CN219950851U - High-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass - Google Patents
High-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass Download PDFInfo
- Publication number
- CN219950851U CN219950851U CN202321326608.4U CN202321326608U CN219950851U CN 219950851 U CN219950851 U CN 219950851U CN 202321326608 U CN202321326608 U CN 202321326608U CN 219950851 U CN219950851 U CN 219950851U
- Authority
- CN
- China
- Prior art keywords
- layer
- dielectric
- metal
- film
- emissivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 33
- 239000004332 silver Substances 0.000 title claims abstract description 33
- 239000005344 low-emissivity glass Substances 0.000 title claims abstract description 22
- 238000002834 transmittance Methods 0.000 title abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 303
- 229910052751 metal Inorganic materials 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 48
- 239000011521 glass Substances 0.000 claims abstract description 38
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 33
- 239000000956 alloy Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000010521 absorption reaction Methods 0.000 claims abstract description 26
- 239000011241 protective layer Substances 0.000 claims abstract description 24
- 230000003647 oxidation Effects 0.000 claims description 58
- 238000007254 oxidation reaction Methods 0.000 claims description 58
- 150000004706 metal oxides Chemical group 0.000 claims description 37
- 229910044991 metal oxide Inorganic materials 0.000 claims description 34
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 14
- 150000004767 nitrides Chemical class 0.000 claims description 13
- 229910007717 ZnSnO Inorganic materials 0.000 claims description 11
- 230000035699 permeability Effects 0.000 claims description 9
- 229910052755 nonmetal Inorganic materials 0.000 claims description 8
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 6
- 239000006096 absorbing agent Substances 0.000 claims 2
- 230000003064 anti-oxidating effect Effects 0.000 abstract description 9
- 239000003963 antioxidant agent Substances 0.000 abstract description 8
- 230000003078 antioxidant effect Effects 0.000 abstract description 8
- 235000006708 antioxidants Nutrition 0.000 abstract 2
- 238000005496 tempering Methods 0.000 description 20
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 15
- 238000000576 coating method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 229910001120 nichrome Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000007888 film coating Substances 0.000 description 4
- 238000009501 film coating Methods 0.000 description 4
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- OLFCLHDBKGQITG-UHFFFAOYSA-N chromium(3+) nickel(2+) oxygen(2-) Chemical compound [Ni+2].[O-2].[Cr+3] OLFCLHDBKGQITG-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910003087 TiOx Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Surface Treatment Of Glass (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model provides high-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass, which comprises a glass substrate, wherein a bottom protective layer, a first dielectric anti-oxidation layer, a first metal low-emissivity layer, a first alloy absorption layer, a second dielectric anti-oxidation layer, a first dielectric interference layer, a third dielectric anti-oxidation layer, a second metal low-emissivity layer, a second alloy absorption layer, a fourth dielectric anti-oxidant layer, a second dielectric interference layer, a fifth dielectric anti-emissivity layer, a third metal low-emissivity layer, a third alloy absorption layer, a sixth dielectric anti-oxidant layer, a third dielectric interference layer and a top protective layer are sequentially arranged on one side of the glass substrate from inside to outside.
Description
Technical Field
The utility model belongs to the field of building glass, and particularly relates to high-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass.
Background
Glass is an important building material, and the use amount of glass in the building industry is increasing along with the increasing demand for building decoration. However, today people pay more attention to the problems of heat control, refrigeration costs and comfort balance of internal sunlight projection, in addition to their aesthetic and appearance characteristics, when selecting glass doors and windows of buildings. This has made Low emissivity glass (Low-E glass) a focus of attention in coated glass.
In the prior art, the low-medium radiation glass has the advantages that the lighting effect is improved along with the rising of the transmission, the sun-shading performance is reduced, and the glass with high transmission and still excellent sun-shading performance is provided.
