CN219998156U - Silicon wafer inserting device and production line - Google Patents
Silicon wafer inserting device and production line Download PDFInfo
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- CN219998156U CN219998156U CN202320606582.2U CN202320606582U CN219998156U CN 219998156 U CN219998156 U CN 219998156U CN 202320606582 U CN202320606582 U CN 202320606582U CN 219998156 U CN219998156 U CN 219998156U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 59
- 239000010703 silicon Substances 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 230000000712 assembly Effects 0.000 claims abstract description 13
- 238000000429 assembly Methods 0.000 claims abstract description 13
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 210000003437 trachea Anatomy 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 abstract description 59
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a silicon wafer inserting device and a production line, comprising a variable pitch mechanism, wherein the variable pitch mechanism comprises a supporting frame and a lifting structure, the supporting frame comprises two vertical plates which are symmetrically arranged, a plurality of supporting columns which are arranged at intervals in the vertical direction are arranged on the vertical plates, the supporting columns on the two vertical plates symmetrically form a plurality of horizontal bearing positions, and the lifting structure is used for driving the supporting frame to move in the vertical direction; the conveying mechanism is used for conveying the silicon wafer into the bearing position; the grabbing mechanism comprises a plurality of substrates which are arranged at intervals along the vertical direction, the arrangement intervals of the substrates correspond to the arrangement intervals of the support columns on the vertical plates, and sucking disc assemblies are arranged on the substrates. The silicon wafer inserting device can be used for rapidly arranging silicon wafers at preset intervals, and is high in efficiency and low in possibility of damaging and polluting the silicon wafers; and can snatch the silicon chip simultaneously through snatching the mechanism, improved the efficiency of inserted sheet and reduced the cost of production, be suitable for practicality.
Description
Technical Field
The utility model relates to the technical field of silicon wafer production equipment, in particular to a silicon wafer inserting device and a production line.
Background
The process of inserting sheets is involved in the production process of the silicon wafers, a plurality of silicon wafers are required to be arranged on a bracket at intervals for processing, and the silicon wafers are taken out of the bracket for subsequent production processes after the processing is finished;
the existing production method generally adopts manual or mechanical hands to take silicon wafers piece by piece and arrange the silicon wafers on a bracket at intervals, the production efficiency is low, the silicon wafers are easy to be polluted and damaged in the manual operation process, and the final quality of the product is affected.
Disclosure of Invention
Therefore, the utility model aims to solve the technical problems that the process of inserting wafers in the prior art generally adopts manual or mechanical hands to take wafers one by one to carry out the operation of inserting wafers, the production efficiency is low, the wafers are easy to be polluted and damaged in the manual operation process, and the final quality of products is affected.
In order to solve the technical problems, the utility model provides a silicon wafer inserting device, which comprises,
the pitch-changing mechanism comprises a supporting frame and a lifting structure, the supporting frame comprises two symmetrically arranged vertical plates, a plurality of supporting columns which are arranged at intervals in the vertical direction are arranged on the two vertical plates, the supporting columns on the two vertical plates symmetrically form a plurality of horizontal bearing positions, and the lifting structure is used for driving the supporting frame to move in the vertical direction;
the conveying mechanism is used for conveying the silicon wafer into the bearing position;
the grabbing mechanism comprises a plurality of substrates which are arranged at intervals along the vertical direction, the arrangement intervals of the substrates correspond to the arrangement intervals of the support columns on the vertical plates, and sucking disc assemblies are arranged on the substrates.
In one embodiment of the utility model, the grabbing mechanism comprises a mounting plate, a plurality of grooves parallel to each other are arranged on the mounting plate at intervals, and the base plate is respectively inserted into each groove.
In one embodiment of the utility model, the chuck assembly comprises a vacuum chuck connected to the substrate, the vacuum chuck being connected to an air tube, the air tube being connected to a vacuum generating device.
In one embodiment of the utility model, a plurality of jacks which are arranged at intervals in the vertical direction are arranged on the vertical plate at intervals, the jacks are horizontally arranged, and the support columns are respectively inserted into the jacks.
In one embodiment of the utility model, the vertical plate is provided with a plurality of pin holes penetrating through the insertion holes respectively, the side surface near one end of the support column is vertically provided with a connecting hole matched with the pin holes, and the support column is inserted into the insertion holes and fixed through a pin shaft.
In one embodiment of the present utility model, the support frame further includes a transverse plate, two ends of the transverse plate are respectively connected to the two vertical plates, two first driving sources are symmetrically disposed on the transverse plate, and output ends of the first driving sources are respectively connected to a clamping plate extending in a vertical direction, and the two clamping plates are respectively located at two sides of each bearing position and are symmetrical to each other.
