CN219872320U - Aluminum profile radiator - Google Patents
Aluminum profile radiator Download PDFInfo
- Publication number
- CN219872320U CN219872320U CN202321355193.3U CN202321355193U CN219872320U CN 219872320 U CN219872320 U CN 219872320U CN 202321355193 U CN202321355193 U CN 202321355193U CN 219872320 U CN219872320 U CN 219872320U
- Authority
- CN
- China
- Prior art keywords
- radiating fins
- clamping pieces
- substrate
- radiator
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 15
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 14
- 239000000741 silica gel Substances 0.000 abstract description 14
- 229910002027 silica gel Inorganic materials 0.000 abstract description 14
- 239000007787 solid Substances 0.000 abstract description 13
- 239000000853 adhesive Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an aluminum profile radiator, which comprises a substrate, wherein radiating fins are uniformly arranged on the top of the substrate, heat conducting grooves are formed between adjacent radiating fins, clamping pieces are arranged on two sides of the bottom of the substrate, two clamping pieces are symmetrically arranged, an assembly groove is formed between the two clamping pieces, the radiating fins are of radial structures, the radiating fins on two sides of the top of the substrate are symmetrically arranged, the tail ends of the two clamping pieces are of chamfer structures, the thickness of the radiating fins is gradually reduced from the bottom to the top, the substrate, the radiating fins and the clamping pieces are integrally formed into a whole structure, the substrate, the radiating fins and the clamping pieces are made of pure aluminum materials, and by placing a heat conducting silica gel pad between a fixed hard disk and the radiator, two sides of the heat conducting silica gel pad are tightly attached to the surfaces of the solid hard disk and the radiator substrate by means of clamping fixation between the solid hard disk and the radiator, so that the situation that the heat radiating efficiency is improved and the heat radiating efficiency is poor caused by adhesive fixation is avoided.
Description
Technical Field
The utility model belongs to the technical field of aluminum radiators, and particularly relates to an aluminum profile radiator.
Background
For any PC, heat dissipation and cooling are indispensable, and the focus of most users lies in the two "heat generating households" of the processor and the display card, and the heat productivity of one accessory is not very small, that is, the solid state disk is used before the storage component of the computer, and in recent years, the storage component is replaced by a small-sized m.2 solid state disk, so that the volume is small, the heat productivity is relatively concentrated on the main control and NAND particles, and a great amount of heat is gathered in the read-write process.
The fixed hard disk heat dissipation mode on the market mainly carries out heat dissipation on the surface of the fixed hard disk through the fixed adhesive radiator with the adhesive heat conduction silica gel gasket, but in general, the influence of the adhesive heat conduction silica gel gasket on the heat conduction effect is very large, and the thermal resistance with the back adhesive is almost doubled with the thermal resistance without the back adhesive. The heat conduction effect is half that before, seriously influences the heat conduction performance and the thermal resistance of the material, and although the heat conduction adhesive glue can be adopted, the heat conduction effect or the heat conduction effect is not required to be achieved as long as the back glue is arranged, and the heat transfer is influenced, so that the radiator capable of conveniently and directly clamping the solid state disk is provided, the glue is not required to be arranged on the heat conduction silica gel gasket, and two sides of the heat conduction silica gel pad are tightly attached to the surfaces of the solid state disk and the radiator base body by means of clamping and fixing between the solid state disk and the radiator, and the heat radiation efficiency is improved.
For the problems in the related art, no effective solution has been proposed at present.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides the aluminum profile radiator, and the adhesive is not required to be arranged on two sides of the heat-conducting silica gel pad, and the heat-conducting silica gel pad is placed between the fixed hard disk and the radiator, so that the heat radiation efficiency is improved by means of clamping and fixing between the solid hard disk and the radiator.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an aluminium alloy radiator, includes the base member, the base member top evenly is provided with the fin, is provided with the heat conduction groove between the adjacent fin, base member bottom both sides all are provided with the fastener, two the fastener symmetry sets up, two be provided with the assembly groove between the fastener.
As a preferable technical scheme of the utility model, the radiating fins are of a radial structure, and the radiating fins on two sides of the top of the substrate are symmetrically arranged.
As a preferable technical scheme of the utility model, the tail ends of the two clamping pieces are of chamfer structures.
As a preferred embodiment of the present utility model, the thickness of the heat sink gradually decreases from bottom to top.
As a preferable technical scheme of the utility model, the matrix, the radiating fin and the clamping piece are integrally formed.
As a preferable technical scheme of the utility model, the matrix, the radiating fins and the clamping piece are made of pure aluminum integrally.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the adhesive is not required to be arranged on two sides of the heat-conducting silica gel pad, the heat-conducting silica gel pad is placed between the fixed hard disk and the radiator, and two sides of the heat-conducting silica gel pad are tightly attached to the surfaces of the solid hard disk and the radiator base body by means of clamping and fixing between the solid hard disk and the radiator, so that the heat dissipation efficiency is improved, and meanwhile, the situation that the heat dissipation efficiency is poor due to the adhesive obtained by bonding and fixing is avoided.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic structural diagram of the utility model for mounting a silica gel heat conduction pad and an M.2 solid state disk;
in the figure: 1. a base; 2. a heat sink; 3. a heat conduction groove; 4. a clamping piece; 5. and (5) an assembly groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples
Referring to fig. 1-2, the present utility model provides the following technical solutions: the utility model provides an aluminium alloy radiator, includes base member 1, base member 1 top evenly is provided with fin 2, is provided with heat conduction groove 3 between the adjacent fin 2, base member 1 bottom both sides all are provided with fastener 4, two fastener 4 symmetry sets up, two be provided with mounting groove 5 between the fastener 4, in this embodiment, during the use, keep flat heat conduction silica gel pad in mounting groove 5, laminating mounting groove 5 top surface prevents, then installs solid state disk in mounting groove 5, makes two fastener 4 detain respectively in the solid state disk both sides can, and fixed hard disk during operation heat carries out the heat transfer through heat conduction silica gel pad and base member 1, and base member 1 and fin 2 are discharged heat through with the air heat dissipation.
In order to increase the area of the diversion trench, accelerate the ventilation and improve the heat dissipation efficiency, in this embodiment, as a preferred technical scheme of the present utility model, the heat dissipation fins 2 are in a radial structure, and the heat dissipation fins 2 on two sides of the top of the base 1 are symmetrically arranged.
In order to facilitate the engagement with the fixed hard disk, in this embodiment, as a preferred technical solution of the present utility model, the ends of the two clamping members 4 are in a chamfer structure.
Because the overall through volume is small, the fin root is easy to break during extrusion molding, and in order to facilitate the overall extrusion molding, in this embodiment, as a preferred technical scheme of the present utility model, the thickness of the fin 2 gradually decreases from bottom to top.
In order to improve the heat dissipation efficiency and reduce the manufacturing cost, in this embodiment, as a preferred technical scheme of the present utility model, the whole of the base, the heat dissipation plate 2 and the clip 4 is an integrally formed structure, and the whole of the base, the heat dissipation plate 2 and the clip 4 is made of pure aluminum.
Finally, it should be noted that: in the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.
The foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
1. An aluminium alloy radiator, includes base member (1), its characterized in that: the heat-conducting structure is characterized in that radiating fins (2) are uniformly arranged at the top of the base body (1), heat-conducting grooves (3) are formed between adjacent radiating fins (2), clamping pieces (4) are arranged on two sides of the bottom of the base body (1), the two clamping pieces (4) are symmetrically arranged, and an assembly groove (5) is formed between the two clamping pieces (4).
2. An aluminum profile heat sink as claimed in claim 1, wherein: the radiating fins (2) are of radial structures, and the radiating fins (2) on two sides of the top of the base body (1) are symmetrically arranged.
3. An aluminum profile heat sink as claimed in claim 1, wherein: the tail ends of the two clamping pieces (4) are of chamfer structures.
4. An aluminum profile heat sink as claimed in claim 1, wherein: the thickness of the heat sink (2) gradually decreases from bottom to top.
5. An aluminum profile heat sink as claimed in claim 1, wherein: the base body (1), the radiating fins (2) and the clamping piece (4) are integrally formed.
6. An aluminum profile heat sink as recited in claim 5, wherein: the radiating fin (2) of the base body (1) and the clamping piece (4) are made of pure aluminum integrally.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321355193.3U CN219872320U (en) | 2023-05-31 | 2023-05-31 | Aluminum profile radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321355193.3U CN219872320U (en) | 2023-05-31 | 2023-05-31 | Aluminum profile radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN219872320U true CN219872320U (en) | 2023-10-20 |
Family
ID=88333233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202321355193.3U Active CN219872320U (en) | 2023-05-31 | 2023-05-31 | Aluminum profile radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN219872320U (en) |
-
2023
- 2023-05-31 CN CN202321355193.3U patent/CN219872320U/en active Active
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