CN219943856U - System for cleaning silicon wafer cleaning equipment and silicon wafer cleaning equipment - Google Patents
System for cleaning silicon wafer cleaning equipment and silicon wafer cleaning equipment Download PDFInfo
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- CN219943856U CN219943856U CN202321197153.0U CN202321197153U CN219943856U CN 219943856 U CN219943856 U CN 219943856U CN 202321197153 U CN202321197153 U CN 202321197153U CN 219943856 U CN219943856 U CN 219943856U
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- cleaning
- tank
- silicon wafer
- cleaning liquid
- wafer cleaning
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- 238000004140 cleaning Methods 0.000 title claims abstract description 324
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 125
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 125
- 239000010703 silicon Substances 0.000 title claims abstract description 125
- 239000007788 liquid Substances 0.000 claims abstract description 149
- 230000001105 regulatory effect Effects 0.000 claims description 11
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 10
- 239000012498 ultrapure water Substances 0.000 claims description 10
- 238000001914 filtration Methods 0.000 claims description 6
- 238000005086 pumping Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 129
- 238000000034 method Methods 0.000 description 12
- 238000011109 contamination Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 230000003749 cleanliness Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000012459 cleaning agent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The embodiment of the utility model discloses a system for cleaning silicon wafer cleaning equipment and the silicon wafer cleaning equipment, wherein the system comprises: a supply unit for supplying a tank cleaning liquid into a cleaning tank of the silicon wafer cleaning apparatus to clean the cleaning tank by overflowing the tank cleaning liquid from the cleaning tank; the receiving groove body is arranged on the periphery of the cleaning groove body and used for receiving the cleaning liquid overflowed from the cleaning groove body.
Description
Technical Field
The utility model relates to the field of semiconductor silicon wafer production, in particular to a system for cleaning silicon wafer cleaning equipment and the silicon wafer cleaning equipment.
Background
The groove type cleaning is a main cleaning mode of a silicon wafer, and in the groove type cleaning, a series of chemical reactions are carried out on cleaning liquid containing chemical cleaning agents in the groove and the surface of the silicon wafer to reduce the content of impurities such as metal, particles and the like on the surface of the silicon wafer.
Conventional apparatuses for cleaning silicon wafers in a tank generally include an inner tank in which a silicon wafer to be cleaned is placed and cleaned by a silicon wafer cleaning liquid in the inner tank. It can be appreciated that as the cleaning process proceeds, the cleanliness of the silicon wafer cleaning solution in the inner tank body is reduced, and the desired cleaning effect on the silicon wafer is no longer achieved, so that the silicon wafer cleaning solution in the inner tank body needs to be circularly filtered. Specifically, clean cleaning liquid can be continuously injected into the inner tank body by means of the circulating pump, so that the cleaning liquid in the inner tank body overflows into the outer tank body arranged on the periphery of the inner tank body, the cleaning liquid in the outer tank body can be filtered by the filter, and the filtered clean silicon wafer cleaning liquid is pumped into the inner tank body again by means of the circulating pump to clean the silicon wafer, thereby realizing the circulating filtration of the cleaning liquid in the inner tank body. In addition, to ensure clean cleaning environment, the apparatus may further include a housing for containing the inner tank and the outer tank, and clean EFU gas from the EFU (Equipment fan filter unit apparatus fan filter unit) is also vented to the housing.
However, in the actual use process, the outer tank body is in a non-immersed state, so that the acidic or alkaline cleaning solution in the tank body has volatility, and chemical adhesion can be caused on the inner wall of the outer tank body and the outer wall of the inner tank body in the long-time use process, and further, in the circulation process of the cleaning solution for the inner tank body and the outer tank body, part of the attached chemical enters the cleaning solution to pollute the cleaning solution, so that the process quality of the cleaned silicon wafer is fluctuated.
Therefore, cleaning of chemicals attached to the cleaning equipment is required to ensure the cleanliness stability of the cleaning tank body and thus the process quality of the silicon wafer after the cleaning is completed. However, it is difficult to achieve such cleaning at present, for example, an excessive level of cleaning liquid in the tank may cause the cleaning liquid to overflow from the tank, and other parts of the cleaning apparatus may be damaged or contaminated, for example, an excessive level of cleaning liquid in the tank may cause the tank to be not cleaned completely.
