the electroplating liquid.
In one embodiment, the circulation filter portion includes:
the water inlet end of the circulating water pipe is arranged at the bottom of the electroplating liquid tank, and the water outlet end of the circulating water pipe is communicated with the electroplating liquid tank;
the circulating water pump is arranged on the circulating water pipe and used for providing power required by the circulating flow of the electroplating solution;
the filter screen is arranged on the circulating water pipe;
the slag collecting groove is arranged on the water inlet side of the filter screen and used for collecting impurities intercepted by the filter screen.
In one embodiment, the circulating filter part further comprises a water dispersion plate, the water dispersion plate is arranged on the inner wall of the electroplating liquid tank, a plurality of water dispersion holes with different directions are formed in the water dispersion plate, and the water outlet end of the circulating water pipe is communicated with the water dispersion holes in the water dispersion plate.
In one embodiment, the circulating water pipe where the filter screen is located is higher than the height of the electroplating solution in the electroplating solution tank, and the slag collecting tank is arranged on the circulating water pipe in a threaded fit mode.
In one embodiment, the filter screen is arranged on one side of the water inlet end of the circulating water pump.
In one embodiment, the bottom of the plating solution tank is provided with an inclined plane, and the inclined plane is inclined downwards towards the water inlet of the circulating filter part.
One or more technical solutions described above in the embodiments of the present invention have at least the following technical effects or advantages:
according to the circuit board processing and electroplating device provided by the embodiment of the utility model, the circulating filter part is arranged on the electroplating liquid tank, so that when impurities in the anode part enter electroplating liquid, the impurities in the electroplating liquid are filtered and removed through the filtering action of the circulating filter part, and the electroplating process is prevented from being influenced by excessive impurities in the electroplating liquid. And the flow velocity of the electroplating solution in the electroplating bath tank is accelerated through the circulating filter part, so that the electroplating efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board processing electroplating apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a water-dispersing plate according to an embodiment of the present invention.
Wherein the respective reference numerals are as follows:
1. a plating bath; 2. an anode section; 3. a circuit board; 4. a direct current power supply; 5. a circulating filtration part; 11. an inclined plane; 51. a circulating water pipe; 52. a water circulating pump; 53. a filter screen; 54. a slag collecting groove; 55. a water-dispersing plate; 551. and water spray holes.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1 to 2, an embodiment of the present application provides a circuit board 3 processing and electroplating apparatus, which includes an electroplating solution tank 1, an anode portion 2, a circuit board 3, a circulating filter portion 5, and a dc power supply 4. Wherein, the plating solution tank 1 is filled with plating solution. The anode section 2 is disposed in the plating liquid tank 1. The circuit board 3 is disposed in the plating solution tank 1. The positive and negative poles of the dc power supply 4 are electrically connected to the positive electrode part 2 and the circuit board 3, respectively. The circulation filter unit 5 is provided in the plating bath tank 1, and the circulation filter unit 5 is used for removing the precipitated impurities in the plating bath tank 1 and increasing the flow rate of the plating solution. The circuit board 3 processing electroplating device that this embodiment provided, through set up circulation filter 5 on electroplating liquid groove 1, when the impurity in the positive pole portion 2 entered into the plating solution in, through circulation filter 5's filtering action, filter the impurity of getting rid of in the plating solution, avoid the too much influence electroplating process of impurity in the plating solution. And the flow velocity of the plating solution in the plating bath tank is accelerated through the circulating filter part 5, and the plating efficiency is improved.
In detail, the water inlet port of the circulation filtering part 5 can be arranged at the bottom of the electroplating liquid tank 1, so that impurities settled at the bottom of the electroplating liquid tank 1 can be better filtered and removed through the structure of the filter screen 53 in the circulation part in the entering of the circulation filtering part 5, and the continuous and stable work of the electroplating device for processing the circuit board 3 is ensured.
In one embodiment, the circulating filter part 5 comprises a circulating water pipe 51, a circulating water pump 52, a filter screen 53 and a slag collecting groove 54. The water inlet end of the circulating water pipe 51 is arranged at the bottom of the electroplating liquid tank 1, and the water outlet end of the circulating water pipe 51 is communicated with the electroplating liquid tank 1. The circulating water pump 52 is provided on the circulating water pipe 51, and the circulating water pump 52 is used for supplying power required for circulating the plating liquid. The filter screen 53 is provided on the circulating water pipe 51. The slag collection groove 54 is disposed on the water inlet side of the filter screen 53, and the slag collection groove 54 is used for collecting impurities intercepted by the filter screen 53. Make the plating solution circulation flow in circulating pipe 51 through the pump body to through the impurity of filter screen 53 interception in the plating solution, then collect impurity by collection sediment groove 54, wait that collection sediment groove 54 collects a quantitative impurity after, can lift collection sediment groove 54 off, get rid of the impurity in collection sediment groove 54, keep the collection sediment ability of collection sediment groove 54.
As shown in FIG. 2, in one embodiment, the circulating filter part 5 further comprises a water dispersing plate 55, the water dispersing plate 55 is disposed on the inner wall of the electroplating bath 1, a plurality of water dispersing holes 551 facing different directions are opened on the water dispersing plate 55, and the water outlet end of the circulating water pipe 51 is communicated with the water dispersing holes 551 on the water dispersing plate 55. Through setting up the water dispersing plate 55 for after the plating solution enters into water dispersing plate 55 via circulating pipe 51, when discharging by the hole 551 that looses, can make the plating solution in the plating cistern 1 be in turbulent state, improve the contact efficiency between anode portion 2 and circuit board 3 and the plating solution, improve the efficiency of electroplating.
In one embodiment, the filter screen 53 is located at a position where the circulating water pipe 51 is higher than the height of the plating solution in the plating solution tank 1, and the slag collecting tank 54 is disposed on the circulating water pipe 51 in a threaded manner. Through the setting with circulating pipe 51 that filter screen 53 is located at the plating solution liquid level height that is higher than in plating bath tank 1, and then make when needs go on when the impurity in needs clearance collection sediment groove 54, only need stop circulating water pump 52, make the plating solution in circulating pipe 51 stop flowing, this moment because circulating pipe 51 that collection sediment groove 54 was located is higher than the plating solution liquid level in plating bath tank 1, so when directly taking off collection sediment groove 54, the plating solution in plating bath tank 1 can not spill from circulating pipe 51, avoid the waste to the plating solution.
In one embodiment, the filter net 53 is disposed at a side of the water inlet end of the circulation water pump 52. Through setting up filter screen 53 in circulating water pump 52 intake end one side for before the plating solution enters into circulating water pump 52, the filtration of filter screen 53 has been avoided the impurity in the plating solution to influence circulating water pump 52's normal work.
In one embodiment, the bottom of the plating liquid tank 1 is provided with an inclined plane 11, and the inclined plane 11 is inclined downward toward the water inlet of the circulating filter portion 5. The inclined plane 11 is arranged, so that impurities in the electroplating liquid tank 1 can automatically enter the water inlet of the circulating filter part 5 after being settled, and the filtering and impurity removing effects of the circulating filter part 5 are better.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a circuit board processing electroplating device for electroplate the circuit board surface, its characterized in that, circuit board processing electroplating device includes:
the electroplating liquid tank is filled with electroplating liquid;
an anode section provided in the plating liquid tank;
the circuit board is arranged in the electroplating liquid tank;
the positive electrode and the negative electrode of the direct current power supply are respectively and electrically connected with the positive electrode part and the circuit board;
and the circulating filter part is arranged on the electroplating liquid tank and is used for removing settled impurities in the electroplating liquid tank and improving the flowing speed of the electroplating liquid.
2. The circuit board processing and plating device of claim 1, wherein the circulating filter part comprises:
the water inlet end of the circulating water pipe is arranged at the bottom of the electroplating liquid tank, and the water outlet end of the circulating water pipe is communicated with the electroplating liquid tank;
the circulating water pump is arranged on the circulating water pipe and used for providing power required by the circulating flow of the electroplating solution;
the filter screen is arranged on the circulating water pipe;
the slag collecting groove is arranged on the water inlet side of the filter screen and used for collecting impurities intercepted by the filter screen.
3. The circuit board processing and plating device of claim 2, wherein:
the circulating filter part also comprises a water dispersion plate, the water dispersion plate is arranged on the inner wall of the electroplating liquid tank, a plurality of water dispersion holes with different orientations are formed in the water dispersion plate, and the water outlet end of the circulating water pipe is communicated with the water dispersion holes in the water dispersion plate.
4. The circuit board processing and plating device of claim 2, wherein:
the circulating water pipe at the position of the filter screen is higher than the height of the electroplating liquid in the electroplating liquid groove, and the slag collecting groove is arranged on the circulating water pipe in a thread fit mode.
5. The circuit board processing and plating device of claim 2, wherein:
the filter screen is arranged on one side of the water inlet end of the circulating water pump.
6. The circuit board processing and plating device of claim 1, wherein:
the bottom of the electroplating liquid tank is provided with an inclined plane which inclines downwards towards the water inlet direction of the circulating filter part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122039696.7U CN215404623U (en) | 2021-08-26 | 2021-08-26 | Circuit board processing and electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122039696.7U CN215404623U (en) | 2021-08-26 | 2021-08-26 | Circuit board processing and electroplating device |
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| Publication Number | Publication Date |
|---|---|
| CN215404623U true CN215404623U (en) | 2022-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122039696.7U Active CN215404623U (en) | 2021-08-26 | 2021-08-26 | Circuit board processing and electroplating device |
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| CN (1) | CN215404623U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116531832A (en) * | 2023-05-05 | 2023-08-04 | 苏州普瑞得电子有限公司 | Surface treatment liquid circulating and filtering device |
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2021
- 2021-08-26 CN CN202122039696.7U patent/CN215404623U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116531832A (en) * | 2023-05-05 | 2023-08-04 | 苏州普瑞得电子有限公司 | Surface treatment liquid circulating and filtering device |
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