In one embodiment of the utility model, the conveying mechanism comprises a bracket, two groups of belt assemblies extending to the supporting frame are symmetrically arranged on the bracket, and a second driving source is arranged on the bracket and drives the two belt assemblies to synchronously rotate.
In one embodiment of the utility model, the free ends of the support columns on both of said risers are spaced apart from each other to form a passageway extending in the vertical direction.
In an embodiment of the present utility model, the lifting structure may be a linear motion module, the linear motion module is disposed vertically, and an output end of the linear motion module is connected to the support frame.
A production line comprising a silicon wafer insert device as claimed in any one of the preceding claims.
Compared with the prior art, the technical scheme of the utility model has the following advantages:
the utility model relates to a silicon wafer inserting device and a production line, comprising a variable pitch mechanism, a conveying mechanism and a grabbing mechanism, wherein the variable pitch mechanism comprises a supporting frame and a lifting structure, the lifting structure is used for driving the supporting frame to move in the vertical direction, the supporting frame comprises two vertical plates, support columns which are arranged at intervals in the vertical direction are arranged on the two vertical plates, and the support columns on the two vertical plates are symmetrically arranged in pairs to form a plurality of bearing positions for bearing silicon wafers; the conveying mechanism is used for conveying the silicon wafer to the bearing position; the grabbing mechanism can grab the silicon wafers arranged on the supporting frame at the same time; the silicon wafer inserting device can be used for rapidly arranging silicon wafers at preset intervals, the whole conveying and arranging processes of the silicon wafers are automatically completed through a machine, the consumed time is small, the efficiency is high, and the possibility of damaging and polluting the silicon wafers is low; and can snatch the silicon chip that arranges simultaneously through supporting snatch mechanism, can improve the efficiency of inserted sheet and reduce the cost of production, whole device's simple structure, installation and maintenance are convenient, are suitable for the practicality.
Drawings
In order that the utility model may be more readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings, in which
FIG. 1 is a perspective view of a variable pitch mechanism of a silicon wafer handling device according to a preferred embodiment of the present utility model;
FIG. 2 is a schematic structural view of a support frame of a variable pitch mechanism of a wafer insertion device according to a preferred embodiment of the present utility model;
FIG. 3 is a schematic view of a transport mechanism of a silicon wafer handling device according to a preferred embodiment of the present utility model;
FIG. 4 is a schematic view of the grasping mechanism of the wafer insert device according to the preferred embodiment of the present utility model;
FIG. 5 is a schematic structural view of a mounting plate of a gripping mechanism of a silicon wafer handling device according to a preferred embodiment of the present utility model;
fig. 6 is a schematic structural view of a substrate of a gripping mechanism of a silicon wafer insertion device according to a preferred embodiment of the present utility model.
Description of the specification reference numerals: 1. a pitch-variable mechanism; 11. a support frame; 12. a lifting structure; 111. a riser; 112. a support column; 113. a clamping plate; 2. a conveying mechanism; 21. a bracket; 22. a belt assembly; 23. a second driving source; 3. a grabbing mechanism; 31. a substrate; 32. a suction cup assembly; 33. a mounting plate; 331. a groove.
Detailed Description
The present utility model will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the utility model and practice it.
Referring to fig. 1-6, a silicon wafer inserting device of the present utility model comprises,
the pitch-changing mechanism 1, the pitch-changing mechanism 1 comprises a supporting frame 11 and a lifting structure 12, the supporting frame 11 comprises two vertical plates 111 which are symmetrically arranged, a plurality of supporting columns 112 which are arranged at intervals in the vertical direction are arranged on the two vertical plates 111, the supporting columns 112 on the two vertical plates 111 symmetrically form a plurality of horizontal bearing positions, and the lifting structure 12 is used for driving the supporting frame 11 to move in the vertical direction;
the conveying mechanism 2 is used for conveying the silicon wafers into the bearing positions;
the grabbing mechanism 3, the grabbing mechanism 3 includes a plurality of base plates 31 which are arranged at intervals along the vertical direction, the arrangement space of the base plates 31 corresponds to the arrangement space of the support columns 112 on each vertical plate 111, and the base plates 31 are provided with sucking disc assemblies 32.
