CN214477374U - CSP chip product pick-and-place mechanism - Google Patents
CSP chip product pick-and-place mechanism Download PDFInfo
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- CN214477374U CN214477374U CN202120434773.6U CN202120434773U CN214477374U CN 214477374 U CN214477374 U CN 214477374U CN 202120434773 U CN202120434773 U CN 202120434773U CN 214477374 U CN214477374 U CN 214477374U
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Abstract
The utility model relates to a CSP chip product pick-and-place mechanism, which comprises a liner bearing linear guide mechanism, wherein the liner bearing linear guide mechanism is positioned at the upper end of the device, two liner bearings and a guide rod main support frame are arranged in the liner bearing linear guide mechanism, the two liner bearings are adjacently arranged at the upper end of the guide rod main support frame, and the two liner bearings vertically and vertically penetrate through the guide rod main support frame and are used for controlling a suction mechanism to suck and transfer the CSP chip product; the spline bearing linear guide mechanism is located at the lower end of the bush bearing linear guide mechanism and fixedly connected with the bush bearing linear guide mechanism, a spline bearing guide rod device is arranged in the spline bearing linear guide mechanism and located at the leftmost end, and a suction device is arranged at the lower portion of the spline bearing guide rod device and used for taking and placing CSP chip products. The utility model discloses can get the CSP chip product of complicacy and put the mechanism and snatch the mechanism combination with processing, the structure can be with the whole thing of many equipment one-tenth equipment simultaneously, has reduced many equipment and has shifted the error to CSP chip product production.
Description
Technical Field
The utility model relates to a semiconductor and industrial automation field specifically are CSP chip product is got and is put mechanism.
Background
Csp (chip Scale package) is a latest generation of memory chip packaging technology, the most advanced form of integrated circuit packaging. Among the various packages, the chip scale package is the smallest area, smallest thickness and thus smallest volume package
In the back-end production process of CSP chip products, it is necessary to pick up from the blue film of wafer at high speed, accurately and reliably, and transfer or process them, such as: positioning correction, electrical property test, visual detection, laser marking, product classification and braid packaging. Because the CSP chip product has the characteristics of small area and thickness and small bearing pressure, the efficient pick-up and transfer of the tiny CSP chip product is technically difficult to realize. The traditional method is that after a product is picked up from a wafer blue film through a die bonding swing arm, other processing procedures are transferred through other two-point picking and placing mechanisms. The manufacturing method has the advantages that in the production and manufacturing process, the transfer times of the CSP chip products are more, the working procedure is longer, the equipment structure is complex, the problems of dark crack, scratch and damage to the CSP chip products are easily caused in the process, the repeated positioning precision of the production mode is not high, various equipment is required to be matched for use, the production efficiency is lower, the yield of finished products is not high, and the actual production cost is higher
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the CSP chip product pick-and-place mechanism is provided, and the technical scheme solves the problems of low production efficiency, low finished product yield and high actual production cost.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a CSP chip product pick and place mechanism comprising:
the device comprises a liner bearing linear guide mechanism, a guide rod main support frame, a suction mechanism and a guide rod guide mechanism, wherein the liner bearing linear guide mechanism is positioned at the upper end of the device, two liner bearings and the guide rod main support frame are arranged in the liner bearing linear guide mechanism, the two liner bearings are adjacently arranged at the upper end of the guide rod main support frame, and the two liner bearings vertically penetrate through the guide rod main support frame and are used for controlling the suction mechanism to suck and transfer the CSP chip products;
spline bearing linear guide mechanism, spline bearing linear guide mechanism is located bush bearing linear guide mechanism's lower extreme position to with bush bearing linear guide mechanism fixed connection, its inside spline bearing guide arm device that is provided with, spline bearing guide arm device are located leftmost end, and the lower part is provided with suction means for getting CSP chip product and put.
Preferably, the bush bearing linear guide mechanism comprises a bush bearing guide rod device and a guide rod main support frame, the bush bearing guide rod device is located at the upper end of the guide rod main support frame, the bush bearing guide rod device comprises a bush bearing guide rod, a spring limit stop, a limit snap ring, a tensioning spring, a bearing bushing limit, an inner bearing bushing and an outer bearing bushing, the bush bearing guide rod is located at the center of the bush bearing guide rod device, the upper end of the bush bearing guide rod device is fixedly connected with the limit snap ring, the spring limit stop is arranged below the limit snap ring and located on the outer side of the bush bearing guide rod and welded with the tensioning spring below, and the other end of the tensioning spring extends to the top end of the guide rod main support frame.
Preferably, the inner bearing bush, the outer bearing bush, tensioning spring and the coaxial setting of bush bearing guide arm, inner bearing bush and outer bearing bush all are located the tensioning spring inside and with bush bearing guide arm outside fixed connection, wherein inner bearing bush sets up in outer bearing bush inside and its slightly less than outer bearing bush setting, guide arm main tributary strut transversely sets up in spline bearing linear guide mechanism upper end, its inside is provided with a plurality of mounting holes and spacing hole, guide arm main tributary strut includes high fine setting bolt and locking fastening nut, high fine setting bolt is located between two bush bearing guide arm devices and with spacing hole phase-match, high fine setting bolt bottom runs through guide arm main tributary strut and sets up in spacing downthehole portion, its top and locking fastening nut threaded connection, and locking fastening nut internal diameter is greater than spacing downthehole diameter.
Preferably, the spline bearing linear guide mechanism comprises a spline bearing guide rod device and a suction nozzle guide rod bracket, the spline bearing guide rod device is positioned on the left side of the bush bearing linear guide mechanism, the upper part of the spline bearing linear guide mechanism comprises a spline bearing linear guide rod, a guide rod fastening clamping block, a suction nozzle buffering rubber mat, a spline linear bearing and a chip pressure spring, the spline bearing linear guide rod is positioned at the center of the spline bearing guide rod device, the guide rod fastening clamping block is positioned on the outer side of the upper end of the spline bearing linear guide rod and is coaxial with the spline bearing linear guide rod, a guide rod upper end fastening screw is arranged on one side of the guide rod fastening clamping block, and the guide rod upper end fastening screw transversely penetrates through the guide rod fastening clamping block and the spline bearing linear guide rod and is used for fixing the guide rod fastening clamping block.
Preferably, the spline linear bearing is arranged at the lower end of the guide rod fastening clamping block and fixedly connected with the spline bearing guide rod, the suction nozzle buffer rubber pad is positioned at the upper end of the spline linear bearing and arranged between the guide rod fastening clamping block and the spline linear bearing, the chip pressure spring is arranged in the suction nozzle guide rod bracket, the top end of the chip pressure spring is welded with the spline linear bearing, the lower part of the spline bearing guide rod device comprises a vacuum quick connector, a suction nozzle connecting block, a chip vacuum suction nozzle, a suction nozzle fastening screw and a guide rod lower end fastening screw, the vacuum quick connector is positioned below the suction nozzle guide rod bracket and fixedly connected with the spline bearing guide rod, the lower end of the chip pressure spring penetrates through the suction nozzle guide rod bracket and is fixedly connected with the vacuum quick connector, the chip vacuum suction nozzle is positioned below the vacuum quick connector and fixedly connected with the vacuum quick connector through the suction nozzle connecting block at one side, the guide rod lower end fastening screw and the suction nozzle fastening screw are arranged at one side of the suction nozzle connecting block, the suction nozzle fastening screw is positioned below the fastening screw at the lower end of the guide rod, the suction nozzle fastening screw and the guide rod are matched to be used for fixedly connecting the vacuum quick connector and the chip vacuum suction nozzle through the suction nozzle connecting block, and the bottom end of the chip vacuum suction nozzle is designed to be inverted cone-shaped so as to be convenient for sucking a target product.
