CN219876722U - High-efficient heat dissipation vehicle-mounted digital power amplifier - Google Patents
High-efficient heat dissipation vehicle-mounted digital power amplifier Download PDFInfo
- Publication number
- CN219876722U CN219876722U CN202321296851.6U CN202321296851U CN219876722U CN 219876722 U CN219876722 U CN 219876722U CN 202321296851 U CN202321296851 U CN 202321296851U CN 219876722 U CN219876722 U CN 219876722U
- Authority
- CN
- China
- Prior art keywords
- power amplifier
- shell
- semiconductor refrigerating
- chip
- vehicle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 29
- 239000004065 semiconductor Substances 0.000 claims abstract description 70
- 230000005855 radiation Effects 0.000 claims abstract description 4
- 230000003321 amplification Effects 0.000 claims description 8
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 238000005057 refrigeration Methods 0.000 abstract description 26
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 5
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a high-efficiency heat-dissipation vehicle-mounted digital power amplifier which comprises a shell, a semiconductor refrigerating sheet arranged on the shell and a power amplifier circuit board arranged in the shell. The vehicle-mounted power amplifier heat radiator and the vehicle-mounted power amplifier system provided by the utility model apply the semiconductor refrigeration technology, organically combine the heat radiating component with the power amplifier, and have the advantages of rapid power amplifier refrigeration, good heat radiation and stability.
Description
Technical Field
The utility model relates to the field of vehicle-mounted power amplifiers, in particular to a heat dissipation device of a vehicle-mounted power amplifier.
Background
As car entertainment systems (including car audio, car television, etc.) become a popular configuration of automobiles, car power amplifiers have also been widely used. The main function of the vehicle-mounted power amplifier is to realize the amplifying function on the audio signal of the vehicle-mounted entertainment system, thereby meeting the entertainment audio-visual requirements of passengers. However, the heat productivity of the vehicle-mounted power amplifier is generally large, and the heat dissipation becomes a problem which needs to be solved, especially when the user continuously increases the volume, the input audio signal of the vehicle-mounted power amplifier becomes large, and the heat dissipation of the power amplifier also increases. Therefore, effective cooling measures must be adopted to ensure the normal working temperature of the vehicle-mounted power amplifier, however, the existing cooling measures mostly adopt a mode that a heat dissipation groove is directly contacted with the power amplifier, heat is taken away through natural convection of the heat dissipation groove and air, the power amplifier temperature is maintained in a certain range, the natural convection mode leads to slow heat dissipation efficiency of the existing vehicle-mounted power amplifier radiator, and the power amplifier bears high temperature for a long time.
Therefore, a vehicle-mounted digital power amplifier convenient to use and capable of efficiently radiating is provided to solve the problems.
Disclosure of Invention
In view of the foregoing drawbacks or shortcomings of the prior art, it is desirable to provide a power amplifier that facilitates heat dissipation.
According to the technical scheme provided by the embodiment of the utility model, the power amplifier with better heat dissipation comprises a shell, wherein the shell is a metal shell, a PCB (printed circuit board) is arranged in the shell, and the PCB is electrically connected with an active power amplifier chip, and is characterized in that: the power amplifier chip is attached to the inner side of the radiating fins or the cold end of the semiconductor refrigerating sheet on the shell.
Further, the semiconductor refrigerating chip also comprises a semiconductor refrigerating sheet hot end which is opposite to the semiconductor refrigerating sheet cold end, and the power amplifier chip is attached to the inner side of the heat dissipation structure, and the structure is as follows: the side wall of the shell is provided with radiating fins, the power amplifier chip is attached to the inner side of the side wall, the cold end of the semiconductor refrigerating sheet is attached to one end close to the power amplifier chip, and the hot end of the semiconductor refrigerating sheet is attached to the outer side of the shell radiating structure. Further, the PCB is locked on the shell through the fixing screw.
Further, the shell is close to one end of the power amplification chip and is provided with a first hole, the first hole penetrates through the shell, the upper end of the semiconductor refrigerating sheet is provided with an outwards protruding portion, the first protruding portion is provided with a first threaded hole, the shell is provided with a first screw, and the semiconductor refrigerating sheet is fixed in the first hole through the first screw.
Further, the power amplifier chip is attached to the inner side of the heat dissipation structure, the semiconductor refrigerating piece is arranged at the cover end, the cold end of the semiconductor refrigerating piece is arranged in the inner cavity of the shell, and the hot end of the semiconductor refrigerating piece is arranged at the outer end of the shell.
Further, the cover end is provided with a second protruding screw, a second peripheral protruding portion is arranged on the outer side of the semiconductor refrigerating sheet, a second threaded hole is formed in the second peripheral protruding portion, and the semiconductor refrigerating sheet is fixed to the shell through threaded connection.