Disclosure of Invention
In order to solve the technical problems, the embodiment of the utility model is expected to provide a system for cleaning silicon wafer cleaning equipment and the silicon wafer cleaning equipment, which can not only enable the tank body of the cleaning equipment to be completely cleaned, but also avoid damage or pollution of overflow cleaning liquid to other parts of the cleaning equipment.
The technical scheme of the utility model is realized as follows:
in a first aspect, embodiments of the present utility model provide a system for cleaning a silicon wafer cleaning apparatus, the system may include:
a supply unit for supplying a tank cleaning liquid into a cleaning tank of the silicon wafer cleaning apparatus to clean the cleaning tank by overflowing the tank cleaning liquid from the cleaning tank;
the receiving groove body is arranged on the periphery of the cleaning groove body and used for receiving the cleaning liquid overflowed from the cleaning groove body.
In the system according to the embodiment of the utility model, the cleaning liquid of the tank body is used for cleaning the tank body in a manner of overflowing from the tank body, so that the tank body can be comprehensively cleaned, and the section which cannot be cleaned in the tank body is avoided, thereby ensuring the cleanliness of the silicon wafer cleaning liquid used in the silicon wafer cleaning process, and ensuring the artwork of the cleaned silicon wafer; on the other hand, due to the existence of the receiving tank, the tank cleaning liquid overflowed from the cleaning tank can be received in the receiving tank, so that other parts of the silicon wafer cleaning equipment are prevented from being damaged or polluted.
In a preferred embodiment of the present utility model, the system may further include a drain line for draining the tank cleaning liquid received in the receiving tank.
Thus, even if the amount of the cleaning liquid overflowed from the cleaning tank to the receiving tank is large in order to complete the cleaning of the cleaning tank more sufficiently, the cleaning liquid in the receiving tank can leave the receiving tank via the liquid discharge pipe, thereby being able to avoid the overflow of the cleaning liquid from the receiving tank, causing damage or contamination to other parts of the silicon wafer cleaning apparatus.
In a preferred embodiment of the present utility model, the system may further include a regulating valve for regulating a flow rate of the tank cleaning liquid flowing in the drain line to prevent overflow of the tank cleaning liquid from the receiving tank.
For example, when the flow rate of the bath cleaning liquid overflowed from the cleaning bath body into the receiving bath body is large, the adjusting valve may be operated so that the flow rate of the bath cleaning liquid flowing in the liquid discharge line is also large, to prevent the bath cleaning liquid from overflowing from the receiving bath body, causing damage or contamination to other parts of the silicon wafer cleaning apparatus.
In a preferred embodiment of the present utility model, the system may further include a liquid level sensor for sensing a liquid level of the tank cleaning liquid received in the receiving tank, the regulating valve regulating the flow rate according to the liquid level.
For example, when the level of the tank cleaning liquid received in the receiving tank is high or near the upper edge of the receiving tank, the regulating valve can regulate the flow rate of the tank cleaning liquid flowing in the liquid discharge line to be large, thereby preventing the tank cleaning liquid from overflowing from the receiving tank and causing damage or contamination to other parts of the silicon wafer cleaning apparatus.
In a second aspect, an embodiment of the present utility model further provides a silicon wafer cleaning apparatus, where the silicon wafer cleaning apparatus may include:
the cleaning tank body is used for accommodating silicon wafer cleaning liquid to clean the silicon wafer;
the system according to the first aspect.
In the silicon wafer cleaning equipment according to the embodiment of the utility model, when the system is used for cleaning the cleaning tank body, the tank body cleaning liquid supplied by the supply unit of the system is used for cleaning the cleaning tank body in a manner of overflowing from the cleaning tank body, so that the cleaning tank body can be comprehensively cleaned, and the section which cannot be cleaned in the cleaning tank body is avoided, thereby ensuring the cleaning degree of the silicon wafer cleaning liquid used in the silicon wafer cleaning process and ensuring the artwork of the cleaned silicon wafer; on the other hand, due to the existence of the receiving tank body of the system, the tank body cleaning liquid overflowed from the cleaning tank body can be received in the receiving tank body, so that other parts of the silicon wafer cleaning equipment are prevented from being damaged or polluted.
In a preferred embodiment of the present utility model, the cleaning bath body may include an inner bath body in which the silicon wafer is received, and an outer bath body for receiving the silicon wafer cleaning liquid overflowed from the inner bath body.