Preferably, the suction nozzle guide rod support is located on one side of the spline bearing guide rod device, the spline bearing guide rod device penetrates through the suction nozzle guide rod support, a buffering limiting rubber mat is arranged inside the upper end of the suction nozzle guide rod support and is matched with the height fine adjustment bolt, and a mounting groove is formed in the position, matched with the bush bearing guide rod device, of the upper end of the suction nozzle guide rod support and is used for fixing the whole bush bearing linear guide mechanism.
Compared with the prior art, the utility model beneficial effect who has is:
the utility model discloses a CSP chip product is got and is put mechanism uses this mechanism and method through implementing, can make CSP chip product carry out high-speed, accurate, reliable spatial position on same platform equipment and shift, has realized picking up from the blue membrane of wafer fast to CSP chip product to quick response is carried out as it: the production process comprises the procedures of positioning correction, electrical property test, visual inspection, laser marking, product classification and braid packaging, and is convenient for process expansion and compatibility in the production and manufacturing process of CSP chip products.
By implementing the utility model, the complex CSP chip product pick-and-place mechanism and the processing and grabbing mechanism can be combined, and a plurality of devices can be integrated into one device, thereby reducing the production transfer error of the CSP chip product by the plurality of devices; the problems of dark cracking, scratching and damage to the CSP chip product in the process are avoided, the processing and the processing in the back-end production and manufacturing process of the CSP chip product are convenient, the labor is saved, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic view of the overall three-dimensional structure of the present invention;
fig. 2 is a cross-sectional view of the present invention from a side view;
FIG. 3 is an overall exploded view of the present invention;
fig. 4 is an exploded view from another perspective of the present invention;
FIG. 5 is a schematic diagram of the present invention;
FIG. 6 is a process diagram of the grabbing operation of the present invention;
FIG. 7 is a process diagram of the processing operation of the present invention;
the reference numbers in the figures are:
1. a bush bearing linear guide mechanism; 11. a bushing bearing guide rod assembly; 111. a spring limit stop; 112. A limit snap ring; 113. tensioning the spring; 114. limiting a bearing bush; 115. an inner bearing bush; 116. an outer bearing sleeve; 12. the guide rod main supporting frame; 121. a height fine-tuning bolt; 122. a locknut;
2. a spline bearing linear guide mechanism; 21. a spline bearing guide rod device; 211. the guide rod fastens the clamping block; 212. The suction nozzle buffers the cushion; 213. a spline linear bearing; 214. a chip pressure spring; 215. a vacuum quick connector; 216. a suction nozzle connecting block; 217. a chip vacuum suction nozzle; 218. a screw is fastened at the upper end of the guide rod; 219. a suction nozzle fastening screw; 220. a screw is fastened at the lower end of the guide rod; 22. a suction nozzle guide rod bracket; 221. buffering and limiting rubber pads;
3. a chip product;
4. a wafer blue film;
5. a chip thimble;
6. a processing device;
A. an end face at A;
B. end face at B;
C. and C, end face.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, 2 and 3, a CSP chip product pick-and-place mechanism includes: the device comprises a liner bearing linear guide mechanism 1, wherein the liner bearing linear guide mechanism 1 is positioned at the upper end of the device, two liner bearings and a guide rod main support frame 12 are arranged in the liner bearing linear guide mechanism 1, the two liner bearings are adjacently arranged at the upper end of the guide rod main support frame 12, and the two liner bearings vertically and vertically penetrate through the guide rod main support frame 12 and are used for controlling a suction mechanism to suck and transfer CSP chip products; the bush bearing linear guide mechanism 1 comprises a bush