CN219875370U - Semiconductor type high-efficiency motor temperature control device - Google Patents
Semiconductor type high-efficiency motor temperature control device Download PDFInfo
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- CN219875370U CN219875370U CN202320918628.4U CN202320918628U CN219875370U CN 219875370 U CN219875370 U CN 219875370U CN 202320918628 U CN202320918628 U CN 202320918628U CN 219875370 U CN219875370 U CN 219875370U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 230000017525 heat dissipation Effects 0.000 claims abstract description 87
- 238000001514 detection method Methods 0.000 claims description 33
- 238000001816 cooling Methods 0.000 claims description 23
- 239000004519 grease Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 239000012141 concentrate Substances 0.000 description 5
- 239000003570 air Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a semiconductor type high-efficiency motor temperature control device which comprises a motor, a first heat dissipation assembly and a second heat dissipation assembly, wherein the first heat dissipation assembly and the second heat dissipation assembly are identical in structure and size, and are respectively positioned at two opposite ends of the motor and are abutted with the motor; the first radiating component comprises a first radiating block and a first semiconductor controllable cooler, one end of the first radiating block is abutted against the motor, and the other end of the first radiating block is detachably connected with the first semiconductor controllable cooler; the second heat dissipation assembly comprises a second heat dissipation block and a second semiconductor controllable cooler, one end of the second heat dissipation block is abutted with the motor, and the other end of the second heat dissipation block is detachably connected with the second semiconductor controllable cooler. The utility model has the effect of improving the heat dissipation efficiency.
Description
Technical Field
The utility model relates to the field of heat dissipation devices, in particular to a semiconductor type efficient motor temperature control device.
Background
With the development of automation technology, small miniature motors are increasingly used as power sources, the application occasions are various, the motors are generally installed in a narrow space with poor ambient air flow, the heat dissipation effect is poor, the traditional cooling mode is air cooling, and the air cooling effect is limited due to the limited surface area of a motor body.
Disclosure of Invention
In order to improve the heat dissipation efficiency of a motor, the utility model provides a semiconductor type efficient motor temperature control device.
The utility model provides a semiconductor type efficient motor temperature control device which adopts the following technical scheme:
the semiconductor type high-efficiency motor temperature control device comprises a motor, a first heat dissipation assembly and a second heat dissipation assembly, wherein the first heat dissipation assembly and the second heat dissipation assembly are identical in structure and size, and are respectively positioned at two opposite ends of the motor and are in butt joint with the motor; the first radiating component comprises a first radiating block and a first semiconductor controllable cooler, one end of the first radiating block is abutted against the motor, and the other end of the first radiating block is detachably connected with the first semiconductor controllable cooler; the second heat dissipation assembly comprises a second heat dissipation block and a second semiconductor controllable cooler, one end of the second heat dissipation block is abutted with the motor, and the other end of the second heat dissipation block is detachably connected with the second semiconductor controllable cooler.
Through adopting above-mentioned technical scheme, after the motor produced the heat, by quick conduction to first radiating block and second radiating block, first radiating block concentrate on first semiconductor controllable cooler with the heat is directional, and the second radiating block concentrate with second semiconductor controllable cooler with the heat is directional, under the effect of first semiconductor controllable cooler and second semiconductor controllable cooler, the heat is discharged very fast, and then reaches the effect that improves the radiating efficiency of motor.
Optionally, a first groove is formed at one end of the first heat dissipation block, which is abutted to the motor, and a second groove is formed at one end of the second heat dissipation block, which is abutted to the motor.
Through adopting above-mentioned technical scheme, first recess and second recess can improve the area of contact of motor with first radiating block and second radiating block respectively, have improved the heat exchange efficiency of first radiating block and second radiating block.
Optionally, the first otic placode is fixed mounting on the first radiating block, be provided with fixing bolt and fixation nut on the first otic placode, fixed mounting has the second otic placode that corresponds with first otic placode on the second radiating block, fixing bolt passes first otic placode and second otic placode in proper order, and with fixation nut threaded connection.
Optionally, a heat conduction silicone grease layer is laid between the first heat dissipation block and the first conductor controllable cooler.
By adopting the technical scheme, the heat conduction silicone grease layer can maximize the heat dissipation section of the first heat dissipation block and the controllable cooler of the first conductor.
Optionally, the first heat dissipation block is made of a material with high heat conductivity.