In a preferred embodiment of the present utility model, the silicon wafer cleaning apparatus may further include:
a circulation line;
and the circulating pump is used for pumping the silicon wafer cleaning liquid from the outer tank body into the inner tank body through the circulating pipeline so as to circulate the silicon wafer cleaning liquid between the inner tank body and the outer tank body.
Thus, the silicon wafer cleaning liquid can circulate between the inner tank body and the outer tank body, thereby ensuring the uniformity of the chemical cleaning agent contained in the silicon wafer cleaning liquid and accelerating the reaction degree of the silicon wafer.
In a preferred embodiment of the present utility model, the silicon wafer cleaning apparatus may further include a filter for filtering the silicon wafer cleaning liquid flowing in the circulation line.
Therefore, the circulation filtration of the silicon wafer cleaning liquid in the inner tank body can be realized, the cleaning degree of the silicon wafer cleaning liquid in the inner tank body is ensured, and the cleaning effect of the silicon wafer is further ensured.
In a preferred embodiment of the present utility model, the wafer cleaning apparatus may further include a heater for heating the wafer cleaning liquid to a set temperature before flowing from the outer bath body to the inner bath body.
Thus, the cleaning performance of the silicon wafer cleaning liquid can be improved. More specifically, in the case where the silicon wafer cleaning liquid is an SC-1 type cleaning liquid or an SC-2 type cleaning liquid, the set temperature may be 40 to 60 ℃. In addition, a heater may be provided downstream of the circulation pump in the direction in which the silicon wafer cleaning liquid flows in the circulation line.
In a preferred embodiment of the present utility model, the bath cleaning solution may be the silicon wafer cleaning solution or ultrapure water.
Specifically, in the case where the silicon wafer cleaning liquid in the cleaning tank body of the silicon wafer cleaning apparatus needs to be replaced, a new silicon wafer cleaning liquid may be injected into, for example, the inner tank body, thereby causing the old silicon wafer cleaning liquid to overflow from the inner tank body into the outer tank body, and in the case where the new silicon wafer cleaning liquid is continuously injected, causing the old silicon wafer cleaning liquid to further overflow from the outer tank body into the receiving tank body, and at the same time, cleaning of the cleaning tank body is completed, that is, in the case where the silicon wafer cleaning liquid serves as a tank cleaning liquid for cleaning the cleaning tank body; on the other hand, in addition to the above-described cleaning method, it is also possible to first drain the silicon wafer cleaning liquid in the cleaning tank body of the silicon wafer cleaning apparatus, and then continuously inject ultrapure water into, for example, the inner tank body, thereby causing the ultrapure water to overflow from the inner tank body into the outer tank body after the inner tank body is filled, and the ultrapure water to overflow from the outer tank body further into the receiving tank body after the outer tank body is also filled, and at the same time, finish cleaning the cleaning tank body, that is, in this case, the ultrapure water serves as a tank cleaning liquid for cleaning the cleaning tank body.
Drawings
FIG. 1 is a schematic diagram of a conventional apparatus for cleaning a silicon wafer;
FIG. 2 is a schematic diagram of a system for cleaning a silicon wafer cleaning apparatus according to a first embodiment of the present utility model;
FIG. 3 is a schematic diagram of a system for cleaning a silicon wafer cleaning apparatus according to a second embodiment of the present utility model;
FIG. 4 is a schematic structural view of a system for cleaning a silicon wafer cleaning apparatus according to a third embodiment of the present utility model;
FIG. 5 is a schematic structural view of a system for cleaning a silicon wafer cleaning apparatus according to a fourth embodiment of the present utility model;
FIG. 6 is a schematic structural view of a silicon wafer cleaning apparatus according to a first embodiment of the present utility model;
fig. 7 is a schematic structural view of a silicon wafer cleaning apparatus according to a second embodiment of the present utility model.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
Referring first to fig. 1, for a conventional apparatus 1A for cleaning a silicon wafer W, it is generally comprised of a cleaning tank 20A, which cleaning tank 20A includes an inner tank 21A and an outer tank 22A, and in order to avoid overflow of a silicon wafer cleaning liquid L2 from the inner tank 21A to the outer tank 22A (as schematically shown by curved arrow in fig. 1) and further from the outer tank 22A, thereby causing damage or contamination of other components of the apparatus 1A, it is necessary to ensure that the level of the silicon wafer cleaning liquid L2 in the outer tank 22A is lower than the upper edge of the outer tank 22A during the entire cleaning process, which can be achieved by, for example, returning the silicon wafer cleaning liquid L2 overflowed into the outer tank 22A to the inner tank 21A (as schematically shown by broken line arrow in fig. 1). In this case, since the wafer cleaning liquid L2 has volatility, it is inevitable that the chemical adheres to the section SE2 in the inner wall of the outer tank 22A which is not immersed by the wafer cleaning liquid L2, and in addition, in the case where the liquid level of the wafer cleaning liquid L2 in the outer tank 22A is lower than the upper edge of the inner tank 21A, it is also possible that the chemical adheres to the section SE1 in the outer wall of the inner tank 21A which is not immersed by the wafer cleaning liquid L2. On the other hand, cleaning of the adhering chemicals is very difficult because, as is readily understood with reference to fig. 1, if the cleaning liquid is injected too much in the outer tank 22A, although the region through which the wafer cleaning liquid L2 flows can be cleaned, it may cause the cleaning liquid to overflow from the outer tank 22A, damage or contaminate other parts of the wafer cleaning apparatus 1A, whereas if the cleaning liquid is not injected too much in the outer tank 22A, although the cleaning liquid can be prevented from overflowing from the outer tank 22A, it may not be cleaned at least in the region of the inner wall of the outer tank 22A which is not immersed by the cleaning liquid.
In this regard, referring to FIG. 2, an embodiment of the present utility model provides a system 10 for cleaning a silicon wafer cleaning apparatus 1A as shown in FIG. 1, the system 10 may comprise:
a supply unit 11 for supplying a tank cleaning liquid L1 into a cleaning tank 20A of the silicon wafer cleaning apparatus 1A to clean the cleaning tank 20A by overflowing the tank cleaning liquid L1 from the cleaning tank 20A, as schematically shown by curved arrows in fig. 2;
a receiving tank 12, the receiving tank 12 being provided at the periphery of the cleaning tank 20A to receive the tank cleaning liquid L1 overflowed from the cleaning tank 20A.
In the system 10 according to an embodiment of the present utility model: because the cleaning liquid L1 overflows from the cleaning tank 20A to clean the cleaning tank 20A, the cleaning tank 20A can be comprehensively cleaned, and the section which cannot be cleaned in the cleaning tank 20A is avoided, so that the cleaning degree of the silicon wafer cleaning liquid used in the silicon wafer cleaning process is ensured, and the artwork of the cleaned silicon wafer can be ensured; on the other hand, due to the presence of the receiving tank 12, the tank cleaning liquid L1 overflowed from the cleaning tank 20A is received in the receiving tank 12, avoiding damage or contamination of other components of the silicon wafer cleaning apparatus 1A.
In a preferred embodiment of the present utility model, referring to fig. 3, the system 10 may further include a drain line 13, the drain line 13 being for draining the tank cleaning liquid L1 received in the receiving tank 12.
In this way, even if the amount of the tank cleaning liquid L1 overflowed from the cleaning tank 20A into the receiving tank 12 is large in order to complete more sufficient cleaning of the cleaning tank 20A, the tank cleaning liquid L1 in the receiving tank 12 can leave the receiving tank 12 via the liquid discharge line 13, whereby the overflow of the tank cleaning liquid L1 from the receiving tank 12 can be prevented from causing damage or contamination to other parts of the silicon wafer cleaning apparatus 1A.
In a preferred embodiment of the present utility model, referring to fig. 4, the system 10 may further include a regulating valve 14, the regulating valve 14 being configured to regulate the flow rate of the tank cleaning liquid L1 flowing in the drain line 13 to prevent the tank cleaning liquid L1 from overflowing the receiving tank 12.
For example, when the flow rate of the tank cleaning liquid L1 overflowed from the cleaning tank 20A into the receiving tank 12 is large, the adjustment valve 14 may be operated so that the flow rate of the tank cleaning liquid L1 flowing in the liquid discharge line 13 is also large to prevent the tank cleaning liquid L1 from overflowing from the receiving tank 12, causing damage or contamination to other components of the silicon wafer cleaning apparatus 1A.
In a preferred embodiment of the present utility model, referring to fig. 5, the system 10 may further include a liquid level sensor 15, the liquid level sensor 15 for sensing a liquid level of the tank cleaning liquid L1 received in the receiving tank 12, and the regulating valve 14 regulates the flow rate according to the liquid level.
For example, when the level of the tank cleaning liquid L1 received in the receiving tank 12 is high or near the upper edge of the receiving tank 12, the regulating valve 14 can regulate the flow rate of the tank cleaning liquid L1 flowing in the drain line 13 to be large, thereby preventing the tank cleaning liquid L1 from overflowing from the receiving tank 12, causing damage or contamination to other components of the silicon wafer cleaning apparatus 1A.
Referring to fig. 6, the embodiment of the present utility model further provides a silicon wafer cleaning apparatus 1, and the silicon wafer cleaning apparatus 1 may include:
a cleaning tank body 20, wherein the cleaning tank body 20 is used for accommodating a silicon wafer cleaning liquid L2 so as to clean a silicon wafer W;
a system 10 according to various embodiments of the present utility model is described.
In the silicon wafer cleaning apparatus 1 according to the embodiment of the present utility model, when the cleaning tank 20 is cleaned by the system 10, since the tank cleaning liquid supplied from the supply unit 11 of the system 10 is used to clean the cleaning tank 20 in such a manner as to overflow from the cleaning tank 20, the cleaning tank 20 can be cleaned comprehensively, and the occurrence of the section which cannot be cleaned in the cleaning tank 20 is avoided, thereby ensuring the degree of cleanliness of the silicon wafer cleaning liquid used in the cleaning process of the silicon wafer, so that the artwork of the cleaned silicon wafer can be ensured; on the other hand, due to the presence of the receiving tank 12 of the system 10, the tank cleaning liquid overflowed from the cleaning tank 20 is received in the receiving tank 12, avoiding damage or contamination of other components of the silicon wafer cleaning apparatus 1.
In a preferred embodiment of the present utility model, still referring to fig. 6, the cleaning bath body 20 may include an inner bath body 21 and an outer bath body 22, the wafer W being accommodated in the inner bath body 21, the outer bath body 22 being for accommodating the wafer cleaning liquid L2 overflowed from the inner bath body 21, as schematically shown by curved arrows in fig. 6.
In a preferred embodiment of the present utility model, referring to fig. 7, the silicon wafer cleaning apparatus 1 may further include:
a circulation line 30;
and a circulation pump 40 for pumping the wafer cleaning liquid L2 from the outer tank 22 into the inner tank 21 via the circulation line 30 so that the wafer cleaning liquid L2 circulates between the inner tank 21 and the outer tank 22.
In this way, the wafer cleaning liquid L2 can circulate between the inner tank body 21 and the outer tank body 22, thereby ensuring uniformity of the chemical cleaning agent contained in the wafer cleaning liquid L2 and accelerating the degree of reaction of the wafer W.
In a preferred embodiment of the present utility model, still referring to fig. 7, the silicon wafer cleaning apparatus 1 may further comprise a filter 50 for filtering the silicon wafer cleaning liquid L2 flowing in the circulation line 30, the filter 50.
Thus, the circulation filtration of the silicon wafer cleaning liquid L2 in the inner tank body 21 can be realized, the cleaning degree of the silicon wafer cleaning liquid L2 in the inner tank body 21 is ensured, and the cleaning effect on the silicon wafer W is further ensured.
In a preferred embodiment of the present utility model, still referring to fig. 7, the wafer cleaning apparatus 1 may further comprise a heater 60, the heater 60 being configured to heat the wafer cleaning liquid L2 to a set temperature before flowing from the outer tank 22 to the inner tank 21.
Thus, the cleaning performance of the silicon wafer cleaning liquid L2 can be improved. More specifically, in the case where the silicon wafer cleaning liquid L2 is an SC-1 type cleaning liquid or an SC-2 type cleaning liquid, the set temperature may be 40 to 60 ℃. As also shown in fig. 7, a heater 60 may be provided downstream of the circulation pump 40 in the direction in which the wafer cleaning liquid L2 flows in the circulation line 30.
In a preferred embodiment of the present utility model, the bath cleaning liquid L1 may be the silicon wafer cleaning liquid L2 or ultrapure water.
Specifically, as can be understood with reference to fig. 7, in the case where the wafer cleaning liquid L2 in the cleaning tank body 20 of the wafer cleaning apparatus 1 needs to be replaced, a new wafer cleaning liquid L2 may be injected into, for example, the inner tank body 21, thereby causing the old wafer cleaning liquid L2 to overflow from the inner tank body 21 into the outer tank body 22, and in the case where the new wafer cleaning liquid L2 is continuously injected, causing the old wafer cleaning liquid L2 to overflow further from the outer tank body 22 into the receiving tank body 12, and at the same time, cleaning of the cleaning tank body 20 is completed, that is, in this case, the wafer cleaning liquid L2 serves as a tank body cleaning liquid L1 for cleaning the cleaning tank body 20; on the other hand, in addition to the above-described cleaning manner, still referring to fig. 7, it is also possible to first drain the silicon wafer cleaning liquid L2 in the cleaning tank body 20 of the silicon wafer cleaning apparatus 1, and then continuously inject ultrapure water into, for example, the inner tank body 21, thereby causing the ultrapure water to overflow from the inner tank body 21 into the outer tank body 22 after the inner tank body 21 is filled, and to overflow from the outer tank body 22 further into the receiving tank body 12 after the outer tank body 22 is also filled, and at the same time, to finish cleaning the cleaning tank body 20, that is, in this case, ultrapure water is used as the tank body cleaning liquid L1 for cleaning the cleaning tank body 20.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
It should be noted that: the technical schemes described in the embodiments of the present utility model may be arbitrarily combined without any collision.
The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.
Claims (10)
1. A system for cleaning a silicon wafer cleaning apparatus, the system comprising:
a supply unit for supplying a tank cleaning liquid into a cleaning tank of the silicon wafer cleaning apparatus to clean the cleaning tank by overflowing the tank cleaning liquid from the cleaning tank;
the receiving groove body is arranged on the periphery of the cleaning groove body and used for receiving the cleaning liquid overflowed from the cleaning groove body.
2. The system of claim 1, further comprising a drain line for draining the tank cleaning liquid received in the receiving tank.
3. The system of claim 2, further comprising a regulator valve for regulating the flow of the tank cleaning liquid flowing in the drain line to prevent overflow of the tank cleaning liquid from the receiving tank.
4. A system according to claim 3, further comprising a level sensor for sensing the level of tank cleaning liquid received in the receiving tank, the regulator valve regulating the flow rate in dependence on the level.
5. A silicon wafer cleaning apparatus, characterized in that the silicon wafer cleaning apparatus comprises:
the cleaning tank body is used for accommodating silicon wafer cleaning liquid to clean the silicon wafer;
the system of any one of claims 1 to 4.
6. The silicon wafer cleaning apparatus according to claim 5, wherein the cleaning bath body includes an inner bath body in which the silicon wafer is accommodated and an outer bath body for accommodating the silicon wafer cleaning liquid overflowed from the inner bath body.
7. The silicon wafer cleaning apparatus according to claim 6, further comprising:
a circulation line;
and the circulating pump is used for pumping the silicon wafer cleaning liquid from the outer tank body into the inner tank body through the circulating pipeline so as to circulate the silicon wafer cleaning liquid between the inner tank body and the outer tank body.
8. The silicon wafer cleaning apparatus according to claim 7, further comprising a filter for filtering the silicon wafer cleaning liquid flowing in the circulation line.
9. The wafer cleaning apparatus of claim 7 further comprising a heater for heating the wafer cleaning liquid to a set temperature prior to flowing from the outer tank to the inner tank.
10. The silicon wafer cleaning apparatus according to any one of claims 5 to 9, wherein the tank cleaning liquid is the silicon wafer cleaning liquid or ultrapure water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321197153.0U CN219943856U (en) | 2023-05-17 | 2023-05-17 | System for cleaning silicon wafer cleaning equipment and silicon wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321197153.0U CN219943856U (en) | 2023-05-17 | 2023-05-17 | System for cleaning silicon wafer cleaning equipment and silicon wafer cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219943856U true CN219943856U (en) | 2023-11-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321197153.0U Active CN219943856U (en) | 2023-05-17 | 2023-05-17 | System for cleaning silicon wafer cleaning equipment and silicon wafer cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219943856U (en) |
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2023
- 2023-05-17 CN CN202321197153.0U patent/CN219943856U/en active Active
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