The utility model discloses a heat-bendable infrared thermal barrier energy-saving coated glass with an authority of CN 205416573U, which is disclosed in 8 th month 3 rd day, wherein 20 layers of films are sequentially overlapped on the surface of a glass substrate, the 20 layers of films are sequentially overlapped on the glass substrate to form a 1 st layer which is a glass substrate, 2 nd and 3 rd layers which are dielectric interference layers, 4 th layers which are dielectric antioxidant layers, 5 th layers which are metal low-emissivity layers, 6 th layers which are dielectric antioxidant layers, 7 th and 8 th layers which are dielectric interference layers, 9 th layers which are dielectric antioxidant layers, 10 th layers which are metal low-emissivity layers, 11 th layers which are alloy light absorbing layers, 12 th layers which are dielectric antioxidant layers, 13 th and 14 th layers which are dielectric interference layers, 15 th layers which are dielectric antioxidant layers, 16 th layers which are metal low-emissivity layers, 17 th layers which are alloy light absorbing layers, 18 th layers which are dielectric antioxidant layers, and 19 th and 20 th and 21 th layers which are composite dielectric protective layers. But it cannot solve the problem of having both high transparency and sunshade performance.
Disclosure of Invention
The utility model provides high-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass, the photo-thermal ratio of which reaches 2.05 (national standard), belongs to high-performance high-transmittance three-silver low, has the characteristics of high transmittance and low sunshade, can be used for processing heat-bending toughened in different places, and has strong market fluxion.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the high-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass comprises a glass substrate, wherein a bottom protective layer, a first dielectric medium oxidation resistant layer, a first metal low-emissivity layer, a first alloy absorbing layer, a second dielectric medium oxidation resistant layer, a first dielectric medium interference layer, a third dielectric medium oxidation resistant layer, a second metal low-emissivity layer, a second alloy absorbing layer, a fourth dielectric medium oxidation resistant layer, a second dielectric medium interference layer, a fifth dielectric medium oxidation resistant layer, a third metal low-emissivity layer, a third alloy absorbing layer, a sixth dielectric medium oxidation resistant layer, a third dielectric medium interference layer and a top protective layer are sequentially arranged on one side of the glass substrate from inside to outside.
The thickness of the glass substrate is 6-12mm;
the thickness of the bottom protective layer is 15-30 nm, and the bottom protective layer is a metal oxide film or a nitride film, preferably a ZnSnO film;
the thickness of the first dielectric oxidation resistance layer is 10-15 nm, and the first dielectric oxidation resistance layer is a metal oxide film layer and is selected from a ZnO film layer or an AZO film layer (zinc aluminum oxide film layer);
the thickness of the first metal low-radiation layer is 15-17 nm, and the first metal low-radiation layer is a metal film layer and is selected from an Ag film layer or a Cu film layer;
the thickness of the first alloy absorption layer is 0.3-1 nm, and the first alloy absorption layer is a metal alloy film or a metal oxide film and is selected from a NiCr film or a NiCrOx film; x represents incomplete oxidation;
the thickness of the second dielectric oxidation resistant layer is 5-10 nm, and the second dielectric oxidation resistant layer is a metal oxide film layer and is selected from AZO film layers (zinc aluminum oxide film layers);
the thickness of the first dielectric interference layer is 60-65 nm, and the first dielectric interference layer is a metal oxide film layer or a metal nitride film layer or a non-metal nitride film layer, and is selected from ZnSnO film layer or Si 3 N 4 A film layer;
the thickness of the third dielectric oxidation resistant layer is 5-10 nm, and the third dielectric oxidation resistant layer is a metal oxide film layer and is selected from AZO film layers (zinc aluminum oxide film layers);
the thickness of the second metal low-radiation layer is 15-17 nm, and the second metal low-radiation layer is a metal film layer and is selected from Ag film layers;
the thickness of the second alloy absorption layer is 0.3-1 nm, and the second alloy absorption layer is a metal alloy film or a metal oxide film and is selected from a NiCr film or a NiCrOx film; x represents incomplete oxidation;
the thickness of the fourth dielectric oxidation resistant layer is 5-10 nm, and the fourth dielectric oxidation resistant layer is a metal oxide film layer and is selected from AZO film layers (zinc aluminum oxide film layers);
