CN219842960U

CN219842960U - Wafer unbuckling die assembly

Info

Publication number: CN219842960U
Application number: CN202320534985.0U
Authority: CN
Inventors: 万士元; 沈达; 王苏龙; 姜锦旺
Original assignee: Wushi Microelectronics Suzhou Co ltd
Current assignee: Wushi Microelectronics Suzhou Co ltd
Priority date: 2023-03-20
Filing date: 2023-03-20
Publication date: 2023-10-17
Anticipated expiration: 2033-03-20

Abstract

The utility model relates to a wafer de-bonding module, comprising: a work table; the material placing and heating mechanism is arranged on the workbench and can move in the horizontal direction relative to the workbench; the adsorption separation mechanism comprises a first driving module, the first driving module comprises a first driving piece, a first connecting piece and a first sucker movably connected with the first connecting piece, the first sucker is provided with a first position contacted with the material placement heating mechanism and a second position far away from the material placement heating mechanism, and the first sucker can be switched between the first position and the second position under the action of the first driving piece; the adsorption separation mechanism further comprises a second driving module, and the second driving module comprises a second driving piece connected with the first sucker; the first sucker is located at the first position, the second driving piece is suitable for applying a force in the direction opposite to the gravity to the first sucker so as to offset the gravity of the first sucker, and further the force applied to the target by the first sucker is reduced, and the risk of damage to the target is reduced.

Description

Wafer unbuckling die assembly

Technical Field

The utility model relates to a wafer de-bonding module, and belongs to the technical field of wafer production equipment.

Background

In the wafer process, the debonding of the wafer from the carrier is one of the important processing steps. The wafer and the carrier are not limited to being separated by melting, thermal sliding shearing or mechanical stripping.

In the prior art, an upper plate with adsorption force is generally used to be matched with a material heating and placing mechanism, a wafer and a carrier plate are fixed, and the wafer and the carrier plate are separated by sliding relatively after heating. As wafers are now thinner and thinner, and some of the wafers are very brittle (e.g. indium phosphide, gallium arsenide, etc.), the above-described de-bonding approach has been very prone to crushing damage when the upper plate is in contact with the wafer or carrier plate due to the weight of the upper plate itself.

Accordingly, there is a need for improvements in the art that overcome the shortcomings of the prior art.

Disclosure of Invention

The utility model aims to provide a wafer debonding module which can offset the gravity of a first sucker and reduce the risk of damaging a wafer in the debonding process.

In order to achieve the above effects, the present utility model adopts the following technical scheme: a wafer debonding module, comprising:

a work table;

the material placing and heating mechanism is arranged on the workbench and can move in the horizontal direction relative to the workbench;

the adsorption separation mechanism is arranged on one side of the material placement heating mechanism and comprises a first driving module, the first driving module comprises a first driving piece, a first connecting piece connected with the first driving piece and a first sucker movably connected with the first connecting piece, the first sucker is provided with a first position contacted with the material placement heating mechanism and a second position far away from the material placement heating mechanism, and the first sucker can be switched between the first position and the second position under the action of the first driving piece;

the adsorption separation mechanism further comprises a second driving module, and the second driving module comprises a second driving piece connected with the first sucker;

the first sucker is located at the first position, and the second driving piece is suitable for applying a force to the first sucker in the direction opposite to the gravity so as to counteract the gravity of the first sucker.

Optionally, in the wafer debonding module, the force is equal to or tends to be equal to the weight of the first chuck.

Optionally, the wafer debonding module includes a first connecting rod connected to the first driving member, and a first connecting plate, wherein one side of the first connecting plate is fixedly connected to the first connecting rod, and the other side of the first connecting plate is movably connected to the first suction cup.

Optionally, in the wafer debonding module, the first connecting plate is provided with a guide member;

the second driving module further comprises a guide column which is connected with the first sucker and penetrates through the first connecting plate to be matched with the guide piece, and the guide column moves along the guide piece under the driving force of the second driving piece.

Optionally, the wafer de-bonding module, the guide post further comprises a connecting portion and a limiting portion, the connecting portion is suitable for connecting the limiting portion and the first sucker, and the first sucker enables the limiting portion to be propped against the guide piece under the action of dead weight.

Optionally, the wafer debonding module further includes a detecting component, the first sucker is located at the first position, and the detecting component is adapted to detect the acting force applied to the target object located on the material placing and heating mechanism.

Optionally, the wafer de-bonding module includes a detecting member, a supporting frame disposed at one side of the detecting member, and an elastic member connecting the detecting member and the supporting frame;

the first sucker is driven by the second driving piece to deform the elastic piece and apply elastic force to the detecting piece.

Optionally, the wafer de-bonding module comprises a supporting frame and a supporting rod, wherein the elastic piece is arranged between the detecting piece and the supporting frame, one end of the supporting rod penetrates through the first connecting plate to be connected with the first sucker, and the other end of the supporting rod is connected with bearings at two ends of the supporting frame.

Optionally, the wafer debonding module further includes a guiding assembly, and the first driving member drives the first connecting plate to drive the first suction cup to switch between the first position and the second position under the action of the guiding assembly.

Optionally, in the wafer debonding module, the first driving module further includes a fixing member;

the guide assembly comprises a guide rod and a guide groove matched with the guide rod, the guide rod is arranged on one of the fixed plate and the first connecting plate, and the guide groove is arranged on the other of the fixed plate and the first connecting plate.

The utility model has the beneficial effects that: according to the utility model, the material placing and heating mechanism and the adsorption and separation mechanism are arranged, and the adsorption and separation mechanism adsorbs a target object and is matched with the material placing and heating mechanism to heat the target object and then adsorb the target object, so that a wafer in the target object is separated from the carrier plate; and through being provided with the second driving piece that is connected with first sucking disc, when first sucking disc is located the first position, when contacting with the target object, this second driving piece is suitable for exerting rather than the effort of gravity to first sucking disc to offset first sucking disc self gravity, and then reduce the effort that first sucking disc was exerted on the target object when wafer contacted with lower sucking disc, reduce the risk of causing the damage to the target object.

The foregoing description is only an overview of the present utility model, and is intended to provide a better understanding of the present utility model, as it is embodied in the following description, with reference to the preferred embodiments of the present utility model and the accompanying drawings.

Drawings

FIG. 1 is a schematic diagram of a wafer debonding module according to the present utility model;

FIG. 2 is a schematic view of a portion of the wafer debonding module shown in FIG. 1;

fig. 3 is a schematic structural diagram of the wafer debonding module shown in fig. 1 in another direction of the adsorption separation mechanism.

Detailed Description

The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. The utility model will be described in detail hereinafter with reference to the drawings in conjunction with embodiments. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

In the present utility model, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used generally with respect to the orientation shown in the drawings or with respect to the component itself in the vertical, upright or gravitational direction; also, for ease of understanding and description, "inner and outer" refers to inner and outer relative to the profile of each component itself, but the above-mentioned orientation terms are not intended to limit the present utility model.

With the demand of miniaturization of electronic products, electronic chips are also being thinner, but if the thickness of the wafer is reduced to 100 μm or less, fragments are very easy to occur, or the wafer is bent and deformed due to stress when the wafer is processed, so that the ultra-thin wafer cannot be directly processed. Therefore, in order to process such ultra-thin wafers, it is necessary to temporarily bond the ultra-thin wafer to a carrier, and after bonding, the wafer and the carrier are integrated into a whole, so that the wafer may be subjected to processes such as thinning, TSV fabrication, rewiring layer fabrication, and internal interconnection formation. The wafer is then separated from the carrier, a process known as wafer debonding. And then cleaning, cutting and other processes are carried out on the thinned wafer, so that the processing process of the ultrathin wafer is completed.

Referring to fig. 1-3, a wafer debonding module according to a preferred embodiment of the present utility model includes a table 1, a material placement heating mechanism 2 disposed on the table 1, and an adsorption separation mechanism 3 disposed on one side of the material placement heating mechanism 2.

Wherein, the material placing and heating mechanism 2 can move in the horizontal direction relative to the workbench 1 under the action of external force so as to be close to or far away from the adsorption separation mechanism 3, thereby being matched with the adsorption separation mechanism 3 to finish the de-bonding.

The material placement heating mechanism 2 includes a material placement component 21 and a material heating component 22. The material placement unit 21 is adapted to place a target object, and the material heating unit 22 is adapted to heat the target object and cooperate with the adsorption separation mechanism 3. When the target object is de-bonded, the target object is placed on the material placement component 21 and moves to the adsorption separation mechanism 3 under the action of external force, the adsorption separation mechanism 3 adsorbs and moves to the material heating component 22, and the material heating component 22 heats the target object and cooperates with the adsorption separation mechanism 3 to separate the target object. In this embodiment, the target is a bonded carrier and wafer. Correspondingly, the object separation refers to: separation of bonded carrier from wafer.

Specifically, the material heating assembly 22 includes a heat insulating plate, a heating plate and a second sucker 221, which are sequentially stacked from bottom to top, and the heating plate acts to transfer heat to the second sucker 221, so that when the second sucker 221 is matched with the first sucker 314, the heat of the second sucker 221 can separate the carrier plate of the target from the wafer.

In order to reduce the risk of wafer breakage, in this embodiment, the second chuck 221 has a plurality of micro holes, each having a diameter of 2-50um. Since the pore diameter of the micropores is fine, the adsorption force applied to the wafer is small. In addition, the plurality of micro holes are distributed on the second sucker 221, so that the adsorption force applied to the wafer is uniform, and the wafer is not damaged. Meanwhile, the wafer can be stably adsorbed by the agglomeration of the adsorption force of the micropores. Also, the material of the second suction cup 221 in this embodiment is silicon carbide.

The adsorption separation mechanism 3 comprises a first driving module 31, the first driving module 31 comprises a fixing plate 311, a first driving piece 312 arranged on the fixing plate 311, a first connecting piece 313 connected with the first driving piece 312, and a first sucking disc 314 connected with the first connecting piece 313, and the first sucking disc 314 is suitable for sucking a target object on the material placing assembly 21 positioned below the first sucking disc 314. The first driving member 312 drives the first connecting member 313 to drive the first suction cup 314 to move toward or away from the target object on the material heating assembly 22 below the first suction cup to perform the debonding or the debonding. In this embodiment, the first driving member 312 is an electric cylinder.

Specifically, the first suction cup 314 has a first position in contact with a target on the material heating assembly 22 and a second position away from the material heating assembly 22. The first driving member 312 is adapted to apply an external force to the first connecting member 313, so that the first connecting member 313 can drive the first suction cup 314 to switch between the first position and the second position, thereby completing the de-bonding of the target. When the target is required to be de-bonded, the material heating assembly 22 is located below the first sucker 314, the first sucker 314 moves from the second position to the first position under the action of the first driving piece 312, and the first sucker 314 cooperates with the second sucker 221 to separate the wafer of the target from the carrier plate; when the de-bonding is completed, the first suction cup 314 is moved from the first position to the second position by the first driving member 312.

In the present embodiment, the first connector 313 includes a first connecting rod 3131 connected to the first driver 312 and a first connecting plate 3132. One side of the first connecting plate 3132 is fixedly connected with the first connecting rod 3131, and the other side of the first connecting plate 3132 is connected with the first sucking disc 314, so that the first driving piece 312 drives the first connecting rod 3131 to move up and down, so as to drive the first connecting plate 3132 to move up and down, and further drive the first sucking disc 314 to switch between the first position and the second position.

The first drive module 31 further includes a guide assembly 315. The guide assembly 315 is adapted to guide the first position and the second position of the first suction cup 314 when they are switched. That is, the first driving member 312 drives the first connecting plate 3132 to drive the first sucker 314 to switch between the first position and the second position under the action of the guiding assembly 315.

In detail, the guide assembly 315 includes a guide bar 3151 and a guide groove 3152 adapted to the guide bar 3151. The guide bar 3151 is disposed on one of the fixing plate 311 and the first connection plate 3132, and the guide groove 3152 is disposed on the other of the fixing plate 311 and the first connection plate 3132. In this embodiment, the guide bar 3151 is disposed on the first connecting plate 3132, and the guide groove 3152 is disposed on the fixing plate 311, so that the first driving member 312 drives the first connecting plate 3132 to move the first suction cup 314 up and down under the action of the guide bar 3151 and the guide groove 3152, so that the first suction cup 314 is switched between the first position and the second position. In this embodiment, the guide groove 3152 and the guide bar 3151 are in the form of a loop bar, that is, the guide groove 3152 is mounted on the fixing plate 311, one end of the guide bar 3151 is connected to the first connecting plate 3132, and the other end is disposed in the guide groove 3152. In other embodiments, the guide bar 3151 may be disposed on the fixing plate 311, and the wire groove may be disposed on the first connecting plate 3132, so long as the above effect is achieved, and the disposed position of the guide assembly 315 is not specifically limited herein, depending on the actual situation.

In actual operation, when the first suction cup 314 moves from the second position to the first position under the action of the first driving member 312, that is, when the first suction cup 314 contacts the target object, the driving force of the first driving member 312 is excessively large or the target object is damaged due to extrusion caused by the weight of the first suction cup 314.

In order to solve the above-mentioned problem, in the present embodiment, the adsorption separation mechanism 3 further includes a second driving module 32, and the second driving module 32 is adapted to apply a force to the first suction cup 314, and the direction of the force is opposite to the direction of the driving force of the first driving member 312 and the direction of the gravity of the first suction cup 314, so as to counteract the excessive driving force of the first driving member 312 and the gravity of the first suction cup 314, so as to prevent the target from being broken due to the excessive force.

Specifically, the second driving module 32 includes a second driving member 321 connected to the first suction cup 314. The second driving member 321 is adapted to apply a force to the first suction cup 314 in a direction opposite to the gravitational force when the first suction cup 314 is in the first position, i.e. when the first suction cup 314 is in contact with the object. To enable a better fit of the first suction cup 314 with the material heating assembly 22 to separate the objects. In this embodiment, the force applied by the second driving member 321 to the first suction cup 314 is equal to or tends to be equal to the weight of the first suction cup 314. Where the force is equal or tends to be equal to the weight of the first suction cup 314, the first driving member 312 is not applying force to the first suction cup 314, and the first suction cup 314 is only subjected to gravity. In this embodiment, the second driving member 321 is a cylinder.

It should be noted that, in the present embodiment, the first suction cup 314 is movably connected to the first connecting plate 3132 through the middle plate 322. The movable connection mode is as follows: the first sucker 314 passes through the hole of the first connecting plate 3132 through the connecting body connected with the middle plate 322, and the diameter of the connecting body is smaller than that of the hole on the first connecting plate 3132, so that after the first driving piece 312 drives the first sucker 314 to contact with the target, the first sucker 314 can move upwards along the hole under the action of the connecting body due to the driving force of the first driving piece 312 and the supporting of the target.

The purpose of the first suction cup 314 being movably connected with the first connecting plate 3132 is to: when the first driving member 312 is not applying a force to the first suction cup 314, the first suction cup 314 naturally sags under the action of gravity. When the second driving member 321 applies an upward force to the first sucker 314, the first sucker 314 can move upwards through the cooperation of the hole and the connecting body under the action of the second driving member 321, so as to reduce the acting force of the first sucker 314 on the target as much as possible.

In this embodiment, the first connecting plate 3132 is further provided with a guide 323, and the second driving module further includes a guide post 324 connected to the first suction cup 314 and engaged with the guide 323 through the first connecting plate 3132, and the guide post 324 is adapted to move along the guide 323 with the first suction cup 314 under the driving force of the second driving member 321. In this embodiment, the guide post 324 is the connector.

The guide post 324 further includes a connecting portion 3241 and a limiting portion 3242. The connecting portion 3241 is adapted to connect the limiting portion 3242 and the first suction cup 314, and the first suction cup 314 makes the limiting portion 3242 abut against the guide 323 under the action of self weight.

In order to facilitate the operator to monitor the acting force applied to the target, in this embodiment, the wafer debonding module further includes a detecting component 4. When the first suction cup 314 is in the first position, i.e. when the first suction cup 314 is in contact with the target object, the detection assembly 4 is adapted to detect the amount of force exerted by the target object on the material heating assembly 22, so as to facilitate the adjustment of the de-bonding apparatus by the worker.

Specifically, the detecting component 4 includes a detecting member 41, a holding frame disposed on one side of the detecting member 41, and an elastic member 43 connecting the detecting member 41 and the holding frame. Wherein the supporting frame is arranged on two sides of the detecting piece 41 in a crossing way. The holding frame comprises a holding transverse frame 42142 positioned above the detecting piece 41 and holding rods positioned on two sides of the detecting piece 41, and the elastic piece 43 is arranged between the detecting piece 41 and the holding transverse frame 42142. One end of the supporting rods 422 arranged at both sides of the detecting member 41 in pairs passes through the connecting plate to be connected with the first sucking disc 314, and the other end of the supporting rods 422 is connected with bearings at both ends of the supporting cross frame 42142. When the second driving member 321 applies a force to the first suction cup 314, the force drives the first suction cup 314 to move or keep stationary with an upward force, so that the elastic member 43 disposed between the detecting member 41 and the supporting cross frame 42142 deforms, and applies an elastic force to the detecting member 41 to detect the pressure applied to the target at this time. In this embodiment, the detecting member 41 is a pressure sensor.

In this embodiment, the wafer de-bonding module further includes an electric control board, and the electric control board is adapted to be in signal connection with the material placement heating mechanism 2 and the adsorption separation mechanism 3.

In summary, the working process of the debonding module in the present utility model is as follows: the object is placed on the material placement component, and the material placement component drives the object to move to the lower side of the adsorption separation mechanism, and the first driving piece drives the first sucker to move to the vicinity of the material placement component so as to adsorb the object. Then the material heating component moves to the lower part of the first sucker, the first sucker moves to a first position, and the material heating component is enabled to receive a target object on the first sucker; meanwhile, the second driving piece is started to apply an acting force on the first sucker, so that the acting force counteracts the gravity of the first sucker, at the moment, the target object only has the adsorption force of the first sucker and the second sucker, bonding glue between the wafer and the carrier plate is dissolved under the action of the heating plate of the material heating assembly, the wafer is separated from the carrier plate, the wafer is adsorbed on the first sucker, the carrier plate is adsorbed on the second sucker, and the de-bonding of the target object is completed.

Compared with the prior art, the wafer carrier plate is provided with the material placing and heating mechanism and the adsorption and separation mechanism, and the adsorption and separation mechanism adsorbs a target object and is matched with the material placing and heating mechanism to heat and adsorb the target object so as to separate the wafer in the target object from the wafer carrier plate; and through being provided with the second driving piece of being connected with first sucking disc, when first sucking disc is located the first position, when contacting with the target object, this second driving piece is suitable for exerting rather than the effort of gravity to first sucking disc to offset first sucking disc self gravity, and then reduce the effort that first sucking disc applyed on the target object, reduce the risk that causes the damage to the target object.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. The wafer debonding module is characterized by comprising:

a work table;

2. The wafer debonding module of claim 1, wherein the force is equal or tends to be equal in magnitude to the weight of the first chuck.

3. The wafer debonding module of claim 1, wherein the first connection member comprises a first connection rod coupled to the first driving member and a first connection plate, one side of the first connection plate is fixedly coupled to the first connection rod, and the other side of the first connection plate is movably coupled to the first chuck.

4. The wafer debonding module of claim 3, wherein the first connection plate has a guide disposed thereon;

5. The wafer debonding module of claim 4, wherein the guide post further comprises a connecting portion and a limiting portion, the connecting portion adapted to connect the limiting portion and the first suction cup, the first suction cup under its own weight to hold the limiting portion against the guide.

6. The wafer debonding module of claim 4, further comprising a detection assembly, the first chuck being positioned in the first position, the detection assembly being adapted to detect the amount of force applied to a target positioned on the material placement heating mechanism.

7. The wafer debonding module of claim 6, wherein the inspection assembly comprises an inspection piece, a holding frame disposed on one side of the inspection piece, and an elastic piece connecting the inspection piece and the holding frame;

8. The wafer debonding module of claim 7, wherein the support comprises a support cross frame and a support bar, the elastic member is disposed between the detection member and the support cross frame, one end of the support bar passes through the first connection plate to be connected with the first suction cup, and the other end of the support bar is connected with bearings at two ends of the support cross frame.

9. The wafer debonding module of claim 3, wherein the first drive module further comprises a guide assembly, the first drive member driving the first connection plate to switch the first chuck between a first position and a second position under the influence of the guide assembly.

10. The wafer debonding module of claim 9, wherein the first driving module further comprises a securing plate;