CN217324377U - PCB electroplating thickness control device - Google Patents

PCB electroplating thickness control device Download PDF

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Publication number
CN217324377U
CN217324377U CN202220355846.7U CN202220355846U CN217324377U CN 217324377 U CN217324377 U CN 217324377U CN 202220355846 U CN202220355846 U CN 202220355846U CN 217324377 U CN217324377 U CN 217324377U
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CN
China
Prior art keywords
baffle
connecting block
electroplating
control device
base
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Active
Application number
CN202220355846.7U
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Chinese (zh)
Inventor
曹荣平
伍晓明
刘洋
张良平
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Shenzhen Jieduobang Technology Co ltd
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Shenzhen Jieduobang Technology Co ltd
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Priority to CN202220355846.7U priority Critical patent/CN217324377U/en
Application granted granted Critical
Publication of CN217324377U publication Critical patent/CN217324377U/en
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Abstract

The utility model discloses a PCB electroplating thickness control device, which comprises electroplating equipment and a base, wherein the base is provided with a height-adjustable connecting block, the connecting block is provided with the electroplating equipment, the base is provided with a baffle plate which shields the electroplating equipment, the baffle plate is provided with a shield cover, the electroplating equipment is arranged in the shield cover, the shield cover is provided with an opening, an air outlet component is fixedly arranged in the baffle plate, the baffle plate is provided with an air outlet, and the air outlet faces the electroplating equipment; the blocking cover is provided with a plurality of blocking pieces. When in use, the utility model has good protection performance, and the equipment is not easy to be damaged; the control of the electroplating thickness is convenient, and the operation is simple.

Description

PCB electroplating thickness control device
Technical Field
The utility model relates to an electroplate thickness control field, concretely relates to PCB board electroplates thickness control device.
Background
The PCB Printed Circuit Board, which is called a Printed Circuit Board in chinese, is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.
At present, a PCB (printed Circuit Board) is often required to be electroplated, the electroplating thickness is not easy to control, electroplating equipment is not effectively protected, and the condition of damage is easy to occur.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a PCB board electroplating thickness control device that can solve above-mentioned problem.
The utility model discloses a realize through following technical scheme: a PCB electroplating thickness control device comprises electroplating equipment and a base, wherein a height-adjustable connecting block is arranged on the base, the electroplating equipment is arranged on the connecting block, a baffle is arranged on the base and shields the electroplating equipment, a shield is arranged on the baffle, the electroplating equipment is arranged in the shield, an opening is formed in the shield, an air outlet assembly is fixedly arranged in the baffle, an air outlet hole is formed in the baffle, and the air outlet hole faces the electroplating equipment; the blocking cover is provided with a plurality of blocking pieces.
As an optimized technical scheme, a central groove is formed in the base, an internal thread is arranged on the inner wall of the central groove, an external thread is arranged on the surface of the connecting block, the external thread is matched with the internal thread, the connecting block is inserted into the central groove and meshed with the internal thread through the thread, the connecting block is of a cylindrical structure, and scale marks from top to bottom are arranged on the connecting block.
As the preferred technical scheme, the blocking cover is made of colloid materials, the blocking cover is fixedly bonded on the baffle, aligned screw holes are formed between the baffle and the connecting block, and screws are inserted into the screw holes.
As an optimized technical scheme, the baffle is provided with an installation cavity, the air outlet assembly comprises a fan support fixed in the installation cavity, a cooling fan is fixed on the fan support, the baffle is provided with an air inlet hole, a dust screen is fixed at the air inlet hole, the baffle is provided with a switch, and the switch is used for controlling the starting and stopping of the cooling fan.
As the preferred technical scheme, the separation blade is made of colloid materials, the inner wall of the separation blade is provided with the adsorption layer, the separation blade is internally provided with a connecting channel, an elastic sheet is fixed in the connecting channel, and the elastic sheet is fixed with the blocking cover.
The beneficial effects of the utility model are that: when in use, the utility model has good protection performance, and the equipment is not easy to be damaged; the control of the electroplating thickness is convenient, and the operation is simple.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view of the present invention;
FIG. 2 is a block diagram of the baffle of the present invention;
fig. 3 is a structural sectional view of the main direction of the present invention.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
This specification includes any features disclosed in the appended claims, abstract and drawings, which are, unless expressly stated otherwise, replaceable with other equivalent or similarly purposed alternative features. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
In the description of the present invention, it should be understood that the terms "one end", "the other end", "outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The use of terms herein such as "upper," "above," "lower," "below," and the like in describing relative spatial positions is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented 90 degrees or at other orientations and the spatially relative descriptors used herein interpreted accordingly.
In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
As shown in fig. 1 to 3, the air-conditioning device comprises an electroplating device 1 and a base 2, wherein a height-adjustable connecting block 12 is arranged on the base 2, the electroplating device 1 is arranged on the connecting block 12, a baffle 3 is arranged on the base 2, the electroplating device 1 is shielded by the baffle 3, a shield 5 is arranged on the baffle 3, the electroplating device 1 is arranged in the shield 5, an opening 15 is arranged on the shield 5, an air outlet component is fixedly arranged in the baffle 3, an air outlet 6 is arranged on the baffle 3, and the air outlet 6 faces the electroplating device 1; the baffle cover 5 is provided with a plurality of baffle plates 16.
Wherein, be provided with central groove on the base 2, the inner wall in central groove is provided with the internal thread, the surface of connecting block 12 is provided with the external screw thread, external screw thread and internal thread phase-match, connecting block 12 insert to central inslot through the thread engagement, and connecting block 12 is cylindric structure, is provided with top-down scale mark 27 on the connecting block 12.
Wherein, keep off the cover 5 and make for the colloid material, keep off the cover 5 and bond and fix on baffle 3, set up the screw hole of alignment between baffle 3 and the connecting block 12, insert the screw in the screw hole. The baffle is convenient for install and dismantle.
Wherein, be provided with the installation cavity on the baffle 3, the air-out subassembly is fixed with radiator fan 10 including fixing the fan bracket 17 in the installation cavity on the fan bracket 17, be provided with fresh air inlet 7 on the baffle 3, fresh air inlet 7 and fresh air outlet department are fixed with the dust screen, set up the switch on the baffle 3, the switch is used for controlling opening of radiator fan 10 and stops. The baffle plate can be internally provided with a storage battery for supplying power, and the storage battery is covered by a battery cover plate.
Wherein, the baffle 16 is made of colloid material, the inner wall of the baffle 16 is provided with an adsorption layer 37, a connecting channel is arranged in the baffle 16, an elastic sheet 9 is fixed in the connecting channel, and the elastic sheet 9 is fixed with the baffle cover 5. The elastic piece is made of elastic metal, so that the bending is convenient to adjust, and the position of the blocking piece can be adjusted.
This technical scheme is when using, on the electroplating device fixed connection piece, connecting block thread engagement is convenient for rotate its position of adjustment for electroplating device's position can be adjusted, can control the distance between equipment and the PCB board, is convenient for carry out the control to different thickness. The existence of the scale marks is convenient for seeing the height of the adjustment of the equipment.
This technical scheme is when using, keeps off the cover and can protect electroplating device, and the adsorbed layer can be the fixed sponge of double faced adhesive tape, can keep apart the material that produces when electroplating and block, has increased the security. The air current that the air-out subassembly produced removes dust and dehumidifies equipment, has effectively protected equipment.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims (5)

1. The utility model provides a PCB board electroplating thickness controlling means, includes electroplating device (1), its characterized in that: the air-out device is characterized by further comprising a base (2), a connecting block (12) with adjustable height is arranged on the base (2), electroplating equipment (1) is arranged on the connecting block (12), a baffle (3) is arranged on the base (2), the electroplating equipment (1) is shielded by the baffle (3), a shield (5) is arranged on the baffle (3), the electroplating equipment (1) is arranged in the shield (5), an opening (15) is formed in the shield (5), an air-out component is fixedly arranged in the baffle (3), an air outlet (6) is formed in the baffle (3), and the air outlet (6) faces the electroplating equipment (1); the blocking cover (5) is provided with a plurality of blocking pieces (16).
2. The PCB plating thickness control device of claim 1, wherein: be provided with the central groove on base (2), the inner wall in central groove is provided with the internal thread, the surface of connecting block (12) is provided with the external screw thread, external screw thread and internal thread phase-match, connecting block (12) insert to the central inslot through thread engagement, and connecting block (12) are cylindric structure, are provided with top-down's scale mark (27) on connecting block (12).
3. The PCB plating thickness control device of claim 1, wherein: the blocking cover (5) is made of colloid materials, the blocking cover (5) is fixedly bonded on the baffle (3), aligned screw holes are formed between the baffle (3) and the connecting block (12), and screws are inserted into the screw holes.
4. The PCB plating thickness control device of claim 1, wherein: be provided with the installation cavity on baffle (3), the air-out subassembly is fixed with radiator fan (10) including fixing fan bracket (17) in the installation cavity on fan bracket (17), be provided with fresh air inlet (7) on baffle (3), fresh air inlet (7) department is fixed with the dust screen, set up the switch on baffle (3), the switch is used for controlling opening of radiator fan (10) and stops.
5. The PCB plating thickness control device of claim 1, wherein: the baffle sheet (16) is made of colloid materials, the inner wall of the baffle sheet (16) is provided with an adsorption layer (37), a connecting channel is arranged in the baffle sheet (16), an elastic sheet (9) is fixed in the connecting channel, and the elastic sheet (9) is fixed with the baffle cover (5).
CN202220355846.7U 2022-02-22 2022-02-22 PCB electroplating thickness control device Active CN217324377U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220355846.7U CN217324377U (en) 2022-02-22 2022-02-22 PCB electroplating thickness control device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220355846.7U CN217324377U (en) 2022-02-22 2022-02-22 PCB electroplating thickness control device

Publications (1)

Publication Number Publication Date
CN217324377U true CN217324377U (en) 2022-08-30

Family

ID=82998288

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220355846.7U Active CN217324377U (en) 2022-02-22 2022-02-22 PCB electroplating thickness control device

Country Status (1)

Country Link
CN (1) CN217324377U (en)

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