the thickness of the second dielectric interference layer is 60-70 nm, and the second dielectric interference layer is a metal oxide film layer or a metal nitride film layer or a non-metal nitride film layer, and is selected from ZnSnO film layer or Si 3 N 4 A film layer;
the thickness of the fifth dielectric oxidation resistance layer is 5-10 nm, and the fifth dielectric oxidation resistance layer is a metal oxide film layer and is selected from a ZnO film layer or an AZO film layer (zinc aluminum oxide film layer);
the thickness of the third metal low-radiation layer is 15 nm-20 nm, and the third metal low-radiation layer is a metal film layer and is selected from Ag film layers;
the thickness of the third alloy absorption layer is 0.3 nm-1 nm, and the third alloy absorption layer is a metal alloy film or a metal oxide film and is selected from a NiCr film or a NiCrOx film; x represents incomplete oxidation;
the thickness of the sixth dielectric oxidation resistant layer is 10 nm-15 nm, and the sixth dielectric oxidation resistant layer is a metal oxide film layer and is selected from AZO film layers (zinc oxide aluminum film layers);
the third dielectric interference layer is 15-30 nm, is a metal oxide film layer or a non-metal oxide film layer and is selected from SiO 2 A film or ZnSnO film;
the thickness of the top protective layer is 5-10 nm, and the top protective layer is a metal oxide film layer selected from TiOx film layer and ZrO film layer 2 A film layer; x represents incomplete oxidation.
The product of the utility model takes high performance as development purpose, according to the difference contrast of the densities of the deposited silver layers on the surfaces of different substrates, the more compact the silver layer is deposited, the lower the resistivity of the silver layer with the same thickness can be achieved, the lower the resistivity is,the lower the emissivity corresponds to the sunshade coefficient, the better the performance. To achieve the aim, the utility model replaces the use of the silicon nitride material with larger conventional stress according to the characteristics of the material, the ZnSnO is used as the bottom layer (bottom protection layer), and the ZnSnO/SiO is used as the third dielectric interference layer and the top protection layer 2 The compactness of the silver layer after being toughened is effectively improved. In order to better improve the oxidation resistance of the film, the surface of the silver layer is protected by nickel-chromium alloy and AZO in a composite manner, and the top layer is protected by zirconium oxide or titanium oxide. Through the structural design of the film layer, after tempering, the three-silver transmittance of the oxide substrate (when the bottom protective layer is preferably a metal oxide film layer) is higher than 74%, the transmission color is more neutral, the photo-thermal ratio is 2.05, the oxide substrate has obvious effect on improving the photo-thermal ratio of the product, and the product performance reaches the advanced level in the industry.
Drawings
FIG. 1 is a schematic diagram of a high performance heat bendable high permeability tempered three-silver low emissivity glass of the present utility model;
in the figure, the glass substrate is 1-, the protective layer is 2-bottom, the first dielectric oxidation-resistant layer is 3-first, the first metal low-emissivity layer is 4-, the first alloy absorption layer is 5-, the second dielectric oxidation-resistant layer is 6-second, the first dielectric interference layer is 7-third, the dielectric oxidation-resistant layer is 8-third, the second metal low-emissivity layer is 9-second, the second alloy absorption layer is 10-second, the fourth dielectric oxidation-resistant layer is 11-fourth, the second dielectric interference layer is 12-second, the fifth dielectric oxidation-resistant layer is 13-third, the third metal low-emissivity layer is 14-third, the third alloy absorption layer is 15-third, the third dielectric oxidation-resistant layer is 16-sixth, the third dielectric interference layer is 17-third, and the protective layer is 18-top.
Detailed Description
The utility model provides high-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass, which comprises a glass substrate 1, wherein a bottom protective layer 2, a first dielectric anti-oxidation layer 3, a first metal low-emissivity layer 4, a first alloy absorption layer 5, a second dielectric anti-oxidation layer 6, a first dielectric interference layer 7, a third dielectric anti-oxidation layer 8, a second metal low-emissivity layer 9, a second alloy absorption layer 10, a fourth dielectric anti-emissivity layer 11, a second dielectric interference layer 12, a fifth dielectric anti-emissivity layer 13, a third metal low-emissivity layer 14, a third alloy absorption layer 15, a sixth dielectric anti-emissivity layer 16, a third dielectric interference layer 17 and a top protective layer 18 are sequentially arranged on one side of the glass substrate 1 from inside to outside.
