CN219832780U - Heat radiation equipment and portable power source - Google Patents

Abstract

The utility model provides a heat radiation device and a mobile power supply, wherein the heat radiation device comprises a first main heat radiation plate, a second main heat radiation plate, a first side heat radiation plate and a second side heat radiation plate, and the first main heat radiation plate, the second main heat radiation plate, the first side heat radiation plate and the second side heat radiation plate are enclosed to form a circulation channel for cooling medium circulation, and the circulation channel is configured for cooling medium circulation. At least one of the first main heat dissipation plate and the second main heat dissipation plate is configured to be capable of carrying the functional module and transferring heat generated by the functional module to the flow channel. At least one of the first side heat sink and the second side heat sink is configured to be capable of carrying another functional module and to transfer heat generated by the other functional module to the flow channel. The heat dissipation device is independently arranged through the first main heat dissipation plate, the second main heat dissipation plate, the first side heat dissipation plate and the second side heat dissipation plate and can be in contact with the functional modules and conduct heat, so that the heat dissipation device can be used for dissipating heat of a plurality of functional modules at the same time, and the heat dissipation device is simple in structure and low in cost.

Description

Heat radiation equipment and portable power source

Technical Field

The embodiment of the utility model relates to the technical field of heat dissipation, in particular to heat dissipation equipment and a mobile power supply.

Background

The conventional heat dissipation mode of the electronic control module is to directly assemble the heat dissipation frame on the circuit board of the electronic control module, so that the functional module of the electronic control module is attached to the heat dissipation frame to realize heat dissipation, but the direct assembly of the heat dissipation frame on the circuit board can lead to the influence on the strength of the circuit board structure, and meanwhile, a plurality of heat dissipation frames need to be configured for the electronic control module, so that the realization cost is high.

Disclosure of Invention

In view of this, the present utility model provides a heat dissipation device and a mobile power supply with good overall heat dissipation effect.

In a first aspect, the present utility model provides a heat dissipating device, including a first main heat dissipating plate and a second main heat dissipating plate, a first side heat dissipating plate and a second side heat dissipating plate, where the first main heat dissipating plate, the second main heat dissipating plate, the first side heat dissipating plate and the second side heat dissipating plate enclose a flow channel through which a cooling medium flows, and the flow channel is configured to allow the cooling medium to flow. At least one of the first main heat dissipation plate and the second main heat dissipation plate is configured to be capable of carrying the functional module and transferring heat generated by the functional module to the flow channel. At least one of the first side heat sink and the second side heat sink is configured to be capable of carrying another functional module and to transfer heat generated by the other functional module to the flow channel.

The heat dissipation device is independent of the functional module, and is not required to be arranged in the functional module, so that the layout space in the functional module is increased; the heat dissipation device is provided with a first main heat dissipation plate, a second main heat dissipation plate, a first side heat dissipation plate and a second side heat dissipation plate which are positioned on the periphery of the circulation channel, and the first main heat dissipation plate, the second main heat dissipation plate, the first side heat dissipation plate and the second side heat dissipation plate are configured to be capable of being in contact with the functional modules and conducting heat, so that the heat dissipation device can be used for simultaneously dissipating a plurality of functional modules, and the heat dissipation device is simple in structure and low in cost.

In one possible embodiment, the heat dissipating device is provided with a plurality of partitions penetrating through both sides of the heat dissipating device, the partitions extending along a penetrating direction of the flow channel, the plurality of partitions being disposed in the flow channel at intervals and partitioning the flow channel into a plurality of sub-channels.

Obviously, in the above embodiment, the plurality of sub-channels enable the air flow entering the heat dissipation device to be dispersed in each sub-channel, and the volume of the sub-channels is far smaller than that of the circulating channel without the partition part, so that the air flow in the sub-channels moves along the penetrating direction, and then the air flow in the sub-channels drives heat to be dissipated to the outside in time. However, the air flow of the flow channel without the partition portion is dispersed in different directions, which results in a longer flow path of the air flow, and thus heat cannot be timely dissipated from the flow channel to the outside.

In one possible embodiment, the partition is connected between the first main heat dissipation plate and the second main heat dissipation plate.

Obviously, in the above embodiment, the partition portion is connected to the first main heat dissipation plate and the second main heat dissipation plate on opposite sides, so that the sub-channels are uniformly distributed, and uniformity of heat dissipation to the outside is improved.