Further, the semiconductor refrigerator comprises a temperature sensor, wherein the temperature sensor is arranged in the inner cavity of the shell, the temperature sensor is electrically connected with the PCB, and the semiconductor refrigerating sheet is electrically connected with the PCB.
Compared with the prior art, the technical scheme of the utility model has the following beneficial effects:
this on-vehicle digital power amplifier of high-efficient heat dissipation can be through the temperature in the temperature sensor response casing, when the temperature is lower in the casing, dispels the heat to the casing through heat radiation fins, and when the temperature was too high in the casing, temperature sensor was with the work of the controller control semiconductor refrigeration piece on the electric signal transmission PCB circuit board, continued to reduce the temperature in the casing through the semiconductor refrigeration piece.
Drawings
FIG. 1 is a schematic diagram of a power amplifier housing;
FIG. 2 is a schematic cross-sectional view of a semiconductor refrigeration sheet and a housing;
FIG. 3 is a schematic cross-sectional view of a semiconductor refrigeration sheet and a housing;
FIG. 4 is a schematic view of the structure of the semiconductor refrigeration piece and the threaded hole of the shell;
FIG. 5 is a schematic view of a housing screw configuration;
fig. 6 is a schematic view of a screw and screw hole mating structure.
In the figure:
1. a housing; 11. a heat radiation fin; 12. a housing cap end;
2. a PCB circuit board;
3. a power amplifier chip;
4. a semiconductor refrigeration sheet; 41. cold end of semiconductor refrigerating sheet; 42. a hot end of the semiconductor refrigerating sheet;
5. a first hole;
6. a first protruding part; 61. a first threaded hole; 62. a first screw;
7. a second protruding part; 71. a second screw; 72. a threaded hole II;
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting of the utility model. It should be noted that, for convenience of description, only the portions related to the utility model are shown in the drawings.
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.
Referring to fig. 1-3, a high-efficiency heat dissipation vehicle-mounted digital power amplifier comprises a shell 1, wherein the shell 1 is a metal shell, a PCB circuit board 2 is arranged in the shell 1, the PCB circuit board 2 is electrically connected with a power amplifier chip 3, a plurality of heat absorption and dissipation structures are arranged on the shell 1, each heat absorption and dissipation structure comprises a heat dissipation fin 11 and a semiconductor refrigeration piece 4, the power amplifier chip 3 is attached to the inner side of the heat dissipation fin 11 or the cold end 41 of the semiconductor refrigeration piece on the shell 1, the power amplifier chip 3 is attached to the inner side of the heat dissipation structure, a fixing pressing block is arranged to fix the power amplifier on the inner side of the heat dissipation structure, and the fixing pressing block locks the power amplifier chip 3 on the shell 1 through a fixing screw;
in the embodiment of the utility model, the temperature sensor 8 is arranged in the inner cavity of the shell 1 and is used for sensing the temperature inside the shell 1, no matter the external temperature of the shell 1 is too high or too low, the temperature sensor 8 always senses the temperature inside the shell 1, the temperature sensor 8 is not influenced by the external environment, the temperature sensor 8 is electrically connected with the PCB 2, the semiconductor refrigerating sheet 4 is electrically connected with the PCB 2, a controller is arranged on the PCB 2, when the temperature in the inner cavity of the shell 1 is too high, the temperature sensor 8 transmits signals to the controller on the PCB 2, the controller transmits electric signals to the semiconductor refrigerating sheet 4, the semiconductor refrigerating sheet 4 starts to work, the cold end 41 of the semiconductor refrigerating sheet absorbs the heat inside the shell 1, and the hot end 42 of the semiconductor refrigerating sheet evacuates the heat to the outside, so that the heat dissipation effect of the power amplification chip 3 is achieved.
The radiating structure is designed into fin-shaped radiating fins, and the radiating efficiency of the shell is increased by increasing the radiating area of the radiating structure.
When the power amplifier works, the power amplifier chip 3 can generate a large amount of heat, the power amplifier chip 3 is attached to the inner side of the shell, the heat is transferred to the outer side radiating fins from the inner side of the shell, and the outer side radiating fins are arranged in a fin shape, so that the power amplifier can radiate more conveniently.