The thickness of the glass substrate is 6-12mm;
the thickness of the bottom protective layer is 15-30 nm, and the bottom protective layer is a metal oxide film or a nitride film and is selected from ZnSnO film;
the thickness of the first dielectric oxidation resistance layer is 10-15 nm, and the first dielectric oxidation resistance layer is a metal oxide film layer and is selected from a ZnO film layer or an AZO film layer (zinc aluminum oxide film layer);
the thickness of the first metal low-radiation layer is 15-17 nm, and the first metal low-radiation layer is a metal film layer and is selected from an Ag film layer or a Cu film layer;
the thickness of the first alloy absorption layer is 0.3 nm-1 nm and is selected from a NiCr film layer or a NiCrOx film layer; x represents incomplete oxidation;
the thickness of the second dielectric oxidation resistant layer is 5-10 nm, and the second dielectric oxidation resistant layer is a metal oxide film layer and is selected from AZO film layers (zinc aluminum oxide film layers);
the thickness of the first dielectric interference layer is 60-65 nm, and the first dielectric interference layer is a metal oxide film layer or a metal nitride film layer or a non-metal nitride film layer, and is selected from ZnSnO film layer or Si 3 N 4 A film layer;
the thickness of the third dielectric oxidation resistant layer is 5-10 nm, and the third dielectric oxidation resistant layer is a metal oxide film layer and is selected from AZO film layers (zinc aluminum oxide film layers);
the thickness of the second metal low-radiation layer is 15-17 nm, and the second metal low-radiation layer is a metal film layer and is selected from Ag film layers;
the thickness of the second alloy absorption layer is 0.3-1 nm, and the second alloy absorption layer is a metal alloy film or a metal oxide film and is selected from a NiCr film or a NiCrOx film; x represents incomplete oxidation;
the thickness of the fourth dielectric oxidation resistant layer is 5-10 nm, and the fourth dielectric oxidation resistant layer is a metal oxide film layer and is selected from AZO film layers (zinc aluminum oxide film layers);
the thickness of the second dielectric interference layer is 60-70 nm, and the second dielectric interference layer is a metal oxide film layer or a metal nitride film layer or a non-metal nitride film layer, and is selected from ZnSnO film layer or Si 3 N 4 A film layer;
the thickness of the fifth dielectric oxidation resistance layer is 5-10 nm, and the fifth dielectric oxidation resistance layer is a metal oxide film layer and is selected from a ZnO film layer or an AZO film layer (zinc aluminum oxide film layer);
the thickness of the third metal low-radiation layer is 15 nm-20 nm, and the third metal low-radiation layer is a metal film layer and is selected from Ag film layers;
the thickness of the third alloy absorption layer is 0.3 nm-1 nm, and the third alloy absorption layer is a metal alloy film or a metal oxide film and is selected from a NiCr film or a NiCrOx film; x represents incomplete oxidation;
the thickness of the sixth dielectric oxidation resistant layer is 10 nm-15 nm, and the sixth dielectric oxidation resistant layer is a metal oxide film layer and is selected from AZO film layers (zinc oxide aluminum film layers);
the third dielectric interference layer is 15-30 nm, is a metal oxide film layer or a non-metal oxide film layer and is selected from SiO 2 A film or ZnSnO film;
the thickness of the top protective layer is 5-10 nm, and the top protective layer is a metal oxide film layer selected from TiOx film layer and ZrO film layer 2 A film layer; x represents incomplete oxidation.