In one possible embodiment, at least one of the first main heat radiating plate, the second main heat radiating plate, the first side heat radiating plate, and the second side heat radiating plate is provided with a plurality of heat transfer portions configured to circulate a cooling medium.

Obviously, in the above embodiment, the heat conduction coefficient of the heat transfer portion is higher than that of the second main heat dissipation plate, so that the heat transfer portion rapidly transfers the heat of the heating portion in the inverter module to the second main heat dissipation plate, thereby avoiding heat from being accumulated at the heating portion of the inverter module and improving the heat dissipation effect.

In one possible embodiment, at least one of the first main heat-dissipating plate, the second main heat-dissipating plate, the first side heat-dissipating plate, and the second side heat-dissipating plate is provided with a heat-dissipating surface that is in contact with the functional module and conducts heat, and the heat-dissipating surface is contoured to a side of the functional module facing the heat-dissipating device.

Obviously, in the above embodiment, the heat dissipation surface is contoured to the functional module, so that the heat dissipation surface and the heat dissipation part of the functional module can be in contact with and conduct heat with the heat dissipation surface no matter what the relative positions of the heat dissipation surface and the heat dissipation part of the functional module are, and the heat conduction effect of the heat dissipation device is improved.

In one possible embodiment, the heat dissipating device further comprises a fan disposed at the opening of the flow channel and configured to suck or blow air to the flow channel.

Obviously, in the above embodiment, the fan can accelerate the airflow velocity in the circulation channel, thereby improving the heat dissipation efficiency.

In a second aspect, the present utility model further provides a portable power source, including a plurality of functional modules and a heat dissipating device, where the plurality of functional modules include an inverter module and a power mechanism, the heat dissipating device includes a first main heat dissipating plate and a second main heat dissipating plate, a first side heat dissipating plate and a second side heat dissipating plate, and the first main heat dissipating plate, the second main heat dissipating plate, the first side heat dissipating plate and the second side heat dissipating plate enclose a flow channel through which a cooling medium flows, and the flow channel is configured to allow the cooling medium to flow. At least one of the first main heat dissipation plate and the second main heat dissipation plate is configured to be capable of carrying the functional module and transferring heat generated by the functional module to the flow channel. At least one of the first side heat sink and the second side heat sink is configured to be capable of carrying another functional module and to transfer heat generated by the other functional module to the flow channel. The first main cooling plate is in contact with the inverter module and conducts heat, and the second main cooling plate is in contact with the power supply mechanism and conducts heat.

In the mobile power supply, the heat dissipation device is independent of the inverter module and the power supply mechanism and is not required to be arranged in the functional module, so that the layout space in the functional module is increased; the heat dissipation device is provided with a first main heat dissipation plate, a second main heat dissipation plate, a first side heat dissipation plate and a second side heat dissipation plate which are positioned on the periphery of the circulation channel, and the first main heat dissipation plate, the second main heat dissipation plate, the first side heat dissipation plate and the second side heat dissipation plate are configured to be capable of being in contact with the functional modules and conducting heat, so that the heat dissipation device can be used for simultaneously dissipating a plurality of functional modules, and the heat dissipation device is simple in structure and low in cost.

In one possible embodiment, the mobile power supply further comprises a support body. The support main body is abutted to one side of the first side radiating plate and one side of the second side radiating plate, which are away from the circulation channel respectively, and the first side radiating plate and the second side radiating plate are at least partially exposed from the support main body so as to be in contact with the functional module.

Obviously, in the above embodiment, the first side heat dissipation plate and the second side heat dissipation plate close to the supporting body can accommodate the functional module with smaller volume, absorb the heat of the functional module and conduct to the circulation channel, so as to improve the overall heat dissipation effect of the mobile power supply.

In one possible embodiment, the first and second main heat sinks are located on opposite sides of the heat sink.

Obviously, in the above embodiment, the mobile power supply is located at two opposite sides of the heat dissipation device through the first main heat dissipation plate and the second main heat dissipation plate, which is favorable for distributing the functional modules at the periphery of the heat dissipation device, and is favorable for ensuring that the areas of the first main heat dissipation plate and the second main heat dissipation plate at two opposite sides are equal or close, and is favorable for distributing a plurality of functional modules with higher heat productivity at two opposite sides of the heat dissipation device, and the heat dissipation of the plurality of functional modules can be realized through one heat dissipation device, so that the compactness of the layout of the mobile power supply is favorable.

In one possible embodiment, the power mechanism includes a battery pack and a second circuit board connected to the battery pack and in contact with the side wall of the heat sink and thermally conductive.

Obviously, in the above embodiment, the second circuit board electrically connected to the battery pack is centrally disposed on one side of the battery pack, so that the first main heat dissipation plate is conveniently contacted with the second circuit board in the power mechanism, which needs to dissipate heat, and heat dissipation of the second circuit board is ensured.

Drawings

Fig. 1 is a schematic structural diagram of a mobile power supply according to an embodiment of the present utility model.

Fig. 2 is an exploded view of the portable power source shown in fig. 1.

Fig. 3 is a schematic diagram of the structure of the mobile power supply shown in fig. 1 with the casing removed.

Fig. 4 is an exploded view of the portable power source shown in fig. 3.

Fig. 5 and fig. 6 are schematic structural diagrams of the heat dissipating device in the mobile power supply shown in fig. 1 at different viewing angles.

Fig. 7 is a schematic sectional view of the portable power source shown in fig. 2.

Description of the main reference signs

200-Mobile Power supply 50-flow channel 1031-Battery pack

100-Heat sink 501-sub-channel 1033-second Circuit Board

10-first Main Heat spreading plate 502-opening 104-first Circuit Board

20-second main heat radiating plate 60-partition 105-fan

201-radiating surface 70-heat transfer portion 107-support body

203-groove 101-inverter module 109-housing

30-first side heat radiation plate 1011-projecting structure

40-second side heat radiation plate 103-power supply mechanism

The utility model will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

In order to further illustrate the technical means and effects adopted by the present utility model to achieve the purpose of the predetermined application, the following description is made with reference to the accompanying drawings and the implementation, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

The conventional heat dissipation mode for the electronic control module is to directly assemble the heat dissipation frame on the circuit board of the electronic control module, and the functional modules of the electronic control module are attached to the heat dissipation frame to realize heat dissipation, but the direct assembly of the heat dissipation frame on the circuit board can cause the influence on the strength of the circuit board structure, and meanwhile, a plurality of heat dissipation frames need to be configured for a plurality of electronic control modules, so that the realization cost is high.

Therefore, the embodiment of the utility model provides a heat radiation device and a mobile power supply for radiating a plurality of heat-generating functional modules and improving the overall heat radiation effect. The heat dissipation device comprises a first main heat dissipation plate, a second main heat dissipation plate, a first side heat dissipation plate and a second side heat dissipation plate, wherein the first main heat dissipation plate, the second main heat dissipation plate, the first side heat dissipation plate and the second side heat dissipation plate enclose to form a circulation channel for cooling medium circulation, and the circulation channel is configured for cooling medium circulation. At least one of the first main heat dissipation plate and the second main heat dissipation plate is configured to be capable of carrying the functional module and transferring heat generated by the functional module to the flow channel. At least one of the first side heat sink and the second side heat sink is configured to be capable of carrying another functional module and to transfer heat generated by the other functional module to the flow channel.

The heat dissipation device is independent of the functional module, and is not required to be arranged in the functional module, so that the layout space in the functional module is increased; the heat dissipation device is provided with a first main heat dissipation plate, a second main heat dissipation plate, a first side heat dissipation plate and a second side heat dissipation plate which are positioned on the periphery of the circulation channel, and the first main heat dissipation plate, the second main heat dissipation plate, the first side heat dissipation plate and the second side heat dissipation plate are configured to be capable of being in contact with the functional modules and conducting heat, so that the heat dissipation device can be used for simultaneously dissipating a plurality of functional modules, and the heat dissipation device is simple in structure and low in cost.

Some embodiments of the present utility model are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.

Referring to fig. 1 and 2, a mobile power supply 200 is provided according to an embodiment of the utility model. The portable power source 200 is a structure for supplying electric power. For example, the mobile power supply 200 may be applied to an electric vehicle or other devices operated by electric power.

The mobile power supply 200 includes a plurality of functional modules and the heat dissipating device 100. When the functional module is electrified and operated, heat is generated, and the heat needs to be emitted to ensure that the functional module stably operates. The heat dissipating device 100 is used for dissipating heat from a functional module. The heat dissipating device 100 conducts heat by contacting the functional module and dissipates the heat to the outside of the mobile power supply 200.

It will be appreciated that in other embodiments, the heat sink device 100 may also be applied to other electronic devices (not shown).

In one embodiment, the plurality of functional modules includes an inverter module 101 and a power mechanism 103. The heat dissipating device 100 includes a first main heat dissipating plate 10, a second main heat dissipating plate 20, a first side heat dissipating plate 30, and a second side heat dissipating plate 40. The first main heat dissipation plate 10, the second main heat dissipation plate 20, the first side heat dissipation plate 30, and the second side heat dissipation plate 40 enclose a flow channel 50. The flow channels 50 extend through opposite sides of the heat sink apparatus 100. The circulation passage 50 is configured to circulate a cooling medium.

It will be appreciated that in other embodiments, the flow channels 50 may extend through adjacent sides of the heat sink apparatus 100.

In one embodiment, the cooling medium is air, and it is understood that in other embodiments, the cooling medium may be a cooled air flow, or the cooling medium may be a liquid.

The first main heat dissipation plate 10 contacts the power supply mechanism 103 to absorb heat of the power supply mechanism 103 and conduct the heat to the circulation channel 50, and the cooling medium in the circulation channel 50 absorbs the heat and is discharged to the outside of the mobile power supply 200, so that heat dissipation of the power supply mechanism 103 by the heat dissipation device 100 is realized.

The second main heat dissipation plate 20 contacts the inverter module 101 to absorb heat of the inverter and transfer the heat to the circulation channel 50, and the cooling medium in the circulation channel 50 absorbs heat and is discharged to the outside of the mobile power supply 200, so that the heat dissipation of the inverter module 101 by the heat dissipation device 100 is realized.

In one embodiment, the plurality of functional modules further includes a first circuit board 104. The support main 107 is abutted against one side of the first side heat dissipation plate 30 and the second side heat dissipation plate 40, which are away from the flow channel 50, respectively, and the first side heat dissipation plate 30 and the second side heat dissipation plate 40 are at least partially exposed from the support main 107. The first circuit board 104 is configured to be in contact with the first side heat dissipation plate 30, the support main 107 is a frame structure, the volume of the first circuit board 104 is smaller than the volumes of the inverter module 101 and the power source mechanism 103, and the first side heat dissipation plate 30 is exposed from the support main 107 to be capable of being in contact with the first circuit board 104. The first side heat dissipation plate 30 absorbs heat of the first circuit board 104 and conducts the heat to a heat dissipation channel, and a cooling mechanism in the heat dissipation channel absorbs the heat and discharges the heat to the outside of the mobile power supply 200, so that heat dissipation of the first circuit board 104 by the heat dissipation device 100 is realized.

The first side heat dissipation plate 30 and the second side heat dissipation plate 40 close to the supporting body 107 can accommodate the functional module with smaller volume, absorb heat of the functional module, and conduct the heat to the circulation channel 50, so as to improve the overall heat dissipation effect of the mobile power supply 200.

It is understood that in other embodiments, the first circuit board 104 may be omitted. When the non-functional module is located between the first and second side heat dissipation plates 30 and 40 and the case 109, the first and second side heat dissipation plates 30 and 40 may also be configured without heat dissipation from the functional module.

In one embodiment, the areas of the first main heat dissipation plate 10 and the second main heat dissipation plate 20 facing away from the heat dissipation channel are larger than the areas of the first side heat dissipation plate 30 and the second side heat dissipation plate 40 facing away from the heat dissipation channel; that is, the areas of the first and second main heat dissipation plates 10 and 20 facing the functional module are larger than the areas of the first and second side heat dissipation plates 30 and 40 facing the functional module, so as to increase the contact areas of the first and second main heat dissipation plates 10 and 20 with the functional module, thereby improving the heat dissipation effect.

It will be appreciated that in other embodiments, the plurality of functional modules may further include other structures that generate heat during operation, such as a flexible circuit board, an interposer, and other electrical connection structures, in the mobile power supply 200, where the functional module with a large amount of heat generation is typically in contact with the first main heat dissipation plate 10 or the second main heat dissipation plate 20.

The heat sink 100 is independent of the inverter module 101 and the power supply mechanism 103, and does not need to be provided in the inverter module 101/the power supply mechanism 103, increasing the layout space of the inverter module 101 and the power supply mechanism 103. And the heat sink apparatus 100 is provided with the first main heat sink 10, the second main heat sink 20, the first side heat sink 30, and the second side heat sink 40 located at the peripheral side of the flow channel 50, the first main heat sink 10, the second main heat sink 20, the first side heat sink 30, and the second side heat sink 40 are configured to be capable of contacting and conducting heat with the functional modules, so that the heat sink apparatus 100 can simultaneously radiate a plurality of functional modules, and the heat sink apparatus 100 is simple in structure and low in cost.

With continued reference to fig. 3 and 4, the mobile power supply 200 includes a support body 107 and a housing 109. The housing 109 is provided to the support body 107. The support body 107 serves to support a plurality of functional modules and the heat sink apparatus 100. The housing 109 is disposed to cover the plurality of functional modules, as shown in fig. 1. When the portable power source 200 is mounted in an electric device (e.g., an electric car, etc.), the inverter module 101, the heat sink 100, and the power source mechanism 103 are disposed in this order in the up-down direction. In the heat dissipating device 100, the first main heat dissipating plate 10 and the second main heat dissipating plate 20 are located on opposite sides of the flow channel 50. The heat sink 100 is connected to the support body 107 and to the inverter module 101. The inverter module 101 is located above the heat sink 100, so that the heat sink 100 radiates heat to the inverter module 101 while supporting the inverter module 101.

It will be appreciated that in other embodiments, the inverter module 101 may also be configured to connect with the support body 107 and contact the heat sink apparatus 100, and the heat sink apparatus 100 can also be configured to carry the inverter module 101.

The power supply mechanism 103 includes a battery pack 1031 and a second circuit board 1033 that are electrically connected. The second circuit board 1033 is a BATTERY management system (BATTERY MANAGEMENT SYSTEM, BMS). The second circuit board 1033 is located between the heat sink apparatus 100 and the battery pack 1031. The second circuit board 1033 is in contact with the first main heat dissipation plate 10 and conducts heat. The second circuit board 1033 electrically connected to the battery pack 1031 is centrally disposed on one side of the battery pack 1031, so that the first main heat dissipation plate 10 is conveniently contacted with the second circuit board 1033 in the power mechanism 103, which needs to dissipate heat, and heat dissipation of the second circuit board 1033 is ensured.

The heat dissipation device 100 is connected to the support body 107 and carries the inverter module 101, so as to improve the stability of the inverter module 101, and prevent the force of the inverter module 101 pressed against the heat dissipation device 100 from being transferred to the power mechanism 103, thereby preventing the power mechanism 103 from being pressed.

In one embodiment, the power supply mechanism 103 is connected to the support body 107, but is not limited thereto. For example, in other embodiments, the power mechanism 103 is connected below the heat dissipating device 100, and the heat dissipating device 100 provides a lifting force to the power mechanism 103, so as to improve the stability of the power mechanism 103 and prevent the heat dissipating device 100 from pressing the power mechanism 103.

The mobile power supply 200 is located at two opposite sides of the heat dissipation device 100 through the first main heat dissipation plate 10 and the second main heat dissipation plate 20, which is beneficial to distributing functional modules at the periphery of the heat dissipation device 100, and is beneficial to ensuring that the areas of the first main heat dissipation plate 10 and the second main heat dissipation plate 20 at two opposite sides are equal or close, and is beneficial to distributing a plurality of functional modules with higher heat productivity at two opposite sides of the heat dissipation device 100, and the heat dissipation of the plurality of functional modules can be realized through one heat dissipation device 100, so that the layout compactness of the mobile power supply 200 is beneficial.

The power supply mechanism 103 and the inverter module 101 are configured to be located within the housing 109 to be isolated from the outside. The heat sink apparatus 100 is fixed to the support body 107, and the flow passage 50 is configured to be exposed from the housing 109 to communicate with the outside.

The functional module is covered by the shell 109, so that the functional module is isolated from the outside, and further, liquid-solid impurities outside are prevented from entering the functional module, so that the mobile power supply 200 can work outdoors and adapt to outdoor climate change, for example, when raining, rainwater does not contact the functional module, and the heat dissipation device 100 is exposed to the outside, thereby accelerating heat dissipation.

