CN216650356U - Heat dissipation structure and display device - Google Patents

Heat dissipation structure and display device Download PDF

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Publication number
CN216650356U
CN216650356U CN202123202346.4U CN202123202346U CN216650356U CN 216650356 U CN216650356 U CN 216650356U CN 202123202346 U CN202123202346 U CN 202123202346U CN 216650356 U CN216650356 U CN 216650356U
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Prior art keywords
layer
heat
heat conduction
convex hull
heat dissipation
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徐军
邹文聪
陈伟雄
朋朝明
张广谱
李新
刘德柱
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Shenzhen Skyworth RGB Electronics Co Ltd
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Shenzhen Skyworth RGB Electronics Co Ltd
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Abstract

The utility model discloses a heat dissipation structure and a display device, wherein the heat dissipation structure comprises: a reinforcing layer; the first heat conduction layer is arranged above the reinforcing layer; and a second thermally conductive layer; the reinforcing layer is arranged below the reinforcing layer; and one side of the second heat conduction layer, which is far away from the reinforcing layer, is provided with a plurality of hollow convex hull structures. Because the side (namely the outside of second heat-conducting layer) that deviates from the enhancement layer of second heat-conducting layer is provided with cavity convex closure structure, through cavity convex closure structure increase heat radiating area, improve the radiating effect. And the hollow convex hull structure is favorable for improving the strength of the second heat conduction layer, so that the thickness of the reinforcing layer can be correspondingly reduced, the distance between the first heat conduction layer and the second heat conduction layer is reduced, heat is favorably conducted from the first heat conduction layer to the second heat conduction layer, and the heat dissipation effect is further improved.

Description

Heat dissipation structure and display device
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation structure and a display device.
Background
At present, the back plate of the OLED television module adopts a steel-plastic plate or aluminum-plastic plate structure, so that the flatness of the back plate is ensured, the flatness of the lamination of the OLED panel is ensured, and the heat of the OLED panel is dissipated through the outer metal surface of the steel-plastic plate.
In the prior art, when a heat dissipation structure of a display panel such as a steel-plastic plate or an aluminum-plastic plate is adopted, the heat dissipation effect is poor.
Accordingly, the prior art is yet to be improved and developed.
SUMMERY OF THE UTILITY MODEL
The present invention provides a heat dissipation structure and a display device, aiming at solving the above-mentioned drawbacks of the prior art, and aims to solve the problem of poor heat dissipation effect of the heat dissipation structure of the display panel in the prior art.
The technical scheme adopted by the utility model for solving the technical problem is as follows:
a heat dissipation structure, wherein, it includes:
a reinforcing layer;
the first heat conduction layer is arranged above the reinforcing layer; and
a second thermally conductive layer; the reinforcing layer is arranged below the reinforcing layer;
and one side of the second heat conduction layer, which is far away from the reinforcing layer, is provided with a plurality of hollow convex hull structures.
The heat dissipation structure, wherein the second heat conduction layer and the hollow convex hull structure are integrally formed.
The heat dissipation structure, wherein, the interior accommodation space that forms of cavity convex hull structure, be provided with heat conduction piece in the accommodation space.
The heat dissipation structure, wherein the heat conducting member includes at least one of a silicone grease heat conducting member, a plastic heat conducting member, and a phase change heat conducting member.
In the heat dissipation structure, the first heat conduction layer is a metal layer; and/or
The reinforced layer is a plastic layer; and/or
The second heat conduction layer is a metal layer.
The heat dissipation structure is characterized in that the thickness of the first heat conduction layer is 0.2-0.6 mm; and/or
The thickness of the reinforcing layer is 1.0-1.4 mm; and/or
The thickness of the second heat conduction layer is 0.2-0.6 mm.
In the heat dissipation structure, the metal layer is a steel layer or an aluminum layer.
The heat dissipation structure is characterized in that the hollow convex hull structure is a spherical crown convex hull, and the diameter of the spherical crown convex hull is 1.0-1.4 mm; and/or
And a plurality of the hollow convex hull structures form a convex hull array.
A display device, comprising:
a display panel;
the heat dissipation structure of any of the above claims;
wherein the display panel is connected with the first heat-conducting layer.
The display device, wherein the display panel is an OLED display panel; and/or
The display panel is bonded with the first heat conduction layer.
Has the advantages that: because the side (namely the outside of second heat-conducting layer) that deviates from the enhancement layer of second heat-conducting layer is provided with cavity convex closure structure, through cavity convex closure structure increase heat radiating area, improve the radiating effect. And the hollow convex hull structure is favorable for improving the strength of the second heat conduction layer, so that the thickness of the reinforcing layer can be correspondingly reduced, the distance between the first heat conduction layer and the second heat conduction layer is reduced, heat is favorably conducted from the first heat conduction layer to the second heat conduction layer, and the heat dissipation effect is further improved.
Drawings
Fig. 1 is a side view of a heat dissipation structure in the present invention.
Fig. 2 is an enlarged view of fig. 1.
Fig. 3 is a rear view of the heat dissipation structure of the present invention.
Description of reference numerals:
10. a first thermally conductive layer; 20. a reinforcing layer; 30. a second thermally conductive layer; 31. a hollow convex hull structure; 32. an accommodating space; 40. a display panel; 50. and (6) adhesive tape.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Referring to fig. 1-3, the present invention provides some preferred embodiments of a heat dissipation structure.
As shown in fig. 1, the heat dissipation structure includes:
a reinforcing layer 20;
a first heat conductive layer 10 disposed above the reinforcing layer 20; and
a second heat conductive layer 30 disposed below the reinforcing layer 20;
wherein, a plurality of hollow convex hull structures 31 are arranged on one side of the second heat conduction layer 30 departing from the reinforcing layer 20.
It is to be noted that the first heat conductive layer 10 and the second heat conductive layer 30 refer to a layer structure for conducting heat, and the reinforcing layer 20 refers to a layer structure for ensuring the strength of the heat dissipation structure. Since the side of the second heat conduction layer 30 away from the reinforcement layer 20 (i.e. the outer side of the second heat conduction layer 30) is provided with the hollow convex hull structure 31, the heat dissipation area is increased by the hollow convex hull structure 31, and the heat dissipation effect is improved. And the hollow convex hull structure 31 is beneficial to improving the strength of the second heat conduction layer 30, so that the thickness of the reinforcing layer 20 can be correspondingly reduced, the distance between the first heat conduction layer 10 and the second heat conduction layer 30 is reduced, heat is conducted from the first heat conduction layer 10 to the second heat conduction layer 30, and the heat dissipation effect is further improved.
Specifically, the first heat conduction layer 10 is used for being connected with the display panel 40, the first heat conduction layer 10 conducts heat emitted by the display panel 40 to the second heat conduction layer 30, and the heat is conducted to the outside air through the second heat conduction layer 30 and the hollow convex hull structure 31, so that heat dissipation of the display panel 40 is achieved. The first heat conducting layer 10 is a planar heat conducting layer to be attached to the display panel 40. The display panel 40 includes: an LED display panel 40 or an OLED display panel 40.
The first heat conducting layer 10 is bonded to the display panel 40, and specifically, the bonding between the first heat conducting layer 10 and the display panel 40 can be achieved by using adhesive tapes 50.
In a preferred embodiment of the present invention, the first heat conducting layer 10 is a metal layer; and/or
The reinforcing layer 20 is a plastic layer; and/or
The second heat conducting layer 30 is a metal layer.
Specifically, the reinforcing layer 20 is usually a plastic layer, and a metal layer is used as the heat conducting layer, the metal layer is a steel layer or an aluminum layer, when the steel layer is used, the heat dissipation structure can form a steel-plastic plate, and when the aluminum layer is used, the heat dissipation structure can form an aluminum-plastic plate.
In a preferred embodiment of the present invention, referring to fig. 1-2, the thickness of the first heat conducting layer 10 is 0.2-0.6 mm; and/or
The thickness of the reinforcing layer 20 is 1.0-1.4 mm; and/or
The thickness of the second heat conduction layer 30 is 0.2-0.6 mm.
Specifically, the thickness of the first heat conduction layer 10 and the thickness of the second heat conduction layer 30 can be set as required, in order to ensure the strength of the heat dissipation structure, the thickness of the reinforcement layer 20 is thicker, and since the hollow convex hull structure 31 is arranged on the second heat conduction layer 30 and the hollow convex hull structure 31 improves the strength of the second heat conduction layer 30, compared with the reinforcement layer 20 in the prior art (generally, the thickness of the reinforcement layer 20 in the prior art is 1.2-1.6mm), the thickness of the reinforcement layer 20 in the present invention can be reduced, and the overall strength of the heat dissipation structure can still be ensured to be unchanged. Since the thickness of the reinforcing layer 20 is reduced, the distance between the first heat conduction layer 10 and the second heat conduction layer 30 is reduced, the thermal resistance between the first heat conduction layer 10 and the second heat conduction layer 30 is reduced, the heat conduction is facilitated, and the heat dissipation efficiency is improved.
It should be noted that, because the thickness of the reinforcing layer 20 is reduced, the thickness of the first heat conduction layer 10 and the thickness of the second heat conduction layer 30 can be slightly increased, and the heat capacity of the first heat conduction layer 10 and the heat capacity of the second heat conduction layer 30 are also increased, so that the heat conduction effect can also be increased, and the heat dissipation efficiency can be improved.
In a preferred embodiment of the present invention, referring to fig. 1-2, an accommodating space 32 is formed in the hollow convex hull structure 31, and a heat conducting member is disposed in the accommodating space 32.
Specifically, providing the accommodation space 32 can reduce the weight of the heat dissipation structure. The accommodating space 32 is provided with a heat conducting member, and the heat dissipation effect is further improved by the heat conducting member.
In a preferred embodiment of the present invention, the heat conducting member includes at least one of a silicone heat conducting member, a plastic heat conducting member, and a phase change heat conducting member.
Specifically, the material of the heat conducting member is determined as needed, and for example, the heat conducting member is a silicone heat conducting member, a plastic heat conducting member, or a phase change heat conducting member. The silicone grease heat conducting part is a component made of heat conducting silicone grease, the plastic heat conducting part is a component made of heat conducting plastic, and the phase change heat conducting part is a component made of phase change material.
In a preferred embodiment of the present invention, referring to fig. 1-2, the second heat conducting layer 30 and the hollow convex hull structure 31 are integrally formed.
Specifically, the hollow convex hull structure 31 may be formed by a punch forming method, for example, a metal plate is punched by a punching process, and one side of the metal plate forms the accommodating space 32, that is, the hollow convex hull structure 31 is formed, so as to obtain the second heat conducting layer 30.
In a preferred embodiment of the present invention, referring to fig. 1-2, the hollow convex hull structure 31 is a spherical crown convex hull, and the diameter of the spherical crown convex hull is 1.0-1.4 mm.
Specifically, the shape of the hollow convex hull structure 31 may be set as needed, for example, a tetrahedral convex hull, a triangular prism convex hull, or the like is used. The hollow convex hull structure 31 may be dimensioned as desired.
In a preferred embodiment of the present invention, referring to fig. 1 and fig. 3, a plurality of the hollow convex hull structures 31 form a convex hull array.
In particular, the hollow convex hull structures 31 may form a convex hull array, which is beneficial to improve the strength of the second heat conduction layer 30. The convex hull array may be a matrix array, but other forms of arrays may be used, such as a triangular array, a hexagonal array, etc.
In summary, one layer (non-OLED bonding surface) of the metal materials on the two surfaces of the steel-plastic plate or the aluminum-plastic plate is a metal stamping plate with a hollow convex hull structure, and the strength of the second heat conducting plate with the hollow convex hull structure is greatly improved compared with that of a plane metal plate; after the strength of the metal layer is improved, the thickness of the plastic layer can be reduced to achieve the same strength of the plane steel-plastic plate or the aluminum-plastic plate without the structure. A structural steel-plastic or aluminium-plastic panel corresponding to the thickness of the whole panel to achieve the same strength will be thinner than a structural steel-plastic or aluminium-plastic panel. Simultaneously under the condition of same thickness, plastic layer thickness attenuate in the panel of taking cavity convex closure structure can increase the metal level and realize the heat capacity of whole panel, the reduction of plastic layer thickness, and heat can be fast from the metal level of binding face metal level more quick conduction to the metal level of band structure. Because the surface is provided with a one-time stamping structure and plates with the same size, the surface area of the plates with the structures is much larger than that of the plates with the same size, and the surface area is increased, so that heat is radiated into the air more quickly, and the heat is radiated out from the back plate more quickly. Through the enhancement of above two kinds of heat dissipation modes for the heat of OLED panel can be more quick derives, reduces OLED surface temperature, guarantees OLED's reliability and reduces OLED ghost shadow risk.
The present invention also provides a display device including:
a display panel 40;
the heat dissipation structure described in any of the above embodiments;
the display panel 40 is connected to the first heat conductive layer 10, as described above.
In a preferred embodiment of the present invention, referring to fig. 1-2, the display panel 40 is an OLED display panel 40; and/or
The display panel 40 is bonded to the first heat conductive layer 10.
Specifically, the heat dissipation structure of the present invention is adopted to dissipate heat of the OLED display panel 40, and has a good heat dissipation effect. The display panel 40 and the first heat conduction layer 10 are bonded by using an adhesive tape 50, and the adhesive tape 50 may be a heat conduction adhesive tape 50, so that the heat emitted by the display panel 40 is sufficiently conducted to the first heat conduction layer 10 and the second heat conduction layer 30.
The display device provided by the utility model has all the beneficial effects due to the arrangement of the heat dissipation structure in any technical scheme, and the description is omitted.
It is to be understood that the utility model is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the utility model as defined by the appended claims.

Claims (10)

1. A heat dissipation structure, comprising:
a reinforcing layer;
the first heat conduction layer is arranged above the reinforcing layer; and
a second heat conducting layer; the reinforcing layer is arranged below the reinforcing layer;
and one side of the second heat conduction layer, which is far away from the reinforcing layer, is provided with a plurality of hollow convex hull structures.
2. The heat dissipation structure of claim 1, wherein the second heat conduction layer and the hollow convex hull structure are integrally formed.
3. The heat dissipating structure of claim 1, wherein a receiving space is formed in the hollow convex hull structure, and a heat conducting member is disposed in the receiving space.
4. The heat dissipating structure of claim 3, wherein the heat conducting member comprises at least one of a silicone heat conducting member, a plastic heat conducting member, and a phase change heat conducting member.
5. The heat dissipation structure of claim 1, wherein the first heat conduction layer is a metal layer; and/or
The reinforcing layer is a plastic layer; and/or
The second heat conduction layer is a metal layer.
6. The heat dissipation structure of claim 5, wherein the thickness of the first heat conduction layer is 0.2-0.6 mm; and/or
The thickness of the reinforcing layer is 1.0-1.4 mm; and/or
The thickness of the second heat conduction layer is 0.2-0.6 mm.
7. The heat dissipation structure of claim 5, wherein the metal layer is a steel layer or an aluminum layer.
8. The heat dissipating structure of any one of claims 1 to 7, wherein the hollow convex hull structure is a spherical crown-shaped convex hull having a diameter of 1.0 to 1.4 mm; and/or
And a plurality of the hollow convex hull structures form a convex hull array.
9. A display device, comprising:
a display panel;
the heat dissipation structure as defined in any one of claims 1 to 8;
wherein the display panel is connected with the first heat-conducting layer.
10. The display device according to claim 9, wherein the display panel is an OLED display panel; and/or
The display panel is bonded with the first heat conduction layer.
CN202123202346.4U 2021-12-17 2021-12-17 Heat dissipation structure and display device Active CN216650356U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123202346.4U CN216650356U (en) 2021-12-17 2021-12-17 Heat dissipation structure and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123202346.4U CN216650356U (en) 2021-12-17 2021-12-17 Heat dissipation structure and display device

Publications (1)

Publication Number Publication Date
CN216650356U true CN216650356U (en) 2022-05-31

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123202346.4U Active CN216650356U (en) 2021-12-17 2021-12-17 Heat dissipation structure and display device

Country Status (1)

Country Link
CN (1) CN216650356U (en)

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