Specifically, the support columns 112 are all arranged horizontally, the support columns 112 on the two vertical plates 111 are correspondingly formed into a plurality of horizontal bearing positions, the bearing positions are used for bearing silicon wafers, and the silicon wafers conveyed by the conveying mechanism 2 are ordered at preset intervals by the plurality of bearing positions which are arranged at intervals in the vertical direction; the grabbing mechanism 3 comprises a vertically arranged mounting plate 33, a plurality of horizontal base plates 31 which are arranged at intervals in the vertical direction are arranged on the mounting plate 33 at intervals, the arrangement intervals of the base plates 31 correspond to the arrangement intervals of the supporting columns 112 (or the arrangement intervals of bearing positions) on the vertical plates 111, sucking disc assemblies 32 for sucking silicon wafers are arranged on the base plates 31, the sucking ends of the sucking disc assemblies 32 face downwards, the mounting plate 33 is connected through a mechanical arm, and therefore the grabbing mechanism 3 is operated to grab a plurality of silicon wafers on the supporting frame 11 simultaneously.
The working process comprises the following steps: a plurality of silicon wafers are conveyed to the variable pitch mechanism 1 through the conveying mechanism 2, one silicon wafer positioned in front of the conveying mechanism 2 is conveyed to one bearing position at the uppermost part of the supporting frame 11, the lifting structure 12 lifts the supporting frame 11 to enable the position of the next bearing position of the supporting frame 11 to correspond to the position of the conveying mechanism 2, the next silicon wafer on the conveying mechanism 2 is conveyed to the bearing position, and the like until the silicon wafers are conveyed to each bearing position on the supporting frame 11 respectively; the manipulator drives the grabbing mechanism 3 to move to the supporting frame 11, so that each substrate 31 of the grabbing mechanism 3 corresponds to the position of each bearing position of the supporting frame 11, and the chuck assemblies 32 on each substrate 31 simultaneously grab a plurality of silicon wafers on each bearing position and perform the inserting operation.
It is conceivable that the silicon wafer inserting device can be used for quickly arranging silicon wafers at preset intervals, the whole conveying and arranging process of the silicon wafers is automatically completed through a machine, the consumed time is small, the efficiency is high, and the possibility of damaging and polluting the silicon wafers is low; and can snatch the silicon chip that arranges simultaneously through supporting snatch mechanism 3, can improve the efficiency of inserted sheet and reduce the cost of production, be suitable for practicality.
Referring to fig. 4-6, further, the grabbing mechanism 3 includes a mounting plate 33, a plurality of mutually parallel grooves 331 are disposed on the mounting plate 33 at intervals, and the base plate 31 is respectively inserted into each groove 331. Specifically, the mounting plate 33 is vertically disposed, and a plurality of horizontal grooves 331 are disposed on the mounting plate 33 and arranged at intervals along the vertical direction, and one ends of the plurality of substrates 31 are respectively inserted into one of the grooves 331. More preferably, through holes are formed in the bottoms of the grooves 331, bolt holes corresponding to the through holes in the bottoms of the grooves 331 are formed in the inserted ends of the substrates 31 and the grooves 331, and the substrates 31 are fixed through bolts, so that stability of the substrates 31 is guaranteed.
Further, the chuck assembly 32 includes a vacuum chuck connected to the substrate 31, and a gas pipe connected to the vacuum chuck and a vacuum generating device.
Further, a plurality of jacks which are arranged at intervals in the vertical direction are arranged on the vertical plate 111 at intervals, the jacks are horizontally arranged, and the support columns 112 are respectively inserted into the jacks.
Further, a plurality of pin holes penetrating through the insertion holes are formed in the vertical plate 111, connection holes matched with the pin holes are vertically formed in the side face, close to one end of the support column 112, and the support column 112 is inserted into the insertion holes and fixed through the pin shafts. Specifically, the end of the support column 112 provided with the connecting hole is inserted into the jack, the connecting hole on the support column 112 corresponds to the position of the pin hole penetrating through the jack, and the pin shaft sequentially penetrates through the pin hole and the connecting hole to fix the support column 112, so that the stability of each support column 112 is ensured.
Further, the supporting frame 11 further includes a transverse plate, two ends of the transverse plate are respectively connected with the two vertical plates 111, two first driving sources are symmetrically arranged on the transverse plate, the output ends of the first driving sources are respectively connected with a clamping plate 113 extending in the vertical direction, and the two clamping plates 113 are respectively located at two sides of each bearing position and are mutually symmetrical. Specifically, after the silicon wafers are conveyed onto the supporting frame 11 through the conveying mechanism 2, the positions of the silicon wafers are different, the two clamping plates are driven to synchronously move in opposite directions through the two first driving sources, the positions of the silicon wafers on the supporting frame 11 are adjusted, the silicon wafers are located in the middle of the supporting frame 11, and the grabbing mechanism 3 is convenient to grab the silicon wafers.
Referring to fig. 3, further, the conveying mechanism 2 includes a bracket 21, two groups of belt assemblies 22 extending toward the supporting frame 11 are symmetrically disposed on the bracket 21, and a second driving source 23 is disposed on the bracket 21, where the second driving source 23 drives the two belt assemblies 22 to rotate synchronously. It is contemplated that a synchronous belt assembly may also be used to carry out the transfer of the silicon wafer.
Further, as shown in fig. 1 and 2, the free ends of the support columns 112 on the two risers 111 are spaced apart from each other to form passages extending in the vertical direction. It is conceivable that the passage between the support columns 112 on the two risers 111 allows the gripping mechanism 3 sufficient space for gripping action, to a certain extent improving the efficiency of the overall production.
Further, the lifting structure 12 may be a linear motion module, the linear motion module is vertically disposed, and an output end of the linear motion module is connected to the supporting frame 11. The lifting structure 12 may also be a cylinder.
A production line comprising a silicon wafer insert device according to any one of the above. The silicon wafer inserting device can be applied to various silicon wafer production lines.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present utility model will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the utility model.
Claims (10)
1. The utility model provides a silicon chip inserted sheet device which characterized in that: comprising the steps of (a) a step of,
the pitch-changing mechanism comprises a supporting frame and a lifting structure, the supporting frame comprises two symmetrically arranged vertical plates, a plurality of supporting columns which are arranged at intervals in the vertical direction are arranged on the two vertical plates, the supporting columns on the two vertical plates symmetrically form a plurality of horizontal bearing positions, and the lifting structure is used for driving the supporting frame to move in the vertical direction;
the conveying mechanism is used for conveying the silicon wafer into the bearing position;
the grabbing mechanism comprises a plurality of substrates which are arranged at intervals along the vertical direction, the arrangement intervals of the substrates correspond to the arrangement intervals of the support columns on the vertical plates, and sucking disc assemblies are arranged on the substrates.
2. The wafer insert device of claim 1, wherein: the grabbing mechanism comprises a mounting plate, a plurality of grooves which are parallel to each other are formed in the mounting plate at intervals, and the base plates are respectively inserted into the grooves.
3. The wafer insert device of claim 2, wherein: the sucking disc subassembly includes vacuum chuck, vacuum chuck with the base plate links to each other, vacuum chuck is connected with the trachea, the trachea is connected with vacuum generating device.
4. The wafer insert device of claim 1, wherein: the vertical plate is provided with a plurality of jacks which are arranged at intervals in the vertical direction at intervals, the jacks are horizontally arranged, and the support columns are respectively inserted into the jacks.
5. The wafer insert device of claim 4, wherein: the vertical plate is provided with a plurality of pin holes penetrating through the insertion holes respectively, the side face, close to one end of the support column, of the vertical plate is vertically provided with a connecting hole matched with the pin holes, and the support column is inserted into the insertion holes and fixed through a pin shaft.
6. The wafer insert device of claim 1, wherein: the supporting frame further comprises a transverse plate, two ends of the transverse plate are respectively connected with the two vertical plates, two first driving sources are symmetrically arranged on the transverse plate, the output ends of the first driving sources are respectively connected with a clamping plate extending in the vertical direction, and the two clamping plates are respectively located on two sides of each bearing position and are mutually symmetrical.
7. The wafer insert device of claim 1, wherein: the conveying mechanism comprises a support, two groups of belt assemblies extending to the supporting frame are symmetrically arranged on the support, a second driving source is arranged on the support, and the second driving source drives the two belt assemblies to synchronously rotate.
8. The wafer insert device of claim 1, wherein: the free ends of the support columns on the two vertical plates are mutually separated to form a passage extending in the vertical direction.
9. The wafer insert device of claim 1, wherein: the lifting structure can be a linear motion module, the linear motion module is vertically arranged, and the output end of the linear motion module is connected with the supporting frame.
10. A production line, characterized in that: a wafer insert device comprising any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320606582.2U CN219998156U (en) | 2023-03-24 | 2023-03-24 | Silicon wafer inserting device and production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320606582.2U CN219998156U (en) | 2023-03-24 | 2023-03-24 | Silicon wafer inserting device and production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219998156U true CN219998156U (en) | 2023-11-10 |
Family
ID=88613221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320606582.2U Active CN219998156U (en) | 2023-03-24 | 2023-03-24 | Silicon wafer inserting device and production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219998156U (en) |
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2023
- 2023-03-24 CN CN202320606582.2U patent/CN219998156U/en active Active
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