The preparation method of the high-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass specifically comprises the following steps of:
1) Coating a substrate: the glass substrate is a float raw sheet;
2) Cleaning: the film is coated by a film developing machine special for film coating, the front surface of the film coating must be dried, impurities and static electricity cannot exist, deionized water is used for cleaning, and the water quality resistance is required to be more than 10 mu s/cm;
3) Coating: the magnetron sputtering vacuum coating mode is adopted to deposit each film layer, and the vacuum degree is ensured to be lower than 3.5x10 before production or experiment -6 bar, the targets of various coating materials are operated normally. The craftsman adjusts the color before tempering according to the standard color spectrum, after adjusting in place, the sample wafer is subjected to tempering and trial burning, the color after tempering is ensured to be consistent with the standard color, and if the difference exists, the correction is carried out by adjusting the color before tempering. After the adjustment is qualified, the qualified products are processed, and the glass is isolated and packaged after being coated with the film.
4) Tempering: the preheating time is 270S, the preheating upper temperature is 550 ℃, the preheating lower temperature is 550 ℃, the high-temperature heating time is 270S, the high-temperature upper temperature is 670 ℃, the high-temperature upper temperature is 665 ℃, the convection fan is 40%, the reinforced wind pressure is 20%, the reinforced time is 150S, and the cooling time is 100S.
5) Hollow working procedure: because the three-silver glass is silvered, the glass must be hollow to prevent oxidation, and the hollow procedure uses aluminium frame, butyl rubber and structural adhesive to make the single glass into double-piece or multi-piece hollow composite glass, so that the glass has better sound-insulating and heat-insulating effects.
Example 1
The high-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass comprises a glass substrate 1, wherein a bottom protective layer 2, a first dielectric anti-oxidation layer 3, a first metal low-emissivity layer 4, a first alloy absorption layer 5, a second dielectric anti-oxidation layer 6, a first dielectric interference layer 7, a third dielectric anti-oxidation layer 8, a second metal low-emissivity layer 9, a second alloy absorption layer 10, a fourth dielectric anti-emissivity layer 11, a second dielectric interference layer 12, a fifth dielectric anti-emissivity layer 13, a third metal low-emissivity layer 14, a third alloy absorption layer 15, a sixth dielectric anti-emissivity layer 16, a third dielectric interference layer 17 and a top protective layer 18 are sequentially arranged on one side of the glass substrate 1 from inside to outside, and the thickness and materials of each film layer are shown in table 1.
The preparation method of the high-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass specifically comprises the following steps:
1) Coating a substrate: the glass substrate is a float raw sheet;
2) Cleaning: the film is coated by a film developing machine special for film coating, the front surface of the film coating must be dried, impurities and static electricity cannot exist, deionized water is used for cleaning, and the water quality resistance is required to be more than 10 mu s/cm;
3) Coating: the magnetron sputtering vacuum coating mode is adopted to deposit each film layer, and the vacuum degree is ensured to be lower than 3.5 multiplied by 10 before production or experiment -6 bar, the targets of various coating materials are operated normally. The craftsman adjusts the color before tempering according to the standard color spectrum, after adjusting in place, the sample wafer is subjected to tempering and trial burning, the color after tempering is ensured to be consistent with the standard color, and if the difference exists, the correction is carried out by adjusting the color before tempering. After the debugging is qualified, the genuine product starts to be processed and platedAnd isolating and packaging the glass after the film. The specific coating process, targets and parameters used are shown in table 1.
4) Tempering: the preheating time is 270S, the preheating upper temperature is 550 ℃, the preheating lower temperature is 550 ℃, the high-temperature heating time is 270S, the high-temperature upper temperature is 670 ℃, the high-temperature upper temperature is 665 ℃, the convection fan is 40%, the reinforced wind pressure is 20%, the reinforced time is 150S, and the cooling time is 100S.
5) Hollow working procedure: 6C+12A+6C structural product (6 mm toughened glass+12 mm hollow+6 mm laminated glass).
The color pairs before and after tempering of the product prepared in example 1 are shown in Table 2. Example 1 post-tempering thermal performance is shown in table 3 below.
Table 1 example 1 parameters of each film layer
| Sequence number | Cathode type | Material | Gas ratio | Film thickness (nm) |
| 1 | Glass substrate | Glass | / | 6mm |
| 2 | Rotary target | Zinc tin oxide | Ar:O 2 ＝550:750 | 27 |
| 3 | Rotary target | Zinc aluminum oxide | Ar:O 2 ＝1000:800 | 8 |
| 4 | Planar target | Silver (Ag) | Ar＝1000 | 15.1 |
| 5 | Planar target | Nickel chromium oxide | Ar:O 2 ＝1000：50 | 1 |
| 6 | Rotary target | AZO | Ar:O 2 ＝1000:30 | 9 |
| 7 | Rotary target | Zinc tin oxide | Ar:O 2 ＝550:750 | 58 |
| 8 | Rotary target | Zinc aluminum oxide | Ar:O 2 ＝1000:800 | 8 |
| 9 | Planar target | Silver (Ag) | Ar＝1000 | 16.3 |
| 10 | Planar target | Nickel chromium oxide | Ar:O 2 ＝1000:30 | 0.3 |
| 11 | Rotary target | AZO | Ar:O 2 ＝1000:30 | 9 |
| 12 | Rotary target | Zinc tin oxide | Ar:O 2 ＝550:750 | 58 |
| 13 | Rotary target | Zinc aluminum oxide | Ar:O 2 ＝1000:800 | 8 |
| 14 | Planar target | Silver (Ag) | Ar＝1000 | 18.5 |
| 15 | Planar target | Nickel chromium oxide | Ar:O 2 ＝1000:30 | 0.5 |
| 16 | Rotary target | AZO | Ar:O 2 ＝1000:30 | 10 |
| 17 | Rotary target | Zinc tin oxide | Ar:O 2 ＝550:750 | 25 |
| 18 | Rotary target | Zirconia (zirconia) | Ar:O 2 ＝800:50 | 10 |
Table 2 example 1 color comparison before and after tempering
TABLE 3 thermal property after tempering of example 1
After tempering, the three-silver transmittance of the oxide substrate is higher than 74%, the transmitted color is more neutral, the photo-thermal ratio is 2.05, the oxide substrate has obvious effect on improving the photo-thermal ratio of the product, and the product performance reaches the advanced level in the industry
Example 2 (as a comparison)
The high-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass comprises a glass substrate 1, wherein each layer is sequentially arranged on one side of the glass substrate 1 from inside to outside, and the thickness and the materials of each film layer are shown in table 4.
TABLE 4 parameters of the various film layers of example 2
Example 2 the preparation was carried out in the same way as in the example, the specific parameters being shown in table 1.
The color pairs before and after tempering of the product of example 2 are shown in table 5. Example 1 post-tempering thermal performance is shown in table 6 below.
TABLE 5 example 2 color comparison before and after tempering
TABLE 6 thermal property after tempering of example 2
Example 2 is used as a comparison, and by comparing the photo-thermal ratio, it can be seen that the thermal performance of example 2 is obviously worse than that of example 1, and the anti-reflection effect of the oxide substrate of example 1 is more obvious and the performance is more excellent.
Claims (9)
1. The high-performance heat-bendable high-permeability toughened three-silver low-emissivity glass is characterized by comprising a glass substrate, wherein a bottom protective layer, a first dielectric oxidation resistant layer, a first metal low-emissivity layer, a first alloy absorption layer, a second dielectric oxidation resistant layer, a first dielectric interference layer, a third dielectric oxidation resistant layer, a second metal low-emissivity layer, a second alloy absorption layer, a fourth dielectric oxidation resistant layer, a second dielectric interference layer, a fifth dielectric oxidation resistant layer, a third metal low-emissivity layer, a third alloy absorption layer, a sixth dielectric oxidation resistant layer, a third dielectric interference layer and a top protective layer are sequentially arranged on one side of the glass substrate from inside to outside.
2. The high performance heat bendable high permeability tempered three silver low emissivity glass of claim 1, wherein said primer protective layer is a metal oxide film or a nitride film.
3. The high performance heat bendable high permeability tempered three silver low emissivity glass of claim 1 or 2, wherein the ZnSnO film layer.
4. The high performance heat bendable high permeability toughened three-silver low emissivity glass of claim 1 or 2, wherein said first dielectric oxidation resistant layer, said second dielectric oxidation resistant layer, third dielectric oxidation resistant layer, fourth dielectric oxidation resistant layer, fifth dielectric oxidation resistant layer and sixth dielectric oxidation resistant layer are metal oxide film layers.
5. The high performance heat bendable high permeability tempered three silver low emissivity glass of claim 1 or 2, wherein said first metal low emissivity layer, second metal low emissivity layer and third metal low emissivity layer are metal film layers.
6. The high performance heat bendable high permeability tempered three-silver low emissivity glass of claim 1 or 2, wherein said first alloy absorber layer, second alloy absorber layer is a metal alloy film or a metal oxide film.
7. The high performance heat bendable high permeability tempered three silver low emissivity glass of claim 1 or 2, wherein the first dielectric interference layer or the second dielectric interference layer is a metal oxide film or a metal nitride film or a non-metal nitride film.
8. The high performance heat bendable high permeability tempered three silver low emissivity glass of claim 1 or 2, wherein said third dielectric interference layer is a metal oxide film or a non-metal oxide film.
9. The high performance heat bendable high permeability tempered three silver low emissivity glass of claim 1 or 2, wherein said top protective layer is a metal oxide film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321326608.4U CN219950851U (en) | 2023-05-29 | 2023-05-29 | High-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321326608.4U CN219950851U (en) | 2023-05-29 | 2023-05-29 | High-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219950851U true CN219950851U (en) | 2023-11-03 |
Family
ID=88540865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321326608.4U Active CN219950851U (en) | 2023-05-29 | 2023-05-29 | High-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219950851U (en) |
-
2023
- 2023-05-29 CN CN202321326608.4U patent/CN219950851U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5336739B2 (en) | Window glass with anti-reflection and thermal insulation properties | |
| CN109305763B (en) | High-transmittance single-silver low-emissivity coated glass | |
| EP0185314B1 (en) | Architectural coating with interference colors | |
| CN110028251B (en) | Copper-containing double-silver low-emissivity coated glass capable of being subsequently processed and preparation method thereof | |
| CN104354393B (en) | Radiation coated glass capable of being toughened | |
| CN113880454A (en) | Preparation method of coated glass | |
| CN210736572U (en) | High-light-transmittance low-radiation coated glass | |
| CN111995258A (en) | Medium-transmittance LOW-reflection temperable double-silver LOW-E glass and preparation method thereof | |
| CN206157058U (en) | But high energy -conserving glass of low radiation of tempering that passes through | |
| CN108218253B (en) | High-permeability tempered three-silver Low-E glass and preparation method thereof | |
| CN212152091U (en) | Low-emissivity coated glass | |
| CN111302652A (en) | Flat-bent matched double-silver coated glass and preparation method thereof | |
| CN109665723B (en) | Ultra-clear neutral-color double-silver low-emissivity coated glass and preparation method thereof | |
| CN219950851U (en) | High-performance heat-bendable high-transmittance toughened three-silver low-emissivity glass | |
| US4891113A (en) | Method of making architectural coating with interference colors | |
| CN109081610B (en) | Medium-transmittance gray temperable double-silver low-emissivity coated glass and preparation method thereof | |
| CN102336529A (en) | High transmittance toughenable low radiation glass and manufacture method thereof | |
| CN111704369A (en) | Panoramic gray double-silver low-emissivity coated glass and preparation method thereof | |
| CN107867804B (en) | Low-radiation energy-saving glass capable of being tempered with film downwards | |
| CN112499987B (en) | Infrared reflection combined film and coated glass | |
| CN210656698U (en) | High-transmittance light blue bendable steel three-silver low-emissivity coated glass | |
| CN108455878A (en) | No color differnece low radiation coated glass and preparation method thereof before and after tempering | |
| CN210030460U (en) | Copper-containing double-silver low-emissivity coated glass capable of being subsequently processed | |
| CN113683314A (en) | Low-emissivity film, coated glass and preparation method thereof | |
| CN204136515U (en) | Radiation coated glass capable of being toughened |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |