CN220123293U - Heat dissipation support and energy storage equipment - Google Patents

Abstract

The utility model provides a heat dissipation bracket which is applied to a heating module, wherein the heating module is provided with a power plate and a radiator arranged on the power plate, the heat dissipation bracket comprises a heat dissipation plate, the heat dissipation plate is fixed relative to the power plate, a space for accommodating the radiator and a power device on the power plate is formed between the heat dissipation plate and the power plate at intervals, and the heat dissipation plate is at least attached to the power device on the power plate far away from the radiator so as to dissipate heat of the power device. The utility model also provides energy storage equipment comprising the heat dissipation bracket. According to the heat dissipation bracket and the energy storage device, the power devices on the power board are attached to the heat dissipation plate, so that the heat dissipation plate can absorb the heat of the power devices, the heat of the power devices is uniform, and the heat dissipation efficiency of the power board is improved.

Description

Heat dissipation support and energy storage equipment

Technical Field

The utility model relates to the field of heat dissipation of circuit boards, in particular to a heat dissipation bracket and energy storage equipment.

Background

At present in movable energy storage power, be equipped with some devices that generate heat on the circuit board in the contravariant module, in order to realize the heat dissipation simultaneously, still need set up the radiator on the circuit board generally to the device that generates heat dispels the heat to in time derive the heat, avoid the device damage, but to the bigger contravariant module of power, because the heat is great, and the heat dissipation is inhomogeneous, leads to local overheated, the problem of heat inadequately.

Disclosure of Invention

In view of the foregoing, it is necessary to provide a heat dissipation bracket and an energy storage device, which are capable of achieving uniform heat dissipation to improve heat dissipation efficiency.

The embodiment of the utility model provides a heat dissipation bracket which is applied to a heating module, wherein the heating module is provided with a power plate and a radiator arranged on the power plate, the heat dissipation bracket comprises a heat dissipation plate, the heat dissipation plate is fixed relative to the power plate, a space for accommodating the radiator and a power device on the power plate is formed between the heat dissipation plate and the power plate at intervals, and the heat dissipation plate is at least attached to the power device on the power plate far away from the radiator so as to dissipate heat of the power device.

According to the heat dissipation bracket provided by the utility model, the power device on the power board is attached to the heat dissipation plate, so that the heat dissipation plate can absorb the heat of the power device and even the heat of the power device, thereby assisting in heat dissipation of the power board and improving the heat dissipation efficiency of the power board.

In some embodiments, the heat spreader plate is attached to the heat sink.

In some embodiments, the heat dissipation plate is formed with a protrusion towards the power board, the protrusion fitting the power device.

In some embodiments, a groove is formed on one surface of the heat dissipation plate facing the power plate, and the inner wall of the groove is attached to the power device.

In some embodiments, the heat dissipation bracket further includes a support post located between the heat dissipation plate and the power plate and connecting the heat dissipation plate and the power plate.

In some embodiments, the power board includes at least two, the heat dissipation plate has a first face and a second face disposed opposite each other, the first face configured to be in contact with the power device of one of the at least two power boards, and the second face configured to be in contact with the power device of another of the at least two power boards.

In some embodiments, the heat dissipation bracket further includes a support plate, the support plate is disposed at a side of the heat dissipation plate facing the second surface at intervals, the support plate is configured to carry a power board where the power device attached to the second surface is located, and the heat dissipation plate is configured to carry a power board where the power device attached to the first surface is located.

In some embodiments, the heat dissipating bracket further includes a fixing member connected to the heat dissipating plate and the support plate, the heat dissipating plate and the support plate being spaced apart to accommodate a power board of the power board device attached to the second face.

In some embodiments, the heat dissipation bracket further includes a heat transfer medium between the power device and the heat dissipation plate, the heat transfer medium connecting the power device and the heat dissipation plate.

The embodiment of the utility model also provides energy storage equipment, which comprises a battery module, an inversion module and a shell, wherein the inversion module comprises a power plate, a radiator arranged on the power plate and a radiating bracket in any embodiment, the radiating plate is at least attached to a power device, far away from the radiator, on the power plate, the battery module is connected with the power plate, the battery module and the inversion module are arranged in the shell, and the battery module is electrically connected with the inversion module.

According to the energy storage device, the heat dissipation efficiency is improved through the heat dissipation support, so that the operation stability of the energy storage device is improved.

Drawings

Fig. 1 is a perspective view of an energy storage device according to an embodiment of the utility model.

Fig. 2 is an exploded view of the energy storage device of fig. 1.

Fig. 3 is a perspective view of the inverter module of fig. 1.

Fig. 4 is an exploded view of the inverter module of fig. 3.

Fig. 5 is a perspective view of the heat dissipating bracket of fig. 4.

Fig. 6 is an exploded view of the heat sink bracket of fig. 5.

Fig. 7 is a perspective view of a bottom view of the heat dissipating plate of fig. 6.

Description of the main reference signs

100-Heat dissipation bracket 10-Heat dissipation plate 11-first side

12-second face 13-projections 14-recesses

20-supporting plate 21-hollowed-out hole 30-fixing piece

31-body portion 311-through hole 312-mounting portion

32-supporting table 321-supporting surface 40-supporting column

50-fan 200-energy storage device 210-battery module

220-inverter module 221-power board 222-radiator

223-power device 230-housing 22-notch.

Detailed Description

The following description of the embodiments of the present utility model refers to the accompanying drawings, which illustrate some, but not all embodiments of the utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "or/and" as used herein includes any and all combinations of one or more of the associated listed items.

At present in movable energy storage power, be equipped with some devices that generate heat on the circuit board in the contravariant module, in order to realize the heat dissipation simultaneously, still need set up the radiator on the circuit board generally to the device that generates heat dispels the heat to in time derive the heat, avoid the device damage, but to the bigger contravariant module of power, because the heat is great, and the heat dissipation is inhomogeneous, lead to local overheated, the problem of heat dissipation capacity is not enough.

In view of the foregoing, it is necessary to provide a heat dissipation bracket and an energy storage device, which are capable of achieving uniform heat dissipation to improve heat dissipation efficiency. The heat dissipation support is applied to the heating module, the heating module is provided with a power plate and a radiator arranged on the power plate, the heat dissipation support comprises a heat dissipation plate, the heat dissipation plate is fixed relative to the power plate, a space for accommodating the radiator and a power device on the power plate is formed between the heat dissipation plate and the power plate at intervals, and the heat dissipation plate is configured to be attached to the power device on the power plate far away from the radiator at least so as to dissipate heat of the power device.

According to the heat dissipation bracket provided by the utility model, the power device on the power board is attached to the heat dissipation plate, so that the heat dissipation plate can absorb the heat of the power device and even the heat of the power device, thereby assisting in heat dissipation of the power board and improving the heat dissipation efficiency of the power board.

Some embodiments of the present utility model are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without collision.

Referring to fig. 1 and 2, a heat dissipation bracket 100 is provided in an embodiment of the utility model, and is applied to a heat generating module of an electrical device. The heating module is provided with a power plate and a radiator arranged on the power plate, the radiator is used for radiating power devices on the upper part of the power plate, the radiating bracket 100 is used for further radiating the power devices of the power plate and homogenizing the heat of the power devices, so that the radiating efficiency of the heating module is improved, and the radiating efficiency and the running stability of electrical equipment are improved. The heating module can be a module with heating devices such as an inversion module, the power board can be a circuit board, the power device can be a capacitor, a resistor or an inductor and other components which can generate heat, and the electrical equipment can be energy storage equipment such as a movable power supply or the like, or electric equipment such as an air conditioner, a refrigerator, an unmanned aerial vehicle and the like with the power board.

Referring to fig. 3 and 4, the heat dissipation bracket 100 includes a heat dissipation plate 10, and the position of the heat dissipation plate 10 is fixed relative to the power board. A space is formed between the heat dissipation plate 10 and the power plate at intervals, and the space is used for accommodating a radiator and a power device on the power plate. The heating panel 10 is laminated mutually with the power device of power board upper portion at least, makes the heat of the power device of this part can transmit to heating panel 10, and heating panel 10 is used for evenly dissipating the heat of absorbing, and even power device's heat, and then plays the radiating effect to the power device that laminates mutually to promote the radiating efficiency of module that generates heat.

Wherein, the partial power device on the power board is close to the radiator and even is attached to the radiator, so that the heat of the partial power device is enough to be dissipated through the radiator efficiently. However, the power devices of other parts on the power board are far away from the radiator, so that heat generated by the power devices far away from the radiator is difficult to dissipate through the radiator, and the power devices of the parts have the problems of uneven heat dissipation and insufficient heat dissipation, so that the heat dissipation plate 10 is at least attached to the power devices far away from the radiator on the power board, and the heat of the power devices with insufficient heat dissipation can be dissipated through the heat dissipation plate 10, so that the heat dissipation of the power devices far away from the radiator is further insufficient.

In some embodiments, since the heat of the power device attached to the heat sink is sufficient to dissipate through the heat sink, but the heat of the power device disposed at intervals to the heat sink is insufficient to dissipate through the heat sink, the heat dissipation plate 10 is attached to all the power devices disposed at intervals to the heat sink on the power board, so as to make up the heat dissipation deficiency of the power devices disposed at intervals to the heat sink, and the power device attached to the heat sink is selectively attached to the heat dissipation plate 10, i.e. attached to or not attached to the heat dissipation plate 10, when the power device attached to the heat sink is also attached to the heat dissipation plate 10, the heat dissipation plate 10 can perform auxiliary heat dissipation on the power device attached to the heat sink, thereby further improving the heat dissipation efficiency.

In other embodiments, the heat dissipation plate 10 is attached to all the power devices on the power board, and no matter the power devices are attached to the heat sink or are arranged at intervals, so that heat of all the power devices on the power board can be dissipated through the heat dissipation plate 10, thereby fully utilizing the heat dissipation area of the heat dissipation plate 10 and maximizing the heat dissipation efficiency.

In other embodiments, the heat dissipation plate 10 is attached to not only the power device but also the heat sink, so that the heat of the heat sink can be dissipated through the heat dissipation plate 10, thereby further improving the heat dissipation efficiency.

As an exemplary example, the power device attached to the heat dissipation plate 10 may be a component that generates heat, such as inductance, capacitance, or resistance.

In some embodiments, the power boards have at least two, the heat dissipation plate 10 has a first face 11 and a second face 12 disposed opposite to each other, the first face 11 is connected with a power device and/or a heat sink on one of the at least two power boards, and the second face 12 is connected with a power device and/or a heat sink on the other of the at least two power boards, so that the heat dissipation area of the front and back sides of the heat dissipation plate 10 can be fully utilized, and thus, in case that the size of the heat dissipation plate 10 is fixed, the number of power boards that the heat dissipation plate 10 can dissipate heat is maximized, or in case that the number of power boards that need to dissipate heat is fixed, the size of the heat dissipation plate 10 is minimized.

Referring to fig. 5 to 7, in some embodiments, since the relative positions of the power board and the heat dissipation plate 10 are fixed, but the heights of the power devices on the power board are not uniform, a gap is formed between the power device with a height smaller than the distance between the power board and the heat dissipation plate 10, so that the power device with a low height cannot be attached to the heat dissipation plate 10. In order to make the heat dissipation plate 10 maximally attach to the power device on the power board, the heat dissipation plate 10 is formed with protrusions 13, and the protrusions 13 are used for compensating for gaps between the power device and the heat dissipation plate 10, so that the power device with a height smaller than the distance between the power board and the heat dissipation plate 10 can attach to the top surface of the protrusions 13, and heat is conducted to the heat dissipation plate 10 through the protrusions 13, thereby improving heat dissipation efficiency.

In some embodiments, since the relative positions of the power board and the heat dissipation plate 10 are fixed, but the heights of the power devices on the power board are not uniform, the power devices with a height greater than the distance between the power board and the heat dissipation plate 10 interfere with the heat dissipation plate 10, so that the power board with a high height cannot be placed in the space. In order to maximally attach the heat dissipation plate 10 to the power device on the power board, the heat dissipation plate 10 is formed with a groove 14, and the groove 14 is used to provide a sufficient receiving space so that the power device having a height greater than the distance between the power board and the heat dissipation plate 10 can attach to the bottom surface of the groove 14 and conduct heat to the heat dissipation plate 10 through the groove 14, thereby improving heat dissipation efficiency.

In some embodiments, the heat dissipation plate 10 forms the protrusion 13 and the groove 14 by the same structure, for example, after the heat dissipation plate 10 forms the protrusion 13 on the first surface 11, the groove 14 is naturally formed on the second surface 12, and for example, after the heat dissipation plate 10 forms the protrusion 13 on the second surface 12, the groove 14 is naturally formed on the first surface 11, so that the structure of the heat dissipation plate 10 is simpler, and the heat dissipation plate 10 is convenient to form the protrusion 13 and the groove 14 through processes such as stamping, so as to improve the processing efficiency of the heat dissipation plate 10.

In other embodiments, the protrusions 13 and the grooves 14 are formed separately, for example, the heat dissipation plate 10 forms the protrusions 13 on the first surface 11 and/or the second surface 12 by increasing the thickness, or the heat dissipation plate 10 forms the grooves 14 on the first surface 11 and/or the second surface 12 by decreasing the thickness, and the heat dissipation plate 10 can make the protrusions 13 and the grooves 14 on the first surface 11 and the second surface 12 exist independently of each other by increasing or decreasing the thickness, so as to adapt to different types of power boards.

In some embodiments, the heat dissipation plate 10 supports power boards connected to the first surface 11 and the second surface 12, that is, a plurality of power boards are all mounted on the heat dissipation plate 10, and when the power boards are mounted on the first surface 11, the power devices of the power boards are attached to the first surface 11; when the power board is mounted on the second surface 12, the power device of the power board is attached to the second surface 12. The heat dissipation plate 10 supports all the power boards, so that the number of parts in the heating module can be reduced, and the volume of the heating module is further reduced.

In some embodiments, the heat dissipation bracket 100 further includes a support plate 20, and the support plate 20 is disposed at a side of the heat dissipation plate 10 facing the second surface 12 at intervals. Of the plurality of power boards, a part of the power boards are mounted on the support plate 20, another part of the power boards are mounted on the heat dissipation plate 10, the support plate 20 is used for supporting the power boards connected with the second surface 12, and the heat dissipation plate 10 is used for supporting the power boards connected with the first surface 11, namely, when the power boards are mounted on the support plate 20, the power devices of the power boards are attached to the second surface 12; when the power board is mounted on the heat dissipation plate 10, the power device of the power board is attached to the first surface 11. The support plate 20 is used for sharing the required structure of installing the power board on the heating panel 10, because, if all the power boards are all installed in the heating panel 10, then necessarily lead to the heating panel 10 to need to provide more required structures to install the power board, and then lead to the structure of heating panel 10 more complicated, and the problem that is inconvenient to install still exists at the positive and negative two sides of heating panel 10 to install the power board, lead to the packaging efficiency of module that generates heat to reduce, so, will install the power board in the second face 12 and install in the support plate 20 instead, can simplify the structure of heating panel 10, and more convenient installation, thereby promote the packaging efficiency of module that generates heat.

In some embodiments, the center of the support plate 20 is provided with a hollowed hole 21, the hollowed hole 21 can expose a power board installed on the support plate 20, so that the bottom of the power board installed on the support plate 20 can radiate heat more efficiently by convection, and the hollowed hole 21 can reduce the weight of the support plate 20, thereby reducing the weight of the heat radiation bracket 100 and the heat generating module.

In some embodiments, the heat dissipation bracket 100 further includes a fixing member 30, where the fixing member 30 is located at edges of the heat dissipation plate 10 and the support plate 20, and the fixing member 30 is used to connect the heat dissipation plate 10 and the support plate 20 to fix a relative position between the heat dissipation plate 10 and the support plate 20. As an exemplary example, the fixing member 30 fixes the plate surface of the heat radiating plate 10 in parallel with the plate surface of the support plate 20 for easy installation.

In some embodiments, the fixing members 30 are plural, the fixing members 30 are distributed at the peripheral edges of the heat dissipation plate 10 and the support plate 20, and gaps are formed between the fixing members 30, and the gaps can expose the space between the heat dissipation plate 10 and the support plate 20, so as to expose the power board mounted on the support plate 20, so that the heat of the power board connected to the second surface 12 of the heat dissipation plate 10 can be dissipated in an air convection manner, and the heat dissipation efficiency is further improved.

In some embodiments, the fixing member 30 includes a main body 31 and a supporting table 32, the supporting table 32 is connected to one side of the main body 31 perpendicular to the height direction, and the supporting table 32 is located between two ends of the main body 31 along the height direction. One end of the main body 31 is connected to the heat dissipating plate 10, and the support base 32 is connected to the support plate 20. As an exemplary example, the main body 31 is in a column shape, the height extending direction of the main body 31 is perpendicular to the plate surface of the heat dissipating plate 10 and the support plate 20, the top end of the main body 31 is used for supporting the heat dissipating plate 10, and one side of the support table 32 facing the top of the main body 31 is provided with a support surface 321, and the support surface 321 is used for fixing the support plate 20.

In some embodiments, the fixing members 30 have four, four fixing members 30 are respectively disposed at four corners of the heat dissipation plate 10 and the support plate 20 to stably support the heat dissipation plate 10 and the support plate 20, and in other embodiments, the fixing members 30 may have other numbers, such as six or seven, to select the support positions according to the heat dissipation plate 10 and the support plate 20 without shapes, so long as the heat dissipation plate 10 and the support plate 20 can be stably supported.

In some embodiments, the support plate 20 is provided with a notch 22 at the edge of the contour, the notch 22 is located between the connection of the support plate 20 and the two adjacent fixing members 30, the notch 22 can expose a larger area of the power board mounted on the support plate 20, so that the power board mounted on the support plate 20 can radiate heat more efficiently by convection, and the notch 22 can reduce the weight of the support plate 20, thereby reducing the weight of the heat radiation bracket 100 and the heat generating module. Optionally, the support plate 20 has a plurality of notches 22, and a notch 22 is disposed between the support plate 20 and the connection portion between each two adjacent fixing members 30.

In some embodiments, the main body 31 is provided with a through hole 311, and the through hole 311 is located at a portion between the top of the main body 31 and the support table 32, such that the through hole 311 communicates with a space between the heat dissipation plate 10 and the support plate 20, thereby exposing a power board mounted on the support plate 20, so that heat of the power board connected to the second face 12 of the heat dissipation plate 10 is more efficiently dissipated by air convection, thereby further improving heat dissipation efficiency, and the through hole 311 can also reduce the weight of the main body 31, thereby reducing the weight of the heat dissipation bracket 100 and the heat generation module.

In some embodiments, the bottom end of the main body 31 is provided with a mounting portion 312, and the mounting portion 312 is used to connect other components so as to mount the main body 31 to the other components, thereby fixing the heat dissipation bracket 100. In other embodiments, the mounting portion 312 may be omitted or located at another position of the main body 31, for example, a position between two ends of the main body 31, and then the support base 32 may be omitted, so that the heat dissipation plate 10 and the support plate 20 may be mounted at two ends of the main body 31, respectively, to simplify the structure.

In some embodiments, the heat dissipation bracket 100 further includes a plurality of support columns 40, one end of each support column 40 is connected to the heat dissipation plate 10 or the support plate 20, and the other end of each support column 40 is connected to the power board to mount the power board to the heat dissipation plate 10 or the support plate 20.

For example, one end of each of the plurality of support columns 40 is disposed on the first surface 11 of the heat dissipation plate 10, and the other end thereof supports a power board together, so that the power board is mounted on the first surface 11, and meanwhile, the power device of the power board is attached to the first surface 11, and the height of each of the support columns 40 is the distance between the power board and the heat dissipation plate 10, so as to calculate the height of the protrusion 13 and the depth of the groove 14 required on the heat dissipation plate 10.

For another example, one end of the supporting columns 40 is disposed on a surface of the supporting plate 20 facing the heat dissipation plate 10, and the other end supports a power board together, so that the power board is mounted on the supporting plate 20, meanwhile, a power device of the power board is attached to the second surface 12 of the heat dissipation plate 10, and the supporting columns 40 suspend the power board above the supporting plate 20, so that the bottom of the power board can dissipate heat in a convection manner.

In some embodiments, the heat of the power board mounted on the first surface 11 may be transferred to the heat dissipation plate 10 through the plurality of support columns 40, so that the heat dissipation plate 10 can further dissipate heat of the power board, and heat dissipation efficiency is improved. Similarly, the heat of the power board mounted on the support board 20 can be transferred to the support board 20 through the support columns 40, so that the support board 20 can further radiate the heat of the power board, and the heat radiation efficiency is improved.

In some embodiments, the power board mounted on the support board 20 may not be supported by the support columns 40, i.e. the power board is directly attached to the support board 20, so long as the power device of the power board can be attached to the second face 12 of the heat dissipation board 10, at this time, the power board is attached to the support board 20, so that the heat of the power board can be conveniently conducted to the support board 20, so that the support board 20 assists the power board to dissipate heat, and the heat dissipation efficiency is further improved.

In some embodiments, the supporting plate 20 and the fixing member 30 are made of heat conductive materials, so that the heat of the heat dissipation plate 10 can be transferred to the fixing member 30, and the heat of the fixing member 30 can be transferred to the supporting plate 20, so that the supporting plate 20 and the fixing member 30 can absorb the heat of the heat dissipation plate 10 to assist the heat dissipation plate 10 to dissipate the heat, and further improve the heat dissipation efficiency. By way of exemplary example, the heat sink 10, the support plate 20 and the fixing member 30 are all metal.

In some embodiments, the heat dissipation bracket 100 further includes a heat-conducting medium (not shown) located between the power device and the heat dissipation plate 10, the heat-conducting medium connects the power device and the first surface 11 and the second surface 12 of the heat dissipation plate 10, and the heat-conducting medium is used to make heat generated by the power device more uniformly conducted to the heat dissipation plate 10, so as to improve heat dissipation uniformity of the heat dissipation plate 10, so as to improve overall heat dissipation efficiency.

In some embodiments, the heat dissipation bracket 100 further includes a plurality of fans 50, the fans 50 are distributed at the edge of the heat dissipation plate 10, and a part of the air outlets of the fans 50 are located at one side of the heat dissipation plate 10 facing the first surface 11, and another part of the air outlets of the fans are located at one side of the heat dissipation plate 10 facing the second surface 12, so that the fans 50 can dissipate heat of the power boards at two sides of the heat dissipation plate 10 at the same time, thereby uniformly improving the heat dissipation efficiency.

Referring to fig. 1, fig. 2, and fig. 4, an energy storage device 200 according to an embodiment of the utility model further includes a battery module 210, an inverter module 220, and a housing 230. The battery module 210 and the inverter module 220 are disposed in the housing 230, and the housing 230 protects the battery module 210 and the inverter module 220. The inverter module 220 includes a power board 221, a heat sink 222 disposed on the power board 221, and a heat dissipation bracket 100. The battery module 210 is connected to a power board 221, and the power board 211 is used for controlling the charging and discharging of the battery module 210. The heat sink 222 is used to dissipate heat from the power device 223 on the power board 221. The heat dissipation plate 10 is at least attached to the power device 223 of the power board 221 far from the heat sink 222, so as to absorb heat of the power device 233 and dissipate the heat uniformly, thereby improving the heat dissipation efficiency of the inverter module 220.

Therefore, the energy storage device 200 provided by the utility model improves the heat dissipation efficiency through the heat dissipation bracket 100, thereby improving the operation stability of the energy storage device 200.

In addition, those skilled in the art will recognize that the foregoing embodiments are merely illustrative of the present utility model and are not intended to be limiting, as appropriate modifications and variations of the foregoing embodiments are within the scope of the disclosure of the utility model.

Claims (10)

1. The utility model provides a heat dissipation support, is applied to the module that generates heat, the module that generates heat have the power board with set up in radiator on the power board, its characterized in that, heat dissipation support includes:

the heat dissipation plate is fixed relative to the power plate, a space for accommodating the radiator and the power device on the power plate is formed between the heat dissipation plate and the power plate at intervals, and the heat dissipation plate is configured to be attached to the power device on the power plate far away from the radiator at least so as to dissipate heat of the power device.

2. The heat dissipating bracket of claim 1, wherein: the heat dissipation plate is attached to the radiator.

3. The heat dissipating bracket of claim 1, wherein: the heat dissipation plate is provided with a protrusion towards the power plate, and the protrusion is attached to the power device.

4. The heat dissipating bracket of claim 1, wherein: and a groove is formed on one surface of the heat radiation plate, which faces the power plate, and the inner wall of the groove is attached to the power device.

5. The heat dissipating bracket of claim 1, wherein: the heat dissipation support also comprises a support column, wherein the support column is positioned between the heat dissipation plate and the power plate and is connected with the heat dissipation plate and the power plate.

6. The heat dissipating bracket of any of claims 1 to 5, wherein: the power board comprises at least two heat dissipation plates, the heat dissipation plates are provided with a first surface and a second surface which are arranged in a back-to-back mode, the first surface is configured to be attached to the power device of one of the at least two power boards, and the second surface is configured to be attached to the power device of the other of the at least two power boards.

7. The heat dissipating bracket of claim 6, wherein: the heat dissipation support further comprises support plates, the support plates are arranged at one side, facing the second face, of the heat dissipation plate at intervals, the support plates are configured to bear the power plates, where the power devices are attached to the second face, and the heat dissipation plates are configured to bear the power plates, where the power devices are attached to the first face.

8. The heat dissipating bracket of claim 7, wherein: the heat dissipation support further comprises a fixing piece, the fixing piece is connected with the heat dissipation plate and the support plate, and the heat dissipation plate is spaced from the support plate to accommodate the power board of the power board device attached to the second surface.

9. The heat dissipating bracket of any of claims 1 to 5, wherein: the heat dissipation support further comprises a heat conduction medium, wherein the heat conduction medium is located between the power device and the heat dissipation plate, and the heat conduction medium is connected with the power device and the heat dissipation plate.

10. An energy storage device, characterized by: the power device comprises a battery module, an inversion module and a shell, wherein the inversion module comprises a power plate, a radiator arranged on the power plate and a radiating bracket as claimed in any one of claims 1 to 9, the radiating plate is at least attached to a power device on the power plate far away from the radiator, the battery module is electrically connected with the power plate, the battery module and the inversion module are arranged in the shell, and the battery module is electrically connected with the inversion module.