Optionally, a first cooling fan is fixedly installed at one end, away from the first cooling block, of the first semiconductor controllable cooler, and a second cooling fan is fixedly installed at one end, away from the second cooling block, of the second semiconductor controllable cooler.
Optionally, the system further comprises a first temperature detection module and a control module;
the first temperature detection module is used for detecting the temperature of the first radiating block in real time and outputting a first temperature detection signal;
the control module is connected with the temperature detection module and is used for receiving the first temperature detection signal and outputting a first control signal when the value reflected by the first temperature detection signal reaches a preset temperature value;
the first cooling fan is connected with the control module and is used for working after receiving a first control signal.
Optionally, the control module adopts a temperature controller.
In summary, the present utility model includes at least one of the following beneficial technical effects:
1. after the motor generates heat, the heat is quickly conducted to the first radiating block and the second radiating block, the first radiating block concentrates the heat in the first semiconductor controllable cooler in a directional manner, the second radiating block concentrates the heat in the second semiconductor controllable cooler in a directional manner, and the heat is quickly discharged under the action of the first semiconductor controllable cooler and the second semiconductor controllable cooler, so that the effect of improving the heat dissipation efficiency of the motor is achieved.
2. The device quantitatively concentrates the heat generated by the motor, improves the heat dissipation efficiency, and reduces the energy consumption of the first heat dissipation fan and the second heat dissipation fan.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present utility model.
FIG. 2 is a system block diagram of an embodiment of the present utility model.
Reference numerals illustrate: 1. a motor; 2. a first heat dissipation assembly; 21. a first heat dissipation block; 211. a first ear plate; 212. a fixing bolt; 213. a fixing nut; 214. a first groove; 22. a first semiconductor controllable cooler; 3. a second heat dissipation assembly; 31. a second heat sink block; 311. a second ear plate; 312. a second groove; 32. a second semiconductor controllable cooler; 4. a thermally conductive silicone grease layer; 5. a first heat radiation fan; 6. a second heat radiation fan; 7. a first temperature detection module; 8. a second temperature detection module; 9. and a control module.
Detailed Description
The present utility model will be described in further detail with reference to the accompanying drawings.
The embodiment of the utility model discloses a semiconductor type efficient motor temperature control device.
Referring to fig. 1 and 2, a semiconductor type efficient motor temperature control device includes a motor 1, a first heat dissipation assembly 2 and a second heat dissipation assembly 3, wherein a rotation axis of the motor 1 is horizontally disposed, the first heat dissipation assembly 2 is located above the motor 1 and is abutted with the motor 1, and the second heat dissipation assembly 3 is located below the motor 1 and is abutted with the motor 1.
The first heat dissipation assembly 2 comprises a first heat dissipation block 21 and a first semiconductor controllable cooler 22, a first groove 214 is formed in the first heat dissipation block 21, the outer wall of the motor 1 is abutted to the groove wall of the first groove 214, the first groove 214 can increase the contact area between the motor 1 and the first heat dissipation block 21, and the heat exchange efficiency of the first heat dissipation block 21 is improved; the first semiconductor controllable cooler 22 is positioned at one end of the first heat dissipation block 21 far away from the motor 1, and the first semiconductor controllable cooler 22 is connected with the first heat dissipation block 21 through bolts and nuts; and a heat conduction silicone grease layer 4 is paved between the motor 1 and the first heat dissipation block 21 and between the first heat dissipation block 21 and the first conductor controllable cooler, and the heat conduction silicone grease layer 4 can maximize the heat dissipation cross section of the motor 1 and the first heat dissipation block 21 and maximize the heat dissipation cross section of the first heat dissipation block 21 and the first conductor controllable cooler.
The second heat dissipation assembly 3 comprises a second heat dissipation block 31 and a second semiconductor controllable cooler 32, a second groove 312 is formed in the second heat dissipation block 31, the outer wall of the motor 1 is abutted with the groove wall of the second groove 312, the second groove 312 can increase the contact area between the motor 1 and the second heat dissipation block 31, and the heat exchange efficiency of the second heat dissipation block 31 is improved; the second semiconductor controllable cooler 32 is positioned at one end of the second heat dissipation block 31 far away from the motor 1, and the second semiconductor controllable cooler 32 is connected with the second heat dissipation block 31 through bolts and nuts; and a heat conduction silicone grease layer 4 is paved between the motor 1 and the second heat dissipation block 31 and between the second heat dissipation block 31 and the second conductor controllable cooler, and the heat conduction silicone grease layer 4 can maximize the heat dissipation cross section of the motor 1 and the second heat dissipation block 31 and maximize the heat dissipation cross section of the second heat dissipation block 31 and the second conductor controllable cooler.