Embodiment one:
referring to fig. 2, 4 and 5, in the embodiment of the present utility model, a second protruding screw 71 is provided at the cover end, a second peripheral protruding portion 7 is provided at the outer side of the semiconductor refrigeration sheet 4, a second threaded hole 72 is provided at the second peripheral protruding portion 7, and the semiconductor refrigeration sheet 4 is fixed on the housing 1 by threaded connection;
the power amplifier chip 3 is attached to the inner side of the heat dissipation structure, and the structure is as follows: the side wall of the shell 12 is provided with radiating fins, the power amplifier chip 3 is attached to the inner side of the side wall, the cold end 41 of the semiconductor refrigerating sheet is attached to one end close to the power amplifier chip 3, and the hot end 42 of the semiconductor refrigerating sheet is attached to the outer side of the radiating structure of the shell 1, so that heat can be better radiated to the outside through the radiating fins 12;
when the power amplifier works, a large amount of heat is generated, the semiconductor refrigerating sheet 4 has no metal shell for transferring heat when not working, and the semiconductor refrigerating sheet 4 does not work when the external temperature is very low because the temperature difference between the semiconductor refrigerating sheet and each place is relatively large, so that the semiconductor refrigerating sheet is arranged at the cover end 12, and the shell 1 can be radiated more effectively.
Embodiment two:
referring to fig. 3 to 5, in the embodiment of the present utility model, a hole one 5 is disposed at one end of the housing 1 near the power amplifier chip 3, the hole one 5 penetrates the housing 1, an outward protruding portion is disposed at an upper end of the semiconductor refrigeration sheet 4, a threaded hole one 61 is disposed at the protruding portion one, a screw one 62 is disposed on the housing 1, and the semiconductor refrigeration sheet 4 is fixed in the hole one 5 through the screw one 62;
the power amplifier chip 3 is attached to the inner side of the heat dissipation structure, the semiconductor refrigerating sheet 4 is arranged at the shell cover end 12, the cold end 41 of the semiconductor refrigerating sheet is arranged in the inner cavity of the shell 1, and the hot end 42 of the semiconductor refrigerating sheet is arranged at the outer end of the shell 1.
When the external temperature is very high, the semiconductor refrigeration piece 4 is required to work frequently, so the semiconductor refrigeration piece 4 is arranged at the position of the attaching power amplification chip 3, a large amount of heat is generated when the power amplification works, the temperature in the shell 1 cannot be quickly reduced to the required temperature only through the radiating fins 11, when the temperature sensor 8 senses that the temperature in the shell 1 is too high, an electric signal is transmitted to the controller to control the semiconductor refrigeration piece 4 to work, the cold end 41 of the semiconductor refrigeration piece absorbs the temperature in the shell 1, and the cold end 41 of the semiconductor refrigeration piece transmits the heat to the hot end 42 of the semiconductor refrigeration piece to dissipate the heat to the outside.
In the embodiment of the utility model, the shell 1 is kept in a closed state, and the semiconductor refrigeration piece 4 and the cover are connected with the shell 1 through screws.
There is a large amount of dust in the air, when casing 1 gets into a large amount of dust, can cause the influence to PCB circuit board 2 to lead to on-vehicle quality that can the power amplifier to reduce, so the power amplifier needs airtight inner space when installing on the car, and it is airtight with casing 1 inner space through threaded connection, thereby makes on-vehicle power amplifier life can not reduce because of external influence.
The working principle of the embodiment is as follows:
the heating value of the vehicle-mounted power amplifier is large in general, and particularly when a user continuously increases the volume, the power amplifier chip 3 is controlled by the PCB 2 of the vehicle-mounted power amplifier, and the heat emitted by the power amplifier chip 3 is increased accordingly, so that if the vehicle-mounted power amplifier does not timely and rapidly dissipate heat, the temperature rise of the power amplifier can be caused, and the working temperature of the vehicle-mounted entertainment system is influenced.
This on-vehicle power amplifier is through being provided with semiconductor refrigeration piece 4, when the temperature is too high in the casing 1, and the difference in temperature with the external world is very big, and temperature sensor 8 senses the casing internal temperature, by the electric signal of temperature sensor 8 conduction to PCB circuit board 2 controller, again by PCB circuit board 2 controller transmission electric signal to semiconductor refrigeration piece 4, semiconductor refrigeration piece 4 laminating casing lateral wall, the heat in the semiconductor refrigeration piece cold junction 41 absorption casing, and then give off the heat by semiconductor refrigeration piece hot junction 42. When the difference between the external temperature and the temperature in the shell 1 is small, the semiconductor refrigerating sheet 4 does not work, and the power amplification chip 3 conducts heat in the shell 1 to be emitted to the outside through the bonding of the side wall of the shell.
Claims (6)
1. The utility model provides a on-vehicle digital power amplifier of high-efficient heat dissipation, includes casing (1), and casing (1) are the metal casing, are provided with PCB circuit board (2) in casing (1), and PCB circuit board (2) electricity is connected active amplifier chip (3), its characterized in that: the power amplifier chip (3) is attached to the inner side of the radiating fins (11) or the cold end (41) of the semiconductor refrigerating sheet on the shell (1).
2. The high-efficiency heat-dissipation vehicle-mounted digital power amplifier according to claim 1, wherein: the power amplifier chip (3) is attached to the inner side of the heat radiation structure, and the structure is as follows: the side wall of the shell (1) is provided with radiating fins (11), the power amplification chip (3) is attached to the inner side of the side wall, the cold end (41) of the semiconductor refrigerating sheet is attached to one end close to the power amplification chip (3), and the hot end (42) of the semiconductor refrigerating sheet is attached to the outer side of the radiating structure of the shell (1).
3. The high-efficiency heat-dissipation vehicle-mounted digital power amplifier according to claim 2, wherein: the semiconductor refrigerating chip is characterized in that a first hole (5) is formed in one end, close to the power amplification chip (3), of the shell (1), the first hole (5) penetrates through the shell (1), an outwards protruding portion (6) is formed in the upper end of the semiconductor refrigerating chip (4), a threaded hole (61) is formed in the protruding portion (6), a first screw (62) is arranged on the shell (1), and the semiconductor refrigerating chip (4) is fixed in the first hole (5) through the first screw (62).
4. The high-efficiency heat-dissipation vehicle-mounted digital power amplifier according to claim 1, wherein: the power amplifier chip (3) is attached to the inner side of the heat dissipation structure, the semiconductor refrigerating piece (4) is arranged at the cover end (12), the cold end (41) of the semiconductor refrigerating piece is arranged in the inner cavity of the shell (1), and the hot end (42) of the semiconductor refrigerating piece is arranged at the outer end of the shell (1).
5. The high-efficiency heat-dissipation vehicle-mounted digital power amplifier according to claim 4, wherein: the cover end (12) is provided with a second raised screw (71), a second peripheral raised part (7) is arranged on the outer side of the semiconductor refrigerating sheet (4), a second threaded hole (72) is formed in the second peripheral raised part (7), and the semiconductor refrigerating sheet (4) is fixed on the shell (1) through threaded connection.
6. The high-efficiency heat-dissipation vehicle-mounted digital power amplifier according to claim 1, wherein: the temperature sensor (8) is arranged in the inner cavity of the shell (1), the temperature sensor (8) is electrically connected with the PCB (2), and the semiconductor refrigerating sheet (4) is electrically connected with the PCB (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321296851.6U CN219876722U (en) | 2023-05-26 | 2023-05-26 | High-efficient heat dissipation vehicle-mounted digital power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321296851.6U CN219876722U (en) | 2023-05-26 | 2023-05-26 | High-efficient heat dissipation vehicle-mounted digital power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876722U true CN219876722U (en) | 2023-10-20 |
Family
ID=88335680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321296851.6U Active CN219876722U (en) | 2023-05-26 | 2023-05-26 | High-efficient heat dissipation vehicle-mounted digital power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219876722U (en) |
-
2023
- 2023-05-26 CN CN202321296851.6U patent/CN219876722U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2020088595A1 (en) | Electronic device, heat dissipation means thereof, and vehicle device | |
| CN210867910U (en) | High-efficient heat radiation structure of intelligence camera | |
| CN210405997U (en) | Heat dissipation structure of electronic device | |
| CN217283820U (en) | Power supply with air cooling and liquid cooling device | |
| CN219876722U (en) | High-efficient heat dissipation vehicle-mounted digital power amplifier | |
| US20020121097A1 (en) | Temperature balance device | |
| US10271439B2 (en) | Closed type display apparatus and method of assembling the same | |
| US20060274500A1 (en) | Heat radiating structure for CPU | |
| CN210671094U (en) | Electronic device | |
| CN211152573U (en) | Pump-driven two-phase fluid loop device for heat dissipation of electronic product | |
| CN209527034U (en) | A kind of waterproof shock-absorbing radiator structure of vehicle electronics product | |
| CN210666558U (en) | Bottom heat radiation structure of machine case | |
| CN208045478U (en) | A kind of power amplifier chips for Android vehicle-mounted navigation audio system fix radiator | |
| CN220874410U (en) | Frequency converter | |
| CN220770906U (en) | Projection lamp and vehicle | |
| CN220629854U (en) | Vehicle-mounted integrated controller with active heat dissipation structure | |
| CN212064699U (en) | Heat radiation structure of circuit board in small seeker | |
| CN219046591U (en) | Circuit board chip radiating shell | |
| CN215420633U (en) | Sound box | |
| JP2001251008A (en) | Optical transmitter and receiver | |
| CN211321853U (en) | Heat radiator for air conditioner controller | |
| CN221487768U (en) | Mobile terminal and main board assembly thereof | |
| CN220543593U (en) | Novel expander of quick multi-functional M.2 solid state hard drives dispels heat | |
| CN220106031U (en) | High-reliability solid state disk | |
| CN215453149U (en) | High heat dissipating STB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |