CN219812396U

CN219812396U - Dustproof circuit board

Info

Publication number: CN219812396U
Application number: CN202320525838.7U
Authority: CN
Inventors: 程金平
Original assignee: Hangzhou Ouyao Electronic Technology Co ltd
Current assignee: Hangzhou Ouyao Electronic Technology Co ltd
Priority date: 2023-03-17
Filing date: 2023-03-17
Publication date: 2023-10-10
Anticipated expiration: 2033-03-17

Abstract

The utility model discloses a dustproof circuit board, which comprises a circuit board main body, wherein a heat conducting fin is stuck on the lower surface of the circuit board main body, a plurality of heat exchange fins are arranged on the lower surface of the heat conducting fin, a mounting frame is arranged at the edge of the upper surface of the circuit board main body, two sides of the heat conducting fin are buckled with the mounting frame through buckle plates, a plurality of layers of dust filtering nets are arranged on the inner side of the upper end of the mounting frame, and the dust filtering nets are arranged in a staggered manner; in this scheme, through the mode that sets up installing frame and dust filter net and conducting strip at both sides surface about the circuit board main part for the dust is blockked by installing frame, dust filter net and conducting strip, thereby realizes the dustproof processing to the circuit board, still can play good radiating effect to the circuit board main part under the effect of conducting strip and dust filter net simultaneously.

Description

Dustproof circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a dustproof circuit board.

Background

Circuit boards are electronic devices that connect electronic components to form a single functional circuit. The existing circuit board body is exposed in the air, dust often enters in daily use, and dust accumulation is more serious for circuit boards used on some outdoor electronic equipment. The dust accumulation on the circuit board not only affects the normal operation and efficiency of the electrical components, but also causes short-circuit faults, thereby reducing the service lives of the circuit board and the electrical components.

The existing circuit board is generally protected in a dustproof way by coating resin glue or attaching a film on the surface of the circuit board, so that the surface of the circuit board is sealed, the heat of the circuit board is difficult to dissipate, and the normal operation and the service life of electronic products are influenced; therefore, in order to solve the above technical problems, we propose a dustproof circuit board.

Disclosure of Invention

The utility model aims to solve the defects in the prior art and provides a dustproof circuit board.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a dustproof circuit board, includes the circuit board main part, the lower surface subsides of circuit board main part is equipped with the conducting strip, and the lower surface of conducting strip is equipped with a plurality of heat transfer fins, and the installing frame has been placed to the upper surface edge of circuit board main part, and the buckle is passed through to the both sides of conducting strip and installing frame lock, and the inboard of installing frame upper end is equipped with the dust filter net of multilayer, and each dust filter net crisscross setting.

Preferably, the lower surface of the circuit board main body is attached with a heat conducting silica gel sheet, and the heat conducting sheet is attached to the lower surface of the heat conducting silica gel sheet.

Preferably, the heat exchange fins are spaced by 6mm, and the sheet bodies of the heat exchange fins are provided with flow holes.

Preferably, the ventilation grooves are formed in the surfaces of the sides of the installation frame, a plurality of layers of filter screens are arranged in the ventilation grooves, and the filter screens are arranged in a staggered mode.

Preferably, the mounting holes at four corners of the circuit board main body are positioned outside the mounting frame, and the outer ring surfaces of the mounting frame, the dust filtering net and the filtering net are all provided with insulating coatings.

Preferably, the lower extreme of buckle is articulated with the both sides of conducting strip, and the both sides of installing the frame are equipped with the draw-in groove, and the upper end lock of buckle is in the draw-in groove, and the downside border of draw-in groove is the arc.

Preferably, the middle part of the two side plate bodies of the circuit board main body is provided with a plurality of positioning columns, and the corresponding positioning columns of the heat conducting fin and the mounting frame are provided with corresponding positioning holes.

The dustproof circuit board provided by the utility model has the beneficial effects that:

1: in the use process, a part of heat of the circuit board main body is downwards transferred to the heat conducting fin and then transferred to each heat exchange fin, and finally heat exchange is carried out between the heat exchange fins and air, so that the heat dissipation treatment of the circuit board main body is realized; meanwhile, a part of heat left by the circuit board main body is dissipated from the dust filtering net at the upper end of the mounting frame; and because the dust filtering net can block dust, in this scheme, through the mode that sets up installing frame and dust filtering net and conducting strip at both sides surface about the circuit board main part for the dust is blocked by installing frame, dust filtering net and conducting strip, thereby realizes the dustproof processing to the circuit board, still can play good radiating effect to the circuit board main part under the effect of conducting strip and dust filtering net simultaneously.

2: in the using process of the scheme, the heat conduction silica gel sheet enables heat of the circuit board main body to be better transferred to the heat conduction sheet; the filter screen is arranged on each side surface of the mounting frame, so that the outside air can flow to the circuit board from the side surface, namely, the heat dissipation effect of the mounting frame on the circuit board main body is enhanced through the arrangement of the filter screen, and the filter screen is still arranged in a plurality of layers, so that the filter screen can effectively filter dust flowing out of the gas at the circuit board, namely, the bad phenomena of short circuit, heat accumulation, static electricity and the like of various components on the upper surface of the circuit board main body caused by dust are avoided; meanwhile, due to the arrangement of the buckle plates, personnel can conveniently clean dust filtered out by the dust filtering net and the filter net, and therefore the heat dissipation performance of the circuit board is prevented from being influenced by accumulated dust.

Drawings

Fig. 1 is an isometric view of a dustproof circuit board according to the present utility model;

fig. 2 is a schematic bottom view of a dustproof circuit board according to the present utility model;

fig. 3 is a schematic structural diagram of a dustproof circuit board according to the present utility model;

fig. 4 is an enlarged schematic diagram of a dustproof circuit board according to the present utility model;

fig. 5 is a schematic diagram of a positioning column of a dustproof circuit board according to the present utility model.

In the figure: 1. a circuit board main body; 2. a heat conductive sheet; 3. heat exchange fins; 4. a mounting frame; 5. a buckle plate; 6. a dust filtering net; 7. a thermally conductive silicone sheet; 8. a flow hole; 9. a filter screen; 10. a clamping groove; 11. positioning columns; 12. and (5) mounting holes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Example 1

Referring to fig. 1-5, a dustproof circuit board comprises a circuit board main body 1, wherein a heat conducting fin 2 is stuck on the lower surface of the circuit board main body 1, a plurality of heat exchange fins 3 are arranged on the lower surface of the heat conducting fin 2, an installation frame 4 is placed on the edge of the upper surface of the circuit board main body 1, two sides of the heat conducting fin 2 are buckled with the installation frame 4 through buckle plates 5, a plurality of layers of dust filtering nets 6 are arranged on the inner side of the upper end of the installation frame 4, and the dust filtering nets 6 are arranged in a staggered manner; in this scheme, through the mode that sets up mounting frame 4 and dust filter 6 and conducting strip 2 at circuit board main part 1 upper and lower both sides surface for the dust is blockked by mounting frame 4, dust filter 6 and conducting strip 2, thereby realizes the dustproof processing to the circuit board, still can play good radiating effect to circuit board main part 1 under the effect of conducting strip 2 and dust filter 6 simultaneously.

Example 2

Referring to fig. 1 to 5, in the case where the other portions are the same as in embodiment 1, this embodiment differs from embodiment 1 in that:

the lower surface of the circuit board main body 1 is adhered with a heat-conducting silica gel sheet 7, the heat-conducting sheet 2 is adhered to the lower surface of the heat-conducting silica gel sheet 7, the heat-conducting silica gel sheet 7 is a heat-conducting medium material synthesized by a special process by taking silica gel as a base material and adding various auxiliary materials such as metal oxide, the heat-conducting medium material is also called a heat-conducting silica gel pad, a heat-conducting silica gel sheet, a soft heat-conducting pad, a heat-conducting silica gel pad and the like in the industry, can fill gaps, can open a heat channel between a heating part and a heat dissipation part, effectively improves heat transfer efficiency, simultaneously has the functions of insulation, shock absorption, sealing and the like, can meet the design requirements of equipment miniaturization and ultra-thinning, has very manufacturability and usability, has wide thickness application range, and is an excellent heat-conducting filling material, so that under the function of the heat-conducting silica gel sheet 7, the heat on the circuit board main body 1 can be well transferred to the heat-conducting sheet 2 in the use process, and finally is subjected to heat dissipation through the heat exchange fin 3; the heat exchange fins 3 are spaced by 6mm, and the sheet bodies of the heat exchange fins 3 are provided with the flow holes 8, and as the sheet bodies of the heat exchange fins 3 are provided with the plurality of flow holes 8, air can flow along the direction of the heat exchange fins 3 and can flow through the flow holes 8, namely, the heat exchange fins 3 can adapt to the non-ventilation wind direction, so that the circuit board main body 1 can radiate heat more quickly when in use; the ventilation grooves are formed in the surfaces of the sides of the mounting frame 4, a plurality of layers of filter screens 9 are arranged in the ventilation grooves, the filter screens 9 are arranged in a staggered mode, and the arrangement of the filter screens 9 not only can enable heat of the circuit board main body 1 to be transferred upwards through the dust filtering screen 6, but also can transfer the heat to the side face, namely external wind can flow through the upper side surface of the circuit board main body 1 through the filter screens 9, and accordingly heat is taken away.

The mounting holes 12 at four corners of the circuit board main body 1 are positioned outside the mounting frame 4, and the outer annular surfaces of the mounting frame 4, the dust filtering net 6 and the filter net 9 are all provided with insulating coatings, so that personnel can conveniently assemble and disassemble the circuit board due to the fact that the mounting holes 12 of the circuit board main body 1 are arranged outside the mounting frame 4, and the insulating coatings are arranged on the outer annular surfaces of the mounting frame 4, the dust filtering net 6 and the filter net 9, so that the phenomenon that the circuit board is interfered or damaged by the components such as the mounting frame 4, the dust filtering net 6 and the filter net 9 in a conventional state is avoided; the lower end of the buckle plate 5 is hinged with the two sides of the heat conducting fin 2, the two sides of the installation frame 4 are provided with clamping grooves 10, the upper end of the buckle plate 5 is buckled in the clamping grooves 10, the lower side edges of the clamping grooves 10 are arc-shaped, the clamping grooves 10 are arranged, the buckle plate 5 is convenient to fix the installation frame 4, and the lower side edges of the clamping grooves 10 are arc-shaped, so that personnel can conveniently buckle the buckle plate 5 and pull the buckle plate 5 open; the middle part of the two side plate bodies of the circuit board main body 1 is provided with a plurality of positioning columns 11, the corresponding positioning columns 11 of the heat conducting strip 2 and the mounting frame 4 are provided with corresponding positioning holes, and the positioning columns 11 and the positioning holes are arranged, so that personnel do not need to carefully align the edges when mounting the mounting frame 4 and the heat conducting strip 2, and the personnel can save labor when mounting the mounting frame 4 and the heat conducting strip 2.

The use principle and the advantages are that: in the use process of the utility model, a person firstly attaches the heat conducting fin 2 to the lower surface of the circuit board main body 1, then installs the circuit board main body 1 with external equipment through the installation hole 12, and further places the installation frame 4 on the upper surface of the circuit board main body 1 and connects the installation frame with the circuit board through the buckle 5, so that the installation of the circuit board is completed; when the circuit board body 1 and all components welded on the board body generate heat in the use process of the circuit board, part of the heat is downwards transferred to the heat conducting fin 2 and then transferred to each heat exchange fin 3, and then heat exchange is carried out between the heat exchange fins 3 and air, so that the heat on the heat exchange fins 3 is dissipated, and the heat dissipation treatment of the circuit board body 1 is realized; meanwhile, as the upper end of the mounting frame 4 is the dust screen 6, that is, the outside control can freely contact with the upper side surface of the circuit board main body 1 and the component device mounted on the circuit board main body through the dust screen 6, a part of heat left by the circuit board main body 1 is dissipated from the dust screen 6 at the upper end of the mounting frame 4; and because dust filter 6 can block the dust, in this scheme, through the mode that sets up mounting frame 4 and dust filter 6 and conducting strip 2 at circuit board main part 1 upper and lower both sides surface for the dust is blocked by mounting frame 4, dust filter 6 and conducting strip 2, thereby realizes the dustproof processing to the circuit board, still can play good radiating effect to circuit board main part 1 under the effect of conducting strip 2 and dust filter 6 simultaneously.

Further, in the scheme, the heat conducting silicon sheet 7 is arranged between the heat conducting sheet 2 and the circuit board main body 1, so that a gap between the heat conducting sheet 2 and the lower surface of the circuit board main body 1 is filled, and heat of the circuit board main body 1 can be better transferred to the heat conducting sheet 2; and because each side surface of installing frame 4 all is equipped with filter screen 9, even make when external air flows to the circuit board from the side, gas accessible filter screen 9 enters into the inside and contacts with the upper surface of circuit board main part 1 of installing frame 4 to finally flow out from filter screen 9 of opposite side, through the setting of filter screen 9 promptly, strengthened the radiating effect of installing frame 4 to circuit board main part 1, and because filter screen 9 still is the multilayer setting, thereby make filter screen 9 can play effectual dust filtration to the gas that flows through circuit board department, avoid the dust to cause short circuit, heat accumulation, static etc. bad phenomenon to each components and parts of circuit board main part 1 upper surface promptly.

Still further in this scheme, because mounting frame 4 passes through buckle 5 and heat conducting strip 2 lock, promptly after the circuit board uses for a long time, when the dust of its dust screen 6 and filter screen 9 department by the filtering is blockked up gradually, personnel can be convenient pull open buckle 5 to clear up dust screen 6 and filter screen 9 after taking off mounting frame 4, promptly through the setting of buckle 5, personnel can be convenient for clear up dust screen 6 and filter screen 9 filtering out, thereby avoid accumulational dust to influence the heat dispersion of circuit board.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a dustproof circuit board, includes circuit board main part (1), its characterized in that, the lower surface subsides of circuit board main part (1) are equipped with conducting strip (2), and the lower surface of conducting strip (2) is equipped with a plurality of heat transfer fin (3), and installing frame (4) have been placed at the upper surface edge of circuit board main part (1), and buckle (5) and installing frame (4) lock are passed through to the both sides of conducting strip (2), and the inboard of installing frame (4) upper end is equipped with multilayer dust filter net (6), and each dust filter net (6) are crisscross to be set up.

2. The dustproof circuit board according to claim 1, wherein the lower surface of the circuit board main body (1) is attached with a heat conducting silica gel sheet (7), and the heat conducting sheet (2) is attached to the lower surface of the heat conducting silica gel sheet (7).

3. A dustproof circuit board according to claim 1, characterized in that the heat exchange fins (3) are spaced by 6mm, and the sheet bodies of the heat exchange fins (3) are provided with flow holes (8).

4. The dustproof circuit board according to claim 1, wherein ventilation grooves are formed in the side surfaces of the mounting frame (4), multiple layers of filter screens (9) are arranged in the ventilation grooves, and the filter screens (9) are arranged in a staggered mode.

5. The dustproof circuit board according to claim 4, wherein the mounting holes (12) at four corners of the circuit board main body (1) are positioned outside the mounting frame (4), and the outer ring surfaces of the mounting frame (4), the dust filtering net (6) and the filter net (9) are provided with insulating coatings.

6. The dustproof circuit board according to claim 1, wherein the lower end of the buckle plate (5) is hinged to two sides of the heat conducting fin (2), clamping grooves (10) are formed in two sides of the mounting frame (4), the upper end of the buckle plate (5) is buckled in the clamping grooves (10), and the edges of the lower sides of the clamping grooves (10) are arc-shaped.

7. The dustproof circuit board according to claim 1, wherein a plurality of positioning columns (11) are arranged in the middle of two side plate bodies of the circuit board main body (1), and corresponding positioning holes are formed in the heat conducting fin (2) and the mounting frame (4) corresponding to the positioning columns (11).