Referring to fig. 5, 6 and 7, in one embodiment, the heat dissipating device 100 is provided with a plurality of partitions 60. The partition 60 extends in the penetrating direction of the flow channel 50. The plurality of partition portions 60 are provided in the flow channel 50 at intervals, and partition the flow channel 50 into a plurality of sub-channels 501.

The plurality of sub-channels 501 enable the air flow entering the heat dissipating device 100 to be dispersed in each sub-channel 501, and the volume of the sub-channel 501 is far smaller than that of the circulation channel 50 without the partition 60, so that the air flow in the sub-channel 501 moves along the penetrating direction, and the air flow in the sub-channel 501 drives heat to be dissipated to the outside in time. However, the air flow of the flow channel 50 without the partition 60 is dispersed in different directions, which results in a longer flow path of the air flow, and thus heat cannot be timely dissipated from the flow channel 50 to the outside.

In one embodiment, the partition 60 is connected to the first and second main heat dissipation plates 10 and 20 at opposite sides of the heat dissipation device 100, but is not limited thereto. For example, in other embodiments, the partition 60 may be connected between the first main heat dissipation plate 10 and the first side heat dissipation plate 30.

The partition 60 is connected to the first and second main heat dissipation plates 10 and 20 at opposite sides, which is advantageous in uniformly distributing the sub-channels 501 to improve uniformity of heat dissipation to the outside.

In one embodiment, the second main heat dissipation plate 20 is provided with a heat dissipation surface 201. The heat radiation surface 201 contacts the inverter module 101 and approximately matches a heat generation portion of the inverter module 101 on a side facing the second main heat radiation plate 20. For example, the inverter module 101 is provided with a protruding structure 1011 protruding towards one side of the second main heat dissipation plate 20, the second main heat dissipation plate 20 is correspondingly provided with a groove 203, and the protruding structure 1011 is encapsulated in the groove 203.

In one embodiment, the protruding structure 1011 is a capacitor, but not limited thereto, the groove 203 accommodates the capacitor, so that the groove wall of the groove 203 conducts the heat of the capacitor. It will be appreciated that in other embodiments, the protruding structure 1011 may also be a transformer structure, or a power board (power supply distribution, PSDR board).

It will be appreciated that in other embodiments, the first main heat sink 10, the first side heat sink 30, and/or the second side heat sink 40 may also be contoured to the functional module in contact therewith. The heat sink 100 is provided with a protruding structure to be in contact with a recessed structure of the functional module, or the heat sink 100 is provided with a recessed structure to be in contact with a protruding structure of the functional module.

Referring to fig. 5, in one embodiment, the second main heat dissipation plate 20 is provided with a plurality of heat transfer portions 70. The heat transfer portion 70 is configured to correspond to a heat generating portion in the functional module. The heat transfer part 70 has a copper sheet structure, but is not limited thereto. The heat conduction coefficient of the heat transfer part 70 is higher than that of the second main heat dissipation plate 20, so that the heat transfer part 70 can quickly transfer the heat of the heat generating part in the inverter module 101 to the second main heat dissipation plate 20, heat is prevented from being accumulated at the heat generating part of the inverter module 101, and the heat dissipation effect is improved.

It will be appreciated that in other embodiments, the heat transfer portion 70 may be a copper tube structure, and the copper tube may be filled with a cooling medium. The cooling medium accelerates the cooling of the heat absorbed by the heat transfer portion 70.

It will be appreciated that in other embodiments, the heat transfer portion 70 may be provided on the first main heat sink 10, the first side heat sink 30, and/or the second side heat sink 40.

In order to stably set the heat transfer part 70 on the second main heat dissipation plate 20, the heat transfer part 70 is adhered to the second main heat dissipation plate 20 through heat-conducting glue, so as to prevent the heat transfer part 70 from being deformed by heat and separating from the second main heat dissipation plate 20, and prevent the deformed heat transfer part 70 from applying a supporting force to the functional module.

In one embodiment, referring to fig. 2 and 3, the mobile power supply 200 further includes a fan 105. The fan 105 is disposed at an opening 502 at one side of the flow channel 50 and configured to blow air to the flow channel 50. The air blown by the fan 105 enters from the opening 502 of the flow channel 50 and drives heat to be conducted to the outside of the flow channel 50.

The fan 105 can accelerate the airflow velocity in the flow channel 50, thereby improving the heat dissipation efficiency.

It will be appreciated that in other embodiments, the fans 105 may be disposed at the openings 502 on two opposite sides of the flow channel 50, wherein the fans 105 on one side of the flow channel 50 blow air into the flow channel 50, and the fans 105 on the other side of the flow channel 50 suck air into the flow channel 50, so as to further increase the flow velocity of the air flow in the flow channel 50, thereby further improving the heat dissipation effect.

The heat sink 100 is independent of the functional module, does not need to be provided in the functional module, increases a layout space in the functional module, and the heat sink 100 is provided with the first main heat sink 10, the second main heat sink 20, the first side heat sink 30, and the second side heat sink 40 located at the peripheral side of the flow channel 50, the first main heat sink 10, the second main heat sink 20, the first side heat sink 30, and the second side heat sink 40 being configured to be capable of contacting with and conducting heat from the functional module, so that the heat sink 100 can simultaneously radiate a plurality of functional modules, and the heat sink 100 is simple in structure and low in cost.

The above embodiments are only for illustrating the technical solution of the present utility model and not for limiting the same, and although the present utility model has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and substance of the technical solution of the present utility model.

Claims (10)

1. A heat sink apparatus characterized in that: the cooling medium circulation device comprises a first main cooling plate, a second main cooling plate, a first side cooling plate and a second side cooling plate, wherein the first main cooling plate, the second main cooling plate, the first side cooling plate and the second side cooling plate are enclosed to form a circulation channel for circulating cooling medium, and the circulation channel is configured for circulating cooling medium;

at least one of the first main heat dissipation plate and the second main heat dissipation plate is configured to be capable of carrying a functional module and transfer heat generated by the functional module to the flow channel;

at least one of the first side heat dissipation plate and the second side heat dissipation plate is configured to be capable of carrying another functional module and transferring heat generated by the other functional module to the flow channel.

2. The heat sink apparatus of claim 1, wherein: the heat dissipation device is provided with a plurality of separation parts, the separation parts penetrate through two sides of the heat dissipation device, the separation parts extend along the penetrating direction of the circulation channel, and the separation parts are arranged in the circulation channel at intervals and separate the circulation channel to form a plurality of sub-channels.

3. The heat sink apparatus of claim 2, wherein: the partition is connected between the first main heat dissipation plate and the second main heat dissipation plate.

4. The heat sink apparatus of claim 2, wherein: at least one of the first main heat dissipation plate, the second main heat dissipation plate, the first side heat dissipation plate, and the second side heat dissipation plate is provided with a plurality of heat transfer portions configured to circulate a cooling medium.

5. The heat sink apparatus of claim 1, wherein: at least one of the first main heat dissipation plate, the second main heat dissipation plate, the first side heat dissipation plate and the second side heat dissipation plate is provided with a heat dissipation surface, the heat dissipation surface is in contact with the functional module and conducts heat, and the heat dissipation surface is profiled on one side of the functional module, which faces the heat dissipation device.

6. The heat dissipating apparatus of any of claims 1 to 5, wherein: the heat dissipation device further comprises a fan, wherein the fan is arranged at the opening of the circulation channel and is configured to suck or blow air to the circulation channel.

7. A portable power source comprising a plurality of functional modules including an inverter module and a power supply mechanism, and a heat dissipating device, wherein the heat dissipating device is the heat dissipating device according to any one of claims 1 to 6;

the first main cooling plate is in contact with the inverter module and conducts heat, and the second main cooling plate is in contact with the power supply mechanism and conducts heat.

8. The mobile power supply of claim 7, wherein: the mobile power supply further comprises a support main body; the support main body is abutted to one side of the first side radiating plate and one side of the second side radiating plate, which are respectively away from the circulation channel, and the first side radiating plate and the second side radiating plate are at least partially exposed from the support main body so as to be in contact with the functional module.

9. The mobile power supply of claim 7, wherein: the first main heat dissipation plate and the second main heat dissipation plate are located at opposite sides of the heat dissipation device.

10. The mobile power supply of claim 7, wherein: the power supply mechanism comprises a battery pack and a second circuit board, wherein the second circuit board is connected with the battery pack, contacts with the side wall of the heat dissipation device and conducts heat.