The present apparatus uses the first semiconductor controllable cooler 22 and the second semiconductor controllable cooler 32 to make the apparatus intelligent and precisely controllable.
It is known that the first heat sink 21 and the second heat sink 31 are each made of a material having high thermal conductivity, such as aluminum. Also, the surface of the first heat sink 21 and the surface of the second heat sink 31 are both oxidized.
The first heat dissipation block 21 is provided with a first ear plate 211, the first ear plate 211 is fixedly mounted on the side wall of the first heat dissipation block 21, and the first ear plate 211 is provided with a fixing bolt 212 and a fixing nut 213. The second heat dissipation block 31 is provided with a second ear plate 311 corresponding to the first ear plate 211, and the second ear plate 311 is fixedly installed on the side wall of the second heat dissipation block 31. The fixing bolt 212 sequentially passes through the first and second lug plates 211 and 311 from top to bottom, and is screw-coupled with the fixing nut 213.
The first radiator fan 5 is fixedly arranged at one end of the first semiconductor controllable cooler 22, which is away from the first radiator block 21, and the second radiator fan 6 is fixedly arranged at the two ends of the second semiconductor controllable cooler 32, which are away from the second radiator block 31. The first and second heat dissipation fans 5 and 6 can generate a large heat dissipation capacity with a smaller air flow, and the reduction of the air flow speed brings about the reduction of noise and dust.
The semiconductor type efficient motor temperature control device further comprises a first temperature detection module 7, a second temperature detection module 8 and a control module 9. In the embodiment of the utility model, the first temperature detection module 7 and the second temperature detection module 8 both adopt temperature sensors, and the control module 9 adopts a temperature controller.
The first temperature detection module 7 is mounted on the first heat dissipation block 21, and is used for detecting the temperature of the first heat dissipation block 21 in real time and outputting a first temperature detection signal; the control module 9 is connected with the first temperature detection module 7, and is used for receiving the first temperature detection signal and outputting a first control signal when the value reflected by the first temperature detection signal reaches a preset temperature value; the first cooling fan 5 is connected to the control module 9 and is configured to operate after receiving the first control signal. In the embodiment of the utility model, the preset temperature value is set according to the actual situation.
The second temperature detection module 8 is mounted on the second heat dissipation block 31, and is used for detecting the temperature of the second heat dissipation block 31 in real time and outputting a second temperature detection signal; the control module 9 is connected with the second temperature detection module 8, and is used for receiving the second temperature detection signal and outputting a second control signal when the value reflected by the second temperature detection signal reaches a preset temperature value; the second cooling fan 6 is connected to the control module 9, and is configured to operate after receiving the second control signal.
It is known that the preset temperature values are plural, the first control signals are plural, and when the values reflected by the first temperature detection signals reach different preset temperature values, the control module 9 outputs different first control signals, and the rotation speeds of the motors of the first cooling fans 5 are different after the first cooling fans 5 receive the different first control signals. Similarly, the second control signals are provided in plurality, and when the values reflected by the second temperature detection signals reach different preset temperature values, the control module 9 outputs different second control signals, and the rotation speeds of the motors of the second cooling fans 6 are different after the second cooling fans 6 receive the different second control signals. For example, the preset temperature values are set to 30 °, 40 ° and 50 °, when the value reflected by the first temperature detection signal reaches 30 °, the control module 9 outputs the first control signal a, after the first cooling fan 5 receives the first control signal a, the motor speed of the first cooling fan 5 is the first-stage speed, when the value reflected by the first temperature detection signal reaches 40 °, the control module 9 outputs the first control signal B, after the first cooling fan 5 receives the first control signal B, the motor speed of the first cooling fan 5 is the second-stage speed, when the value reflected by the first temperature detection signal reaches 50 °, the control module 9 outputs the first control signal C, and after the first cooling fan 5 receives the first control signal C, the motor speed of the first cooling fan 5 is the third-stage speed.
The implementation principle of the semiconductor type high-efficiency motor temperature control device provided by the embodiment of the utility model is as follows: the device utilizes the first radiating block 21 and the second radiating block 31 to timely conduct heat generated by the motor 1 away from the motor 1, realizes rapid cooling of the first radiating block 21 through the first semiconductor controllable cooler 22, realizes rapid cooling of the second radiating block 31 through the second semiconductor controllable cooler 32, achieves the purpose of temperature control, and meanwhile, the first radiating block 21 is arranged between the motor 1 and the first semiconductor controllable cooler 22, the second radiating block 31 is arranged between the motor 1 and the second semiconductor controllable cooler 32, and the first radiating block 21 and the second radiating block 31 can play a role in homogenizing heat transfer, so that the heat exchange efficiency is further improved.
The above embodiments are not intended to limit the scope of the present utility model, so: all equivalent changes in structure, shape and principle of the utility model should be covered in the scope of protection of the utility model.
Claims (8)
1. A semiconductor type high-efficiency motor temperature control device is characterized in that: the motor comprises a motor (1), a first heat dissipation assembly (2) and a second heat dissipation assembly (3), wherein the first heat dissipation assembly (2) and the second heat dissipation assembly (3) are identical in structure and size, and the first heat dissipation assembly (2) and the second heat dissipation assembly (3) are respectively positioned at two opposite ends of the motor (1) and are in butt joint with the motor (1); the first heat dissipation assembly (2) comprises a first heat dissipation block (21) and a first semiconductor controllable cooler (22), one end of the first heat dissipation block (21) is abutted with the motor (1), and the other end of the first heat dissipation block is detachably connected with the first semiconductor controllable cooler (22); the second heat dissipation assembly (3) comprises a second heat dissipation block (31) and a second semiconductor controllable cooler (32), one end of the second heat dissipation block (31) is abutted to the motor (1), and the other end of the second heat dissipation block is detachably connected with the second semiconductor controllable cooler (32).
2. The semiconductor type efficient motor temperature control device according to claim 1, wherein: a first groove (214) is formed in one end, abutted to the motor (1), of the first radiating block (21), and a second groove (312) is formed in one end, abutted to the motor (1), of the second radiating block (31).
3. The semiconductor type efficient motor temperature control device according to claim 1, wherein: first otic placode (211) is fixed mounting on first radiating block (21), be provided with fixing bolt (212) and fixation nut (213) on first otic placode (211), fixed mounting has second otic placode (311) corresponding with first otic placode (211) on second radiating block (31), fixing bolt (212) pass first otic placode (211) and second otic placode (311) in proper order, and with fixation nut (213) threaded connection.
4. The semiconductor type efficient motor temperature control device according to claim 1, wherein: a heat conduction silicone grease layer (4) is paved between the first radiating block (21) and the first conductor controllable cooler.
5. The semiconductor type efficient motor temperature control device according to claim 1, wherein: the first radiating block (21) is made of a material with high heat conductivity.
6. The semiconductor type efficient motor temperature control device according to claim 1, wherein: one end of the first semiconductor controllable cooler (22) deviating from the first radiating block (21) is fixedly provided with a first radiating fan (5), and one end of the second semiconductor controllable cooler (32) deviating from the second radiating block (31) is fixedly provided with a second radiating fan (6).
7. The semiconductor type efficient motor temperature control device according to claim 6, wherein: the device also comprises a first temperature detection module (7) and a control module (9);
the first temperature detection module (7) is used for detecting the temperature of the first radiating block (21) in real time and outputting a first temperature detection signal;
the control module (9) is connected with the temperature detection module and is used for receiving the first temperature detection signal and outputting a first control signal when the value reflected by the first temperature detection signal reaches a preset temperature value;
the first cooling fan (5) is connected with the control module (9) and is used for working after receiving a first control signal.
8. The semiconductor type efficient motor temperature control device according to claim 7, wherein: the control module (9) adopts a temperature controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320918628.4U CN219875370U (en) | 2023-04-22 | 2023-04-22 | Semiconductor type high-efficiency motor temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320918628.4U CN219875370U (en) | 2023-04-22 | 2023-04-22 | Semiconductor type high-efficiency motor temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219875370U true CN219875370U (en) | 2023-10-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320918628.4U Active CN219875370U (en) | 2023-04-22 | 2023-04-22 | Semiconductor type high-efficiency motor temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219875370U (en) |
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2023
- 2023-04-22 CN CN202320918628.4U patent/CN219875370U/en active Active
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