CN219873475U - Cutting device - Google Patents

Abstract

The application relates to a cutting device which is provided with a first path for semiconductor element circulation, wherein the first path is provided with a material receiving station, a waste material station, a material supplying station, an adjusting station and a cutting station; a positioning vision module, a rechecking vision module and a carrying module are arranged above the first path; the cutting station is provided with a cutting platform and an adsorption module arranged on the cutting platform, and the cutting platform is provided with a blanking hole and can move back and forth along a first direction; the adsorption module is arranged at the edge of the blanking hole in a surrounding manner; the adsorption module comprises a fixed seat and a movable seat which are opposite along a second direction and are arranged at intervals, and a material rejecting space communicated with the blanking hole is formed between the fixed seat and the movable seat; the movable seat can move close to or away from the fixed seat along the second direction; the second direction is disposed at an angle to the first direction. The cutting equipment can be used for stably fixing the semiconductor elements, is suitable for the semiconductor elements of different types, and improves the cutting quality.

Description

Cutting device

Technical Field

The application relates to the technical field of semiconductor manufacturing, in particular to cutting equipment.

Background

Currently, in the semiconductor device inspection process, a defective product needs to be cut. In practice, a diagonally fixed arrangement is generally used to cut and fix the semiconductor element, so as to ensure that the semiconductor element does not shift under the cutting force during the cutting process. However, in the diagonal fixing manner, there may be a case where the fixing is unstable, thereby affecting the cutting quality.

Disclosure of Invention

Based on this, it is necessary to provide a cutting apparatus which can fix semiconductor elements more stably and is suitable for semiconductor elements of different types, and the cut material does not interfere with the raw material.

A cutting device, which is provided with a first path for semiconductor element circulation, wherein the first path is provided with a receiving station, a waste station, a feeding station, an adjusting station and a cutting station; a positioning vision module, a rechecking vision module and a carrying module are arranged above the first path, the carrying module can circulate among stations along the first path, the positioning vision module is used for collecting the image information of the semiconductor element on the feeding station, and the rechecking vision module is used for collecting the image information of the semiconductor element cut by the cutting station; the cutting station is provided with a cutting platform and an adsorption module arranged on the cutting platform, and the cutting platform is provided with a blanking hole and can move back and forth along a first direction; the adsorption module is arranged at the edge of the blanking hole in a surrounding mode; the adsorption module comprises a fixed seat and a movable seat which are opposite along a second direction and are arranged at intervals, and a material rejecting space communicated with the blanking hole is formed between the fixed seat and the movable seat; the movable seat can move close to or away from the fixed seat along a second direction; the first direction and the second direction are arranged at an angle, and the second direction is the same as or tends to be the same as the first path.

According to the cutting equipment, the fixed seat and the movable seat are respectively arranged on two sides of the blanking hole so as to fix two side edges of the semiconductor element extending along the first direction. Therefore, compared with diagonal fixation, the method adopting opposite side fixation has more effective protection to the semiconductor element, so as to avoid interference between cutting and fixation, meet the normal operation of cutting process and ensure the cutting quality. Moreover, the movable seat can move relative to the fixed seat so as to be convenient for adapting to semiconductor elements with different sizes. Meanwhile, due to the fact that the fixed seat and the movable seat are arranged at the positions which are compared with the blanking holes, the material rejecting space between the fixed seat and the movable seat is communicated with the blanking holes, and cut materials can just fall out from the blanking holes through the material rejecting space, so that interference to raw materials of semiconductor elements and cutting operation is avoided, and cutting quality is guaranteed. In addition, after the semiconductor element after cutting can pass through the recheck vision module, whether the semiconductor element is cut to be qualified or not is judged, and if the semiconductor element is not qualified, the semiconductor element can be cut again, so that the cutting quality is further ensured.

In some embodiments, a plurality of grooves are formed on one side of the fixed seat and one side of the movable seat, which are away from the cutting platform, and are arranged at intervals along the first direction, and an adsorption hole is formed in each groove; the fixed seat and the movable seat are internally provided with air passages which are communicated with the adsorption holes.

In some embodiments, a plurality of the adsorption holes, a part of the adsorption holes are positioned in the first area, and another part of the adsorption holes are positioned in the second area; the area of the first area is smaller than that of the second area along the first direction; the first area and the second area are both provided with the air passage; and/or, in the first area, the number of the air passages is at least two, and the air passages are arranged at intervals along the first direction and are not communicated with each other; each air passage is connected with at least two arbitrary adjacent adsorption holes.

In some embodiments, along the adsorption direction, the movable seat and the fixed seat each comprise a base, a sealing element and a vacuum guide rail, wherein the base, the sealing element and the vacuum guide rail are sequentially overlapped from top to bottom, the sealing element is pressed between the base and the vacuum guide rail, the sealing element is provided with a groove body to form the air passage, and the adsorption hole is formed in the vacuum guide rail.

In some embodiments, the fixing base is fixedly arranged on the cutting platform, a supporting plate extends from one side of the movable base, which is away from the fixing base, along the second direction, a connecting block for connecting a power source is convexly arranged on the supporting plate, and the supporting plate is in sliding connection with the cutting platform.

In some embodiments, the cutting station is further provided with a laser cutting module and a dust removing module, and the dust removing module is installed below the laser cutting module; the dust removal module is configured with a suction baffle and a suction pipeline connected with the suction baffle, the suction baffle is enclosed to form a suction cavity, at least one suction baffle is configured with a through hole, and one end of the suction pipeline is communicated with the suction cavity through the through hole.

In some of these embodiments, the review vision module and the positioning vision module each include a vision camera, an adjustment slide, and a vision bracket; one end of the visual support is suspended above the material receiving station or the material feeding station, the adjusting sliding table is mounted at the suspended end of the visual support, and the visual camera is mounted at the adjusting sliding table; the adjusting sliding table can rotate around the Z axis and the Y axis relative to the vision support so as to drive the vision camera to synchronously rotate, and the adjusting sliding table can drive the vision camera to respectively move along the Z axis and the X axis; the Z axis is along a third direction, the Y axis is along the first direction, the X axis is along the second direction, and the third direction, the second direction and the first direction are arranged in a pairwise angle mode.

In some embodiments, the adjusting sliding table comprises a reference block, a first adjusting block and a second adjusting block; the first adjusting block comprises a first connecting arm and a second connecting arm which are arranged at an angle, the first connecting arm is connected with the reference block, the second connecting arm is positioned on one side of the reference block, which is away from the vision bracket, and is connected with the second adjusting block, and the second adjusting block is connected with the vision camera; the first adjusting block can rotate around the Z axis relative to the reference block, and the second adjusting block can rotate around the Y axis relative to the second connecting arm.

In some embodiments, at least one of the positioning vision module and the review vision module includes an illumination source; the cutting device further comprises a light source support, and the illumination light source is mounted on the light source support.

In some embodiments, the cutting apparatus includes a support beam having a length extending in a second direction, the handling modules including a first handling module and a second handling module, the first handling module and the second handling module each being slidably connected to the support beam; the first carrying module can flow between stations along the first path, and the second carrying module can flow relative to the material receiving station along the first path.

In some embodiments, the first handling module includes a static stand frame, a voltage amplifier, and a static platform, where the static platform is mounted on the static stand frame and is electrically connected to the voltage amplifier, the static stand frame is slidably connected to the supporting beam, and the voltage amplifier can regulate a static voltage of the static platform; and/or, the second carrying module comprises a plurality of adsorbing pieces, a pneumatic source and an adsorbing frame, wherein the adsorbing pieces are arranged at intervals on the adsorbing frame and are communicated with the pneumatic source, and the adsorbing frame is connected with the supporting cross beam in a sliding manner.

In some of these embodiments, the adjustment station is provided with an adjustment platform; the adjusting platform comprises a rotating mechanism, a translation mechanism and an adjusting panel, wherein the rotating mechanism is connected to the bottom of the adjusting panel, and the translation mechanism is connected with the rotating mechanism; the translation mechanism is used for driving the adjustment panel to move along the first direction through the rotation mechanism, and the rotation mechanism is used for driving the adjustment panel to rotate around the central axis of the adjustment panel.

In some embodiments, the cutting apparatus further comprises a plurality of trays arranged at intervals, at least one of the plurality of trays being located at the receiving station, at least one other of the plurality of trays being located at the feeding station; each tray is provided with an avoidance hole; the cutting device further comprises a positioning piece, a part of the positioning piece can penetrate through the avoidance hole to extend into the tray, and the positioning piece is configured to drive the semiconductor element to move in the tray in response to external force driving; and/or the first path is also provided with a waste station, and the waste station is arranged at intervals with the material receiving station and the material supplying station.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present application, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following descriptions are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

FIG. 1 is a schematic view of a cutting apparatus provided by the present application;

FIG. 2 is a schematic view of a cutting station in a cutting apparatus according to the present application;

FIG. 3 is a schematic diagram of the cutting platform and the adsorption module provided in FIG. 2;

FIG. 4a is a schematic diagram showing a first part of an adsorption module in a cutting apparatus according to the present application;

FIG. 4b is a second schematic diagram illustrating the adsorption module in the cutting apparatus according to the present application;

FIG. 5 is a partial exploded view of an adsorption module in a cutting apparatus according to the present application;

FIG. 6 is a schematic diagram of a review visual module and a positioning visual module in a cutting device according to the present application;

FIG. 7 is a partial schematic view of the review visual module provided in FIG. 6;

FIG. 8 is a schematic view of a tray in a cutting apparatus according to the present application;

FIG. 9 is a schematic diagram of a first handling module in a cutting apparatus according to the present application;

FIG. 10 is a schematic diagram of a second handling module in a cutting apparatus according to the present application;

FIG. 11 is a first schematic view of an adjustment platform in a cutting apparatus according to the present application;

fig. 12 is a second schematic diagram of the adjustment platform in the cutting device provided by the application.

Reference numerals: 100. a working machine; 200. a cutting station; 300. a material receiving station; 400. a waste station; 500. a feed station; 600. adjusting a station; 700. a support beam; 800. a semiconductor element; 11. cutting a platform; 12. an adsorption module; 13. a vacuum generating device; 14. a laser cutting module; 15. a waste collection box; 16. a dust removal module; 17. a linear module; 21. rechecking a vision module; 22. positioning a visual module; 30. a material tray; 31. a material receiving disc; 32. a feed tray; 33. a waste tray; 34. a positioning piece; 131. a vacuum logic valve; 141. a laser control cabinet; 142. positioning a camera in an auxiliary manner; 143. a laser platform; 144. a visual light source; 161. a suction baffle; 1601. a suction chamber; 1611. a through hole; 162. a suction duct; 163. a dust removal bracket; 111. a blanking hole; 121. a fixing seat; 122. a movable seat; 1201. a material picking space; 1202. a groove; 1203. adsorption holes; 1204. an airway; 1221. a support plate; 1222. a connecting block; 1223. a floating joint; 1224. a power source; 1205. a first region; 1206. a second region; 1207. a base; 1208. a seal; 1209. a vacuum guide rail; 301. avoidance holes; 211. a vision camera; 212. adjusting the sliding table; 213. a visual support; 2121. a reference block; 2122. a first adjustment block; 2123. a second adjustment block; 231. an illumination light source; 232. a light source support; 2321. a cross beam; 2322. a longitudinal beam; 2323. a vertical beam; 2324. a main beam; 2325. a connecting lug; 2326. a mounting block; 2124. a first arcuate aperture; 2125. a second arcuate aperture; 40. a carrying module; 41. a first handling module; 42. a second carrying module; 43. a lifting mechanism; 44. assembling a beam; 45. a sliding seat; 411. an electrostatic stage frame; 412. a voltage amplifier; 413. an electrostatic platform; 414. a paper ejection cylinder; 421. an adsorption frame; 422. an absorbing member; 401. a cross frame beam; 402. a longitudinal frame beam; 403. a sheet metal bending part; 50. adjusting a platform; 51. a rotation mechanism; 52. a translation mechanism; 53. an adjustment panel; 54. a splice plate; 55. a sliding support block; 56. sliding the support rail; 511. a rotating electric machine; 512. rotating the driving wheel; 513. rotating the driven wheel; 514. rotating the synchronous belt; 521. a translation motor; 522. a first synchronization band set; 523. a second set of synchronized bands; 524. joining the substrates; 5221. a first drive wheel; 5222. a first driven wheel; 5223. a first belt; 5231. a second driving wheel; 5232. a second driven wheel; 5233. and a second belt.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and the like are used in the description of the present application for the purpose of illustration only and do not represent the only embodiment.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through intermedial media. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used in the description of the present application includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, 2, 3 and 6, an embodiment of the present application provides a cutting apparatus for cutting a semiconductor element 800. The cutting equipment is provided with a first path for the semiconductor element 800 to flow, the first path is provided with a material receiving station 300, a material supplying station 500, an adjusting station 600 and a cutting station 200, a positioning vision module 22, a rechecking vision module 21 and a carrying module 40 are arranged above the first path, the carrying module 40 can flow between each station along the first path, the positioning vision module 22 is used for collecting image information of the semiconductor element 800 positioned at the material supplying station 500, and the rechecking vision module 21 is used for collecting image information of the semiconductor element 800 cut by the cutting station 200.

The cutting station 200 is provided with a cutting platform 11 and an adsorption module 12 mounted on the cutting platform 11, the cutting platform 11 is provided with a blanking hole 111 and can reciprocate along a first direction, and the adsorption module 12 is enclosed at the edge of the blanking hole 111. The adsorption module 12 comprises a fixed seat 121 and a movable seat 122 which are opposite along the second direction and are arranged at intervals, and a material rejecting space 1201 communicated with the blanking hole 111 is formed between the fixed seat 121 and the movable seat 122; the movable seat 122 can perform approaching movement or separating movement relative to the fixed seat 121 along the second direction; the second direction is disposed at an angle to the first direction.

Wherein the Y axis is the first direction, the X axis is the second direction, and the Z axis is the third direction.

In actual use, the semiconductor element 800 to be cut is transported to the feeding station 500, the positioning vision module 22 is used to obtain the pose of the semiconductor element 800 at this time, and then the first transporting module 41 is used to transport the semiconductor element 800 to the adjusting station 600, so as to adjust the pose of the semiconductor element 800 to adapt to the cutting pose requirement; then, the first carrying module 41 is used for carrying the workpiece to the cutting station 200, and the workpiece is adsorbed and fixed by the adsorption module 12 so as to be convenient for cutting; the cut workpiece is moved to the material receiving station 300 by the first carrying module 41, and photographed by the review visual module 21 to determine whether the cut semiconductor element 800 meets the process requirement; if not, the first carrying module 41 is used to carry to the cutting station 200 for secondary cutting until the process requirement is met.

Of course, the cutting device further includes a waste station 400 disposed on the first path, when the review vision module 21 photographs the cut workpiece, it is determined that the cut semiconductor element 800 seriously does not meet the process requirement; alternatively, after multiple cutting, the semiconductor device 800 still does not meet the process requirement, and the first transporting module 41 is used to transport the semiconductor device to the waste station 400 for recycling the waste.

When the semiconductor element 800 is cut, the semiconductor element 800 is fixed by the movable seat 122 and the fixed seat 121 and is positioned above the blanking hole 111 on the cutting platform 11, and then the semiconductor element is moved to the cutting station 200 along with the cutting platform 11 to perform cutting treatment. The cut waste can directly fall from the material rejecting space 1201 between the movable seat 122 and the fixed seat 121 to the material discharging hole 111, so as to facilitate the collection of the waste.

In the above process, since the fixed seat 121 and the movable seat 122 are respectively disposed at two sides of the blanking hole 111, that is, two side walls of the semiconductor element along the first direction are fixed, a manner of fixing the edges is formed, so as to improve the fixing stability, so that the semiconductor element 800 is not easy to deform or cheap in the cutting process, and the cutting quality is improved. Moreover, the movable base 122 is convenient to adapt to the fixation of the semiconductor element 800 with different sizes due to the movement of the fixed base 121, so that the use flexibility is higher; further, the fixing position with the semiconductor element 800 can be adjusted by the movable base 122, and the fixing stability can be further improved. Meanwhile, due to the arrangement of the fixed seat 121 and the movable seat 122 in comparison with the blanking hole 111, the material rejecting space 1201 between the fixed seat 121 and the movable seat 122 is communicated with the blanking hole 111, and the cut material just can fall out of the blanking hole 111 through the material rejecting space 1201, so that interference to the raw material of the semiconductor element 800 and cutting operation is avoided, and the cutting quality is ensured. In addition, after the semiconductor element 800 after being cut is subjected to the review visual module 21, whether the semiconductor element is cut is judged to be qualified or not, and if the semiconductor element is not qualified, the semiconductor element can be cut again, so that the cutting quality is further ensured.

When in actual use, the cutting device further comprises a working machine 100, the cutting platform 11 is slidably connected to the working machine 100 through a sliding rail, and the working machine 100 is provided with a linear module 17 for driving the cutting platform 11 to linearly reciprocate along a first direction.

As shown in fig. 4a and 4b, in some embodiments, a plurality of grooves 1202 are configured on a side of the fixed seat 121 and the movable seat 122 facing away from the cutting platform 11, and each groove 1202 is provided with an adsorption hole 1203; the fixed seat 121 and the movable seat 122 are respectively provided with an air passage 1204, and the air passages 1204 are communicated with a plurality of adsorption holes 1203. That is, the fixed seat 121 and the movable seat 122 both adopt a vacuum adsorption mode to fix the semiconductor element. In addition, the method is convenient for controlling the air flow, is convenient for adjusting the adsorption force acting on the semiconductor element, and has better fixing effect. When the semiconductor device is adsorbed on the fixed seat 121 and the movable seat 122, the arrangement of the grooves 1202 can form an air cavity to increase the adsorption area acting on the semiconductor device and improve the fixing effect.

Further, as shown in fig. 3, the fixing base 121 is fixedly arranged on the cutting platform 11. The movable base 122 extends along a side of the second direction away from the fixed base 121, and a support plate 1221 is provided with a connection block 1222 protruding from the support plate 1221, and the connection block 1222 is connected to the power source 1224 by a floating joint 1223. The bottom of the support plate 1221 is connected to the cutting table 11 by the cooperation of the rail blocks. The power source 1224 drives the movable base 122 to reciprocate along the second direction through the floating joint 1223 so as to approach or separate from the fixed base 121. The power source 1224 may be an electric push rod or an air cylinder, which can only push the movable seat 122; meanwhile, the floating joint 1223 is configured to buffer the vibration generated when the power source 1224 pushes against, so as to improve the stability of the movable seat 122.

As shown in fig. 5, in some embodiments, a portion of the suction holes 1203 are located in the first region 1205, and another portion of the suction holes 1203 are located in the second region 1206; the area of the first region 1205 is smaller than the area of the second region 1206 along the length direction of the blanking hole 111, i.e., along the first direction; the first region 1205 and the second region 1206 are each provided with an air passage 1204. That is, by the arrangement of the divided regions, stable adsorption can be satisfied for semiconductor elements of different sizes. The second region 1206 having a larger area may be used for compatibility with small-sized and large-sized semiconductor elements, and the first region 1205 may be used for auxiliary suction fixation when the semiconductor elements are oversized, so as to satisfy the suction fixation of oversized semiconductor elements.

In practical use, the cutting device further comprises a vacuum generating device 13, so as to be communicated with the fixed seat 121 and the air passage 1204 in the movable seat 122 through hoses, thereby meeting the vacuum adsorption requirement.

As shown in fig. 5, in the preferred embodiment, in the first region 1205, the number of the air passages 1204 is two, and are arranged at intervals in the first direction and are not communicated with each other; one air passage 1204 is connected with two arbitrary adjacent suction holes 1203, and the other air passage 1204 is connected with more than two arbitrary adjacent suction holes 1203. Specifically, since the first region 1205 is used to assist the second region 1206 to adsorb and fix the oversized semiconductor element, two air passages 1204 are provided in the first region 1205 to select the appropriate air passages according to the semiconductor element. Meanwhile, since the second region 1206 may adsorb a large-sized semiconductor element, the plurality of adsorption holes 1203 may be communicated through one air passage 1204 to satisfy simultaneous vacuum of the plurality of adsorption holes 1203.

As shown in fig. 5, for example, in the suction direction, the movable base 122 and the fixed base 121 each include a base 1207, a sealing member 1208, and a vacuum rail 1209 stacked in this order from bottom to top, and the sealing member 1208 is pressed between the base 1207 and the vacuum rail 1209. Wherein the sealing member 1208 is configured with a groove body penetrating in the thickness direction thereof; the suction holes 1203 are provided in the vacuum rail 1209 and penetrate in the thickness direction of the vacuum rail 1209; the base 1207 is provided with a plurality of channels arranged at intervals along the length direction thereof, and one end of each channel is connected with a vacuum logic valve 131. When the sealing member 1208 is pressed between the base 1207 and the vacuum guide rail 1209, the groove body thereon can form an air passage 1204 for air flow, and the passage is communicated with the air passage 1204, so that vacuum adsorption of the semiconductor element can be satisfied. Moreover, the occurrence of air pressure leakage can be prevented due to the provision of the vacuum logic valve 131.

As shown in fig. 2, in some embodiments, the cutting station 200 is further provided with a laser cutting module 14 and a waste collection box 15 located below the laser cutting module 14; when the cutting platform 11 moves below the laser cutting module 14, the waste collection box 15 is located below the blanking hole 111 and is communicated with the blanking hole 111, and the waste collection box 15 can move along the first direction. Specifically, the laser cutting module 14 is arranged, so that the semiconductor element is cut by using laser, and the efficiency is high. The laser cutting module 14 adopts a laser cutting instrument and is matched with a laser control cabinet 141. Meanwhile, the cut waste directly falls to the waste collection box 15 at the bottom for collection treatment; and, the slip setting of garbage collection box 15 is convenient for the manual work to take out and put back to satisfy the waste material clearance in the garbage collection box 15. Wherein, garbage collection box 15 includes big collecting box and little collecting box, and little collecting box slides and sets up in big collecting box.

As shown in fig. 2, further, the cutting station 200 is further provided with a dust removing module 16, and the dust removing module 16 is installed below the laser cutting module 14; the dust removing module 16 is configured with suction baffles 161 and suction ducts 162 connected to the suction baffles 161, the suction baffles 161 are enclosed as suction chambers 1601, and at least one suction baffle 161 is configured with through holes 1611, one end of the suction duct 162 communicates with the suction chambers 1601 through the openings. That is, the dust removal module 16 is arranged to collect and treat the waste gas generated in the cutting process, so as to reduce the waste gas pollution; and, the setting of suction baffle 161 is so as to enclose into suction chamber 1601, when satisfying suction efficiency improvement, plays the guard action to the laser head on the laser cutting module 14 to the life of extension laser head.

The top and bottom of the pumping chamber 1601 are open, so that the laser head of the laser cutting module 14 can emit laser to break down the semiconductor element. A through hole 1611 is opened at one side of the suction baffle 161 in the second direction so that the suction duct 162 communicates with the suction chamber 1601 to perform suction. The end of the suction duct 162 is flared and the large mouth is fitted with a through hole 1611 to increase the suction range and increase the suction efficiency. Meanwhile, the suction baffle 161 is connected with a dust removing bracket 163 so as to facilitate the suction baffle 161 to be elevated above the cutting platform 11, and reduce interference to the movement of the cutting platform 11.

As shown in fig. 2, further, an auxiliary positioning camera 142 is mounted on the laser cutting module 14 to take the position when the semiconductor element reaches the dicing station 200. The laser cutting module 14 is fixed above the cutting stage 11 by an inverted laser stage 143, and a vision light source 144 is mounted on the laser stage 143 to illuminate the semiconductor device for the auxiliary positioning camera 142.

As shown in fig. 6 and 7, in some embodiments, the review vision module 21 and the positioning vision module 22 each include a vision camera 211, an adjustment slide 212, and a vision bracket 213; one end of the visual support 213 is suspended above the material receiving station 300 or the material feeding station 500, the adjusting sliding table 212 is mounted at the suspended end of the visual support 213, and the visual camera 211 is mounted on the adjusting sliding table 212; the adjusting sliding table 212 can rotate around the Z axis and the Y axis relative to the vision support 213 so as to drive the vision camera 211 to synchronously rotate; and the adjustment slide table 212 can drive the vision camera 211 to move along the Z axis and the X axis, respectively.

Specifically, the bottom end of the vision support 213 is fixedly disposed on the workbench 100, and after the top end of the vision support 213 extends upward along the vertical direction, the top end of the vision support extends to the upper portion of the receiving tray 31 along the first direction, and then extends downward along the vertical direction for a section to reduce the distance between the extending end and the receiving tray 31. The adjustment slide 212 is suspended from the extended end of the vision support 213 by an engagement arm. The adjustment slide 212 has rotational adjustment in two directions to facilitate fine adjustment of the position of the vision camera 211 relative to the semiconductor element.

As shown in fig. 7, further, the adjusting sliding table 212 includes a reference block 2121, a first adjusting block 2122 and a second adjusting block 2123, the first adjusting block 2122 is mounted on the reference block 2121, and the second adjusting block 2123 is mounted on a side of the first adjusting block 2122 facing away from the reference block 2121 and is connected to the vision camera 211; the first adjustment block 2122 is rotatable about the Z-axis relative to the reference block 2121, and the second adjustment block 2123 is rotatable about the Y-axis relative to the first adjustment block 2122.

Specifically, the first adjustment block 2122 has a first connection arm arranged in a vertical direction and a second connection arm arranged in a horizontal direction. The reference block 2121 is fixedly connected with the connecting arm; the first connecting arm is overlapped on the top of the reference block 2121, and the second connecting arm is positioned on one side of the reference block 2121 away from the visual support 213; the second adjustment block 2123 is coupled to a second coupling arm of the first adjustment block 2122. Wherein, the first connecting arm is provided with two first arc-shaped holes 2124, and the two first arc-shaped holes 2124 are concentrically arranged and radially arranged at intervals along the first connecting arm; meanwhile, two second arc-shaped holes 2125 are formed in two sides of the second adjusting block 2123 along the third direction, and the two second arc-shaped holes 2125 are concentrically arranged and radially arranged at intervals. Such a setting facilitates adjusting the mounting angle of the first adjustment block 2122 relative to the reference block 2121 on a horizontal plane, and facilitates adjusting the mounting angle of the second adjustment block 2123 relative to the first adjustment block 2122 on a vertical plane, thereby achieving the mounting angle adjustment of the visual camera 211.

Wherein, be connected with first regulation seat on the second linking arm of first regulating block 2122 to through first bolt and second regulating block 2123 threaded connection, through rotatory first bolt with drive second regulating block 2123 along Z axle relative first regulating block 2122 removal. The reference block 2121 is connected to a second adjustment seat, and is screwed to the first adjustment block 2122 by a second bolt, and the first adjustment block 2122 is driven to move along the X-axis relative to the reference block 2121 by rotating the second bolt.

As shown in fig. 6, at least one of the positioning vision module 22 and the review vision module 21 further comprises an illumination light source 231; the cutting apparatus further includes a light source holder 232, and a plurality of illumination light sources 231 are mounted to the light source holder 232. Specifically, the illumination light source 231 is disposed so as to illuminate the semiconductor element for which an image is to be acquired. The light source brackets 232 may be fixedly disposed on the two vision brackets 213 so as to suspend the illumination light source 231 above the material receiving station 300 and the material feeding station 500. The light source support 232 includes two beams 2321 extending along the second direction, the two beams 2321 are arranged at intervals along the first direction, and a plurality of stringers 2322 extending along the first direction are connected between the two beams 2321, and the plurality of stringers 2322 are arranged at intervals along the second direction, so as to improve connection reliability between the two beams 2321. A vertical beam 2323 is connected to the upper side of each longitudinal beam 2322, one end, away from the longitudinal beam 2322, of each vertical beam 2323 is connected to a total beam 2324, and the total beams 2324 are fixedly arranged at the extending ends of the two visual supports 213. In a specific embodiment, the positioning vision module 22 and the review vision module 21 each include an illumination light source 231, where two illumination light sources 231 are mounted on two beams 2321 and are spaced apart along the length direction of the beams 2321, and the height of each illumination light source 231 relative to the beams 2321 in the vertical direction is convenient to adjust.

As shown in fig. 6, for example, each of the illumination light sources 231 has a connecting lug 2325 connected to each of the two ends in the axial direction, and each of the connecting lugs 2325 is connected to the cross member 2321 by a mounting block 2326. The connection lugs 2325 are configured with long holes extending in the vertical direction in length, the mounting blocks 2326 are configured with locking holes, and the connection lugs 2325 are locked to the mounting blocks 2326 by means of the cooperation of bolts and nuts.

It should be added that the connection is achieved by using the bolt and the nut, and the mode of adjusting the height in combination with the long hole is a mode which is easily thought by a person skilled in the art, so that the description is omitted.

The cutting setting is described in detail below in connection with the entire cutting process.

As shown in fig. 1 and 8, the scrap station 400 is disposed between the receiving station 300 and the feeding station 500 to facilitate storage of defective semiconductor elements. Wherein the cutting apparatus comprises a plurality of trays 30 arranged at intervals, at least one of the trays 30 being located at a receiving station 300 as a receiving tray 31, at least one other being located at a waste station 400 as a waste tray 33, and at least one further being located at a feeding station 500 as a feeding tray 32. The feeding tray 32 is used for placing semiconductor elements to be cut, the receiving tray 31 is used for placing semiconductor elements which are qualified after cutting, and the waste tray 33 is used for placing semiconductor elements which are unqualified after cutting.

As shown in fig. 8, further, the receiving station 300, the waste station 400 and the feeding station 500 are provided with two opposite guide rails arranged at intervals, so that the corresponding trays 30 slide in or out along the corresponding guide rails; meanwhile, the tail of each tray 30 is provided with a handle, so that the trays 30 can be replaced manually. Each tray 30 is configured with a relief hole 301. The cutting device further comprises a positioning piece 34, part of the positioning piece 34 can penetrate through the avoidance hole 301 to extend into the tray 30, and the positioning piece 34 can push the semiconductor element to move in the tray 30 under the action of external force driving so as to ensure that the semiconductor element is in place.

When the semiconductor elements after being qualified in cutting are placed on the material receiving tray 31, dust-free paper is required to be placed between any two adjacent semiconductor elements in order to avoid abrasion between any two adjacent semiconductor elements. Therefore, in actual use, the supporting beam 700 with the length extending along the second direction is further disposed on the working platform 100, the carrying module 40 includes the first carrying module 41 and the second carrying module 42, and the first carrying module 41 and the second carrying module 42 are disposed at intervals and are both slidingly connected to the supporting beam 700, and can both move along the length direction of the supporting beam 700, so as to meet the carrying of the semiconductor element and the dust-free paper. Wherein the first carrying module 41 is capable of circulating between the stations along the first path when carrying the semiconductor element; the second handling module 42 is capable of being rotated along the first path relative to the receiving station 300 during handling of the dust-free paper.