bearing guide rod device 11 and a guide rod main support frame 12, the bush bearing guide rod device 11 is located at the upper end of the guide rod main support frame 12, the bush bearing guide rod device 11 comprises a bush bearing guide rod, a spring limit stop 111, a limit snap ring 112, a tensioning spring 113, a bearing bush limit 114, an inner bearing bush 115 and an outer bearing bush 116, the bush bearing guide rod is located at the center of the bush bearing guide rod device 11, the upper end of the bush bearing guide rod device is fixedly connected with the limit snap ring 112, the spring limit stop 111 is arranged below the limit snap ring 112, the spring limit stop 111 is located on the outer side of the bush bearing guide rod and is welded with a tensioning spring 113 below the spring limit stop 111, and the other end of the tensioning spring 113 extends to the top end of the guide rod main support frame 12. A plurality of bush bearing guide rod devices 11 are arranged for fixedly connecting the bush bearing linear guide mechanism 1 with the spline bearing linear guide mechanism 2, and transmitting the force applied by an external pressurizing mechanism to the spline bearing guide rod device 21 to enable the spline bearing linear guide mechanism to descend to a preset position, a limit snap ring 112 at the top end is used for avoiding the displacement of the bush bearing guide rod and fixing a spring limit stop 111, the spring limit stop 111 resists and blocks the pressure applied by a tension spring 113 and conducts downwards through acting force and reacting force, and the tension spring 113 can only work within a preset range due to the limitation of the spring limit stop 111, and is prevented from being separated from the bush bearing guide rod due to excessive force;
the inner bearing bush 115, the outer bearing bush 116, the tension spring 113 and the bush bearing guide rod are coaxially arranged, the inner bearing bush 115 and the outer bearing bush 116 are both positioned inside the tension spring 113 and fixedly connected with the outer side of the bush bearing guide rod, wherein the inner bearing bush 115 is arranged inside the outer bearing bush 116 and is slightly lower than the outer bearing bush 116, the guide rod main support frame 12 is transversely arranged at the upper end of the spline bearing linear guide mechanism 2, a plurality of mounting holes and limiting holes are arranged inside the guide rod main support frame 12, the guide rod main support frame 12 comprises a height fine adjustment bolt 121 and a locking fastening nut 122, the height fine adjustment bolt 121 is positioned between the two bush bearing guide rod devices 11 and is matched with the limiting holes, the bottom end of the height fine adjustment bolt 121 penetrates through the guide rod main support frame 12 and is arranged inside the limiting holes, the top end of the height fine adjustment bolt is in threaded connection with the locking fastening nut 122, and the inner diameter of the locking fastening nut 122 is larger than the inner diameter of the limiting holes, the inner bearing bush 115 is used for fixing the bearing and limiting the position of the bearing, so that the bearing rotates in a preset range, the bearing is prevented from being deviated under the condition of long-time working operation, thereby causing influence on the precision of the device, the inner bearing bush 115 and the bush bearing guide rod are sleeved by the outer bearing bush 116, the integral protection effect is realized, the inner bearing bush 115 and the outer bearing bush 116 are fixed at the working position through the bearing bush limiting position 114 at the upper end, the deviation influence caused by shaking in the actual operation process is prevented, the guide rod main support frame 12 vertically fixes the integral bush bearing guide rod device 11 and fixes the integral bush bearing guide rod device with the spline bearing linear guide mechanism 2 at the lower part, the up-and-down supporting effect is realized, and the high fine adjustment of the bush linear guide mechanism 1 can be realized through the matching of the height fine adjustment bolt 112 and the anti-loosening fastening nut 122, the purpose of accurate positioning is achieved.
Referring to fig. 1, 2 and 4, the spline bearing linear guide mechanism 2 is located at the lower end of the bush bearing linear guide mechanism 1 and is fixedly connected with the bush bearing linear guide mechanism 1, a spline bearing guide rod device 21 is arranged in the spline bearing linear guide mechanism, the spline bearing guide rod device 21 is located at the leftmost end, and a suction device is arranged at the lower part of the spline bearing linear guide mechanism and is used for taking and placing CSP chip products. Spline bearing linear guide mechanism 2 includes spline bearing guide rod device 21 and suction nozzle guide rod support 22, spline bearing guide rod device 21 is located the left side of bush bearing linear guide mechanism 1, its upper portion includes spline bearing linear guide rod, guide rod fastening clamp splice 211, suction nozzle buffering cushion 212, spline linear bearing 213, chip pressure spring 214, spline bearing linear guide rod is located the central point of spline bearing guide rod device 21, guide rod fastening clamp splice 211 is located the upper end outside of spline bearing linear guide rod, and with the coaxial setting of spline bearing linear guide rod, guide rod fastening clamp splice 211 one side is provided with guide rod upper end fastening screw 218, guide rod upper end fastening screw 218 transversely runs through guide rod fastening clamp splice 211 and spline bearing linear guide rod, be used for fixed guide rod fastening clamp splice 211. The spline bearing guide rod is a core component of the spline bearing linear guide mechanism 2 and is used for driving the chip vacuum suction nozzle 217 to move up and down, the chip vacuum suction nozzle is limited in position by the guide rod fastening clamping block 211 at the upper end of the spline bearing guide rod, and the guide rod fastening clamping block 211 can be fixed on the spline bearing guide rod by the transverse arrangement of the guide rod upper end fastening screw 218;
the spline linear bearing 213 is arranged at the lower end of the guide rod fastening clamping block 211 and fixedly connected with the spline bearing guide rod, the suction nozzle buffer rubber pad 212 is positioned at the upper end of the spline linear bearing 213 and is arranged between the guide rod fastening clamping block 211 and the spline linear bearing 213, the chip pressure spring 214 is arranged inside the suction nozzle guide rod bracket 22, the top end of the chip pressure spring is welded with the spline linear bearing 213, the lower part of the spline bearing guide rod device 21 comprises a vacuum quick connector 215, a suction nozzle connecting block 216, a chip vacuum suction nozzle 217, a suction nozzle fastening screw 219 and a guide rod lower end fastening screw 220, the vacuum quick connector 215 is positioned below the suction nozzle guide rod bracket 22 and fixedly connected with the spline bearing guide rod, the lower end of the chip pressure spring 214 penetrates through the guide rod bracket 22 and is fixedly connected with the vacuum quick connector 215, the chip vacuum suction nozzle 217 is positioned below the vacuum quick connector 215 and is fixedly connected with the vacuum quick connector 215 through the suction nozzle connecting block 216 on one side, a guide rod lower end fastening screw 220 and a suction nozzle fastening screw 219 are arranged on one side of the suction nozzle connecting block 216, the suction nozzle fastening screw 219 is positioned below the guide rod lower end fastening screw 220 and is matched with the suction nozzle connecting block 216 to fixedly connect the vacuum quick connector 215 with the chip vacuum suction nozzle 217, the bottom end of the chip vacuum suction nozzle 217 is designed in an inverted cone shape so as to be convenient for sucking a target product, the suction nozzle buffer rubber pad 212 is used for reducing the impact force between the guide rod fastening clamping block 211 and the spline linear bearing 213, the spline linear bearing 213 is used for enabling the spline bearing linear guide mechanism 2 to change different angular positions so as to ensure accurate positioning, target samples at different positions are sucked, the pressure range borne by a common CSP chip product is 30-100mgf, the problems of dark crack, scratch and damage to the CSP chip product are avoided by adjusting the chip pressure spring 214, the vacuum quick connector 215 is used for assisting the chip vacuum CSP 217 to suck the suction nozzle chip, the suction nozzle connecting block 216 on one side stably and fixedly connects the two, so that the situation that the two are deviated due to repeated work and cannot be accurately positioned is avoided;
suction nozzle guide rod support 22 is located spline bearing guide rod device 21 one side, and spline bearing guide rod device 21 runs through suction nozzle guide rod support 22, suction nozzle guide rod support 22 upper end inside is provided with buffering spacing cushion 221, buffering spacing cushion 221 and high fine setting bolt 121 phase-match, suction nozzle guide rod support 22 upper end and bush bearing guide rod device 11 phase-match position have seted up the mounting groove, be used for fixed bush bearing linear guide mechanism 1 whole, and conduct the power of implementing external pressure mechanism on bush bearing linear guide mechanism 1 to spline bearing guide rod device 21, thereby make chip vacuum suction nozzle 217 can adsorb the CSP chip and temporarily store and shift to predetermined station and lift off.
The using process of the device is as follows: according to the CSP chip product with the chip-level package, because the CSP chip product needs to be transferred and adhered to the wafer blue film E in the process of manufacturing, the CSP chip product with the chip vacuum suction nozzle 217 is precisely moved down linearly to be close to the upper surface of the CSP chip product 3, then the chip ejector pin 5 is moved up linearly to eject the CSP chip product 3, the CSP chip product 3 is moved up together with the suction nozzle under the thrust of the chip ejector pin 5, the chip ejector pin 5 pierces the wafer blue film 4, the CSP chip product 3 is transferred and adsorbed to the position below the chip vacuum suction nozzle 217, and finally the chip ejector pin 5 is lowered and collected, and the CSP chip product 3 is successfully transferred to the position below the suction nozzle.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the principles of the present invention may be applied to any other embodiment without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A CSP chip product pick and place mechanism, comprising:
the device comprises a liner bearing linear guide mechanism (1), wherein the liner bearing linear guide mechanism (1) is positioned at the upper end of the device, two liner bearings and a guide rod main support frame (12) are arranged in the liner bearing linear guide mechanism, the two liner bearings are adjacently arranged at the upper end of the guide rod main support frame (12), and the two liner bearings vertically penetrate through the guide rod main support frame (12) and are used for controlling an absorption mechanism to absorb and transfer CSP chip products;
spline bearing linear guide mechanism (2), spline bearing linear guide mechanism (2) are located the lower extreme position of bush bearing linear guide mechanism (1) to with bush bearing linear guide mechanism (1) fixed connection, its inside spline bearing guide arm device (21) that is provided with, spline bearing guide arm device (21) are located the leftmost end, and the lower part is provided with suction means for get CSP chip product and put.
2. The CSP chip product pick-and-place mechanism according to claim 1, wherein the bushing bearing linear guide mechanism (1) comprises a bushing bearing guide rod device (11) and a guide rod main support frame (12), the bushing bearing guide rod device (11) is located at the upper end of the guide rod main support frame (12), the bushing bearing guide rod device (11) comprises a bushing bearing guide rod, a spring limit stop (111), a limit snap ring (112), a tension spring (113), a bearing bushing limit (114), an inner bearing bushing (115) and an outer bearing bushing (116), the bushing bearing guide rod is located at the center of the bushing bearing guide rod device (11), the upper end of the bushing bearing guide rod is fixedly connected with the limit snap ring (112), the spring limit stop (111) is arranged below the limit snap ring (112), the spring limit stop (111) is located outside the bushing bearing guide rod and is welded with the tension spring (113) below the bushing bearing guide rod, the other end of the tension spring (113) extends to the top end of the guide rod main supporting frame (12).
3. The CSP chip product pick-and-place mechanism as claimed in claim 2, wherein the inner bearing bushing (115), the outer bearing bushing (116), the tension spring (113) and the bushing bearing guide rod are coaxially arranged, the inner bearing bushing (115) and the outer bearing bushing (116) are both located inside the tension spring (113) and fixedly connected with the outside of the bushing bearing guide rod, wherein the inner bearing bushing (115) is located inside the outer bearing bushing (116) and slightly lower than the outer bearing bushing (116), the guide rod main support frame (12) is transversely arranged at the upper end of the spline bearing linear guide mechanism (2), and is internally provided with a plurality of mounting holes and limiting holes, the guide rod main support frame (12) comprises a height fine adjustment bolt (121) and a fastening nut (122), the height fine adjustment bolt (121) is located between the two bushing bearing guide rod devices (11) and is matched with the limiting holes, the bottom end of the height fine-tuning bolt (121) penetrates through the guide rod main support frame (12) and is arranged in the limiting hole, the top end of the height fine-tuning bolt is in threaded connection with the anti-loosening fastening nut (122), and the inner diameter of the anti-loosening fastening nut (122) is larger than the inner diameter of the limiting hole.
4. The CSP chip product pick-and-place mechanism according to claim 1, wherein the spline bearing linear guide mechanism (2) comprises a spline bearing guide rod device (21) and a suction nozzle guide rod bracket (22), the spline bearing guide rod device (21) is located at the left side of the bush bearing linear guide mechanism (1), the upper portion of the spline bearing linear guide mechanism comprises a spline bearing linear guide rod, a guide rod fastening clamp block (211), a suction nozzle buffer rubber pad (212), a spline linear bearing (213) and a chip pressure spring (214), the spline bearing linear guide rod is located at the center of the spline bearing guide rod device (21), the guide rod fastening clamp block (211) is located at the outer side of the upper end of the spline bearing linear guide rod and is coaxial with the spline bearing linear guide rod, a guide rod upper end fastening screw (218) is arranged at one side of the guide rod fastening clamp block (211), the guide rod upper end fastening screw (218) transversely penetrates through the guide rod fastening clamp block (211) and the spline bearing linear guide rod, used for fixing the guide rod fastening clamping block (211).
5. The CSP chip product pick-and-place mechanism as claimed in claim 4, wherein the spline linear bearing (213) is disposed at the lower end of the guide rod fastening clamp block (211) and fixedly connected to the spline bearing guide rod, the suction nozzle buffer rubber pad (212) is disposed at the upper end of the spline linear bearing (213) and disposed between the guide rod fastening clamp block (211) and the spline linear bearing (213), the chip pressure spring (214) is disposed inside the suction nozzle guide rod bracket (22) and the top end thereof is welded to the spline linear bearing (213), the lower portion of the spline bearing guide rod device (21) comprises a vacuum quick coupling (215), a suction nozzle connecting block (216), a chip vacuum suction nozzle (217), a suction nozzle fastening screw (219) and a guide rod lower end fastening screw (220), the vacuum quick coupling (215) is disposed below the suction nozzle guide rod bracket (22) and fixedly connected to the spline bearing guide rod, the lower end of a chip pressure spring (214) penetrates through a suction nozzle guide rod support (22) and is fixedly connected with a vacuum quick connector (215), a chip vacuum suction nozzle (217) is located at the position below the vacuum quick connector (215), and is fixedly connected with the vacuum quick connector (215) through a suction nozzle connecting block (216) on one side, a guide rod lower end fastening screw (220) and a suction nozzle fastening screw (219) are arranged on one side of the suction nozzle connecting block (216), the suction nozzle fastening screw (219) is located below the guide rod lower end fastening screw (220), and the suction nozzle fastening screw and the suction nozzle connecting block are matched to be used for fixedly connecting the vacuum quick connector (215) with a chip vacuum suction nozzle (217) through the suction nozzle connecting block (216), and the bottom end of the chip vacuum suction nozzle (217) is designed to be inverted cone-shaped so that a target product can be conveniently sucked.
6. The CSP chip product pick-and-place mechanism according to claim 5, wherein the suction nozzle guide rod bracket (22) is located at one side of the spline bearing guide rod device (21), the spline bearing guide rod device (21) penetrates through the suction nozzle guide rod bracket (22), a buffering and limiting rubber pad (221) is arranged inside the upper end of the suction nozzle guide rod bracket (22), the buffering and limiting rubber pad (221) is matched with the height fine adjustment bolt (121), and a mounting groove is formed at the matching position of the upper end of the suction nozzle guide rod bracket (22) and the bush bearing guide rod device (11) for fixing the whole bush bearing linear guide mechanism (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120434773.6U CN214477374U (en) | 2021-03-01 | 2021-03-01 | CSP chip product pick-and-place mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120434773.6U CN214477374U (en) | 2021-03-01 | 2021-03-01 | CSP chip product pick-and-place mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN214477374U true CN214477374U (en) | 2021-10-22 |
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| CN202120434773.6U Active CN214477374U (en) | 2021-03-01 | 2021-03-01 | CSP chip product pick-and-place mechanism |
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- 2021-03-01 CN CN202120434773.6U patent/CN214477374U/en active Active
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