In order to avoid interference between the two conveying operations, the first conveying module 41 is disposed near the feeding tray 32, and the second conveying module 42 is disposed near the receiving tray 31; and two buffer pads (as hard limit) and sensors (as soft limit) are arranged on each carrying module, so that the carrying safety and stability are improved by combining the soft limit with the hard limit.

It should be noted that the structure of the supporting beam 700 is a mature technology in the prior art, and is not an improvement point of the present application, so that the description is omitted.

Because the thickness of the semiconductor element to be absorbed is small and the overall size is large, special attention is paid to stability in the process of carrying, so that the semiconductor element is prevented from falling off in the process of carrying, and the protection of the semiconductor element is improved. Based on this, as shown in fig. 1 and 9, in some embodiments, the first handling module 41 includes a static platform frame 411, a voltage amplifier 412 and a static platform 413, the static platform frame 411 is slidably connected to the supporting beam 700, the static platform 413 is mounted on the static platform frame 411, and the static platform 413 is electrically connected to the voltage amplifier 412, and the voltage amplifier 412 can regulate the static voltage of the static platform 413.

That is, the electrostatic adsorption method is used to convey the semiconductor device. Since the projection area of the electrostatic stage 413 in the vertical direction is large, it can be substantially adapted to the size of the semiconductor element; therefore, the semiconductor element can form an entire contact state with the semiconductor element during adsorption, and the contact area between the semiconductor element and the semiconductor element is increased, so that stable adsorption of the semiconductor element is met, and the falling risk is reduced while the flatness and the integrity of the semiconductor element are ensured.

Further, as shown in fig. 9, since the semiconductor element and the dust-free paper are disposed to cross, a paper ejection cylinder 414 is further installed on the electrostatic stage frame 411, and a driving end of the paper ejection cylinder 414 can pass through the electrostatic stage 413 to press against the dust-free paper, so as to prevent the dust-free paper in the receiving tray 31 from adhering to the semiconductor element or the electrostatic stage 413. Wherein, the electrostatic platform 413 is correspondingly provided with an opening for the driving end of the paper ejection cylinder 414 to pass through, and the position of the opening is matched with the position of the paper ejection cylinder 414; a gap is formed between the electrostatic stage frame 411 and a side of the electrostatic stage 413 facing away from the suction side. The drive end of the top paper cylinder 414 may be retracted within the gap or flush with the electrostatic platform 413 when it is not required to press against the dust-free paper. The projection surface dimension of the electrostatic stage 413 in the vertical direction is larger than the planar dimension of the semiconductor element. In this way, the suction with the entire surface of the semiconductor element is ensured, and the suction is formed with the operation of the top paper cylinder 414. Wherein the number of top paper cylinders 414 is plural and spaced apart.

Meanwhile, because the dust-free paper is used for protecting the semiconductor element, the plane size of the dust-free paper is larger than that of the semiconductor element, so that the dust-free paper is not easy to carry, and the risk of falling off is more likely to exist. Based on this, as shown in fig. 1 and 10, the second carrying module 42 includes an adsorption frame 421, a plurality of adsorption members 422, and a pneumatic source, the adsorption frame 421 is slidably connected to the support beam 700, and the plurality of adsorption members 422 are arranged at intervals on the adsorption frame 421 and are connected to the pneumatic source. In this way, the plurality of adsorbing elements 422 are arranged at intervals to meet the requirement of a larger adsorption area, and the plurality of adsorbing elements 422 are fixed at multiple points, so that the adsorption effect on the dust-free paper is improved on the basis of meeting the planar size of the dust-free paper. In a specific embodiment, the adsorption member 422 employs a bernoulli chuck to perform the adsorption of the dust-free paper in a non-contact manner, thereby facilitating the soft grasping of the dust-free paper and minimizing the contact with the dust-free paper.

The specific working principle of the Bernoulli sucker is the prior art, and the Bernoulli sucker does not belong to the application point of the application, so that the Bernoulli sucker is not repeated.

In summary, the first carrying module 41 and the second carrying module 42 need to be lifted and lowered along the vertical direction to satisfy the suction operation of the electrostatic platform 413 and the suction member 422. Thus, the first and second transport modules 41 and 42 each have a lifting mechanism 43, which is a first lifting mechanism and a second lifting mechanism, respectively. The two lifting mechanisms 43 adopt linear cylinders or other linear driving modules to be connected with the corresponding electrostatic stage frames 411 or the adsorption frames 421 through follow-up sliding blocks.

As shown in fig. 9 and 10, further, in order to improve the assembly quality, an L-shaped assembly beam 44 is fixed between the electrostatic stage frame 411 and the corresponding slider, an L-shaped assembly beam 44 is also fixed between the suction frame 421 and the corresponding slider, the two assembly beams 44 have substantially the same structure, and a buffer is further mounted on the assembly beam 44. Meanwhile, the first and second elevating mechanisms are respectively installed at sides facing away from the respective assembly beams 44 with sliding seats 45 for cooperation with the support beams 700.

Still further, the electrostatic stage frame 411 and the suction frame 421 are substantially identical, and each includes a cross frame beam 401 and a longitudinal frame beam 402, which are vertically disposed; the length of the longitudinal frame beam 402 is smaller than the length of the transverse frame beam 401, and the longitudinal frame beam 402 is fixedly arranged at the bottom of the transverse frame beam 401.

In the electrostatic stage frame 411, the number of the longitudinal frame beams 402 and the number of the transverse frame beams 401 are two, and are respectively arranged at intervals. Two longitudinal frame beams 402 are distributed at intervals at positions close to the middle of the transverse frame beam 401, and sheet metal bending parts 403 are respectively and fixedly arranged at positions of the two transverse frame beams 401 close to the end parts, so that a paper ejection cylinder 414 is assembled through the sheet metal bending parts 403, and a gap is formed between the sheet metal bending parts and an electrostatic platform 413. The structures of the two sheet metal bending parts 403 may be the same or different, for example, one sheet metal bending part 403 is arranged in a zigzag manner with an included angle of 90 degrees, and the other sheet metal bending part 403 is arranged in an inverted "convex" manner.

In the adsorption frame 421, the number of the longitudinal frame beams 402 is four, the number of the transverse frame beams 401 is two, and the four longitudinal frame beams 402 are uniformly distributed at intervals along the length direction of the transverse frame beams 401 so as to separate the transverse frame beams 401 into three spaced mounting sections, and each mounting section is provided with an adsorption piece 422; thus, in the present embodiment, the number of the adsorbing members 422 is six.

As shown in fig. 1, 11 and 12, in some embodiments, the cutting apparatus further includes an adjustment platform 50, where the adjustment platform 50 is disposed at the adjustment station 600, so as to adjust the angle and position of the semiconductor element to meet the cutting requirements. Specifically, the adjusting platform 50 includes a rotating mechanism 51, a translating mechanism 52 and an adjusting panel 53, the rotating mechanism 51 is connected to the bottom of the adjusting panel 53, the translating mechanism 52 is connected to the rotating mechanism 51, the translating mechanism 52 is used for driving the adjusting panel 53 to move along the second direction through the rotating mechanism 51, and the rotating mechanism 51 is used for driving the adjusting panel 53 to rotate around the central axis of the adjusting panel 53.

Specifically, the rotation mechanism 51 includes a rotation motor 511, a rotation driving wheel 512, a rotation driven wheel 513, and a rotation synchronous belt 514, wherein a motor shaft of the rotation motor 511 is in transmission connection with the rotation driving wheel 512, and the rotation synchronous belt 514 is tensioned between the rotation driving wheel 512 and the rotation driven wheel 513 to drive the rotation driven wheel 513 to rotate through the rotation driving wheel 512. The rotary driven wheel 513 is connected to the adjustment panel 53 through a disc to drive the adjustment panel 53 to rotate synchronously. The casing of the rotary motor 511 is fixed on a joint plate 54, the joint plate 54 is connected with the translation mechanism 52, and the joint plate 54 is convexly provided with a rotary driven wheel 513 to support the rotary driven wheel 513 for rotation. The connector plate 54 is provided with a photoelectric switch and the disk is provided with a contact piece extending out so as to be matched with the photoelectric switch. The diameter of the rotary driving wheel 512 is larger than that of the rotary driven wheel 513, so that the rotary synchronous belt 514 can be tensioned better, and the transmission stability is improved.

Meanwhile, the translation mechanism 52 includes a translation motor 521, a first synchronous belt group 522, a second synchronous belt group 523, and a linking substrate 524, the linking substrate 524 and the translation motor 521 are both mounted on the workbench 100, a motor shaft of the translation motor 521 is in transmission connection with the first synchronous belt group 522, the first synchronous belt group 522 is in transmission connection with the second synchronous belt group 523, and the linking plate 54 is connected with the first synchronous belt group 522 through a sliding support block 55 so as to satisfy the linear movement of the linking plate 54. The first synchronous belt set 522 includes a first driving wheel 5221, a first driven wheel 5222, and a first driving belt 5223, the first driving wheel 5221 is in driving connection with a motor shaft of the translation motor 521, and the first driving belt 5223 is tensioned between the first driving wheel 5221 and the first driven wheel 5222. The second synchronous belt set 523 includes a second driving wheel 5231, a second driven wheel 5232 and a second driving belt 5233, the second driving wheel 5231 is in transmission connection with the first driven wheel 5222 through a rotating shaft, the second driving belt 5233 is tensioned between the second driving wheel 5231 and the second driven wheel 5232, and the sliding supporting block 55 is connected with the second driving belt 5233. The engagement substrate 524 is configured with a rotation hole for the rotation shaft to pass through, and the rotation shaft is rotatably connected with the engagement substrate 524 through a bearing. A sliding support rail 56 is disposed on a side of the engagement substrate 524 facing away from the first synchronization belt set 522, and a sliding support block 55 is slidably connected to the sliding support rail 56, so as to support and move the sliding support block 55. Wherein the number of the sliding supporting blocks 55 is at least two, and one sliding supporting block 55 is connected with the second transmission belt 5233 and is in sliding connection with the sliding supporting rail 56; the other sliding supporting block 55 is connected to one side of the connecting plate 54 away from the adjusting panel 53 and is in sliding connection with the sliding supporting rail 56; thus, the support of the engagement plate 54 can be improved.

In actual use, after the first carrying module 41 drives the semiconductor element to be transferred from the feeding tray 32 to the adjusting panel 53, the controller can control the translation motor 521 and the rotation motor 511 to move respectively based on the position captured by the positioning vision module 22, so as to meet the angle and position adjustment of the adjusting panel 53, so that the semiconductor element thereon reaches the target position and angle.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of the application should be determined from the following claims.

Claims (13)

1. A cutting apparatus, characterized by a first path for the circulation of semiconductor elements (800), said first path being provided with a receiving station (300), a feeding station (500), an adjusting station (600) and a cutting station (200); a positioning vision module (22), a rechecking vision module (21) and a carrying module (40) are arranged above the first path, the carrying module (40) can flow between stations along the first path, the positioning vision module (22) is used for collecting image information of the semiconductor element (800) on the feeding station (500), and the rechecking vision module (21) is used for collecting image information of the semiconductor element (800) cut by the cutting station (200);

the cutting station (200) is provided with a cutting platform (11) and an adsorption module (12) arranged on the cutting platform (11), the cutting platform (11) is provided with a blanking hole (111) and can move back and forth along a first direction, and the adsorption module (12) is arranged at the edge of the blanking hole (111) in a surrounding mode; the adsorption module (12) comprises a fixed seat (121) and a movable seat (122) which are opposite along a second direction and are arranged at intervals, and a picking space (1201) communicated with the blanking hole (111) is formed between the fixed seat (121) and the movable seat (122); the movable seat (122) can move close to or away from the fixed seat (121) along a second direction; the first direction and the second direction are arranged at an angle, and the second direction is the same as or tends to be the same as the first path.

2. The cutting apparatus according to claim 1, wherein a plurality of grooves (1202) arranged at intervals along the first direction are formed in one side of the fixed seat (121) and the movable seat (122) away from the cutting platform (11), and an adsorption hole (1203) is formed in each groove (1202);

the fixing seat (121) and the movable seat (122) are internally provided with air passages (1204), and the air passages (1204) are communicated with a plurality of adsorption holes (1203).

3. The cutting apparatus according to claim 2, wherein, within the plurality of suction holes (1203), a part of the suction holes (1203) is located in the first region (1205), and another part of the suction holes (1203) is located in the second region (1206); along the first direction, the first region (1205) has an area smaller than an area of the second region (1206); the first region (1205) and the second region (1206) are each provided with the airway (1204), and/or,

in the first region (1205), the number of the air passages (1204) is at least two, and the air passages are arranged at intervals along the first direction and are not communicated with each other; each air passage (1204) is connected with at least two arbitrary adjacent adsorption holes (1203).

4. A cutting apparatus according to claim 3, wherein, in the suction direction, the movable seat (122) and the fixed seat (121) each comprise a base (1207), a sealing member (1208) and a vacuum guide rail (1209) stacked in this order from top to bottom, the sealing member (1208) is pressed between the base (1207) and the vacuum guide rail (1209), the sealing member (1208) is configured with a groove body to form the air passage (1204), and the suction hole (1203) is provided in the vacuum guide rail (1209).

5. The cutting apparatus according to claim 1, wherein the fixing base (121) is fixedly arranged on the cutting platform (11), a support plate (1221) extends from one side of the movable base (122) away from the fixing base (121) along the second direction, the support plate (1221) is convexly provided with a connecting block (1222) for connecting the power source (1224), and the support plate (1221) is slidably connected with the cutting platform (11) _。

6. The cutting apparatus according to claim 1, wherein the cutting station (200) is further provided with a laser cutting module (14) and a dust removal module (16), the dust removal module (16) being mounted below the laser cutting module (14);

the dust removal module (16) is provided with a suction baffle (161) and a suction pipeline (162) connected to the suction baffle (161), the suction baffle (161) is surrounded into a suction cavity (1601), at least one suction baffle (161) is provided with a through hole (1611), and one end of the suction pipeline (162) is communicated with the suction cavity (1601) through the through hole (1611).

7. The cutting apparatus according to claim 1, wherein the review vision module (21) and the positioning vision module (22) each include a vision camera (211), an adjustment slide (212), and a vision bracket (213);

One end of the visual support (213) is suspended above the material receiving station (300) or the material feeding station (500), the adjusting sliding table (212) is mounted at the suspended end of the visual support (213), and the visual camera (211) is mounted on the adjusting sliding table (212); the adjusting sliding table (212) can rotate around the Z axis and the Y axis relative to the vision support (213) so as to drive the vision camera (211) to synchronously rotate, and the adjusting sliding table (212) can drive the vision camera (211) to respectively move along the Z axis and the X axis;

the Z axis is along a third direction, the Y axis is along the first direction, the X axis is along the second direction, and the third direction, the second direction and the first direction are arranged in a pairwise angle mode.

8. The cutting apparatus according to claim 7, wherein the adjustment slide (212) includes a reference block (2121), a first adjustment block (2122), and a second adjustment block (2123);

the first adjusting block (2122) comprises a first connecting arm and a second connecting arm which are arranged at an angle and connected, the first connecting arm is connected with the reference block (2121), the second connecting arm is positioned on one side of the reference block (2121) away from the vision bracket (213) and connected with the second adjusting block (2123), and the second adjusting block (2123) is connected with the vision camera (211);

The first adjusting block (2122) can rotate around the Z axis relative to the reference block (2121), and the second adjusting block (2123) can rotate around the Y axis relative to the second connecting arm.

9. The cutting apparatus according to claim 1, wherein at least one of the positioning vision module (22) and the review vision module (21) comprises an illumination light source (231);

the cutting apparatus further includes a light source holder (232), and the illumination light source (231) is mounted to the light source holder (232).

10. The cutting apparatus according to claim 1, characterized in that the cutting apparatus comprises a support beam (700) extending in a second direction in length; the carrying module (40) comprises a first carrying module (41) and a second carrying module (42),

the first carrying module (41) and the second carrying module (42) are both in sliding connection with the supporting beam (700), the first carrying module (41) can flow between stations along the first path, and the second carrying module (42) can flow along the first path relative to the receiving station (300).

11. The cutting apparatus according to claim 10, wherein the first handling module (41) includes an electrostatic stage frame (411), a voltage amplifier (412) and an electrostatic stage (413), the electrostatic stage (413) is mounted on the electrostatic stage frame (411) and is electrically connected to the voltage amplifier (412), the electrostatic stage frame (411) is slidably connected to the supporting beam (700), and the voltage amplifier (412) is capable of regulating an electrostatic voltage of the electrostatic stage (413); and/or, the second carrying module (42) comprises a plurality of adsorbing pieces (422), a pneumatic source and an adsorbing frame (421), wherein the adsorbing pieces (422) are arranged at intervals in the adsorbing frame (421) and are communicated with the pneumatic source, and the adsorbing frame (421) is connected with the supporting beam (700) in a sliding mode.

12. The cutting apparatus as claimed in claim 1, characterized in that the adjustment station (600) is provided with an adjustment platform (50);

the adjusting platform (50) comprises a rotating mechanism (51), a translation mechanism (52) and an adjusting panel (53), wherein the rotating mechanism (51) is connected to the bottom of the adjusting panel (53), and the translation mechanism (52) is connected with the rotating mechanism (51);

the translation mechanism (52) is used for driving the adjustment panel (53) to move along the first direction through the rotation mechanism (51), and the rotation mechanism (51) is used for driving the adjustment panel (53) to rotate around the central axis of the adjustment panel (53).

13. The cutting apparatus according to claim 1, further comprising a plurality of spaced apart trays (30), at least one of the trays (30) being located at the receiving station (300) and at least another one being located at the feeding station (500); each tray (30) is provided with an avoidance hole (301); the cutting device further comprises a positioning piece (34), wherein a part of the positioning piece (34) can penetrate through the avoidance hole (301) to extend into the tray (30), and the positioning piece (34) is configured to drive the semiconductor element (800) to move in the tray (30) in response to external force driving; and/or

The first path is also provided with a waste station (400), and the waste station (400) is arranged at intervals with the material receiving station (300) and the material supplying station (500).